Trenz Electronic GmbH 产品

TEP0001-01

Trenz Electronic GmbH

PMOD DUAL CAN-FD TRANSCEIVER

• Protocol: CAN
• Function: Transceiver
• Interface: -
• Standards: -
• Voltage - Supply: 3 V ~ 3.6 V
• Current - Supply: -
• Operating Temperature: -40°C ~ 125°C
• Package / Case: Module
• Supplier Device Package: Module

封装: Module

TE0741-02-410-2CF

Trenz Electronic GmbH

SOM KINTEX-7 410T 32MB FLASH AES

• Module/Board Type: FPGA
• Core Processor: Kintex-7 410T
• Co-Processor: -
• Speed: 200MHz
• Flash Size: 32MB
• RAM Size: -
• Connector Type: Samtec LSHM
• Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
• Operating Temperature: 0°C ~ 70°C

封装: -

TE0741-02-070-2IF

Trenz Electronic GmbH

SOM KINTEX-7 70T 32MB FLASH AES

• Module/Board Type: FPGA
• Core Processor: Kintex-7 70T
• Co-Processor: -
• Speed: 200MHz
• Flash Size: 32MB
• RAM Size: -
• Connector Type: Samtec LSHM
• Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
• Operating Temperature: -40°C ~ 85°C

封装: -

TE0600-02IVFN

Trenz Electronic GmbH

SOM GIGABEE XC6SLX150 2X128MB 3I

• Module/Board Type: FPGA
• Core Processor: Spartan-6 LX-150
• Co-Processor: -
• Speed: 125MHz
• Flash Size: 16MB
• RAM Size: 256MB
• Connector Type: Samtec LSHM
• Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
• Operating Temperature: -40°C ~ 85°C

封装: -

TE0841-01-040-1I

Trenz Electronic GmbH

SOM USCALE XCKU040-1I 1GB DDR4

• Module/Board Type: FPGA
• Core Processor: Kintex UltraScale KU40
• Co-Processor: -
• Speed: -
• Flash Size: 32MB
• RAM Size: 4GB
• Connector Type: Samtec LSHM
• Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
• Operating Temperature: -40°C ~ 85°C

封装: -

TE0320-00-EV02IB

Trenz Electronic GmbH

SOM SPARTAN-3A 3400K 1333MB DDR

• Module/Board Type: FPGA, USB Core
• Core Processor: Spartan-3A DSP
• Co-Processor: Cypress EZ-USB FX2LP
• Speed: 100MHz
• Flash Size: 4MB
• RAM Size: 128MB
• Connector Type: B2B
• Size / Dimension: 2.7" x 1.9" (68mm x 48mm)
• Operating Temperature: -40°C ~ 85°C

封装: -

TE0807-02-04EG-1E

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE

• Module/Board Type: -
• Core Processor: -
• Co-Processor: -
• Speed: -
• Flash Size: -
• RAM Size: -
• Connector Type: -
• Size / Dimension: -
• Operating Temperature: -

封装: -

TE0820-03-02EG-1ED

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

• Module/Board Type: MPU Core
• Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784E
• Co-Processor: -
• Speed: -
• Flash Size: 128MB
• RAM Size: 2GB
• Connector Type: B2B
• Size / Dimension: 1.57" x 1.97" (40mm x 50mm)
• Operating Temperature: 0°C ~ 85°C

封装: -

TE0841-02-035-1C

Trenz Electronic GmbH

SOM USCALE 2GB DDR4

• Module/Board Type: FPGA Core
• Core Processor: Kintex UltraScale KU035
• Co-Processor: -
• Speed: -
• Flash Size: 64MB
• RAM Size: 2GB
• Connector Type: B2B
• Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
• Operating Temperature: 0°C ~ 70°C

封装: -

TE0803-02-04CG-1EB

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 256MB

• Module/Board Type: MPU Core
• Core Processor: Zynq UltraScale+ XCZU4CG-1SFVC784E
• Co-Processor: -
• Speed: -
• Flash Size: 256MB
• RAM Size: 2GB
• Connector Type: B2B
• Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
• Operating Temperature: 0°C ~ 85°C

封装: -

TE0823-01-3PIU1F

Trenz Electronic GmbH

ICOBOARD

• Module/Board Type: MCU, FPGA
• Core Processor: ARM Cortex-A53, ARM® Cortex®-R5
• Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I
• Speed: -
• Flash Size: 128MB
• RAM Size: 1GB
• Connector Type: USB
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: -40°C ~ 85°C

封装: -

Request a Quote

TE0782-02-A2I33FA

Trenz Electronic GmbH

IC MODULE CORTEX

• Module/Board Type: MCU, FPGA
• Core Processor: ARM Cortex-A9
• Co-Processor: Zynq-7000 (Z-7100)
• Speed: -
• Flash Size: 32MB
• RAM Size: 1GB
• Connector Type: Board-to-Board (BTB) Socket - 480
• Size / Dimension: 3.350" L x 3.350" W (85.00mm x 85.00mm)
• Operating Temperature: -40°C ~ 85°C

封装: -

Request a Quote

TE0808-05-9GI21-A

Trenz Electronic GmbH

USOM+ MPSOC ZYNQ USCALE FPGA

• Module/Board Type: MPU Core
• Core Processor: Zynq UltraScale+ XCZU9EG-2FFVC900I
• Co-Processor: -
• Speed: -
• Flash Size: 128MB
• RAM Size: 4GB
• Connector Type: B2B
• Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
• Operating Temperature: -40°C ~ 85°C

封装: -

Request a Quote

TE0830-01-ABI26FAP

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

• Module/Board Type: MPU Core
• Core Processor: Zynq UltraScale+ ZU11EG-1I
• Co-Processor: -
• Speed: -
• Flash Size: 128MB
• RAM Size: 16GB
• Connector Type: 2 x 400 Pin
• Size / Dimension: 4.724" L x 4.724" W (120.00mm x 120.00mm)
• Operating Temperature: -40°C ~ 85°C

封装: -

Request a Quote

TE0823-01-3PIU1FA

Trenz Electronic GmbH

ICOBOARD

• Module/Board Type: MCU, FPGA
• Core Processor: ARM Cortex-A53, ARM® Cortex®-R5
• Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I
• Speed: -
• Flash Size: 128MB
• RAM Size: 1GB
• Connector Type: USB
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: -40°C ~ 85°C

封装: -

Request a Quote

TE0803-04-4BE11-A

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

• Module/Board Type: MPU Core
• Core Processor: Zynq UltraScale+ XCZU4EG-1SFVC784E
• Co-Processor: -
• Speed: -
• Flash Size: 128MB
• RAM Size: 2GB
• Connector Type: B2B
• Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
• Operating Temperature: 0°C ~ 85°C

封装: -

Request a Quote

TE0820-03-2BE21FA

Trenz Electronic GmbH

MOD MPSOC

• Module/Board Type: -
• Core Processor: -
• Co-Processor: -
• Speed: -
• Flash Size: -
• RAM Size: -
• Connector Type: -
• Size / Dimension: -
• Operating Temperature: -

封装: -

Request a Quote

TE0715-05-71C33-A

Trenz Electronic GmbH

IC MOD

• Module/Board Type: MCU, FPGA
• Core Processor: ARM Cortex-A9
• Co-Processor: Zynq-7000 (Z-7030)
• Speed: 125MHz
• Flash Size: 32MB
• RAM Size: 1GB
• Connector Type: Samtec LSHM
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: 0°C ~ 70°C

封装: -

TE0720-04-61C33MA

Trenz Electronic GmbH

SOC MODULE WITH XILINX ZYNQ 7020

• Module/Board Type: MPU Core
• Core Processor: Zynq™ XC7Z020-1CLG484C
• Co-Processor: ARM Cortex-A9
• Speed: -
• Flash Size: 32MB
• RAM Size: 8GB
• Connector Type: Board-to-Board (BTB) Socket
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: 0°C ~ 70°C

封装: -

Request a Quote

TE0600-03-83I11-A

Trenz Electronic GmbH

IC MODULE GIGABEE

• Module/Board Type: FPGA Core
• Core Processor: Spartan-6 LX-150
• Co-Processor: -
• Speed: 125MHz
• Flash Size: 16MB
• RAM Size: 256MB
• Connector Type: Samtec LSHM
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: -40°C ~ 85°C

封装: -

Request a Quote

TE0741-05-D2C-1-A

Trenz Electronic GmbH

MODULE FPGA KINTEX

• Module/Board Type: FPGA
• Core Processor: Xilinx Kintex-7 FPGA XC7K325T-2FBG676C
• Co-Processor: -
• Speed: -
• Flash Size: 32MB
• RAM Size: -
• Connector Type: Board-to-Board (BTB) Socket
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: 0°C ~ 70°C

封装: -

Request a Quote

TE0720-03-62I33NA

Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

• Module/Board Type: MCU, FPGA
• Core Processor: ARM Cortex-A9
• Co-Processor: Zynq-7000 (Z-7020)
• Speed: -
• Flash Size: 32GB
• RAM Size: 1GB
• Connector Type: Samtec LSHM
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: 0°C ~ 70°C

封装: -

Request a Quote

TE0741-04-G2I-1-A

Trenz Electronic GmbH

MODULE FPGA KINTEX

• Module/Board Type: FPGA Core
• Core Processor: Xilinx Kintex-7 FPGA XC7K410T-2FBG676I
• Co-Processor: -
• Speed: -
• Flash Size: 32MB
• RAM Size: -
• Connector Type: Board-to-Board (BTB) Socket
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: -40°C ~ 85°C

封装: -

Request a Quote

TE0714-03-35-2IC7

Trenz Electronic GmbH

IC MODULE ARTIX-7

• Module/Board Type: -
• Core Processor: -
• Co-Processor: -
• Speed: -
• Flash Size: -
• RAM Size: -
• Connector Type: -
• Size / Dimension: -
• Operating Temperature: -

封装: -

Request a Quote

TE0745-03-72I31-A

Trenz Electronic GmbH

SOM WITH AMD ZYNQ 7030-2I, 1 GBY

• Module/Board Type: MPU Core
• Core Processor: ARM Cortex-A9
• Co-Processor: Xilinx Zynq 7030 SoC XC7Z030-2FBG676I
• Speed: -
• Flash Size: 64MB
• RAM Size: 1GB
• Connector Type: Samtec ST5
• Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
• Operating Temperature: -40°C ~ 85°C

封装: -

Request a Quote

TE0745-02-93E31-A

Trenz Electronic GmbH

MOD SOM DDR3L 1GB

• Module/Board Type: MCU, FPGA
• Core Processor: ARM Cortex-A9
• Co-Processor: Zynq-7000 (Z-7045)
• Speed: -
• Flash Size: 64MB
• RAM Size: 1GB
• Connector Type: Board-to-Board (BTB) Socket - 480
• Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
• Operating Temperature: -40°C ~ 85°C

封装: -

Request a Quote

TE0820-05-3BE81MA

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

• Module/Board Type: -
• Core Processor: -
• Co-Processor: -
• Speed: -
• Flash Size: -
• RAM Size: -
• Connector Type: -
• Size / Dimension: -
• Operating Temperature: -

封装: -

Request a Quote

TE0745-02-92I31-A

Trenz Electronic GmbH

MOD SOM DDR3L 1GB

• Module/Board Type: MCU, FPGA
• Core Processor: ARM Cortex-A9
• Co-Processor: Zynq-7000 (Z-7045)
• Speed: -
• Flash Size: 64MB
• RAM Size: 1GB
• Connector Type: Board-to-Board (BTB) Socket - 480
• Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
• Operating Temperature: -40°C ~ 85°C

封装: -

Request a Quote

TE0714-03-50-2I

Trenz Electronic GmbH

IC MODULE

• Module/Board Type: FPGA Core
• Core Processor: Artix-7 A50T
• Co-Processor: -
• Speed: -
• Flash Size: 16MB
• RAM Size: 16MB
• Connector Type: Samtec LSHM
• Size / Dimension: 1.180" L x 1.570" W (30.00mm x 40.00mm)
• Operating Temperature: -40°C ~ 85°C

封装: -

TE0726-04-41I94-A

Trenz Electronic GmbH

IC MODULE ZYNQBERRY

• Module/Board Type: -
• Core Processor: -
• Co-Processor: -
• Speed: -
• Flash Size: -
• RAM Size: -
• Connector Type: -
• Size / Dimension: -
• Operating Temperature: -

封装: -

Request a Quote