页 7 - Trenz Electronic GmbH 产品

零件编号	制造商	描述	封装	库存
TE0600-03IMVF	Trenz Electronic GmbH	SOM GIGABEE 2X512MB REV. 3 Module/Board Type: FPGA Core Processor: Spartan-6 LX-150 Co-Processor: - Speed: 125MHz Flash Size: 16MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存4,800
TE0600-03BM	Trenz Electronic GmbH	FPGA MICROMOD SPARTAN-6 LX Module/Board Type: FPGA Core Processor: Spartan-6 LX-100 Co-Processor: - Speed: 125MHz Flash Size: 16MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存5,424
TE0722-02	Trenz Electronic GmbH	SOM ZYNQ SOFT PROPELLER 40DIP Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7010) Speed: 33MHz Flash Size: 16MB RAM Size: - Connector Type: 40 Pin Size / Dimension: 0.71" x 2.01" (18mm x 51mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存7,776
TE0741-03-410-2CF	Trenz Electronic GmbH	SOM KINTEX-7 410T 32MB FLASH AES Module/Board Type: FPGA Core Processor: Kintex-7 410T Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: - Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存3,536
TE0715-04-15-1I	Trenz Electronic GmbH	SOM ZYNQ XC7Z015-1I 1GB DDR3 Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7015) Speed: 125MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存6,204
TE0723-03-07S-1C	Trenz Electronic GmbH	SOM ARDUZYNQ ZYNQ Z-7007S Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7007S) Speed: 766MHz Flash Size: 16MB RAM Size: 512MB Connector Type: B2B Size / Dimension: - Operating Temperature: 0°C ~ 70°C	封装: -	库存6,560
TE0720-03-1QF	Trenz Electronic GmbH	SOM ZYNQ XA7Z020-1Q 1GB DDR3 Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: -	封装: -	库存6,372
TE0712-02-200-1I	Trenz Electronic GmbH	SOM ARTIX-7 XC7A200T-1I 1GB DDR3 Module/Board Type: FPGA Core Processor: Artix-7 A200T Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存6,396
TEC0850-03-015EG1E	Trenz Electronic GmbH	IC MODULE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	库存5,232
TE0818-01-6BE21-A	Trenz Electronic GmbH	ULTRASOM+ MPSOC MODULE WITH ZYNQ Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU6EG-1FFVC900E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote
TE0820-04-4DE21FA	Trenz Electronic GmbH	MOD MPSOC ZU4EV-1E 2GB DDR4 IND Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU4EV-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote
TE0600-03-52I11-A	Trenz Electronic GmbH	IC MODULE GIGABEE Module/Board Type: FPGA Core Core Processor: Spartan-6 LX-45 Co-Processor: - Speed: 125MHz Flash Size: 16MB RAM Size: 256MB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote
TE0820-05-3AE81MA	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	Request a Quote
TE0865-02-FBE23MA	Trenz Electronic GmbH	MPSOC MODULE WITH ZYNQ ULTRASCAL Module/Board Type: MPU Core Core Processor: Zynq™ UltraScale+™ XCZU19EG-1FFVC1760E Co-Processor: - Speed: - Flash Size: 256MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 3.937" L x 2.953" W (100.00mm x 75.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote
TE0720-03-61C530A	Trenz Electronic GmbH	IC SOC MODULE XILINX ZYNQ Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: 125MHz Flash Size: - RAM Size: 256MB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C	封装: -	Request a Quote
TE0714-04-42I-7-B	Trenz Electronic GmbH	IC MODULE ARTIX-7 Module/Board Type: FPGA Core Processor: Artix-7 A35T Co-Processor: Artix-7 Speed: - Flash Size: 16MB RAM Size: - Connector Type: - Size / Dimension: 1.570" L x 1.180" W (40.00mm x 30.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote
TE0720-03-61Q33MA	Trenz Electronic GmbH	IC SOC MODULE XILINX ZYNQ Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: - Flash Size: 8GB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote
TE0720-03-61Q33FA	Trenz Electronic GmbH	IC SOC MODULE XILINX ZYNQ Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: 125MHz Flash Size: 4GB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote
TE0720-04-61Q33MA	Trenz Electronic GmbH	IC SOC MODULE XILINX ZYNQ Module/Board Type: Ethernet Core Core Processor: ARM® Cortex®-A9 Co-Processor: - Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote
TE0715-05-73E33-A	Trenz Electronic GmbH	SOC MODULE WITH XILINX ZYNQ 7030 Module/Board Type: MPU Core Core Processor: Zynq™ XC7Z030-3SBG485E Co-Processor: ARM Cortex-A9 Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote
TE0726-03-11C64-A	Trenz Electronic GmbH	IC MODULE ZYNQBERRY Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7007S) Speed: - Flash Size: 16MB RAM Size: 512MB Connector Type: CSI, DSI Size / Dimension: 1.180" L x 1.570" W (30.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C	封装: -	Request a Quote
TE0803-04-4AE11-A	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU4CG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote
TE0808-05-6BE81-A	Trenz Electronic GmbH	ULTRASOM+ MPSOC MODULE WITH ZYNQ Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	Request a Quote
TE0818-02-BBE81-A	Trenz Electronic GmbH	ULTRASOM+ MPSOC MODULE WITH AMD Module/Board Type: MPU Core Core Processor: Xilinx Zynq UltraScale+ XCZU15EG-1FFVC900E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket - 4 x 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote
TE0745-02-93E11-KA	Trenz Electronic GmbH	MOD SOM DDR3L 1GB Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7045) Speed: - Flash Size: 64MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket - 480 Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote
TE0715-04-71I33-A	Trenz Electronic GmbH	IC SOC MODULE 1GB DDR3L Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7030) Speed: 125MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote
AM0010-02-5DI21MA	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq™ UltraScale+™ ZU5EV-1I Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 2.220" L x 1.575" W (56.40mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote
TE0745-02-81C31-AK	Trenz Electronic GmbH	MOD SOM DDR3L 1GB Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7035) Speed: - Flash Size: 64MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket - 480 Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote
TE0712-02-72C36-C	Trenz Electronic GmbH	FPGA MODULE ARTIX7 Module/Board Type: FPGA Core Core Processor: Artix-7 A100T Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote
TE0741-04-B2C-1-AF	Trenz Electronic GmbH	MODULE FPGA KINTEX Module/Board Type: FPGA Core Core Processor: Xilinx Kintex-7 FPGA XC7K160T-2FFG676C Co-Processor: - Speed: - Flash Size: 32MB RAM Size: - Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C	封装: -	Request a Quote

TE0600-03IMVF

Trenz Electronic GmbH

SOM GIGABEE 2X512MB REV. 3

Module/Board Type: FPGA
Core Processor: Spartan-6 LX-150
Co-Processor: -
Speed: 125MHz
Flash Size: 16MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存4,800

TE0600-03BM

Trenz Electronic GmbH

FPGA MICROMOD SPARTAN-6 LX

Module/Board Type: FPGA
Core Processor: Spartan-6 LX-100
Co-Processor: -
Speed: 125MHz
Flash Size: 16MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存5,424

TE0722-02

Trenz Electronic GmbH

SOM ZYNQ SOFT PROPELLER 40DIP

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7010)
Speed: 33MHz
Flash Size: 16MB
RAM Size: -
Connector Type: 40 Pin
Size / Dimension: 0.71" x 2.01" (18mm x 51mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存7,776

TE0741-03-410-2CF

Trenz Electronic GmbH

SOM KINTEX-7 410T 32MB FLASH AES

Module/Board Type: FPGA
Core Processor: Kintex-7 410T
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: -
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存3,536

TE0715-04-15-1I

Trenz Electronic GmbH

SOM ZYNQ XC7Z015-1I 1GB DDR3

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7015)
Speed: 125MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存6,204

TE0723-03-07S-1C

Trenz Electronic GmbH

SOM ARDUZYNQ ZYNQ Z-7007S

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7007S)
Speed: 766MHz
Flash Size: 16MB
RAM Size: 512MB
Connector Type: B2B
Size / Dimension: -
Operating Temperature: 0°C ~ 70°C

封装: -

库存6,560

TE0720-03-1QF

Trenz Electronic GmbH

SOM ZYNQ XA7Z020-1Q 1GB DDR3

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: -

封装: -

库存6,372

TE0712-02-200-1I

Trenz Electronic GmbH

SOM ARTIX-7 XC7A200T-1I 1GB DDR3

Module/Board Type: FPGA
Core Processor: Artix-7 A200T
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存6,396

TEC0850-03-015EG1E

Trenz Electronic GmbH

IC MODULE

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

库存5,232

TE0818-01-6BE21-A

Trenz Electronic GmbH

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU6EG-1FFVC900E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

Request a Quote

TE0820-04-4DE21FA

Trenz Electronic GmbH

MOD MPSOC ZU4EV-1E 2GB DDR4 IND

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU4EV-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

Request a Quote

TE0600-03-52I11-A

Trenz Electronic GmbH

IC MODULE GIGABEE

Module/Board Type: FPGA Core
Core Processor: Spartan-6 LX-45
Co-Processor: -
Speed: 125MHz
Flash Size: 16MB
RAM Size: 256MB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

Request a Quote

TE0820-05-3AE81MA

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

Request a Quote

TE0865-02-FBE23MA

Trenz Electronic GmbH

MPSOC MODULE WITH ZYNQ ULTRASCAL

Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ XCZU19EG-1FFVC1760E
Co-Processor: -
Speed: -
Flash Size: 256MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 3.937" L x 2.953" W (100.00mm x 75.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

Request a Quote

TE0720-03-61C530A

Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Speed: 125MHz
Flash Size: -
RAM Size: 256MB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C

封装: -

Request a Quote

TE0714-04-42I-7-B

Trenz Electronic GmbH

IC MODULE ARTIX-7

Module/Board Type: FPGA
Core Processor: Artix-7 A35T
Co-Processor: Artix-7
Speed: -
Flash Size: 16MB
RAM Size: -
Connector Type: -
Size / Dimension: 1.570" L x 1.180" W (40.00mm x 30.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

Request a Quote

TE0720-03-61Q33MA

Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Speed: -
Flash Size: 8GB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

Request a Quote

TE0720-03-61Q33FA

Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Speed: 125MHz
Flash Size: 4GB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

Request a Quote

TE0720-04-61Q33MA

Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

Module/Board Type: Ethernet Core
Core Processor: ARM® Cortex®-A9
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

Request a Quote

TE0715-05-73E33-A

Trenz Electronic GmbH

SOC MODULE WITH XILINX ZYNQ 7030

Module/Board Type: MPU Core
Core Processor: Zynq™ XC7Z030-3SBG485E
Co-Processor: ARM Cortex-A9
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

Request a Quote

TE0726-03-11C64-A

Trenz Electronic GmbH

IC MODULE ZYNQBERRY

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7007S)
Speed: -
Flash Size: 16MB
RAM Size: 512MB
Connector Type: CSI, DSI
Size / Dimension: 1.180" L x 1.570" W (30.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C

封装: -

Request a Quote

TE0803-04-4AE11-A

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU4CG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

Request a Quote

TE0808-05-6BE81-A

Trenz Electronic GmbH

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

Request a Quote

TE0818-02-BBE81-A

Trenz Electronic GmbH

ULTRASOM+ MPSOC MODULE WITH AMD

Module/Board Type: MPU Core
Core Processor: Xilinx Zynq UltraScale+ XCZU15EG-1FFVC900E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket - 4 x 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

Request a Quote

TE0745-02-93E11-KA

Trenz Electronic GmbH

MOD SOM DDR3L 1GB

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7045)
Speed: -
Flash Size: 64MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket - 480
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

Request a Quote

TE0715-04-71I33-A

Trenz Electronic GmbH

IC SOC MODULE 1GB DDR3L

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7030)
Speed: 125MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

Request a Quote

AM0010-02-5DI21MA

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ ZU5EV-1I
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 2.220" L x 1.575" W (56.40mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

Request a Quote

TE0745-02-81C31-AK

Trenz Electronic GmbH

MOD SOM DDR3L 1GB

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7035)
Speed: -
Flash Size: 64MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket - 480
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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TE0712-02-72C36-C

Trenz Electronic GmbH

FPGA MODULE ARTIX7

Module/Board Type: FPGA Core
Core Processor: Artix-7 A100T
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

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TE0741-04-B2C-1-AF

Trenz Electronic GmbH

MODULE FPGA KINTEX

Module/Board Type: FPGA Core
Core Processor: Xilinx Kintex-7 FPGA XC7K160T-2FFG676C
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: -
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C

封装: -

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