图片 |
零件编号 |
制造商 |
描述 |
封装 |
库存 |
数量 |
Voltage - Collector Emitter Breakdown (Max) | Current - Collector (Ic) (Max) | Current - Collector Pulsed (Icm) | Vce(on) (Max) @ Vge, Ic | Power - Max | Switching Energy | Input Type | Gate Charge | Td (on/off) @ 25°C | Test Condition | Reverse Recovery Time (trr) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IGBT TRENCH FS 650V 160A TO247-3
|
封装: - |
库存528 |
|
650 V | 160 A | 600 A | 1.65V @ 15V, 150A | 621 W | 5.8mJ (on), 5.4mJ (off) | Standard | 301 nC | 45ns/341ns | 400V, 150A, 10Ohm, 15V | 84 ns | -40°C ~ 175°C (TJ) | Through Hole | TO-247-3 | PG-TO247-3-46 |
||
Infineon Technologies |
IGBT TRENCH 600V 30A TO251-3
|
封装: - |
Request a Quote |
|
600 V | 30 A | 45 A | 2.1V @ 15V, 15A | 250 W | 900µJ | Standard | 90 nC | 16ns/183ns | 400V, 15A, 15Ohm, 15V | 110 ns | -40°C ~ 175°C (TJ) | Through Hole | TO-251-3 Short Leads, IPAK, TO-251AA | PG-TO251-3 |
||
Infineon Technologies |
IGBT 1200V 40A DIE
|
封装: - |
Request a Quote |
|
1200 V | - | 120 A | 2.42V @ 15V, 40A | - | - | Standard | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
IGBT TRENCH FS 600V 150A DIE
|
封装: - |
Request a Quote |
|
600 V | 150 A | 450 A | 1.9V @ 15V, 150A | - | - | Standard | - | - | - | - | -40°C ~ 175°C (TJ) | Surface Mount | Die | Die |
||
Infineon Technologies |
IGBT 3 CHIP 600V
|
封装: - |
Request a Quote |
|
600 V | 30 A | 90 A | 2.05V @ 15V, 30A | - | - | Standard | - | - | - | - | -40°C ~ 175°C (TJ) | Surface Mount | Die | Die |
||
Infineon Technologies |
IGBT TRENCH 1200V 154A TO247-3
|
封装: - |
库存606 |
|
1200 V | 154 A | 225 A | 2V @ 15V, 75A | 630 W | 5.13mJ (on), 3.48mJ (off) | Standard | 450 nC | 38ns/190ns | 600V, 75A, 2.1Ohm, 15V | - | -40°C ~ 175°C (TJ) | Through Hole | TO-247-3 | PG-TO247-3-55 |
||
Infineon Technologies |
IGBT TRENCH FS 600V 77A TO247-3
|
封装: - |
库存732 |
|
600 V | 77 A | 300 A | 2.3V @ 15V, 75A | 178 W | 2.65mJ (on), 1.3mJ (off) | Standard | 440 nC | 32ns/210ns | 400V, 75A, 5Ohm, 15V | 107 ns | -40°C ~ 175°C (TJ) | Through Hole | TO-247-3 | PG-TO247-3-AI |
||
Infineon Technologies |
IGBT TRENCH 100V
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
IGBT TRENCH FS 1200V 109A TO247
|
封装: - |
库存510 |
|
1200 V | 109 A | 300 A | 2.15V @ 15V, 75A | 549 W | 2.01mJ (on), 1.76mJ (off) | Standard | 550 nC | 40ns/359ns | - | 95 ns | -40°C ~ 175°C (TJ) | Through Hole | TO-247-4 | PG-TO247-4-U02 |
||
Infineon Technologies |
IGBT 750V 150A TO247-3
|
封装: - |
库存645 |
|
750 V | 150 A | 360 A | 1.65V @ 15V, 120A | 577 W | 6.4mJ (on), 3.4mJ (off) | Standard | 481 nC | 57ns/285ns | 450V, 120A, 4.8Ohm, 15V | - | -40°C ~ 175°C (TJ) | Through Hole | TO-247-3 | PG-TO247-3-51 |
||
Infineon Technologies |
IGBT TRENCH FS 600V 40A TO263-3
|
封装: - |
库存2,868 |
|
600 V | 40 A | 80 A | 2.4V @ 15V, 20A | 170 W | 690µJ | Standard | 120 nC | 16ns/194ns | 400V, 20A, 14.6Ohm, 15V | - | -40°C ~ 175°C (TJ) | Surface Mount | TO-263-3, D2PAK (2 Leads + Tab), TO-263AB | PG-TO263-3 |
||
Infineon Technologies |
IGBT 3 CHIP 600V WAFER
|
封装: - |
Request a Quote |
|
600 V | 30 A | 90 A | 2.5V @ 15V, 30A | - | - | Standard | - | 44ns/324ns | 400V, 30A, 11Ohm, 15V | - | -55°C ~ 150°C (TJ) | Surface Mount | Die | Die |
||
Infineon Technologies |
FZ1200R16 - INSULATED GATE BIPOL
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
IGBT
|
封装: - |
库存2,250 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
IGBT 3 CHIP 600V 200A WAFER
|
封装: - |
Request a Quote |
|
600 V | 200 A | 600 A | 1.9V @ 15V, 200A | - | - | Standard | - | - | - | - | -40°C ~ 175°C (TJ) | Surface Mount | Die | Die |
||
Infineon Technologies |
IGBT TRENCH FS 600V 200A DIE
|
封装: - |
Request a Quote |
|
600 V | 200 A | 600 A | 1.9V @ 15V, 200A | - | - | Standard | - | - | - | - | -40°C ~ 175°C (TJ) | Surface Mount | Die | Die |
||
Infineon Technologies |
IGBT 1200V 10A SAWN ON FOIL
|
封装: - |
Request a Quote |
|
1200 V | - | 30 A | 2.07V @ 15V, 8A | - | - | Standard | - | - | - | - | -40°C ~ 175°C (TJ) | Surface Mount | Die | Die |
||
Infineon Technologies |
DISCRETE SWITCHES
|
封装: - |
Request a Quote |
|
650 V | 50 A | - | - | - | - | Standard | - | - | - | - | - | Surface Mount | TO-263-3, D2PAK (2 Leads + Tab), TO-263AB | PG-TO263-3-2 |
||
Infineon Technologies |
IGBT IGNITION LL
|
封装: - |
Request a Quote |
|
430 V | 14 A | - | 2.65V @ 4.5V, 10A | - | - | Logic | - | - | - | - | -40°C ~ 175°C (TJ) | Surface Mount | Die | Die |
||
Infineon Technologies |
IGBT TRENCH FS 600V 150A DIE
|
封装: - |
Request a Quote |
|
600 V | 150 A | 450 A | 1.9V @ 15V, 150A | - | - | Standard | - | - | - | - | -40°C ~ 175°C (TJ) | Surface Mount | Die | Die |
||
Infineon Technologies |
IGBT 650V 28A TO220-3
|
封装: - |
Request a Quote |
|
650 V | 38 A | 90 A | 1.9V @ 15V, 28A | 130 W | 530µJ (on), 400µJ (off) | Standard | 50 nC | 27ns/184ns | 400V, 28A, 34Ohm, 15V | 73 ns | -40°C ~ 175°C (TJ) | Through Hole | TO-220-3 | PG-TO220-3 |
||
Infineon Technologies |
IGBT 3 CHIP 600V WAFER
|
封装: - |
Request a Quote |
|
600 V | 10 A | 30 A | 2.5V @ 15V, 10A | - | - | Standard | - | 20ns/110ns | 300V, 10A, 27Ohm, 15V | - | -55°C ~ 150°C (TJ) | Surface Mount | Die | Die |
||
Infineon Technologies |
IGBT CHIP
|
封装: - |
Request a Quote |
|
600 V | 10 A | - | 1.3V @ 15V, 2A | - | - | Standard | - | - | - | - | - | Surface Mount | Die | Die |
||
Infineon Technologies |
IGBT TRENCH
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
IGBT TRENCH
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
IGBT TRENCH FS 1200V 92A TO247-3
|
封装: - |
库存1,140 |
|
1200 V | 92 A | 300 A | 2.15V @ 15V, 75A | 549 W | 4.22mJ (on), 1.66mJ (off) | Standard | 535 nC | 55ns/461ns | - | 145 ns | -40°C ~ 175°C (TJ) | Through Hole | TO-247-3 | PG-TO247-3-U06 |
||
Infineon Technologies |
IGBT 3 CHIP 600V WAFER
|
封装: - |
Request a Quote |
|
600 V | 20 A | 60 A | 2.5V @ 15V, 20A | - | - | Standard | - | 21ns/110ns | 300V, 20A, 13Ohm, 15V | - | -55°C ~ 150°C (TJ) | Surface Mount | Die | Die |
||
Infineon Technologies |
IGBT 3 CHIP 600V WAFER
|
封装: - |
Request a Quote |
|
600 V | 20 A | 60 A | 2.5V @ 15V, 20A | - | - | Standard | - | 21ns/110ns | 300V, 20A, 13Ohm, 15V | - | -55°C ~ 150°C (TJ) | Surface Mount | Die | Die |
||
Infineon Technologies |
IGBT 3 CHIP 600V WAFER
|
封装: - |
Request a Quote |
|
600 V | 20 A | 60 A | 2.5V @ 15V, 20A | - | - | Standard | - | 21ns/110ns | 300V, 20A, 13Ohm, 15V | - | -55°C ~ 150°C (TJ) | Surface Mount | Die | Die |
||
Infineon Technologies |
IGBT 3 CHIP 600V WAFER
|
封装: - |
Request a Quote |
|
600 V | 20 A | 60 A | 2.5V @ 15V, 20A | - | - | Standard | - | 21ns/110ns | 300V, 20A, 13Ohm, 15V | - | -55°C ~ 150°C (TJ) | Surface Mount | Die | Die |