页 49 - 嵌入式 - 微控制器，微处理器，FPGA 模块 | 集成电路（IC）

零件编号	制造商	描述	封装	库存	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
DC-ME-01T-MF-50	Digi International	MODULE ME 8MB 2MB FLASH 50PK Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 2MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存6,176	ARM7TDMI, NS7520	-	55MHz	2MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 85°C
CC-9P-V236-Z1-B	Digi International	MODULE 9P 64MB SDRAM 64MB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	库存3,456	-	-	-	-	-	-	-	-
CC-9P-T237-Z1-B	Digi International	MODULE 9P 64MB SDRAM 128MB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	库存3,040	-	-	-	-	-	-	-	-
SOMOMAP3530-11-1672IFCR	Logic	SYSTEM ON MODULE LV OMAP3530 Module/Board Type: MPU, DSP Core Core Processor: ARM? Cortex?-A8, OMAP3530 Co-Processor: TMS320C64x (DSP) Speed: 600MHz Flash Size: 256MB (NAND), 8MB (NOR) RAM Size: 128MB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 1.23" x 3.01" (31.2mm x 76.5mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存7,856	ARM? Cortex?-A8, OMAP3530	TMS320C64x (DSP)	600MHz	256MB (NAND), 8MB (NOR)	128MB	Board-to-Board (BTB) Socket - 240	1.23" x 3.01" (31.2mm x 76.5mm)	0°C ~ 70°C
101-0522	Digi International	MODULE RABBITCORE RCM3220 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 44.2MHz Flash Size: 512KB RAM Size: 768KB Connector Type: 2 IDC Headers 2x17 Size / Dimension: 1.85" x 2.73" (47mm x 69mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存6,784	Rabbit 3000	-	44.2MHz	512KB	768KB	2 IDC Headers 2x17	1.85" x 2.73" (47mm x 69mm)	0°C ~ 70°C
CENGLH7A404-11-504HCR-B	Logic	CARD ENGINE 64MB SDRAM Module/Board Type: MPU Core Core Processor: ARM922T, LH7A404 Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存4,640	ARM922T, LH7A404	-	200MHz	32MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
101-0453	Digi International	MODULE RABBITCORE RCM2300 Module/Board Type: MPU Core Core Processor: Rabbit 2000 Co-Processor: - Speed: 22.1MHz Flash Size: 256KB RAM Size: 128KB Connector Type: 2 IDC Headers 2x26 Size / Dimension: 1.15" x 1.6" (29mm x 41mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存7,168	Rabbit 2000	-	22.1MHz	256KB	128KB	2 IDC Headers 2x26	1.15" x 1.6" (29mm x 41mm)	-40°C ~ 85°C
SOMAM1808-10-1602QHIR	Logic	SYSTEM ON MODULE AM1808 Module/Board Type: MPU Core Core Processor: ARM926EJ-S, AM1808 Co-Processor: - Speed: 450MHz Flash Size: 8MB RAM Size: 128MB Connector Type: - Size / Dimension: 1.18" x 1.57" (30mm x 40mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存7,760	ARM926EJ-S, AM1808	-	450MHz	8MB	128MB	-	1.18" x 1.57" (30mm x 40mm)	-40°C ~ 85°C
CC-9P-V524-LX	Digi International	MODULE 9P 32MB SDRAM 16MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9215 Co-Processor: - Speed: 150MHz Flash Size: 16MB RAM Size: 32MB Connector Type: Board-to-Board (BTB) Socket - 160 Size / Dimension: 1.97" x 1.97" (50mm x 50mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存3,728	ARM926EJ-S, NS9215	-	150MHz	16MB	32MB	Board-to-Board (BTB) Socket - 160	1.97" x 1.97" (50mm x 50mm)	-40°C ~ 85°C
5CSX-H6-42A-RI	Critical Link LLC	MITYSOM-5CSX W/ ALTERA CYCLONE V Module/Board Type: MPU, FPGA Core Core Processor: ARM? Cortex?-A9, Cyclone V SX/SE Co-Processor: NEON SIMD Speed: 800MHz Flash Size: 32MB RAM Size: 1.25GB Connector Type: Edge Connector Size / Dimension: 3.2" x 1.5" (82mm x 39mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存3,600	ARM? Cortex?-A9, Cyclone V SX/SE	NEON SIMD	800MHz	32MB	1.25GB	Edge Connector	3.2" x 1.5" (82mm x 39mm)	-40°C ~ 85°C
100-1500-1	Bluetechnix GmbH	MODULE QSEVEN-I.MX537 Module/Board Type: MPU Core Core Processor: i.MX537 Co-Processor: - Speed: 800MHz Flash Size: 2GB (NAND), 4MB (NOR) RAM Size: 1GB Connector Type: Qseven Card-Edge 230 Size / Dimension: 2.76" x 2.76" (70mm x 70mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存4,096	i.MX537	-	800MHz	2GB (NAND), 4MB (NOR)	1GB	Qseven Card-Edge 230	2.76" x 2.76" (70mm x 70mm)	-40°C ~ 85°C
DC-SP-01-C	Digi International	ADAPTER SP CUSTOMIZABLE MODEL Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 4MB RAM Size: 16MB Connector Type: RJ45 Size / Dimension: 3.88" x 1.68" (98.5mm x 42.7mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存4,096	ARM7TDMI, NS7520	-	55MHz	4MB	16MB	RJ45	3.88" x 1.68" (98.5mm x 42.7mm)	-40°C ~ 85°C
BS1-IC	Parallax Inc.	BASIC STAMP I MODULE Module/Board Type: MCU Core Core Processor: PIC16C56A Co-Processor: - Speed: 4MHz Flash Size: 256B EEPROM RAM Size: 16B Connector Type: - Size / Dimension: 1.4" x 0.6" (35.6mm x 15.2mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存6,456	PIC16C56A	-	4MHz	256B EEPROM	16B	-	1.4" x 0.6" (35.6mm x 15.2mm)	0°C ~ 70°C
DC-ME4-01T-DYN	Digi International	MODULE DIGI CONNECT ME Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 4MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存2,656	ARM7TDMI, NS7520	-	55MHz	4MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 85°C
SOMOMAP3530-12-1783IFXR	Logic	SOM OMAP3530 SOM-LV TY Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	库存4,336	-	-	-	-	-	-	-	-
TE0803-01-02EG-1EA	Trenz Electronic GmbH	SOM USCALE+ XCZU2EG-1S 2GB DDR4 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	库存7,904	-	-	-	-	-	-	-	-
DLP-FR256	DLP Design Inc.	MICROCONTROLLER FERROELECTRIC Module/Board Type: MCU Core Core Processor: 16-Bit RISC Co-Processor: - Speed: 16MHz Flash Size: 256KB FRAM RAM Size: 8K x 8 Connector Type: USB - B Size / Dimension: 2.22" x 0.9" (56.4mm x 22.9mm) Operating Temperature: -	封装: -	库存5,296	16-Bit RISC	-	16MHz	256KB FRAM	8K x 8	USB - B	2.22" x 0.9" (56.4mm x 22.9mm)	-
G400S-SM-480	GHI Electronics, LLC	IC MOD ARM926EJ-S 400MHZ 32KB Module/Board Type: MPU Core Core Processor: ARM926EJ-S Co-Processor: - Speed: 400MHz Flash Size: 4MB (External) RAM Size: 32KB (Internal), 128MB (External) Connector Type: - Size / Dimension: 1.90" x 1.30" (48.3mm x 33.1mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存5,808	ARM926EJ-S	-	400MHz	4MB (External)	32KB (Internal), 128MB (External)	-	1.90" x 1.30" (48.3mm x 33.1mm)	-40°C ~ 85°C
OSD32MP157F-512M-BAA	Octavo Systems LLC	SIP: 157F, 512MB, BAA Module/Board Type: MPU Core Core Processor: Arm® Dual Cortex®-A7, Arm® Cortex®-M4 Co-Processor: NEON™ SIMD Speed: 800MHz Flash Size: - RAM Size: 512MB Connector Type: 302-BGA Size / Dimension: 0.710" L x 0.710" W (18.00mm x 18.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote	Arm® Dual Cortex®-A7, Arm® Cortex®-M4	NEON™ SIMD	800MHz	-	512MB	302-BGA	0.710" L x 0.710" W (18.00mm x 18.00mm)	0°C ~ 85°C
TE0741-05-G2C-1-A	Trenz Electronic GmbH	MODULE FPGA KINTEX Module/Board Type: FPGA Core Processor: Xilinx Kintex-7 FPGA XC7K410T-2FBG676C Co-Processor: - Speed: - Flash Size: 32MB RAM Size: - Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C	封装: -	Request a Quote	Xilinx Kintex-7 FPGA XC7K410T-2FBG676C	-	-	32MB	-	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 70°C
CYCLONE-10-LP	Intel	PROTOTYPE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	Request a Quote	-	-	-	-	-	-	-	-
FORLINX-FET1012A-C-10512MOE01IA11	Forlinx Embedded	NXP LS1012ASOM,512MB DDR3L 8GB e Module/Board Type: MPU Core Processor: ARM® Cortex®-A53 Co-Processor: - Speed: 1.0GHz Flash Size: 8GB eMMC, 16Mb QSPI RAM Size: 512MB Connector Type: Board-to-Board (BTB) Socket - 160 Size / Dimension: 1.770" L x 1.570" W (45.00mm x 40.00mm) Operating Temperature: -40°C ~ 80°C	封装: -	Request a Quote	ARM® Cortex®-A53	-	1.0GHz	8GB eMMC, 16Mb QSPI	512MB	Board-to-Board (BTB) Socket - 160	1.770" L x 1.570" W (45.00mm x 40.00mm)	-40°C ~ 80°C
RK3328-SOM-2G	Olimex LTD	IC Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53 Co-Processor: - Speed: 1.5GHz Flash Size: - RAM Size: 2GB Connector Type: USB Size / Dimension: - Operating Temperature: -	封装: -	Request a Quote	ARM® Cortex®-A53	-	1.5GHz	-	2GB	USB	-	-
TE0820-03-3BE21FA	Trenz Electronic GmbH	MOD MPSOC Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote	Zynq UltraScale+ XCZU3EG-1SFVC784E	-	-	128MB	2GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
TE0720-03-62I33FL	Trenz Electronic GmbH	IC SOC MODULE XILINX ZYNQ Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: 125MHz Flash Size: 4GB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7020)	125MHz	4GB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0715-04-30-3E	Trenz Electronic GmbH	IC SOC MODULE 1GB DDR3L Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7030) Speed: 125MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7030)	125MHz	32MB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
A10S-P8-A5E-RI-SB	Critical Link LLC	ARRIA 10 SOC MODULE, 270KLE, 6GB Module/Board Type: MPU, FPGA Core Core Processor: ARM® Cortex®-A9 Co-Processor: NEON™ SIMD Speed: 1.2GHz Flash Size: - RAM Size: 4GB Connector Type: Board-to-Board (BTB) Size / Dimension: 4.000" L x 4.000" W (101.50mm x 101.50mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存51	ARM® Cortex®-A9	NEON™ SIMD	1.2GHz	-	4GB	Board-to-Board (BTB)	4.000" L x 4.000" W (101.50mm x 101.50mm)	-40°C ~ 85°C
EC-VA-H264-8B-60-1080-MXC-ZL	System-On-Chip (SOC) Technologies Inc.	IC MOD ARTIX-7 A200T 256KB 32MB Module/Board Type: FPGA Core Core Processor: Artix-7 A200T Co-Processor: - Speed: - Flash Size: 32MB RAM Size: 256KB Connector Type: SO-DIMM-204 Size / Dimension: 2.700" L x 2.000" W (68.00mm x 51.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote	Artix-7 A200T	-	-	32MB	256KB	SO-DIMM-204	2.700" L x 2.000" W (68.00mm x 51.00mm)	0°C ~ 85°C
TE0741-04-A2C-1-A	Trenz Electronic GmbH	MODULE FPGA KINTEX Module/Board Type: FPGA Core Core Processor: Xilinx Kintex-7 FPGA XC7K70T-2FBG676C Co-Processor: - Speed: - Flash Size: 32MB RAM Size: - Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C	封装: -	Request a Quote	Xilinx Kintex-7 FPGA XC7K70T-2FBG676C	-	-	32MB	-	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 70°C
DC-VA-H264-10B-60-4K-OPVIC-0000	System-On-Chip (SOC) Technologies Inc.	DECODER H264 4K VID/AUD 10BIT Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	Request a Quote	-	-	-	-	-	-	-	-

DC-ME-01T-MF-50

Digi International

MODULE ME 8MB 2MB FLASH 50PK

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 2MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存6,176

ARM7TDMI, NS7520

-

55MHz

2MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 85°C

CC-9P-V236-Z1-B

Digi International

MODULE 9P 64MB SDRAM 64MB FLASH

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

库存3,456

-

CC-9P-T237-Z1-B

Digi International

MODULE 9P 64MB SDRAM 128MB FLASH

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

库存3,040

-

SOMOMAP3530-11-1672IFCR

Logic

SYSTEM ON MODULE LV OMAP3530

Module/Board Type: MPU, DSP Core
Core Processor: ARM? Cortex?-A8, OMAP3530
Co-Processor: TMS320C64x (DSP)
Speed: 600MHz
Flash Size: 256MB (NAND), 8MB (NOR)
RAM Size: 128MB
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 1.23" x 3.01" (31.2mm x 76.5mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存7,856

ARM? Cortex?-A8, OMAP3530

TMS320C64x (DSP)

600MHz

256MB (NAND), 8MB (NOR)

128MB

Board-to-Board (BTB) Socket - 240

1.23" x 3.01" (31.2mm x 76.5mm)

0°C ~ 70°C

101-0522

Digi International

MODULE RABBITCORE RCM3220

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 44.2MHz
Flash Size: 512KB
RAM Size: 768KB
Connector Type: 2 IDC Headers 2x17
Size / Dimension: 1.85" x 2.73" (47mm x 69mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存6,784

Rabbit 3000

-

44.2MHz

512KB

768KB

2 IDC Headers 2x17

1.85" x 2.73" (47mm x 69mm)

0°C ~ 70°C

CENGLH7A404-11-504HCR-B

Logic

CARD ENGINE 64MB SDRAM

Module/Board Type: MPU Core
Core Processor: ARM922T, LH7A404
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存4,640

ARM922T, LH7A404

-

200MHz

32MB

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

0°C ~ 70°C

101-0453

Digi International

MODULE RABBITCORE RCM2300

Module/Board Type: MPU Core
Core Processor: Rabbit 2000
Co-Processor: -
Speed: 22.1MHz
Flash Size: 256KB
RAM Size: 128KB
Connector Type: 2 IDC Headers 2x26
Size / Dimension: 1.15" x 1.6" (29mm x 41mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存7,168

Rabbit 2000

-

22.1MHz

256KB

128KB

2 IDC Headers 2x26

1.15" x 1.6" (29mm x 41mm)

-40°C ~ 85°C

SOMAM1808-10-1602QHIR

Logic

SYSTEM ON MODULE AM1808

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, AM1808
Co-Processor: -
Speed: 450MHz
Flash Size: 8MB
RAM Size: 128MB
Connector Type: -
Size / Dimension: 1.18" x 1.57" (30mm x 40mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存7,760

ARM926EJ-S, AM1808

-

450MHz

8MB

128MB

-

1.18" x 1.57" (30mm x 40mm)

-40°C ~ 85°C

CC-9P-V524-LX

Digi International

MODULE 9P 32MB SDRAM 16MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9215
Co-Processor: -
Speed: 150MHz
Flash Size: 16MB
RAM Size: 32MB
Connector Type: Board-to-Board (BTB) Socket - 160
Size / Dimension: 1.97" x 1.97" (50mm x 50mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存3,728

ARM926EJ-S, NS9215

-

150MHz

16MB

32MB

Board-to-Board (BTB) Socket - 160

1.97" x 1.97" (50mm x 50mm)

-40°C ~ 85°C

5CSX-H6-42A-RI

Critical Link LLC

MITYSOM-5CSX W/ ALTERA CYCLONE V

Module/Board Type: MPU, FPGA Core
Core Processor: ARM? Cortex?-A9, Cyclone V SX/SE
Co-Processor: NEON SIMD
Speed: 800MHz
Flash Size: 32MB
RAM Size: 1.25GB
Connector Type: Edge Connector
Size / Dimension: 3.2" x 1.5" (82mm x 39mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存3,600

ARM? Cortex?-A9, Cyclone V SX/SE

NEON SIMD

800MHz

32MB

1.25GB

Edge Connector

3.2" x 1.5" (82mm x 39mm)

-40°C ~ 85°C

100-1500-1

Bluetechnix GmbH

MODULE QSEVEN-I.MX537

Module/Board Type: MPU Core
Core Processor: i.MX537
Co-Processor: -
Speed: 800MHz
Flash Size: 2GB (NAND), 4MB (NOR)
RAM Size: 1GB
Connector Type: Qseven Card-Edge 230
Size / Dimension: 2.76" x 2.76" (70mm x 70mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存4,096

i.MX537

-

800MHz

2GB (NAND), 4MB (NOR)

1GB

Qseven Card-Edge 230

2.76" x 2.76" (70mm x 70mm)

-40°C ~ 85°C

DC-SP-01-C

Digi International

ADAPTER SP CUSTOMIZABLE MODEL

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 4MB
RAM Size: 16MB
Connector Type: RJ45
Size / Dimension: 3.88" x 1.68" (98.5mm x 42.7mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存4,096

ARM7TDMI, NS7520

-

55MHz

4MB

16MB

RJ45

3.88" x 1.68" (98.5mm x 42.7mm)

-40°C ~ 85°C

BS1-IC

Parallax Inc.

BASIC STAMP I MODULE

Module/Board Type: MCU Core
Core Processor: PIC16C56A
Co-Processor: -
Speed: 4MHz
Flash Size: 256B EEPROM
RAM Size: 16B
Connector Type: -
Size / Dimension: 1.4" x 0.6" (35.6mm x 15.2mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存6,456

PIC16C56A

-

4MHz

256B EEPROM

16B

-

1.4" x 0.6" (35.6mm x 15.2mm)

0°C ~ 70°C

DC-ME4-01T-DYN

Digi International

MODULE DIGI CONNECT ME

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 4MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存2,656

ARM7TDMI, NS7520

-

55MHz

4MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 85°C

SOMOMAP3530-12-1783IFXR

Logic

SOM OMAP3530 SOM-LV TY

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

库存4,336

-

TE0803-01-02EG-1EA

Trenz Electronic GmbH

SOM USCALE+ XCZU2EG-1S 2GB DDR4

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

库存7,904

-

DLP-FR256

DLP Design Inc.

MICROCONTROLLER FERROELECTRIC

Module/Board Type: MCU Core
Core Processor: 16-Bit RISC
Co-Processor: -
Speed: 16MHz
Flash Size: 256KB FRAM
RAM Size: 8K x 8
Connector Type: USB - B
Size / Dimension: 2.22" x 0.9" (56.4mm x 22.9mm)
Operating Temperature: -

封装: -

库存5,296

16-Bit RISC

-

16MHz

256KB FRAM

8K x 8

USB - B

2.22" x 0.9" (56.4mm x 22.9mm)

-

G400S-SM-480

GHI Electronics, LLC

IC MOD ARM926EJ-S 400MHZ 32KB

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S
Co-Processor: -
Speed: 400MHz
Flash Size: 4MB (External)
RAM Size: 32KB (Internal), 128MB (External)
Connector Type: -
Size / Dimension: 1.90" x 1.30" (48.3mm x 33.1mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存5,808

ARM926EJ-S

-

400MHz

4MB (External)

32KB (Internal), 128MB (External)

-

1.90" x 1.30" (48.3mm x 33.1mm)

-40°C ~ 85°C

OSD32MP157F-512M-BAA

Octavo Systems LLC

SIP: 157F, 512MB, BAA

Module/Board Type: MPU Core
Core Processor: Arm® Dual Cortex®-A7, Arm® Cortex®-M4
Co-Processor: NEON™ SIMD
Speed: 800MHz
Flash Size: -
RAM Size: 512MB
Connector Type: 302-BGA
Size / Dimension: 0.710" L x 0.710" W (18.00mm x 18.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

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Arm® Dual Cortex®-A7, Arm® Cortex®-M4

NEON™ SIMD

800MHz

-

512MB

302-BGA

0.710" L x 0.710" W (18.00mm x 18.00mm)

0°C ~ 85°C

TE0741-05-G2C-1-A

Trenz Electronic GmbH

MODULE FPGA KINTEX

Module/Board Type: FPGA
Core Processor: Xilinx Kintex-7 FPGA XC7K410T-2FBG676C
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: -
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C

封装: -

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Xilinx Kintex-7 FPGA XC7K410T-2FBG676C

-

32MB

-

Board-to-Board (BTB) Socket

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 70°C

CYCLONE-10-LP

Intel

PROTOTYPE

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

Request a Quote

-

FORLINX-FET1012A-C-10512MOE01IA11

Forlinx Embedded

NXP LS1012ASOM,512MB DDR3L 8GB e

Module/Board Type: MPU
Core Processor: ARM® Cortex®-A53
Co-Processor: -
Speed: 1.0GHz
Flash Size: 8GB eMMC, 16Mb QSPI
RAM Size: 512MB
Connector Type: Board-to-Board (BTB) Socket - 160
Size / Dimension: 1.770" L x 1.570" W (45.00mm x 40.00mm)
Operating Temperature: -40°C ~ 80°C

封装: -

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ARM® Cortex®-A53

-

1.0GHz

8GB eMMC, 16Mb QSPI

512MB

Board-to-Board (BTB) Socket - 160

1.770" L x 1.570" W (45.00mm x 40.00mm)

-40°C ~ 80°C

RK3328-SOM-2G

Olimex LTD

IC

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53
Co-Processor: -
Speed: 1.5GHz
Flash Size: -
RAM Size: 2GB
Connector Type: USB
Size / Dimension: -
Operating Temperature: -

封装: -

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ARM® Cortex®-A53

-

1.5GHz

-

2GB

USB

-

TE0820-03-3BE21FA

Trenz Electronic GmbH

MOD MPSOC

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

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Zynq UltraScale+ XCZU3EG-1SFVC784E

-

128MB

2GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 85°C

TE0720-03-62I33FL

Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Speed: 125MHz
Flash Size: 4GB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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ARM Cortex-A9

Zynq-7000 (Z-7020)

125MHz

4GB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0715-04-30-3E

Trenz Electronic GmbH

IC SOC MODULE 1GB DDR3L

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7030)
Speed: 125MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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ARM Cortex-A9

Zynq-7000 (Z-7030)

125MHz

32MB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

A10S-P8-A5E-RI-SB

Critical Link LLC

ARRIA 10 SOC MODULE, 270KLE, 6GB

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Cortex®-A9
Co-Processor: NEON™ SIMD
Speed: 1.2GHz
Flash Size: -
RAM Size: 4GB
Connector Type: Board-to-Board (BTB)
Size / Dimension: 4.000" L x 4.000" W (101.50mm x 101.50mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存51

ARM® Cortex®-A9

NEON™ SIMD

1.2GHz

-

4GB

Board-to-Board (BTB)

4.000" L x 4.000" W (101.50mm x 101.50mm)

-40°C ~ 85°C

EC-VA-H264-8B-60-1080-MXC-ZL

System-On-Chip (SOC) Technologies Inc.

IC MOD ARTIX-7 A200T 256KB 32MB

Module/Board Type: FPGA Core
Core Processor: Artix-7 A200T
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: 256KB
Connector Type: SO-DIMM-204
Size / Dimension: 2.700" L x 2.000" W (68.00mm x 51.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

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Artix-7 A200T

-

32MB

256KB

SO-DIMM-204

2.700" L x 2.000" W (68.00mm x 51.00mm)

0°C ~ 85°C

TE0741-04-A2C-1-A

Trenz Electronic GmbH

MODULE FPGA KINTEX

Module/Board Type: FPGA Core
Core Processor: Xilinx Kintex-7 FPGA XC7K70T-2FBG676C
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: -
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C

封装: -

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Xilinx Kintex-7 FPGA XC7K70T-2FBG676C

-

32MB

-

Board-to-Board (BTB) Socket

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 70°C

DC-VA-H264-10B-60-4K-OPVIC-0000

System-On-Chip (SOC) Technologies Inc.

DECODER H264 4K VID/AUD 10BIT

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

Request a Quote

-