页 51 - 嵌入式 - 微控制器，微处理器，FPGA 模块 | 集成电路（IC）

零件编号	制造商	描述	封装	库存	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
CC-MX-PF47-KST	Digi International	MODULE CONNECTCORE I.MX287 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	库存4,432	-	-	-	-	-	-	-	-
TE0745-01-35-1C	Trenz Electronic GmbH	SOM SOC Z7 XC7Z035-1FBG676C 1GB Module/Board Type: MCU, FPGA Core Processor: ARM? Cortex?-A9 Co-Processor: Zynq-7000 (Z-7035) Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec UFPS Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存6,896	ARM? Cortex?-A9	Zynq-7000 (Z-7035)	-	32MB	1GB	Samtec UFPS	2.05" x 2.99" (52mm x 76mm)	0°C ~ 70°C
DC-SP-01R-C-W-25	Digi International	ADAPTER SP CUSTOMIZABLE 25PK Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 4MB RAM Size: 16MB Connector Type: RJ45 Size / Dimension: 3.88" x 1.68" (98.5mm x 42.7mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存4,384	ARM7TDMI, NS7520	-	55MHz	4MB	16MB	RJ45	3.88" x 1.68" (98.5mm x 42.7mm)	-40°C ~ 85°C
SOMOMAP3503-10-1672IFCR	Logic	SYSTEM ON MODULE LV OMAP3503 Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, OMAP3503 Co-Processor: - Speed: 600MHz Flash Size: 256MB (NAND), 8MB (NOR) RAM Size: 128MB Connector Type: Board-to-Board (BTB) Socket - 480 Size / Dimension: 1.23" x 3.01" (31.2mm x 76.5mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存5,920	ARM? Cortex?-A8, OMAP3503	-	600MHz	256MB (NAND), 8MB (NOR)	128MB	Board-to-Board (BTB) Socket - 480	1.23" x 3.01" (31.2mm x 76.5mm)	0°C ~ 70°C
CENGLH7A400-10-504HCR	Logic	CARD ENGINE 64MB SDRAM Module/Board Type: MPU Core Core Processor: ARM922T, LH7A400 Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存6,928	ARM922T, LH7A400	-	200MHz	32MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
FS-3000	Digi International	MODULE 128MB SDRAM 128MB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	库存6,608	-	-	-	-	-	-	-	-
CENGLH7A400-10-403EI	Logic	CARD ENGINE 16MB FLASH 32MB RAM Module/Board Type: MPU Core Core Processor: ARM922T, LH7A400 Co-Processor: - Speed: 200MHz Flash Size: 16MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存7,344	ARM922T, LH7A400	-	200MHz	16MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	-40°C ~ 85°C
101-0454	Digi International	MODULE RABBITCORE RCM2200 Module/Board Type: MPU Core Core Processor: Rabbit 2000 Co-Processor: - Speed: 22.1MHz Flash Size: 256KB RAM Size: 128KB Connector Type: 2 IDC Headers 2x13 Size / Dimension: 1.6" x 2.3" (41mm x 58mm) Operating Temperature: -40°C ~ 70°C	封装: -	库存4,048	Rabbit 2000	-	22.1MHz	256KB	128KB	2 IDC Headers 2x13	1.6" x 2.3" (41mm x 58mm)	-40°C ~ 70°C
DOH5210C	Dave Embedded Systems	SYSTEM ON MODULE DM8148 2GB DDR3 Module/Board Type: MPU, DSP Core Core Processor: ARM? Cortex?-A8, DM8148 Co-Processor: TMS320C674x (DSP) Speed: 1GHz Flash Size: 1GB (NAND), 32MB (NOR) RAM Size: - Connector Type: 2 x 140 Pins 0.6mm Pitch Size / Dimension: - Operating Temperature: -	封装: -	库存7,856	ARM? Cortex?-A8, DM8148	TMS320C674x (DSP)	1GHz	1GB (NAND), 32MB (NOR)	-	2 x 140 Pins 0.6mm Pitch	-	-
TE0715-04-30-1C	Trenz Electronic GmbH	SOM SOC 7Z030-1SBG485C 1GB DDR3 Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7030) Speed: 125MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存2,080	ARM Cortex-A9	Zynq-7000 (Z-7030)	125MHz	32MB	1GB	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	0°C ~ 70°C
CC-MX-PF47-ZK	Digi International	MOD I.MX287 128MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S i.mx287 Co-Processor: - Speed: 454MHz Flash Size: 128MB RAM Size: 128MB Connector Type: Edge Connector - 52 Size / Dimension: 2" x 1.38" (51mm x 35mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存3,856	ARM926EJ-S i.mx287	-	454MHz	128MB	128MB	Edge Connector - 52	2" x 1.38" (51mm x 35mm)	-40°C ~ 85°C
BS2PE	Parallax Inc.	MODULE BASIC STAMP 2PE Module/Board Type: MCU Core Core Processor: SX48AC Co-Processor: - Speed: 8MHz Flash Size: 32KB EEPROM RAM Size: 38B Connector Type: - Size / Dimension: 1.2" x 0.6" (30mm x 15mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存6,032	SX48AC	-	8MHz	32KB EEPROM	38B	-	1.2" x 0.6" (30mm x 15mm)	0°C ~ 70°C
CENGPXA270-520-11-504HCR	Logic	CARD ENGINE 64MB SDRAM Module/Board Type: MCU Core Core Processor: PXA270 Co-Processor: - Speed: 520MHz Flash Size: 32MB RAM Size: 64MB Connector Type: Edge Connector Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存6,336	PXA270	-	520MHz	32MB	64MB	Edge Connector	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
EZ80F915150MODG	Zilog	BOARD ZDOTS SBC Z80ACCLAIM Module/Board Type: MCU, Ethernet Core Core Processor: eZ80F91 Co-Processor: - Speed: 50MHz Flash Size: 256KB (Internal), 8MB (External) RAM Size: 8KB (Internal), 512KB (External) Connector Type: Header 2x30 Size / Dimension: 2.5" x 3.1" (63.5mm x 78.7mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存6,360	eZ80F91	-	50MHz	256KB (Internal), 8MB (External)	8KB (Internal), 512KB (External)	Header 2x30	2.5" x 3.1" (63.5mm x 78.7mm)	0°C ~ 70°C
DC-ME-Y413-LX	Digi International	ME 9210 16MB SDRAM 8MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9210 Co-Processor: - Speed: 75MHz Flash Size: 8MB RAM Size: 16MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 80°C	封装: -	库存7,740	ARM926EJ-S, NS9210	-	75MHz	8MB	16MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 80°C
DC-ME9-01-C-10	Digi International	MODULE DIGI CONNECT ME Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	库存6,752	-	-	-	-	-	-	-	-
XPP100300S-04R	Lantronix, Inc.	XPORT PRO ROHS EXTENDED RAM, EXT Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	库存6,912	-	-	-	-	-	-	-	-
TE0803-02-04EG-1ID	Trenz Electronic GmbH	MODULE SOM TE0803-02 Module/Board Type: MPU Core Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: B2B Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: -	封装: -	库存2,272	-	-	-	-	-	B2B	2.05" x 2.99" (52mm x 76mm)	-
TE0821-01-3AE31PA	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU3CG-1SFVC784E Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: 2 x 100 Pin Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote	Zynq UltraScale+ XCZU3CG-1SFVC784E	ARM® Cortex®-A53, ARM® Cortex®-R5	-	128MB	4GB	2 x 100 Pin	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
ME-XU1-6EG-1I-D11E-R4-2	Enclustra FPGA Solutions	SOM ZYNQ XU1 US+ ZU6EG Module/Board Type: MPU, FPGA Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: - Speed: 600MHz, 1.5GHz Flash Size: 16GB RAM Size: 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	-	600MHz, 1.5GHz	16GB	4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	-40°C ~ 85°C
TEM0007-01-CAD11-A	Trenz Electronic GmbH	MICROCHIP POLARFIRE SOC FPGA 25T Module/Board Type: FPGA Core Processor: - Co-Processor: - Speed: - Flash Size: 64MB RAM Size: 1GB Connector Type: B2B Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -	封装: -	Request a Quote	-	-	-	64MB	1GB	B2B	1.970" L x 1.570" W (50.00mm x 40.00mm)	-
ME-XU9-7EG-2I-D11E-L13-R2-1	Enclustra FPGA Solutions	SOM XU9 ZYNQ 7EG REV2.1 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	Request a Quote	-	-	-	-	-	-	-	-
TE0820-04-40121FA	Trenz Electronic GmbH	MOD MPSOC 2GB DDR4 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	Request a Quote	-	-	-	-	-	-	-	-
ME-CA1-30-8C-D7-R6-1	Enclustra FPGA Solutions	SOM CYCLONE IV EP4CE30 128MB Module/Board Type: FPGA Core Core Processor: - Co-Processor: - Speed: - Flash Size: 16MB RAM Size: 128MB Connector Type: 168 Pin Size / Dimension: 2.200" L x 2.130" W (56.00mm x 54.00mm) Operating Temperature: 0°C ~ 70°C	封装: -	Request a Quote	-	-	-	16MB	128MB	168 Pin	2.200" L x 2.130" W (56.00mm x 54.00mm)	0°C ~ 70°C
EC-VA-H264-10B-60-1080-MXC-ZL	System-On-Chip (SOC) Technologies Inc.	IC MOD ARTIX-7 A200T 256KB 32MB Module/Board Type: FPGA Core Core Processor: Artix-7 A200T Co-Processor: - Speed: - Flash Size: 32MB RAM Size: 256KB Connector Type: SO-DIMM-204 Size / Dimension: 2.700" L x 2.000" W (68.00mm x 51.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote	Artix-7 A200T	-	-	32MB	256KB	SO-DIMM-204	2.700" L x 2.000" W (68.00mm x 51.00mm)	0°C ~ 85°C
TE0715-04-73E33-A	Trenz Electronic GmbH	IC SOC MODULE 1GB DDR3L Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7030) Speed: 125MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7030)	125MHz	32MB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0741-04-B3E-1-AF	Trenz Electronic GmbH	MODULE FPGA KINTEX Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	Request a Quote	-	-	-	-	-	-	-	-
TEM0005-02-010I	Trenz Electronic GmbH	FPGA MODULE WITH MICROCHIP SMART Module/Board Type: FPGA Core Processor: - Co-Processor: - Speed: - Flash Size: 32MB QSPI RAM Size: 256MB Connector Type: B2B Size / Dimension: 2.205" L x 1.220" W (56.00mm x 31.00mm) Operating Temperature: -	封装: -	Request a Quote	-	-	-	32MB QSPI	256MB	B2B	2.205" L x 1.220" W (56.00mm x 31.00mm)	-
EDM1-IMX6U10-R10-MSD-9377	Wandboard.Org	IC MODULE CORTEX-A9 1GB Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A9, i.MX6DualLite Co-Processor: - Speed: - Flash Size: - RAM Size: 1GB Connector Type: EDM Connector Size / Dimension: 2.360" L x 3.230" W (60.00mm x 82.00mm) Operating Temperature: -	封装: -	Request a Quote	ARM® Cortex®-A9, i.MX6DualLite	-	-	-	1GB	EDM Connector	2.360" L x 3.230" W (60.00mm x 82.00mm)	-
TE0741-05-A2C-1-A	Trenz Electronic GmbH	MODULE FPGA KINTEX Module/Board Type: FPGA Core Processor: Xilinx Kintex-7 FPGA XC7K070T-2FBG676C Co-Processor: - Speed: - Flash Size: 32MB RAM Size: - Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C	封装: -	Request a Quote	Xilinx Kintex-7 FPGA XC7K070T-2FBG676C	-	-	32MB	-	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 70°C

CC-MX-PF47-KST

Digi International

MODULE CONNECTCORE I.MX287

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

库存4,432

-

TE0745-01-35-1C

Trenz Electronic GmbH

SOM SOC Z7 XC7Z035-1FBG676C 1GB

Module/Board Type: MCU, FPGA
Core Processor: ARM? Cortex?-A9
Co-Processor: Zynq-7000 (Z-7035)
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec UFPS
Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存6,896

ARM? Cortex?-A9

Zynq-7000 (Z-7035)

-

32MB

1GB

Samtec UFPS

2.05" x 2.99" (52mm x 76mm)

0°C ~ 70°C

DC-SP-01R-C-W-25

Digi International

ADAPTER SP CUSTOMIZABLE 25PK

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 4MB
RAM Size: 16MB
Connector Type: RJ45
Size / Dimension: 3.88" x 1.68" (98.5mm x 42.7mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存4,384

ARM7TDMI, NS7520

-

55MHz

4MB

16MB

RJ45

3.88" x 1.68" (98.5mm x 42.7mm)

-40°C ~ 85°C

SOMOMAP3503-10-1672IFCR

Logic

SYSTEM ON MODULE LV OMAP3503

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8, OMAP3503
Co-Processor: -
Speed: 600MHz
Flash Size: 256MB (NAND), 8MB (NOR)
RAM Size: 128MB
Connector Type: Board-to-Board (BTB) Socket - 480
Size / Dimension: 1.23" x 3.01" (31.2mm x 76.5mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存5,920

ARM? Cortex?-A8, OMAP3503

-

600MHz

256MB (NAND), 8MB (NOR)

128MB

Board-to-Board (BTB) Socket - 480

1.23" x 3.01" (31.2mm x 76.5mm)

0°C ~ 70°C

CENGLH7A400-10-504HCR

Logic

CARD ENGINE 64MB SDRAM

Module/Board Type: MPU Core
Core Processor: ARM922T, LH7A400
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存6,928

ARM922T, LH7A400

-

200MHz

32MB

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

0°C ~ 70°C

FS-3000

Digi International

MODULE 128MB SDRAM 128MB FLASH

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

库存6,608

-

CENGLH7A400-10-403EI

Logic

CARD ENGINE 16MB FLASH 32MB RAM

Module/Board Type: MPU Core
Core Processor: ARM922T, LH7A400
Co-Processor: -
Speed: 200MHz
Flash Size: 16MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存7,344

ARM922T, LH7A400

-

200MHz

16MB

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

-40°C ~ 85°C

101-0454

Digi International

MODULE RABBITCORE RCM2200

Module/Board Type: MPU Core
Core Processor: Rabbit 2000
Co-Processor: -
Speed: 22.1MHz
Flash Size: 256KB
RAM Size: 128KB
Connector Type: 2 IDC Headers 2x13
Size / Dimension: 1.6" x 2.3" (41mm x 58mm)
Operating Temperature: -40°C ~ 70°C

封装: -

库存4,048

Rabbit 2000

-

22.1MHz

256KB

128KB

2 IDC Headers 2x13

1.6" x 2.3" (41mm x 58mm)

-40°C ~ 70°C

DOH5210C

Dave Embedded Systems

SYSTEM ON MODULE DM8148 2GB DDR3

Module/Board Type: MPU, DSP Core
Core Processor: ARM? Cortex?-A8, DM8148
Co-Processor: TMS320C674x (DSP)
Speed: 1GHz
Flash Size: 1GB (NAND), 32MB (NOR)
RAM Size: -
Connector Type: 2 x 140 Pins 0.6mm Pitch
Size / Dimension: -
Operating Temperature: -

封装: -

库存7,856

ARM? Cortex?-A8, DM8148

TMS320C674x (DSP)

1GHz

1GB (NAND), 32MB (NOR)

-

2 x 140 Pins 0.6mm Pitch

-

TE0715-04-30-1C

Trenz Electronic GmbH

SOM SOC 7Z030-1SBG485C 1GB DDR3

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7030)
Speed: 125MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存2,080

ARM Cortex-A9

Zynq-7000 (Z-7030)

125MHz

32MB

1GB

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

0°C ~ 70°C

CC-MX-PF47-ZK

Digi International

MOD I.MX287 128MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S i.mx287
Co-Processor: -
Speed: 454MHz
Flash Size: 128MB
RAM Size: 128MB
Connector Type: Edge Connector - 52
Size / Dimension: 2" x 1.38" (51mm x 35mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存3,856

ARM926EJ-S i.mx287

-

454MHz

128MB

Edge Connector - 52

2" x 1.38" (51mm x 35mm)

-40°C ~ 85°C

BS2PE

Parallax Inc.

MODULE BASIC STAMP 2PE

Module/Board Type: MCU Core
Core Processor: SX48AC
Co-Processor: -
Speed: 8MHz
Flash Size: 32KB EEPROM
RAM Size: 38B
Connector Type: -
Size / Dimension: 1.2" x 0.6" (30mm x 15mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存6,032

SX48AC

-

8MHz

32KB EEPROM

38B

-

1.2" x 0.6" (30mm x 15mm)

0°C ~ 70°C

CENGPXA270-520-11-504HCR

Logic

CARD ENGINE 64MB SDRAM

Module/Board Type: MCU Core
Core Processor: PXA270
Co-Processor: -
Speed: 520MHz
Flash Size: 32MB
RAM Size: 64MB
Connector Type: Edge Connector
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存6,336

PXA270

-

520MHz

32MB

64MB

Edge Connector

2.37" x 2.67" (60.2mm x 67.8mm)

0°C ~ 70°C

EZ80F915150MODG

Zilog

BOARD ZDOTS SBC Z80ACCLAIM

Module/Board Type: MCU, Ethernet Core
Core Processor: eZ80F91
Co-Processor: -
Speed: 50MHz
Flash Size: 256KB (Internal), 8MB (External)
RAM Size: 8KB (Internal), 512KB (External)
Connector Type: Header 2x30
Size / Dimension: 2.5" x 3.1" (63.5mm x 78.7mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存6,360

eZ80F91

-

50MHz

256KB (Internal), 8MB (External)

8KB (Internal), 512KB (External)

Header 2x30

2.5" x 3.1" (63.5mm x 78.7mm)

0°C ~ 70°C

DC-ME-Y413-LX

Digi International

ME 9210 16MB SDRAM 8MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9210
Co-Processor: -
Speed: 75MHz
Flash Size: 8MB
RAM Size: 16MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 80°C

封装: -

库存7,740

ARM926EJ-S, NS9210

-

75MHz

8MB

16MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 80°C

DC-ME9-01-C-10

Digi International

MODULE DIGI CONNECT ME

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

库存6,752

-

XPP100300S-04R

Lantronix, Inc.

XPORT PRO ROHS EXTENDED RAM, EXT

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

库存6,912

-

TE0803-02-04EG-1ID

Trenz Electronic GmbH

MODULE SOM TE0803-02

Module/Board Type: MPU Core
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: B2B
Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
Operating Temperature: -

封装: -

库存2,272

-

B2B

2.05" x 2.99" (52mm x 76mm)

-

TE0821-01-3AE31PA

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU3CG-1SFVC784E
Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: 2 x 100 Pin
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

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Zynq UltraScale+ XCZU3CG-1SFVC784E

ARM® Cortex®-A53, ARM® Cortex®-R5

-

128MB

4GB

2 x 100 Pin

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 85°C

ME-XU1-6EG-1I-D11E-R4-2

Enclustra FPGA Solutions

SOM ZYNQ XU1 US+ ZU6EG

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: -
Speed: 600MHz, 1.5GHz
Flash Size: 16GB
RAM Size: 4GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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ARM® Cortex®-A53, ARM® Cortex®-R5

-

600MHz, 1.5GHz

16GB

4GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

-40°C ~ 85°C

TEM0007-01-CAD11-A

Trenz Electronic GmbH

MICROCHIP POLARFIRE SOC FPGA 25T

Module/Board Type: FPGA
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: 64MB
RAM Size: 1GB
Connector Type: B2B
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -

封装: -

Request a Quote

-

64MB

1GB

B2B

1.970" L x 1.570" W (50.00mm x 40.00mm)

-

ME-XU9-7EG-2I-D11E-L13-R2-1

Enclustra FPGA Solutions

SOM XU9 ZYNQ 7EG REV2.1

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

Request a Quote

-

TE0820-04-40121FA

Trenz Electronic GmbH

MOD MPSOC 2GB DDR4

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

Request a Quote

-

ME-CA1-30-8C-D7-R6-1

Enclustra FPGA Solutions

SOM CYCLONE IV EP4CE30 128MB

Module/Board Type: FPGA Core
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: 16MB
RAM Size: 128MB
Connector Type: 168 Pin
Size / Dimension: 2.200" L x 2.130" W (56.00mm x 54.00mm)
Operating Temperature: 0°C ~ 70°C

封装: -

Request a Quote

-

16MB

128MB

168 Pin

2.200" L x 2.130" W (56.00mm x 54.00mm)

0°C ~ 70°C

EC-VA-H264-10B-60-1080-MXC-ZL

System-On-Chip (SOC) Technologies Inc.

IC MOD ARTIX-7 A200T 256KB 32MB

Module/Board Type: FPGA Core
Core Processor: Artix-7 A200T
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: 256KB
Connector Type: SO-DIMM-204
Size / Dimension: 2.700" L x 2.000" W (68.00mm x 51.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

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Artix-7 A200T

-

32MB

256KB

SO-DIMM-204

2.700" L x 2.000" W (68.00mm x 51.00mm)

0°C ~ 85°C

TE0715-04-73E33-A

Trenz Electronic GmbH

IC SOC MODULE 1GB DDR3L

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7030)
Speed: 125MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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ARM Cortex-A9

Zynq-7000 (Z-7030)

125MHz

32MB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0741-04-B3E-1-AF

Trenz Electronic GmbH

MODULE FPGA KINTEX

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

Request a Quote

-

TEM0005-02-010I

Trenz Electronic GmbH

FPGA MODULE WITH MICROCHIP SMART

Module/Board Type: FPGA
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: 32MB QSPI
RAM Size: 256MB
Connector Type: B2B
Size / Dimension: 2.205" L x 1.220" W (56.00mm x 31.00mm)
Operating Temperature: -

封装: -

Request a Quote

-

32MB QSPI

256MB

B2B

2.205" L x 1.220" W (56.00mm x 31.00mm)

-

EDM1-IMX6U10-R10-MSD-9377

Wandboard.Org

IC MODULE CORTEX-A9 1GB

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A9, i.MX6DualLite
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: 1GB
Connector Type: EDM Connector
Size / Dimension: 2.360" L x 3.230" W (60.00mm x 82.00mm)
Operating Temperature: -

封装: -

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ARM® Cortex®-A9, i.MX6DualLite

-

1GB

EDM Connector

2.360" L x 3.230" W (60.00mm x 82.00mm)

-

TE0741-05-A2C-1-A

Trenz Electronic GmbH

MODULE FPGA KINTEX

Module/Board Type: FPGA
Core Processor: Xilinx Kintex-7 FPGA XC7K070T-2FBG676C
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: -
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C

封装: -

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Xilinx Kintex-7 FPGA XC7K070T-2FBG676C

-

32MB

-

Board-to-Board (BTB) Socket

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 70°C