页 3 - Trenz Electronic GmbH 产品 | 深圳黑森尔电子
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Trenz Electronic GmbH 产品

记录 194
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零件编号
制造商
描述
封装
库存
数量
TEP0001-01
Trenz Electronic GmbH

PMOD DUAL CAN-FD TRANSCEIVER

  • Protocol: CAN
  • Function: Transceiver
  • Interface: -
  • Standards: -
  • Voltage - Supply: 3 V ~ 3.6 V
  • Current - Supply: -
  • Operating Temperature: -40°C ~ 125°C
  • Package / Case: Module
  • Supplier Device Package: Module
封装: Module
库存4,400
TE0741-02-410-2CF
Trenz Electronic GmbH

SOM KINTEX-7 410T 32MB FLASH AES

  • Module/Board Type: FPGA
  • Core Processor: Kintex-7 410T
  • Co-Processor: -
  • Speed: 200MHz
  • Flash Size: 32MB
  • RAM Size: -
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
  • Operating Temperature: 0°C ~ 70°C
封装: -
库存7,232
TE0741-02-070-2IF
Trenz Electronic GmbH

SOM KINTEX-7 70T 32MB FLASH AES

  • Module/Board Type: FPGA
  • Core Processor: Kintex-7 70T
  • Co-Processor: -
  • Speed: 200MHz
  • Flash Size: 32MB
  • RAM Size: -
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
  • Operating Temperature: -40°C ~ 85°C
封装: -
库存7,424
TE0600-02IVFN
Trenz Electronic GmbH

SOM GIGABEE XC6SLX150 2X128MB 3I

  • Module/Board Type: FPGA
  • Core Processor: Spartan-6 LX-150
  • Co-Processor: -
  • Speed: 125MHz
  • Flash Size: 16MB
  • RAM Size: 256MB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
  • Operating Temperature: -40°C ~ 85°C
封装: -
库存4,352
TE0841-01-040-1I
Trenz Electronic GmbH

SOM USCALE XCKU040-1I 1GB DDR4

  • Module/Board Type: FPGA
  • Core Processor: Kintex UltraScale KU40
  • Co-Processor: -
  • Speed: -
  • Flash Size: 32MB
  • RAM Size: 4GB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
  • Operating Temperature: -40°C ~ 85°C
封装: -
库存6,896
TE0320-00-EV02IB
Trenz Electronic GmbH

SOM SPARTAN-3A 3400K 1333MB DDR

  • Module/Board Type: FPGA, USB Core
  • Core Processor: Spartan-3A DSP
  • Co-Processor: Cypress EZ-USB FX2LP
  • Speed: 100MHz
  • Flash Size: 4MB
  • RAM Size: 128MB
  • Connector Type: B2B
  • Size / Dimension: 2.7" x 1.9" (68mm x 48mm)
  • Operating Temperature: -40°C ~ 85°C
封装: -
库存6,336
TE0807-02-04EG-1E
Trenz Electronic GmbH

IC MODULE ZYNQ USCALE

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
封装: -
库存5,280
TE0820-03-02EG-1ED
Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

  • Module/Board Type: MPU Core
  • Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 2GB
  • Connector Type: B2B
  • Size / Dimension: 1.57" x 1.97" (40mm x 50mm)
  • Operating Temperature: 0°C ~ 85°C
封装: -
库存5,616
TE0841-02-035-1C
Trenz Electronic GmbH

SOM USCALE 2GB DDR4

  • Module/Board Type: FPGA Core
  • Core Processor: Kintex UltraScale KU035
  • Co-Processor: -
  • Speed: -
  • Flash Size: 64MB
  • RAM Size: 2GB
  • Connector Type: B2B
  • Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
  • Operating Temperature: 0°C ~ 70°C
封装: -
库存7,024
TE0803-02-04CG-1EB
Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 256MB

  • Module/Board Type: MPU Core
  • Core Processor: Zynq UltraScale+ XCZU4CG-1SFVC784E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 256MB
  • RAM Size: 2GB
  • Connector Type: B2B
  • Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
  • Operating Temperature: 0°C ~ 85°C
封装: -
库存6,512
TE0823-01-3PIU1F
Trenz Electronic GmbH

ICOBOARD

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A53, ARM® Cortex®-R5
  • Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 1GB
  • Connector Type: USB
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: -40°C ~ 85°C
封装: -
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TE0782-02-A2I33FA
Trenz Electronic GmbH

IC MODULE CORTEX

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7100)
  • Speed: -
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Board-to-Board (BTB) Socket - 480
  • Size / Dimension: 3.350" L x 3.350" W (85.00mm x 85.00mm)
  • Operating Temperature: -40°C ~ 85°C
封装: -
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TE0808-05-9GI21-A
Trenz Electronic GmbH

USOM+ MPSOC ZYNQ USCALE FPGA

  • Module/Board Type: MPU Core
  • Core Processor: Zynq UltraScale+ XCZU9EG-2FFVC900I
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 4GB
  • Connector Type: B2B
  • Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature: -40°C ~ 85°C
封装: -
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TE0830-01-ABI26FAP
Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

  • Module/Board Type: MPU Core
  • Core Processor: Zynq UltraScale+ ZU11EG-1I
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 16GB
  • Connector Type: 2 x 400 Pin
  • Size / Dimension: 4.724" L x 4.724" W (120.00mm x 120.00mm)
  • Operating Temperature: -40°C ~ 85°C
封装: -
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TE0823-01-3PIU1FA
Trenz Electronic GmbH

ICOBOARD

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A53, ARM® Cortex®-R5
  • Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 1GB
  • Connector Type: USB
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: -40°C ~ 85°C
封装: -
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TE0803-04-4BE11-A
Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

  • Module/Board Type: MPU Core
  • Core Processor: Zynq UltraScale+ XCZU4EG-1SFVC784E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 2GB
  • Connector Type: B2B
  • Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature: 0°C ~ 85°C
封装: -
Request a Quote
TE0820-03-2BE21FA
Trenz Electronic GmbH

MOD MPSOC

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
封装: -
Request a Quote
TE0715-05-71C33-A
Trenz Electronic GmbH

IC MOD

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7030)
  • Speed: 125MHz
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: 0°C ~ 70°C
封装: -
库存9
TE0720-04-61C33MA
Trenz Electronic GmbH

SOC MODULE WITH XILINX ZYNQ 7020

  • Module/Board Type: MPU Core
  • Core Processor: Zynq™ XC7Z020-1CLG484C
  • Co-Processor: ARM Cortex-A9
  • Speed: -
  • Flash Size: 32MB
  • RAM Size: 8GB
  • Connector Type: Board-to-Board (BTB) Socket
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: 0°C ~ 70°C
封装: -
Request a Quote
TE0600-03-83I11-A
Trenz Electronic GmbH

IC MODULE GIGABEE

  • Module/Board Type: FPGA Core
  • Core Processor: Spartan-6 LX-150
  • Co-Processor: -
  • Speed: 125MHz
  • Flash Size: 16MB
  • RAM Size: 256MB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: -40°C ~ 85°C
封装: -
Request a Quote
TE0741-05-D2C-1-A
Trenz Electronic GmbH

MODULE FPGA KINTEX

  • Module/Board Type: FPGA
  • Core Processor: Xilinx Kintex-7 FPGA XC7K325T-2FBG676C
  • Co-Processor: -
  • Speed: -
  • Flash Size: 32MB
  • RAM Size: -
  • Connector Type: Board-to-Board (BTB) Socket
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: 0°C ~ 70°C
封装: -
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TE0720-03-62I33NA
Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7020)
  • Speed: -
  • Flash Size: 32GB
  • RAM Size: 1GB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: 0°C ~ 70°C
封装: -
Request a Quote
TE0741-04-G2I-1-A
Trenz Electronic GmbH

MODULE FPGA KINTEX

  • Module/Board Type: FPGA Core
  • Core Processor: Xilinx Kintex-7 FPGA XC7K410T-2FBG676I
  • Co-Processor: -
  • Speed: -
  • Flash Size: 32MB
  • RAM Size: -
  • Connector Type: Board-to-Board (BTB) Socket
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: -40°C ~ 85°C
封装: -
Request a Quote
TE0714-03-35-2IC7
Trenz Electronic GmbH

IC MODULE ARTIX-7

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
封装: -
Request a Quote
TE0745-03-72I31-A
Trenz Electronic GmbH

SOM WITH AMD ZYNQ 7030-2I, 1 GBY

  • Module/Board Type: MPU Core
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Xilinx Zynq 7030 SoC XC7Z030-2FBG676I
  • Speed: -
  • Flash Size: 64MB
  • RAM Size: 1GB
  • Connector Type: Samtec ST5
  • Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature: -40°C ~ 85°C
封装: -
Request a Quote
TE0745-02-93E31-A
Trenz Electronic GmbH

MOD SOM DDR3L 1GB

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7045)
  • Speed: -
  • Flash Size: 64MB
  • RAM Size: 1GB
  • Connector Type: Board-to-Board (BTB) Socket - 480
  • Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature: -40°C ~ 85°C
封装: -
Request a Quote
TE0820-05-3BE81MA
Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
封装: -
Request a Quote
TE0745-02-92I31-A
Trenz Electronic GmbH

MOD SOM DDR3L 1GB

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7045)
  • Speed: -
  • Flash Size: 64MB
  • RAM Size: 1GB
  • Connector Type: Board-to-Board (BTB) Socket - 480
  • Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature: -40°C ~ 85°C
封装: -
Request a Quote
TE0714-03-50-2I
Trenz Electronic GmbH

IC MODULE

  • Module/Board Type: FPGA Core
  • Core Processor: Artix-7 A50T
  • Co-Processor: -
  • Speed: -
  • Flash Size: 16MB
  • RAM Size: 16MB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.180" L x 1.570" W (30.00mm x 40.00mm)
  • Operating Temperature: -40°C ~ 85°C
封装: -
库存105
TE0726-04-41I94-A
Trenz Electronic GmbH

IC MODULE ZYNQBERRY

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
封装: -
Request a Quote