Trenz Electronic GmbH 产品 | 深圳黑森尔电子

零件编号	制造商	描述	封装	库存
TE0600-03B	Trenz Electronic GmbH	SOM GIGABEE 2X128MB REV. 3 Module/Board Type: FPGA Core Processor: Spartan-6 LX-100 Co-Processor: - Speed: 125MHz Flash Size: 16MB RAM Size: 256MB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存5,440
TE0710-02-35-2CF	Trenz Electronic GmbH	SOM ARTIX-7 35T 512 MBYTE DDR3 Module/Board Type: FPGA Core Processor: Artix-7 A35T Co-Processor: - Speed: 100MHz Flash Size: 32MB RAM Size: 512MB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存5,488
TE0711-01-100-2C	Trenz Electronic GmbH	SOM ARTIX-7 HIGH IO 100T USB 2C Module/Board Type: FPGA Core Processor: Artix-7 A100T Co-Processor: - Speed: 100MHz Flash Size: 32MB RAM Size: - Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存3,568
TE0723-03M	Trenz Electronic GmbH	SOM ARDUZYNQ ZYNQ Z-7010 Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7010) Speed: 12MHz Flash Size: 16MB RAM Size: 512MB Connector Type: B2B Size / Dimension: - Operating Temperature: 0°C ~ 70°C	封装: -	库存4,064
TE0720-03-1CF-S	Trenz Electronic GmbH	STARTER KIT XILINX ZYNQ MICROSOM Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存6,192
TE0745-02-30-2IA	Trenz Electronic GmbH	SOM DDR3 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	库存7,456
TE0808-04-09EG-2IE	Trenz Electronic GmbH	ULTRASOM+ MPSOC-MODUL MIT ZYNQ U Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU9EG-1FFVC900E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: B2B Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存4,928
TE0820-03-03EG-1EA	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 1.57" x 1.97" (40mm x 50mm) Operating Temperature: 0°C ~ 80°C	封装: -	库存4,688
TE0803-03-2AE11-A	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: 0°C ~ 85°C	封装: -	库存7,968
TE0712-02-82C36-AW	Trenz Electronic GmbH	FPGA MODULE ARTIX7 Module/Board Type: FPGA Core Core Processor: Artix-7 A200T Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote
TE0813-02-2AE81-A	Trenz Electronic GmbH	MPSOC MODULE WITH AMD ZYNQ ULTRA Module/Board Type: MPU Core Core Processor: Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket - 4 x 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote
TE0803-04-2AE11-A	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote
TE0712-03-82C36-A	Trenz Electronic GmbH	FPGA MODULE ARTIX7 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	Request a Quote
TE0600-04-52I11-M	Trenz Electronic GmbH	IC MODULE GIGABEE Module/Board Type: FPGA Core Processor: Xilinx Spartan™ 6 XC6SLX45-2FGG484I Co-Processor: - Speed: 100MHz Flash Size: 16MB RAM Size: 128MB Connector Type: B2B Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote
TE0782-02-045-2IC	Trenz Electronic GmbH	IC MODULE CORTEX Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7045) Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket - 480 Size / Dimension: 3.350" L x 3.350" W (85.00mm x 85.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote
TE0745-03-92I31-AK	Trenz Electronic GmbH	SOM WITH AMD ZYNQ 7045-2I AND HE Module/Board Type: MPU Core Core Processor: ARM Cortex-A9 Co-Processor: Xilinx Zynq 7045 SoC XC7Z045-2FBG676I Speed: - Flash Size: 64MB RAM Size: 1GB Connector Type: Samtec ST5 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote
TE0720-03-61Q42NA	Trenz Electronic GmbH	IC SOC MODULE XILINX ZYNQ Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: - Flash Size: 32GB RAM Size: - Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -	封装: -	Request a Quote
TE0720-03-61Q33FL	Trenz Electronic GmbH	IC SOC MODULE XILINX ZYNQ Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: 125MHz Flash Size: 4GB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote
TE0720-03-62I33GA	Trenz Electronic GmbH	IC SOC MODULE XILINX ZYNQ Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: 125MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote
TE0821-01-3BI21MA	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq™ UltraScale+™ XCZU3EG-1SFVC784I Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: 2 x 160 Pin Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote
TE0808-05-6BE21-A	Trenz Electronic GmbH	ULTRASOM+ MPSOC MODULE WITH ZYNQ Module/Board Type: MPU Core Core Processor: Zynq™ UltraScale+™ ZU6EG-1FFVC900E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: 4 x 160 Pin Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote
TE0630-02-52C12-A	Trenz Electronic GmbH	FPGA MODULE SPARTAN-6 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	Request a Quote
TE0712-02-82I36-A	Trenz Electronic GmbH	FPGA MODULE ARTIX7 Module/Board Type: FPGA Core Core Processor: Artix-7 A200T Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote
TE0821-01-3BE21MA	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: 2 x 100 Pin Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote
TE0808-04-BBE21-A	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU15EG-1FFVC900E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote
TE0712-02-71I06-M	Trenz Electronic GmbH	FPGA MODULE ARTIX7 Module/Board Type: FPGA Core Core Processor: - Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote
AM0010-02-4AE21MA	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq™ UltraScale+™ ZU4CG-1E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 2.205" L x 1.575" W (56.00mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote
TE0745-03-71I31-A	Trenz Electronic GmbH	MOD SOM DDR3L 1GB Module/Board Type: FPGA Core Processor: ARM® Cortex®-A9 Co-Processor: Zynq-7000 (Z-7030) Speed: - Flash Size: 64MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 2.047" L x 2.992" W (52.00mm x 76.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote
TE0820-05-2AE81MA	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	Request a Quote
TE0817-01-7DE21-A	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU7EV-1FBVB900E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote

TE0600-03B

Trenz Electronic GmbH

SOM GIGABEE 2X128MB REV. 3

Module/Board Type: FPGA
Core Processor: Spartan-6 LX-100
Co-Processor: -
Speed: 125MHz
Flash Size: 16MB
RAM Size: 256MB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存5,440

TE0710-02-35-2CF

Trenz Electronic GmbH

SOM ARTIX-7 35T 512 MBYTE DDR3

Module/Board Type: FPGA
Core Processor: Artix-7 A35T
Co-Processor: -
Speed: 100MHz
Flash Size: 32MB
RAM Size: 512MB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存5,488

TE0711-01-100-2C

Trenz Electronic GmbH

SOM ARTIX-7 HIGH IO 100T USB 2C

Module/Board Type: FPGA
Core Processor: Artix-7 A100T
Co-Processor: -
Speed: 100MHz
Flash Size: 32MB
RAM Size: -
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存3,568

TE0723-03M

Trenz Electronic GmbH

SOM ARDUZYNQ ZYNQ Z-7010

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7010)
Speed: 12MHz
Flash Size: 16MB
RAM Size: 512MB
Connector Type: B2B
Size / Dimension: -
Operating Temperature: 0°C ~ 70°C

封装: -

库存4,064

TE0720-03-1CF-S

Trenz Electronic GmbH

STARTER KIT XILINX ZYNQ MICROSOM

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存6,192

TE0745-02-30-2IA

Trenz Electronic GmbH

SOM DDR3

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

库存7,456

TE0808-04-09EG-2IE

Trenz Electronic GmbH

ULTRASOM+ MPSOC-MODUL MIT ZYNQ U

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU9EG-1FFVC900E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: B2B
Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存4,928

TE0820-03-03EG-1EA

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 1.57" x 1.97" (40mm x 50mm)
Operating Temperature: 0°C ~ 80°C

封装: -

库存4,688

TE0803-03-2AE11-A

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
Operating Temperature: 0°C ~ 85°C

封装: -

库存7,968

TE0712-02-82C36-AW

Trenz Electronic GmbH

FPGA MODULE ARTIX7

Module/Board Type: FPGA Core
Core Processor: Artix-7 A200T
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

Request a Quote

TE0813-02-2AE81-A

Trenz Electronic GmbH

MPSOC MODULE WITH AMD ZYNQ ULTRA

Module/Board Type: MPU Core
Core Processor: Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket - 4 x 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

Request a Quote

TE0803-04-2AE11-A

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

Request a Quote

TE0712-03-82C36-A

Trenz Electronic GmbH

FPGA MODULE ARTIX7

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

Request a Quote

TE0600-04-52I11-M

Trenz Electronic GmbH

IC MODULE GIGABEE

Module/Board Type: FPGA
Core Processor: Xilinx Spartan™ 6 XC6SLX45-2FGG484I
Co-Processor: -
Speed: 100MHz
Flash Size: 16MB
RAM Size: 128MB
Connector Type: B2B
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

Request a Quote

TE0782-02-045-2IC

Trenz Electronic GmbH

IC MODULE CORTEX

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7045)
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket - 480
Size / Dimension: 3.350" L x 3.350" W (85.00mm x 85.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

Request a Quote

TE0745-03-92I31-AK

Trenz Electronic GmbH

SOM WITH AMD ZYNQ 7045-2I AND HE

Module/Board Type: MPU Core
Core Processor: ARM Cortex-A9
Co-Processor: Xilinx Zynq 7045 SoC XC7Z045-2FBG676I
Speed: -
Flash Size: 64MB
RAM Size: 1GB
Connector Type: Samtec ST5
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

Request a Quote

TE0720-03-61Q42NA

Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Speed: -
Flash Size: 32GB
RAM Size: -
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -

封装: -

Request a Quote

TE0720-03-61Q33FL

Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Speed: 125MHz
Flash Size: 4GB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

Request a Quote

TE0720-03-62I33GA

Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Speed: 125MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

Request a Quote

TE0821-01-3BI21MA

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ XCZU3EG-1SFVC784I
Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: 2 x 160 Pin
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

Request a Quote

TE0808-05-6BE21-A

Trenz Electronic GmbH

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ ZU6EG-1FFVC900E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: 4 x 160 Pin
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

Request a Quote

TE0630-02-52C12-A

Trenz Electronic GmbH

FPGA MODULE SPARTAN-6

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

Request a Quote

TE0712-02-82I36-A

Trenz Electronic GmbH

FPGA MODULE ARTIX7

Module/Board Type: FPGA Core
Core Processor: Artix-7 A200T
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

Request a Quote

TE0821-01-3BE21MA

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E
Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: 2 x 100 Pin
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

Request a Quote

TE0808-04-BBE21-A

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU15EG-1FFVC900E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

Request a Quote

TE0712-02-71I06-M

Trenz Electronic GmbH

FPGA MODULE ARTIX7

Module/Board Type: FPGA Core
Core Processor: -
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

Request a Quote

AM0010-02-4AE21MA

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ ZU4CG-1E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 2.205" L x 1.575" W (56.00mm x 40.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

Request a Quote

TE0745-03-71I31-A

Trenz Electronic GmbH

MOD SOM DDR3L 1GB

Module/Board Type: FPGA
Core Processor: ARM® Cortex®-A9
Co-Processor: Zynq-7000 (Z-7030)
Speed: -
Flash Size: 64MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 2.047" L x 2.992" W (52.00mm x 76.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

Request a Quote

TE0820-05-2AE81MA

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

Request a Quote

TE0817-01-7DE21-A

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU7EV-1FBVB900E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

Request a Quote