页 46 - 嵌入式 - 微控制器，微处理器，FPGA 模块 | 集成电路（IC）

零件编号	制造商	描述	封装	库存	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
SOMM5485-MED01-0201R-A	Logic	MODULE FIRE ENGINE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	库存7,872	-	-	-	-	-	-	-	-
CC-9P-V524-DSA-1	Digi International	CONNECTCORE 9P Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9215 Co-Processor: - Speed: 150MHz Flash Size: 16MB RAM Size: 32MB Connector Type: - Size / Dimension: - Operating Temperature: -40°C ~ 85°C	封装: -	库存2,784	ARM926EJ-S, NS9215	-	150MHz	16MB	32MB	-	-	-40°C ~ 85°C
20-101-1314	Digi International	MODULE ETHERNET OP7300 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	库存6,336	-	-	-	-	-	-	-	-
SOMOMAP3503-11-1672IFCR	Logic	SYSTEM ON MODULE LV OMAP3503 Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, OMAP3503 Co-Processor: - Speed: 600MHz Flash Size: 256MB (NAND), 8MB (NOR) RAM Size: 128MB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 1.23" x 3.01" (31.2mm x 76.5mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存3,472	ARM? Cortex?-A8, OMAP3503	-	600MHz	256MB (NAND), 8MB (NOR)	128MB	Board-to-Board (BTB) Socket - 240	1.23" x 3.01" (31.2mm x 76.5mm)	0°C ~ 70°C
101-1028	Digi International	MODULE RABBITCORE RCM3750 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 22.1MHz Flash Size: 512KB (Internal), 1MB (External) RAM Size: 512KB Connector Type: IDC Header 2x20 Size / Dimension: 1.2" x 2.95" (30mm x 75mm) Operating Temperature: -40°C ~ 70°C	封装: -	库存5,568	Rabbit 3000	-	22.1MHz	512KB (Internal), 1MB (External)	512KB	IDC Header 2x20	1.2" x 2.95" (30mm x 75mm)	-40°C ~ 70°C
CENGPXA270-312-10-550ECR	Logic	CARD ENGINE 64MB SDRAM 64MB NAND Module/Board Type: MCU Core Core Processor: PXA270 Co-Processor: - Speed: 312MHz Flash Size: 64MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存6,528	PXA270	-	312MHz	64MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
DC-SP-01R-C-25	Digi International	ADAPTER SP CUSTOM MODEL RS-232 Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 4MB RAM Size: 16MB Connector Type: RJ45 Size / Dimension: 3.88" x 1.68" (98.5mm x 42.7mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存7,168	ARM7TDMI, NS7520	-	55MHz	4MB	16MB	RJ45	3.88" x 1.68" (98.5mm x 42.7mm)	-40°C ~ 85°C
CENGLH7A400-10-503HC-B	Logic	CARD ENGINE 64MB SDRAM Module/Board Type: MPU Core Core Processor: ARM922T, LH7A400 Co-Processor: - Speed: 200MHz Flash Size: 16MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存2,560	ARM922T, LH7A400	-	200MHz	16MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
CC-MX-PF47-ZK-B	Digi International	MOD WI-IMX287 128M FLASH 25/PK Module/Board Type: MPU Core Core Processor: ARM926EJ-S i.mx287 Co-Processor: - Speed: 454MHz Flash Size: 128MB RAM Size: 128MB Connector Type: Edge Connector - 52 Size / Dimension: 2" x 1.38" (51mm x 35mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存4,832	ARM926EJ-S i.mx287	-	454MHz	128MB	128MB	Edge Connector - 52	2" x 1.38" (51mm x 35mm)	-40°C ~ 85°C
SOMOMAP3530-11-1782JFIR	Logic	SYSTEM ON MODULE LV OMAP3530 Module/Board Type: MPU, DSP Core Core Processor: ARM? Cortex?-A8, OMAP3530 Co-Processor: TMS320C64x (DSP) Speed: 600MHz Flash Size: 512MB (NAND), 8MB (NOR) RAM Size: 256MB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 1.23" x 3.01" (31.2mm x 76.5mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存2,752	ARM? Cortex?-A8, OMAP3530	TMS320C64x (DSP)	600MHz	512MB (NAND), 8MB (NOR)	256MB	Board-to-Board (BTB) Socket - 240	1.23" x 3.01" (31.2mm x 76.5mm)	-40°C ~ 85°C
CC-MX-LB6B-ZM	Digi International	MODULE I.MX51 2GB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	库存3,472	-	-	-	-	-	-	-	-
3352-GX-X27-RC	Critical Link LLC	MITYSOM-335X SOM Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, AM3352 Co-Processor: NEON SIMD Speed: 720MHz Flash Size: 256MB RAM Size: 256MB Connector Type: SO-DIMM-204 Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存4,704	ARM? Cortex?-A8, AM3352	NEON SIMD	720MHz	256MB	256MB	SO-DIMM-204	2.66" x 1.5" (67.6mm x 38.1mm)	0°C ~ 70°C
20-101-0405	Digi International	MODULE RABBITCORE RCM2010 Module/Board Type: MPU Core Core Processor: Rabbit 2000 Co-Processor: - Speed: 25.8MHz Flash Size: 256KB RAM Size: 128KB Connector Type: 2 IDC Headers 2x20 Size / Dimension: 1.9" x 2.3" (48.3mm x 58.4mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存7,392	Rabbit 2000	-	25.8MHz	256KB	128KB	2 IDC Headers 2x20	1.9" x 2.3" (48.3mm x 58.4mm)	-40°C ~ 85°C
SOMDM3730-11-1783IFXR	Logic	DM3730 SOM-LV TYPE III 256MB LPD Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	库存4,976	-	-	-	-	-	-	-	-
OSD3358-512M-BSM	Octavo Systems LLC	21MM 256 BALL BGA Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A8, AM3358 Co-Processor: NEON™ SIMD Speed: 1GHz Flash Size: - RAM Size: 512MB Connector Type: 256-BGA Size / Dimension: 0.83" x 0.83" (21mm x 21mm) Operating Temperature: 0°C ~ 85°C	封装: -	库存13,986	ARM® Cortex®-A8, AM3358	NEON™ SIMD	1GHz	-	512MB	256-BGA	0.83" x 0.83" (21mm x 21mm)	0°C ~ 85°C
EC-VA-H265-10B-60-1080-OPVIC-0000	System-On-Chip (SOC) Technologies Inc.	ENCODER H265 HD VID/AUD 10BIT Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	Request a Quote	-	-	-	-	-	-	-	-
TE0808-04-15EG-1EK	Trenz Electronic GmbH	IC MOD SOM MPSOC Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU15EG-1FFVC900E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote	Zynq UltraScale+ XCZU15EG-1FFVC900E	-	-	128MB	4GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	0°C ~ 85°C
ME-XU1-15EG-2I-D12E-G1-R4-2	Enclustra FPGA Solutions	SOM ZYNQ XU1 US+ ZU15EG Module/Board Type: MPU, FPGA Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: - Speed: 600MHz, 1.5GHz Flash Size: 16GB RAM Size: 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	-	600MHz, 1.5GHz	16GB	4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	-40°C ~ 85°C
S00021-02	Trenz Electronic GmbH	MOD SOM DDR3L 1GB Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	Request a Quote	-	-	-	-	-	-	-	-
TE0841-02-31I21-A	Trenz Electronic GmbH	IC MODULE Module/Board Type: FPGA Core Core Processor: Kintex UltraScale KU035 Co-Processor: - Speed: - Flash Size: 64MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	Kintex UltraScale KU035	-	-	64MB	2GB	B2B	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
FORLINX-FET3568J-C-182GSE16GIB10	Forlinx Embedded	Rockchip RK3568SOM, 2GB DDR4, 16 Module/Board Type: MPU Core Processor: ARM® Cortex®-A55 Co-Processor: - Speed: 1.8GHz Flash Size: 16GB eMMC RAM Size: 2GB Connector Type: Board-to-Board (BTB) 4 x 80 Pin Size / Dimension: 1.770" L x 2.756" W (45.00mm x 70.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	ARM® Cortex®-A55	-	1.8GHz	16GB eMMC	2GB	Board-to-Board (BTB) 4 x 80 Pin	1.770" L x 2.756" W (45.00mm x 70.00mm)	-40°C ~ 85°C
ME-XU1-6CG-1E-D11E-R4-2	Enclustra FPGA Solutions	SOM ZYNQ XU1 US+ ZU6CG Module/Board Type: FPGA Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: - Speed: 600MHz, 1.5GHz Flash Size: 16GB RAM Size: 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	-	600MHz, 1.5GHz	16GB	4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	0°C ~ 85°C
TE0803-04-2BE11-A	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	库存6	Zynq UltraScale+ XCZU2EG-1SFVC784E	-	-	128MB	2GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	0°C ~ 85°C
ME-XU7-6EG-1I-D11E-R4	Enclustra FPGA Solutions	SOM ZYNQ US+ ZU6EG 2GB+1GB PL Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	Request a Quote	-	-	-	-	-	-	-	-
SCM-20260N-C	GHI Electronics, LLC	SITCORE SCM20260N SOM Module/Board Type: MPU Core Core Processor: SITCore Co-Processor: - Speed: 480MHz Flash Size: 16MB RAM Size: 32MB Connector Type: - Size / Dimension: - Operating Temperature: -40°C ~ 85°C	封装: -	库存954	SITCore	-	480MHz	16MB	32MB	-	-	-40°C ~ 85°C
EC-VA-H264-8B-30-1080-MXC-ZL	System-On-Chip (SOC) Technologies Inc.	IC MOD ARTIX-7 A200T 256KB 32MB Module/Board Type: FPGA Core Core Processor: Artix-7 A200T Co-Processor: - Speed: - Flash Size: 32MB RAM Size: 256KB Connector Type: SO-DIMM-204 Size / Dimension: 2.700" L x 2.000" W (68.00mm x 51.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote	Artix-7 A200T	-	-	32MB	256KB	SO-DIMM-204	2.700" L x 2.000" W (68.00mm x 51.00mm)	0°C ~ 85°C
TE0720-03-S004	Trenz Electronic GmbH	IC SOC MODULE XILINX ZYNQ Module/Board Type: MCU, FPGA Core Processor: - Co-Processor: Zynq-7000 (Z-7020) Speed: - Flash Size: 8GB RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	Request a Quote	-	Zynq-7000 (Z-7020)	-	8GB	-	-	-	-
5746-PX-4AA-RC	Critical Link LLC	TEXAS INSTRUMENTS AM5746 SOM (32 Module/Board Type: MPU, FPGA Core Core Processor: ARM® Cortex®-A15 Co-Processor: - Speed: 1.5GHz Flash Size: 32MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) - 100, Edge Connector - 310 Size / Dimension: 3.460" L x 2.730" W (87.88mm x 69.34mm) Operating Temperature: 0°C ~ 70°C	封装: -	Request a Quote	ARM® Cortex®-A15	-	1.5GHz	32MB	1GB	Board-to-Board (BTB) - 100, Edge Connector - 310	3.460" L x 2.730" W (87.88mm x 69.34mm)	0°C ~ 70°C
MYC-JX8MMA7-8E2D-32Q256D-160-I	MYIR Tech Limited	ARM i.MX 8M Mini + Artix-7 FPGA Module/Board Type: MPU, FPGA Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4 Co-Processor: Xilinx Artix-7 XC7A25T Speed: 1.8GHz Flash Size: 8GB eMMC, 32MB QSPI RAM Size: 2GB Connector Type: Pin(s) Size / Dimension: 3.228" L x 1.772" W (82.00mm x 45.00mm) Operating Temperature: -40°C ~ 105°C	封装: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-M4	Xilinx Artix-7 XC7A25T	1.8GHz	8GB eMMC, 32MB QSPI	2GB	Pin(s)	3.228" L x 1.772" W (82.00mm x 45.00mm)	-40°C ~ 105°C
TE0745-03-71I31-AK	Trenz Electronic GmbH	SOM WITH AMD ZYNQ 7030-1I AND HE Module/Board Type: MPU Core Core Processor: ARM Cortex-A9 Co-Processor: Xilinx Zynq 7030 SoC XC7Z030-1FBG676I Speed: - Flash Size: 64MB RAM Size: 1GB Connector Type: Samtec ST5 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	ARM Cortex-A9	Xilinx Zynq 7030 SoC XC7Z030-1FBG676I	-	64MB	1GB	Samtec ST5	2.990" L x 2.050" W (76.00mm x 52.00mm)	-40°C ~ 85°C

SOMM5485-MED01-0201R-A

Logic

MODULE FIRE ENGINE

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

库存7,872

-

CC-9P-V524-DSA-1

Digi International

CONNECTCORE 9P

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9215
Co-Processor: -
Speed: 150MHz
Flash Size: 16MB
RAM Size: 32MB
Connector Type: -
Size / Dimension: -
Operating Temperature: -40°C ~ 85°C

封装: -

库存2,784

ARM926EJ-S, NS9215

-

150MHz

16MB

32MB

-

-40°C ~ 85°C

20-101-1314

Digi International

MODULE ETHERNET OP7300

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

库存6,336

-

SOMOMAP3503-11-1672IFCR

Logic

SYSTEM ON MODULE LV OMAP3503

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8, OMAP3503
Co-Processor: -
Speed: 600MHz
Flash Size: 256MB (NAND), 8MB (NOR)
RAM Size: 128MB
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 1.23" x 3.01" (31.2mm x 76.5mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存3,472

ARM? Cortex?-A8, OMAP3503

-

600MHz

256MB (NAND), 8MB (NOR)

128MB

Board-to-Board (BTB) Socket - 240

1.23" x 3.01" (31.2mm x 76.5mm)

0°C ~ 70°C

101-1028

Digi International

MODULE RABBITCORE RCM3750

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 22.1MHz
Flash Size: 512KB (Internal), 1MB (External)
RAM Size: 512KB
Connector Type: IDC Header 2x20
Size / Dimension: 1.2" x 2.95" (30mm x 75mm)
Operating Temperature: -40°C ~ 70°C

封装: -

库存5,568

Rabbit 3000

-

22.1MHz

512KB (Internal), 1MB (External)

512KB

IDC Header 2x20

1.2" x 2.95" (30mm x 75mm)

-40°C ~ 70°C

CENGPXA270-312-10-550ECR

Logic

CARD ENGINE 64MB SDRAM 64MB NAND

Module/Board Type: MCU Core
Core Processor: PXA270
Co-Processor: -
Speed: 312MHz
Flash Size: 64MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存6,528

PXA270

-

312MHz

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

0°C ~ 70°C

DC-SP-01R-C-25

Digi International

ADAPTER SP CUSTOM MODEL RS-232

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 4MB
RAM Size: 16MB
Connector Type: RJ45
Size / Dimension: 3.88" x 1.68" (98.5mm x 42.7mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存7,168

ARM7TDMI, NS7520

-

55MHz

4MB

16MB

RJ45

3.88" x 1.68" (98.5mm x 42.7mm)

-40°C ~ 85°C

CENGLH7A400-10-503HC-B

Logic

CARD ENGINE 64MB SDRAM

Module/Board Type: MPU Core
Core Processor: ARM922T, LH7A400
Co-Processor: -
Speed: 200MHz
Flash Size: 16MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存2,560

ARM922T, LH7A400

-

200MHz

16MB

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

0°C ~ 70°C

CC-MX-PF47-ZK-B

Digi International

MOD WI-IMX287 128M FLASH 25/PK

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S i.mx287
Co-Processor: -
Speed: 454MHz
Flash Size: 128MB
RAM Size: 128MB
Connector Type: Edge Connector - 52
Size / Dimension: 2" x 1.38" (51mm x 35mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存4,832

ARM926EJ-S i.mx287

-

454MHz

128MB

Edge Connector - 52

2" x 1.38" (51mm x 35mm)

-40°C ~ 85°C

SOMOMAP3530-11-1782JFIR

Logic

SYSTEM ON MODULE LV OMAP3530

Module/Board Type: MPU, DSP Core
Core Processor: ARM? Cortex?-A8, OMAP3530
Co-Processor: TMS320C64x (DSP)
Speed: 600MHz
Flash Size: 512MB (NAND), 8MB (NOR)
RAM Size: 256MB
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 1.23" x 3.01" (31.2mm x 76.5mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存2,752

ARM? Cortex?-A8, OMAP3530

TMS320C64x (DSP)

600MHz

512MB (NAND), 8MB (NOR)

256MB

Board-to-Board (BTB) Socket - 240

1.23" x 3.01" (31.2mm x 76.5mm)

-40°C ~ 85°C

CC-MX-LB6B-ZM

Digi International

MODULE I.MX51 2GB FLASH

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

库存3,472

-

3352-GX-X27-RC

Critical Link LLC

MITYSOM-335X SOM

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8, AM3352
Co-Processor: NEON SIMD
Speed: 720MHz
Flash Size: 256MB
RAM Size: 256MB
Connector Type: SO-DIMM-204
Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存4,704

ARM? Cortex?-A8, AM3352

NEON SIMD

720MHz

256MB

SO-DIMM-204

2.66" x 1.5" (67.6mm x 38.1mm)

0°C ~ 70°C

20-101-0405

Digi International

MODULE RABBITCORE RCM2010

Module/Board Type: MPU Core
Core Processor: Rabbit 2000
Co-Processor: -
Speed: 25.8MHz
Flash Size: 256KB
RAM Size: 128KB
Connector Type: 2 IDC Headers 2x20
Size / Dimension: 1.9" x 2.3" (48.3mm x 58.4mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存7,392

Rabbit 2000

-

25.8MHz

256KB

128KB

2 IDC Headers 2x20

1.9" x 2.3" (48.3mm x 58.4mm)

-40°C ~ 85°C

SOMDM3730-11-1783IFXR

Logic

DM3730 SOM-LV TYPE III 256MB LPD

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

库存4,976

-

OSD3358-512M-BSM

Octavo Systems LLC

21MM 256 BALL BGA

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A8, AM3358
Co-Processor: NEON™ SIMD
Speed: 1GHz
Flash Size: -
RAM Size: 512MB
Connector Type: 256-BGA
Size / Dimension: 0.83" x 0.83" (21mm x 21mm)
Operating Temperature: 0°C ~ 85°C

封装: -

库存13,986

ARM® Cortex®-A8, AM3358

NEON™ SIMD

1GHz

-

512MB

256-BGA

0.83" x 0.83" (21mm x 21mm)

0°C ~ 85°C

EC-VA-H265-10B-60-1080-OPVIC-0000

System-On-Chip (SOC) Technologies Inc.

ENCODER H265 HD VID/AUD 10BIT

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

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-

TE0808-04-15EG-1EK

Trenz Electronic GmbH

IC MOD SOM MPSOC

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU15EG-1FFVC900E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

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Zynq UltraScale+ XCZU15EG-1FFVC900E

-

128MB

4GB

B2B

2.050" L x 2.990" W (52.00mm x 76.00mm)

0°C ~ 85°C

ME-XU1-15EG-2I-D12E-G1-R4-2

Enclustra FPGA Solutions

SOM ZYNQ XU1 US+ ZU15EG

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: -
Speed: 600MHz, 1.5GHz
Flash Size: 16GB
RAM Size: 4GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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ARM® Cortex®-A53, ARM® Cortex®-R5

-

600MHz, 1.5GHz

16GB

4GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

-40°C ~ 85°C

S00021-02

Trenz Electronic GmbH

MOD SOM DDR3L 1GB

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

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-

TE0841-02-31I21-A

Trenz Electronic GmbH

IC MODULE

Module/Board Type: FPGA Core
Core Processor: Kintex UltraScale KU035
Co-Processor: -
Speed: -
Flash Size: 64MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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Kintex UltraScale KU035

-

64MB

2GB

B2B

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

FORLINX-FET3568J-C-182GSE16GIB10

Forlinx Embedded

Rockchip RK3568SOM, 2GB DDR4, 16

Module/Board Type: MPU
Core Processor: ARM® Cortex®-A55
Co-Processor: -
Speed: 1.8GHz
Flash Size: 16GB eMMC
RAM Size: 2GB
Connector Type: Board-to-Board (BTB) 4 x 80 Pin
Size / Dimension: 1.770" L x 2.756" W (45.00mm x 70.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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ARM® Cortex®-A55

-

1.8GHz

16GB eMMC

2GB

Board-to-Board (BTB) 4 x 80 Pin

1.770" L x 2.756" W (45.00mm x 70.00mm)

-40°C ~ 85°C

ME-XU1-6CG-1E-D11E-R4-2

Enclustra FPGA Solutions

SOM ZYNQ XU1 US+ ZU6CG

Module/Board Type: FPGA
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: -
Speed: 600MHz, 1.5GHz
Flash Size: 16GB
RAM Size: 4GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

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ARM® Cortex®-A53, ARM® Cortex®-R5

-

600MHz, 1.5GHz

16GB

4GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

0°C ~ 85°C

TE0803-04-2BE11-A

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

库存6

Zynq UltraScale+ XCZU2EG-1SFVC784E

-

128MB

2GB

B2B

2.050" L x 2.990" W (52.00mm x 76.00mm)

0°C ~ 85°C

ME-XU7-6EG-1I-D11E-R4

Enclustra FPGA Solutions

SOM ZYNQ US+ ZU6EG 2GB+1GB PL

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

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-

SCM-20260N-C

GHI Electronics, LLC

SITCORE SCM20260N SOM

Module/Board Type: MPU Core
Core Processor: SITCore
Co-Processor: -
Speed: 480MHz
Flash Size: 16MB
RAM Size: 32MB
Connector Type: -
Size / Dimension: -
Operating Temperature: -40°C ~ 85°C

封装: -

库存954

SITCore

-

480MHz

16MB

32MB

-

-40°C ~ 85°C

EC-VA-H264-8B-30-1080-MXC-ZL

System-On-Chip (SOC) Technologies Inc.

IC MOD ARTIX-7 A200T 256KB 32MB

Module/Board Type: FPGA Core
Core Processor: Artix-7 A200T
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: 256KB
Connector Type: SO-DIMM-204
Size / Dimension: 2.700" L x 2.000" W (68.00mm x 51.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

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Artix-7 A200T

-

32MB

256KB

SO-DIMM-204

2.700" L x 2.000" W (68.00mm x 51.00mm)

0°C ~ 85°C

TE0720-03-S004

Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

Module/Board Type: MCU, FPGA
Core Processor: -
Co-Processor: Zynq-7000 (Z-7020)
Speed: -
Flash Size: 8GB
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

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-

Zynq-7000 (Z-7020)

-

8GB

-

5746-PX-4AA-RC

Critical Link LLC

TEXAS INSTRUMENTS AM5746 SOM (32

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Cortex®-A15
Co-Processor: -
Speed: 1.5GHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) - 100, Edge Connector - 310
Size / Dimension: 3.460" L x 2.730" W (87.88mm x 69.34mm)
Operating Temperature: 0°C ~ 70°C

封装: -

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ARM® Cortex®-A15

-

1.5GHz

32MB

1GB

Board-to-Board (BTB) - 100, Edge Connector - 310

3.460" L x 2.730" W (87.88mm x 69.34mm)

0°C ~ 70°C

MYC-JX8MMA7-8E2D-32Q256D-160-I

MYIR Tech Limited

ARM i.MX 8M Mini + Artix-7 FPGA

Module/Board Type: MPU, FPGA
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4
Co-Processor: Xilinx Artix-7 XC7A25T
Speed: 1.8GHz
Flash Size: 8GB eMMC, 32MB QSPI
RAM Size: 2GB
Connector Type: Pin(s)
Size / Dimension: 3.228" L x 1.772" W (82.00mm x 45.00mm)
Operating Temperature: -40°C ~ 105°C

封装: -

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ARM® Cortex®-A53, ARM® Cortex®-M4

Xilinx Artix-7 XC7A25T

1.8GHz

8GB eMMC, 32MB QSPI

2GB

Pin(s)

3.228" L x 1.772" W (82.00mm x 45.00mm)

-40°C ~ 105°C

TE0745-03-71I31-AK

Trenz Electronic GmbH

SOM WITH AMD ZYNQ 7030-1I AND HE

Module/Board Type: MPU Core
Core Processor: ARM Cortex-A9
Co-Processor: Xilinx Zynq 7030 SoC XC7Z030-1FBG676I
Speed: -
Flash Size: 64MB
RAM Size: 1GB
Connector Type: Samtec ST5
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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ARM Cortex-A9

Xilinx Zynq 7030 SoC XC7Z030-1FBG676I

-

64MB

1GB

Samtec ST5

2.990" L x 2.050" W (76.00mm x 52.00mm)

-40°C ~ 85°C