图片 |
零件编号 |
制造商 |
描述 |
封装 |
库存 |
数量 |
Voltage - Collector Emitter Breakdown (Max) | Current - Collector (Ic) (Max) | Current - Collector Pulsed (Icm) | Vce(on) (Max) @ Vge, Ic | Power - Max | Switching Energy | Input Type | Gate Charge | Td (on/off) @ 25°C | Test Condition | Reverse Recovery Time (trr) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
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Infineon Technologies |
IGBT 3 CHIP 600V WAFER
|
封装: - |
Request a Quote |
|
600 V | 20 A | 60 A | 2.5V @ 15V, 20A | - | - | Standard | - | 21ns/110ns | 300V, 20A, 13Ohm, 15V | - | -55°C ~ 150°C (TJ) | Surface Mount | Die | Die |
||
Infineon Technologies |
IGBT TRENCH FS 650V 75A DIE
|
封装: - |
Request a Quote |
|
650 V | 75 A | 225 A | 2.22V @ 15V, 75A | - | - | Standard | - | - | - | - | -40°C ~ 175°C (TJ) | Surface Mount | Die | Die |
||
Infineon Technologies |
IGBT 600V 40A 170W TO220-3
|
封装: - |
Request a Quote |
|
600 V | 40 A | 80 A | 2.4V @ 15V, 20A | 170 W | 690µJ | Standard | 120 nC | 16ns/194ns | 400V, 20A, 14.6Ohm, 15V | 112 ns | -40°C ~ 175°C (TJ) | Through Hole | TO-220-3 | PG-TO220-3 |
||
Infineon Technologies |
TRENCH 40<-<100V
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
IGBT TRENCH FS 650V 23A TO252-3
|
封装: - |
库存8,970 |
|
650 V | 23 A | 42.5 A | 1.9V @ 15V, 8.5A | 75 W | 200µJ (on), 70µJ (off) | Standard | 27 nC | 30ns/106ns | 400V, 8.5A, 47Ohm, 15V | - | -40°C ~ 175°C (TJ) | Surface Mount | TO-252-3, DPAK (2 Leads + Tab), SC-63 | PG-TO252-3 |
||
Infineon Technologies |
TRENCH <= 40V
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
IGBT W/ULTRAFAST SOFT RECOVERY D
|
封装: - |
Request a Quote |
|
600 V | 31 A | 62 A | 2.2V @ 15V, 15A | 208 W | 220µJ (on), 340µJ (off) | Standard | 56 nC | 34ns/184ns | 400V, 15A, 22Ohm, 15V | - | -55°C ~ 150°C (TJ) | Through Hole | TO-262-3 Long Leads, I2PAK, TO-262AA | TO-262 |
||
Infineon Technologies |
IGBT 600V D2PAK-3
|
封装: - |
Request a Quote |
|
600 V | 12 A | 24 A | 2.5V @ 15V, 4A | 63 W | 73µJ (on), 47µJ (off) | Standard | 12 nC | 22ns/100ns | 400V, 4A, 100Ohm, 15V | - | -55°C ~ 175°C (TJ) | Surface Mount | TO-263-3, D2PAK (2 Leads + Tab), TO-263AB | D2PAK |
||
Infineon Technologies |
IGBT TRENCH 1200V 154A TO247-3
|
封装: - |
库存288 |
|
1200 V | 154 A | 225 A | 2V @ 15V, 75A | 630 W | 5.13mJ (on), 3.48mJ (off) | Standard | 450 nC | 38ns/190ns | 600V, 75A, 2.1Ohm, 15V | - | -40°C ~ 175°C (TJ) | Through Hole | TO-247-3 | PG-TO247-3-46 |
||
Infineon Technologies |
IGBT TRENCH FS 600V 30A DIE
|
封装: - |
Request a Quote |
|
600 V | 30 A | 90 A | 1.9V @ 15V, 30A | - | - | Standard | - | - | - | - | -40°C ~ 175°C (TJ) | Surface Mount | Die | Die |
||
Infineon Technologies |
IGBT TRENCH FS 600V 30A DIE
|
封装: - |
Request a Quote |
|
600 V | 30 A | 90 A | 1.9V @ 15V, 30A | - | - | Standard | - | - | - | - | -40°C ~ 175°C (TJ) | Surface Mount | Die | Die |
||
Infineon Technologies |
IGBT CHIP
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
IGBT 600V 19A 60W TO220-3
|
封装: - |
Request a Quote |
|
600 V | 19 A | 38 A | 1.6V @ 15V, 10A | 60 W | 120µJ (on), 2.05mJ (off) | Standard | 27 nC | 27ns/540ns | 480V, 10A, 50Ohm, 15V | - | -55°C ~ 150°C (TJ) | Through Hole | TO-220-3 | TO-220AB |
||
Infineon Technologies |
IGBT TRENCH FS 600V 200A DIE
|
封装: - |
Request a Quote |
|
600 V | 200 A | 600 A | 1.9V @ 15V, 200A | - | - | Standard | - | - | - | - | -40°C ~ 175°C (TJ) | Surface Mount | Die | Die |
||
Infineon Technologies |
IGBT TRENCH FS 600V 73A TO247-3
|
封装: - |
库存720 |
|
600 V | 73 A | 150 A | 2V @ 15V, 50A | 164 W | 1.5mJ (on), 1.42mJ (off) | Standard | 290 nC | 28ns/305ns | 400V, 50A, 7Ohm, 15V | 91 ns | -40°C ~ 175°C (TJ) | Through Hole | TO-247-3 | PG-TO247-3-AI |
||
Infineon Technologies |
IGBT 3 CHIP 600V
|
封装: - |
Request a Quote |
|
650 V | 50 A | 150 A | 1.77V @ 15V, 50A | - | - | Standard | - | - | - | - | -40°C ~ 175°C (TJ) | Surface Mount | Die | Die |
||
Infineon Technologies |
DISCRETE SWITCHES
|
封装: - |
库存6,000 |
|
650 V | 15 A | - | - | - | - | Standard | - | - | - | - | - | Surface Mount | TO-263-3, D2PAK (2 Leads + Tab), TO-263AB | PG-TO263-3-2 |
||
Infineon Technologies |
IGBT
|
封装: - |
库存333 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
IGBT TRENCH FS 1350V 60A TO247-3
|
封装: - |
库存585 |
|
1350 V | 60 A | 90 A | 1.95V @ 15V, 30A | 330 W | 1.4mJ (off) | Standard | 235 nC | -/310ns | 600V, 30A, 10Ohm, 15V | - | -40°C ~ 175°C (TJ) | Through Hole | TO-247-3 | PG-TO247-3 |
||
Infineon Technologies |
IGBT TRENCH FS 600V 50A DIE
|
封装: - |
Request a Quote |
|
600 V | 50 A | 150 A | 1.85V @ 15V, 50A | - | - | Standard | - | - | - | - | -40°C ~ 175°C (TJ) | Surface Mount | Die | Die |
||
Infineon Technologies |
IGBT TRENCH FS 600V 50A DIE
|
封装: - |
Request a Quote |
|
600 V | 50 A | 150 A | 1.85V @ 15V, 50A | - | - | Standard | - | - | - | - | -40°C ~ 175°C (TJ) | Surface Mount | Die | Die |
||
Infineon Technologies |
IGBT CHIP
|
封装: - |
Request a Quote |
|
1200 V | 25 A | - | 2.7V @ 15V, 10A | - | - | Standard | - | - | - | - | - | Surface Mount | Die | Die |
||
Infineon Technologies |
INSULATED GATE BIPOLAR TRANSISTO
|
封装: - |
Request a Quote |
|
1200 V | - | 300 A | 2.1V @ 15V, 100A | - | - | Standard | - | - | - | - | -55°C ~ 150°C (TJ) | Surface Mount | Die | Die |
||
Infineon Technologies |
IGBT NPT FS 1200V 50A TO247-3
|
封装: - |
库存11,889 |
|
1200 V | 50 A | 75 A | 2.2V @ 15V, 25A | 190 W | 4.2mJ | Standard | 155 nC | 50ns/560ns | 600V, 25A, 22Ohm, 15V | - | -40°C ~ 150°C (TJ) | Through Hole | TO-247-3 | PG-TO247-3-1 |
||
Infineon Technologies |
IGBT TRENCH FS 650V 30A TO263-3
|
封装: - |
库存2,748 |
|
650 V | 30 A | 45 A | 2.1V @ 15V, 15A | 105 W | 400µJ (on), 80µJ (off) | Standard | 38 nC | 16ns/145ns | 400V, 15A, 39Ohm, 15V | 70 ns | -40°C ~ 175°C (TJ) | Surface Mount | TO-263-3, D2PAK (2 Leads + Tab), TO-263AB | PG-TO263-3 |
||
Infineon Technologies |
TRENCH 40<-<100V
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
IGBT
|
封装: - |
库存3,000 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
BSM300GA160 - INSULATED GATE BIP
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
IGBT 3 CHIP 600V WAFER
|
封装: - |
Request a Quote |
|
600 V | 20 A | 60 A | 2.5V @ 15V, 20A | - | - | Standard | - | 21ns/110ns | 300V, 20A, 13Ohm, 15V | - | -55°C ~ 150°C (TJ) | Surface Mount | Die | Die |
||
Infineon Technologies |
IGBT 3 CHIP 600V WAFER
|
封装: - |
Request a Quote |
|
600 V | 20 A | 60 A | 2.5V @ 15V, 20A | - | - | Standard | - | 21ns/110ns | 300V, 20A, 13Ohm, 15V | - | -55°C ~ 150°C (TJ) | Surface Mount | Die | Die |