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Trenz Electronic GmbH 产品

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TE0712-02-35-2I
Trenz Electronic GmbH

SOM ARTIX-7 XC7A35T-2I 1GB DDR3

  • Module/Board Type: FPGA
  • Core Processor: Artix-7 A35T
  • Co-Processor: -
  • Speed: 200MHz
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
  • Operating Temperature: -40°C ~ 85°C
封装: -
库存5,536
TE0630-01I
Trenz Electronic GmbH

SOM SPARTAN-6 1GB DDR3

  • Module/Board Type: FPGA, USB Core
  • Core Processor: Spartan-6 LX-45
  • Co-Processor: Cypress EZ-USB FX2LP
  • Speed: 100MHz
  • Flash Size: 8MB
  • RAM Size: 128MB
  • Connector Type: B2B
  • Size / Dimension: 1.6" x 1.9" (40.5mm x 47.5mm)
  • Operating Temperature: -40°C ~ 85°C
封装: -
库存7,008
TE0723-03
Trenz Electronic GmbH

SOM ARDUZYNQ 7Z10 USBOTG MICROSD

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7010)
  • Speed: 12MHz
  • Flash Size: 16MB
  • RAM Size: 512MB
  • Connector Type: B2B
  • Size / Dimension: -
  • Operating Temperature: 0°C ~ 70°C
封装: -
库存6,512
TE0741-03-325-2IF
Trenz Electronic GmbH

SOM KINTEX-7 325T 32MB FLASH AES

  • Module/Board Type: FPGA
  • Core Processor: Kintex-7 325T
  • Co-Processor: -
  • Speed: 200MHz
  • Flash Size: 32MB
  • RAM Size: -
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
  • Operating Temperature: -40°C ~ 85°C
封装: -
库存7,456
TE0720-03-1CR
Trenz Electronic GmbH

SOM SOC 7Z020-1CLG484C 256MB DDR

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7020)
  • Speed: -
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
  • Operating Temperature: 0°C ~ 70°C
封装: -
库存7,072
TE0820-02-02EG-1EA
Trenz Electronic GmbH

SOM USCALE+ XCZU2EG-1S 1GB DDR4

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
封装: -
库存5,712
TE0820-02-03EG-1EA
Trenz Electronic GmbH

SOM USCALE+ XCZU3EG-1S 1GB DDR4

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
封装: -
库存5,360
TE0745-02-45-2IA
Trenz Electronic GmbH

SOM ZYNQ 1GB DDR3

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM® Cortex®-A9
  • Co-Processor: Zynq-7000 (Z-7045)
  • Speed: -
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Samtec UFPS
  • Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
  • Operating Temperature: -40°C ~ 85°C
封装: -
库存6,816
TE0745-02-81C11-A
Trenz Electronic GmbH

SOM MIT XILINX ZYNQ

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM® Cortex®-A9
  • Co-Processor: Zynq-7000 (Z-7035)
  • Speed: -
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Samtec ST5
  • Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
  • Operating Temperature: -40°C ~ 85°C
封装: -
库存4,192
TE0715-04-52I33-A
Trenz Electronic GmbH

IC SOC MODULE 1GB DDR3L

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7015)
  • Speed: 125MHz
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: -40°C ~ 85°C
封装: -
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TE0813-01-3AE11-A
Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

  • Module/Board Type: MPU Core
  • Core Processor: Zynq UltraScale+ XCZU3CG-1SFVC784E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 2GB
  • Connector Type: Board-to-Board (BTB) Socket - 240
  • Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature: 0°C ~ 85°C
封装: -
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AM0010-02-5DE21MA
Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

  • Module/Board Type: MPU Core
  • Core Processor: Zynq™ UltraScale+™ ZU5EV-1E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 4GB
  • Connector Type: Board-to-Board (BTB) Socket
  • Size / Dimension: 2.220" L x 1.575" W (56.40mm x 40.00mm)
  • Operating Temperature: 0°C ~ 85°C
封装: -
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TE0720-03-2IFA
Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7020)
  • Speed: -
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: B2B
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: -40°C ~ 85°C
封装: -
Request a Quote
TE0600-04-83I21-A
Trenz Electronic GmbH

IC MODULE GIGABEE

  • Module/Board Type: FPGA
  • Core Processor: Xilinx Spartan™ 6 XC6SLX150-3FGG484I
  • Co-Processor: -
  • Speed: 125MHz
  • Flash Size: 16MB
  • RAM Size: 512MB
  • Connector Type: B2B
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: -40°C ~ 85°C
封装: -
Request a Quote
TE0745-02-91C11-A
Trenz Electronic GmbH

SOM 1GB DDR3 XC7Z045-1FBG676C

  • Module/Board Type: MPU Core
  • Core Processor: Xilinx Zynq XC7Z045-1FBG676C
  • Co-Processor: -
  • Speed: -
  • Flash Size: 64MB
  • RAM Size: 1GB
  • Connector Type: Samtec ST5
  • Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature: 0°C ~ 70°C
封装: -
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TE0745-02-91C31-A
Trenz Electronic GmbH

MOD SOM DDR3L 1GB

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7045)
  • Speed: -
  • Flash Size: 64MB
  • RAM Size: 1GB
  • Connector Type: Board-to-Board (BTB) Socket - 480
  • Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature: -40°C ~ 85°C
封装: -
Request a Quote
TE0720-03-31C33MA
Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7014S)
  • Speed: 766MHz
  • Flash Size: 8GB
  • RAM Size: 1GB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: 0°C ~ 70°C
封装: -
Request a Quote
TE0745-02-93E31-AK
Trenz Electronic GmbH

SOM WITH XILINX ZYNQ 7045-3E AND

  • Module/Board Type: MPU Core
  • Core Processor: Zynq™ 7045 SoC XC7Z045-3FFG676E
  • Co-Processor: ARM Cortex-A9
  • Speed: -
  • Flash Size: 64MB
  • RAM Size: 1GB
  • Connector Type: Board-to-Board (BTB) Socket
  • Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature: -40°C ~ 85°C
封装: -
Request a Quote
TE0820-04-3BE21FL
Trenz Electronic GmbH

MOD MPSOC ZU3EG-1E 2GB DDR4 IND

  • Module/Board Type: MPU Core
  • Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 2GB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: 0°C ~ 85°C
封装: -
Request a Quote
TE0808-04-06EG-1EK
Trenz Electronic GmbH

IC MOD SOM MPSOC

  • Module/Board Type: MPU Core
  • Core Processor: Zynq UltraScale+ XCZU6EG-1FFVC900E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 4GB
  • Connector Type: B2B
  • Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature: 0°C ~ 85°C
封装: -
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TE0713-03-82C46-A
Trenz Electronic GmbH

IC SOM ARTIX-7 FPGA DDR3

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
封装: -
Request a Quote
TE0745-03-82I31-A
Trenz Electronic GmbH

SOM WITH AMD ZYNQ 7035-2I, 1 GBY

  • Module/Board Type: MPU Core
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Xilinx Zynq 7035 SoC XC7Z035-2FBG676I
  • Speed: -
  • Flash Size: 64MB
  • RAM Size: 1GB
  • Connector Type: Board-to-Board (BTB) Socket - 250
  • Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature: -40°C ~ 85°C
封装: -
Request a Quote
TE0712-02-71I36-A
Trenz Electronic GmbH

FPGA MODULE ARTIX7

  • Module/Board Type: FPGA Core
  • Core Processor: Artix-7 A100T
  • Co-Processor: -
  • Speed: 200MHz
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: -40°C ~ 85°C
封装: -
Request a Quote
TE0712-02-72C36-A
Trenz Electronic GmbH

FPGA MODULE ARTIX7

  • Module/Board Type: FPGA Core
  • Core Processor: Artix-7 A100T
  • Co-Processor: -
  • Speed: 200MHz
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: 0°C ~ 85°C
封装: -
Request a Quote
TE0600-03-72C21-A
Trenz Electronic GmbH

IC MODULE GIGABEE

  • Module/Board Type: FPGA Core
  • Core Processor: Spartan-6 LX-100
  • Co-Processor: -
  • Speed: 125MHz
  • Flash Size: 16MB
  • RAM Size: 256MB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: 0°C ~ 70°C
封装: -
Request a Quote
TE0741-04-B2C-1-A
Trenz Electronic GmbH

IC MOD KINTEX-7 160T 200MHZ 32MB

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
封装: -
Request a Quote
TE0820-04-3AE21FA
Trenz Electronic GmbH

MOD MPSOC ZU3CG-1E 2GB DDR4 IND

  • Module/Board Type: MPU Core
  • Core Processor: Zynq UltraScale+ XCZU3CG-1SFVC784E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 2GB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: 0°C ~ 85°C
封装: -
Request a Quote
TE0808-05-9GI21-AK
Trenz Electronic GmbH

ULTRASOM+ MPSOC-MODULE WITH ZYNQ

  • Module/Board Type: MPU Core
  • Core Processor: Zynq UltraScale+ XCZU9EG-2FFVC900I
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 4GB
  • Connector Type: 4 x 160 Pin
  • Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature: -40°C ~ 85°C
封装: -
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TE0630-03-82I12-A
Trenz Electronic GmbH

FPGA MODULE WITH AMD SPARTAN 6 L

  • Module/Board Type: FPGA
  • Core Processor: Xilinx Spartan™ 6 XC6SLX150-2CSG484I
  • Co-Processor: -
  • Speed: -
  • Flash Size: 8MB
  • RAM Size: 128MB
  • Connector Type: Board-to-Board (BTB) Socket - 80
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: -40°C ~ 85°C
封装: -
Request a Quote
TE0600-04-72C11-A
Trenz Electronic GmbH

IC MODULE GIGABEE

  • Module/Board Type: FPGA
  • Core Processor: Xilinx Spartan™ 6 XC6SLX100-2FGG484C
  • Co-Processor: -
  • Speed: 125MHz
  • Flash Size: 16MB
  • RAM Size: 128MB
  • Connector Type: B2B
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: 0°C ~ 70°C
封装: -
Request a Quote