页 35 - 嵌入式 - 微控制器，微处理器，FPGA 模块 | 集成电路（IC）

零件编号	制造商	描述	封装	库存	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
M5485HFEE-E	Logic	MODULE FIRE ENGINE Module/Board Type: MPU Core Core Processor: ColdFire V4e, MCF5485 Co-Processor: - Speed: 200MHz Flash Size: 16MB (NOR), 2MB (Boot) RAM Size: 64MB Connector Type: - Size / Dimension: 3.7" x 4.5" (95mm x 114mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存6,736	ColdFire V4e, MCF5485	-	200MHz	16MB (NOR), 2MB (Boot)	64MB	-	3.7" x 4.5" (95mm x 114mm)	-40°C ~ 85°C
TE0600-02B	Trenz Electronic GmbH	SOM GIGABEE XC6SLX100 2X128MB 2I Module/Board Type: FPGA Core Processor: Spartan-6 LX-100 Co-Processor: - Speed: 125MHz Flash Size: 16MB RAM Size: 256MB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存6,224	Spartan-6 LX-100	-	125MHz	16MB	256MB	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	0°C ~ 70°C
CC-9C-V212-Z1-B	Digi International	MODULE 9C 16MB SDRAM 4MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9360 Co-Processor: - Speed: 155MHz Flash Size: 4MB RAM Size: 16MB Connector Type: SO-DIMM-144 Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存3,168	ARM926EJ-S, NS9360	-	155MHz	4MB	16MB	SO-DIMM-144	3.59" x 2.06" (91.2mm x 52.2mm)	-40°C ~ 85°C
MOD5270BXXE	NXP	MOD NETBURNER MOD5270 10 UNITS Module/Board Type: MCU, Ethernet Core Core Processor: ColdFire 5270 Co-Processor: - Speed: 95MHz Flash Size: 512KB RAM Size: 2.064MB Connector Type: RJ-45, 2x50 Header Size / Dimension: 2.6" x 2" (66.04mm x 50.8mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存3,440	ColdFire 5270	-	95MHz	512KB	2.064MB	RJ-45, 2x50 Header	2.6" x 2" (66.04mm x 50.8mm)	0°C ~ 70°C
CENGLH7A404-11-403EC	Logic	CARD ENGINE 16MB FLASH 32MB RAM Module/Board Type: MPU Core Core Processor: ARM922T, LH7A404 Co-Processor: - Speed: 200MHz Flash Size: 16MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存2,496	ARM922T, LH7A404	-	200MHz	16MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
DC-SP-01-C-W-25	Digi International	ADAPTER SP CUSTOMIZABLE 25PK Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 4MB RAM Size: 16MB Connector Type: RJ45 Size / Dimension: 3.88" x 1.68" (98.5mm x 42.7mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存2,688	ARM7TDMI, NS7520	-	55MHz	4MB	16MB	RJ45	3.88" x 1.68" (98.5mm x 42.7mm)	-40°C ~ 85°C
TE0715-04-15-2I	Trenz Electronic GmbH	SOM SOC 7Z015-2CLG485I 1GB DDR3 Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7015) Speed: 125MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存3,184	ARM Cortex-A9	Zynq-7000 (Z-7015)	125MHz	32MB	1GB	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	-40°C ~ 85°C
CC-MX-MB6B-ZK	Digi International	MODULE I.MX51 600MHZ 3GB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	库存7,632	-	-	-	-	-	-	-	-
CC-9P-T236-Z1	Digi International	MODULE 9P 64MB SDRAM 64MB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	库存6,060	-	-	-	-	-	-	-	-
CC-9P-V502-C-B	Digi International	MOD 9P 8MB SDRAM 4MB FLASH 25PAK Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9215 Co-Processor: - Speed: 150MHz Flash Size: 4MB RAM Size: 8MB Connector Type: Board-to-Board (BTB) Socket - 160 Size / Dimension: 1.97" x 1.97" (50mm x 50mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存7,856	ARM926EJ-S, NS9215	-	150MHz	4MB	8MB	Board-to-Board (BTB) Socket - 160	1.97" x 1.97" (50mm x 50mm)	-40°C ~ 85°C
DLP-HS-FPGA-A	DLP Design Inc.	MODULE USB-TO-FPGA SPARTAN3 Module/Board Type: FPGA, USB Core Core Processor: Spartan-3A, XC3S200A Co-Processor: FT2232H Speed: 66MHz Flash Size: - RAM Size: 32MB Connector Type: USB - B, Pin Header Size / Dimension: 3" x 1.2" (76.2mm x 30.5mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存6,816	Spartan-3A, XC3S200A	FT2232H	66MHz	-	32MB	USB - B, Pin Header	3" x 1.2" (76.2mm x 30.5mm)	0°C ~ 70°C
SOMDM3730-11-1783JFIR	Logic	DM3730 SOM-LV TYPE III 800MHZ 25 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	库存4,800	-	-	-	-	-	-	-	-
OSD3358-512M-IND	Octavo Systems LLC	SIP SOM AM3358 512MB DDR3 Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A8, AM3358 Co-Processor: NEON™ SIMD Speed: 1GHz Flash Size: - RAM Size: 512MB Connector Type: 400-BGA Size / Dimension: 1.06" x 1.06" (27.0mm x 27.0mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存7,080	ARM® Cortex®-A8, AM3358	NEON™ SIMD	1GHz	-	512MB	400-BGA	1.06" x 1.06" (27.0mm x 27.0mm)	-40°C ~ 85°C
OSD32MP157C-512M-IAA	Octavo Systems LLC	SIP ARM CORTEX STM32MP157C Module/Board Type: MPU Core Core Processor: Arm® Dual Cortex®-A7, Arm® Cortex®-M4 Co-Processor: NEON™ SIMD Speed: 650MHz, 209MHz Flash Size: - RAM Size: - Connector Type: 302-BGA Size / Dimension: 0.709" L x 0.709" W (18.00mm x 18.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存1,929	Arm® Dual Cortex®-A7, Arm® Cortex®-M4	NEON™ SIMD	650MHz, 209MHz	-	-	302-BGA	0.709" L x 0.709" W (18.00mm x 18.00mm)	-40°C ~ 85°C
TE0712-03-81I36-A	Trenz Electronic GmbH	FPGA MODULE ARTIX7 Module/Board Type: FPGA Core Core Processor: Artix-7 XC7A200T-1FBG484I Co-Processor: - Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	Artix-7 XC7A200T-1FBG484I	-	-	32MB	1GB	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0726-04-41C94-A	Trenz Electronic GmbH	IC MODULE ZYNQBERRY Module/Board Type: FPGA Core Processor: Zynq™ XC7Z010-1CLG225C Co-Processor: - Speed: - Flash Size: 16MB RAM Size: 512MB Connector Type: RJ45 Size / Dimension: 3.661" L x 2.500" W (93.00mm x 63.50mm) Operating Temperature: 0°C ~ 70°C	封装: -	Request a Quote	Zynq™ XC7Z010-1CLG225C	-	-	16MB	512MB	RJ45	3.661" L x 2.500" W (93.00mm x 63.50mm)	0°C ~ 70°C
ME-ZX5-30-1I-D10-R3-2	Enclustra FPGA Solutions	SOM ZYNQ 7Z030 1GB Module/Board Type: FPGA Core Core Processor: ARM® Dual-Core Cortex-A9 Co-Processor: Artix-7, Kintex-7 Speed: 1GHz Flash Size: 512MB RAM Size: 512MB, 1GB Connector Type: 168 Pin Size / Dimension: 2.200" L x 2.130" W (56.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存186	ARM® Dual-Core Cortex-A9	Artix-7, Kintex-7	1GHz	512MB	512MB, 1GB	168 Pin	2.200" L x 2.130" W (56.00mm x 54.00mm)	-40°C ~ 85°C
20-101-0030	Digi	BL1600 CONTROLLER Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	Request a Quote	-	-	-	-	-	-	-	-
TE0808-04-6BE21-A	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 4GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU6EG-1FFVC900E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote	Zynq UltraScale+ XCZU6EG-1FFVC900E	-	-	128MB	4GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	0°C ~ 85°C
MA-ZX3-20-2I-D10-R7	Enclustra FPGA Solutions	SOM ZYNQ 7Z020 1GB Module/Board Type: MPU Core Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: 50MHz Flash Size: 1GB (NAND) RAM Size: 1.024GB Connector Type: 200 Pin Size / Dimension: 2.660" L x 1.180" W (67.60mm x 30.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7020)	50MHz	1GB (NAND)	1.024GB	200 Pin	2.660" L x 1.180" W (67.60mm x 30.00mm)	-40°C ~ 85°C
TE0600-03IC4	Trenz Electronic GmbH	IC MODULE GIGABEE Module/Board Type: FPGA Core Core Processor: Spartan-6 LX-45 Co-Processor: - Speed: 125MHz Flash Size: 16MB RAM Size: 256MB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	Spartan-6 LX-45	-	125MHz	16MB	256MB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
DC-VA-H264-10B-60-1080-MD00C-A200T	System-On-Chip (SOC) Technologies Inc.	MOD H264 DEC 60FPS 1080 SODIMM Module/Board Type: DSP, FPGA Core Core Processor: - Co-Processor: Xilinx Artix-7 XC7A200T Speed: - Flash Size: 32MB RAM Size: 512MB Connector Type: SO-DIMM Size / Dimension: - Operating Temperature: -	封装: -	Request a Quote	-	Xilinx Artix-7 XC7A200T	-	32MB	512MB	SO-DIMM	-	-
TE0630-02IBFC1	Trenz Electronic GmbH	FPGA MODULE SPARTAN-6 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	Request a Quote	-	-	-	-	-	-	-	-
ME-XU7-15EG-2I-D12E-R3	Enclustra FPGA Solutions	IC MOD ARM 533MHZ/1.333GHZ 2GB Module/Board Type: MPU, FPGA Core Core Processor: ARM® Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU Co-Processor: - Speed: 533MHz, 1.333GHz Flash Size: 16GB RAM Size: 2GB, 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	ARM® Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU	-	533MHz, 1.333GHz	16GB	2GB, 4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	-40°C ~ 85°C
TE0741-05-B2I-1-A	Trenz Electronic GmbH	MODULE FPGA KINTEX Module/Board Type: FPGA Core Processor: Xilinx Kintex-7 FPGA XC7K160T-2FBG676I Co-Processor: - Speed: - Flash Size: 32MB RAM Size: - Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	Xilinx Kintex-7 FPGA XC7K160T-2FBG676I	-	-	32MB	-	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0820-04-2AE21FA	Trenz Electronic GmbH	MOD MPSOC ZU2CG-1E 2GB DDR4 IND Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote	Zynq UltraScale+ XCZU2CG-1SFVC784E	-	-	128MB	2GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
TE0813-02-2BE81-A	Trenz Electronic GmbH	MPSOC MODULE WITH AMD ZYNQ ULTRA Module/Board Type: MPU Core Core Processor: Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket - 4 x 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote	Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 4 x 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
CC-WST-DX58-NK	Digi	CC STM32MP133 802.11 BLUETOOTH Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4 Co-Processor: - Speed: 209MHz, 650MHz Flash Size: 256MB RAM Size: 256MB Connector Type: Pin(s) Size / Dimension: 1.142" L x 1.142" W (29.00mm x 29.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存6	ARM® Cortex®-A7, ARM® Cortex®-M4	-	209MHz, 650MHz	256MB	256MB	Pin(s)	1.142" L x 1.142" W (29.00mm x 29.00mm)	-40°C ~ 85°C
TE0745-02-92I31-F	Trenz Electronic GmbH	MOD SOM DDR3L 1GB Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7045) Speed: - Flash Size: 64MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket - 480 Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7045)	-	64MB	1GB	Board-to-Board (BTB) Socket - 480	2.050" L x 2.990" W (52.00mm x 76.00mm)	-40°C ~ 85°C
TE0712-02-72C03-M	Trenz Electronic GmbH	IC MODULE ARTIX7 Module/Board Type: FPGA Core Core Processor: - Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote	-	-	200MHz	32MB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C

M5485HFEE-E

Logic

MODULE FIRE ENGINE

Module/Board Type: MPU Core
Core Processor: ColdFire V4e, MCF5485
Co-Processor: -
Speed: 200MHz
Flash Size: 16MB (NOR), 2MB (Boot)
RAM Size: 64MB
Connector Type: -
Size / Dimension: 3.7" x 4.5" (95mm x 114mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存6,736

ColdFire V4e, MCF5485

-

200MHz

16MB (NOR), 2MB (Boot)

64MB

-

3.7" x 4.5" (95mm x 114mm)

-40°C ~ 85°C

TE0600-02B

Trenz Electronic GmbH

SOM GIGABEE XC6SLX100 2X128MB 2I

Module/Board Type: FPGA
Core Processor: Spartan-6 LX-100
Co-Processor: -
Speed: 125MHz
Flash Size: 16MB
RAM Size: 256MB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存6,224

Spartan-6 LX-100

-

125MHz

16MB

256MB

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

0°C ~ 70°C

CC-9C-V212-Z1-B

Digi International

MODULE 9C 16MB SDRAM 4MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9360
Co-Processor: -
Speed: 155MHz
Flash Size: 4MB
RAM Size: 16MB
Connector Type: SO-DIMM-144
Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存3,168

ARM926EJ-S, NS9360

-

155MHz

4MB

16MB

SO-DIMM-144

3.59" x 2.06" (91.2mm x 52.2mm)

-40°C ~ 85°C

MOD5270BXXE

NXP

MOD NETBURNER MOD5270 10 UNITS

Module/Board Type: MCU, Ethernet Core
Core Processor: ColdFire 5270
Co-Processor: -
Speed: 95MHz
Flash Size: 512KB
RAM Size: 2.064MB
Connector Type: RJ-45, 2x50 Header
Size / Dimension: 2.6" x 2" (66.04mm x 50.8mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存3,440

ColdFire 5270

-

95MHz

512KB

2.064MB

RJ-45, 2x50 Header

2.6" x 2" (66.04mm x 50.8mm)

0°C ~ 70°C

CENGLH7A404-11-403EC

Logic

CARD ENGINE 16MB FLASH 32MB RAM

Module/Board Type: MPU Core
Core Processor: ARM922T, LH7A404
Co-Processor: -
Speed: 200MHz
Flash Size: 16MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存2,496

ARM922T, LH7A404

-

200MHz

16MB

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

0°C ~ 70°C

DC-SP-01-C-W-25

Digi International

ADAPTER SP CUSTOMIZABLE 25PK

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 4MB
RAM Size: 16MB
Connector Type: RJ45
Size / Dimension: 3.88" x 1.68" (98.5mm x 42.7mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存2,688

ARM7TDMI, NS7520

-

55MHz

4MB

16MB

RJ45

3.88" x 1.68" (98.5mm x 42.7mm)

-40°C ~ 85°C

TE0715-04-15-2I

Trenz Electronic GmbH

SOM SOC 7Z015-2CLG485I 1GB DDR3

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7015)
Speed: 125MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存3,184

ARM Cortex-A9

Zynq-7000 (Z-7015)

125MHz

32MB

1GB

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

-40°C ~ 85°C

CC-MX-MB6B-ZK

Digi International

MODULE I.MX51 600MHZ 3GB FLASH

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

库存7,632

-

CC-9P-T236-Z1

Digi International

MODULE 9P 64MB SDRAM 64MB FLASH

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

库存6,060

-

CC-9P-V502-C-B

Digi International

MOD 9P 8MB SDRAM 4MB FLASH 25PAK

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9215
Co-Processor: -
Speed: 150MHz
Flash Size: 4MB
RAM Size: 8MB
Connector Type: Board-to-Board (BTB) Socket - 160
Size / Dimension: 1.97" x 1.97" (50mm x 50mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存7,856

ARM926EJ-S, NS9215

-

150MHz

4MB

8MB

Board-to-Board (BTB) Socket - 160

1.97" x 1.97" (50mm x 50mm)

-40°C ~ 85°C

DLP-HS-FPGA-A

DLP Design Inc.

MODULE USB-TO-FPGA SPARTAN3

Module/Board Type: FPGA, USB Core
Core Processor: Spartan-3A, XC3S200A
Co-Processor: FT2232H
Speed: 66MHz
Flash Size: -
RAM Size: 32MB
Connector Type: USB - B, Pin Header
Size / Dimension: 3" x 1.2" (76.2mm x 30.5mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存6,816

Spartan-3A, XC3S200A

FT2232H

66MHz

-

32MB

USB - B, Pin Header

3" x 1.2" (76.2mm x 30.5mm)

0°C ~ 70°C

SOMDM3730-11-1783JFIR

Logic

DM3730 SOM-LV TYPE III 800MHZ 25

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

库存4,800

-

OSD3358-512M-IND

Octavo Systems LLC

SIP SOM AM3358 512MB DDR3

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A8, AM3358
Co-Processor: NEON™ SIMD
Speed: 1GHz
Flash Size: -
RAM Size: 512MB
Connector Type: 400-BGA
Size / Dimension: 1.06" x 1.06" (27.0mm x 27.0mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存7,080

ARM® Cortex®-A8, AM3358

NEON™ SIMD

1GHz

-

512MB

400-BGA

1.06" x 1.06" (27.0mm x 27.0mm)

-40°C ~ 85°C

OSD32MP157C-512M-IAA

Octavo Systems LLC

SIP ARM CORTEX STM32MP157C

Module/Board Type: MPU Core
Core Processor: Arm® Dual Cortex®-A7, Arm® Cortex®-M4
Co-Processor: NEON™ SIMD
Speed: 650MHz, 209MHz
Flash Size: -
RAM Size: -
Connector Type: 302-BGA
Size / Dimension: 0.709" L x 0.709" W (18.00mm x 18.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存1,929

Arm® Dual Cortex®-A7, Arm® Cortex®-M4

NEON™ SIMD

650MHz, 209MHz

-

302-BGA

0.709" L x 0.709" W (18.00mm x 18.00mm)

-40°C ~ 85°C

TE0712-03-81I36-A

Trenz Electronic GmbH

FPGA MODULE ARTIX7

Module/Board Type: FPGA Core
Core Processor: Artix-7 XC7A200T-1FBG484I
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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Artix-7 XC7A200T-1FBG484I

-

32MB

1GB

Board-to-Board (BTB) Socket

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0726-04-41C94-A

Trenz Electronic GmbH

IC MODULE ZYNQBERRY

Module/Board Type: FPGA
Core Processor: Zynq™ XC7Z010-1CLG225C
Co-Processor: -
Speed: -
Flash Size: 16MB
RAM Size: 512MB
Connector Type: RJ45
Size / Dimension: 3.661" L x 2.500" W (93.00mm x 63.50mm)
Operating Temperature: 0°C ~ 70°C

封装: -

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Zynq™ XC7Z010-1CLG225C

-

16MB

512MB

RJ45

3.661" L x 2.500" W (93.00mm x 63.50mm)

0°C ~ 70°C

ME-ZX5-30-1I-D10-R3-2

Enclustra FPGA Solutions

SOM ZYNQ 7Z030 1GB

Module/Board Type: FPGA Core
Core Processor: ARM® Dual-Core Cortex-A9
Co-Processor: Artix-7, Kintex-7
Speed: 1GHz
Flash Size: 512MB
RAM Size: 512MB, 1GB
Connector Type: 168 Pin
Size / Dimension: 2.200" L x 2.130" W (56.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存186

ARM® Dual-Core Cortex-A9

Artix-7, Kintex-7

1GHz

512MB

512MB, 1GB

168 Pin

2.200" L x 2.130" W (56.00mm x 54.00mm)

-40°C ~ 85°C

20-101-0030

Digi

BL1600 CONTROLLER

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

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-

TE0808-04-6BE21-A

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 4GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU6EG-1FFVC900E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

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Zynq UltraScale+ XCZU6EG-1FFVC900E

-

128MB

4GB

B2B

2.050" L x 2.990" W (52.00mm x 76.00mm)

0°C ~ 85°C

MA-ZX3-20-2I-D10-R7

Enclustra FPGA Solutions

SOM ZYNQ 7Z020 1GB

Module/Board Type: MPU Core
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Speed: 50MHz
Flash Size: 1GB (NAND)
RAM Size: 1.024GB
Connector Type: 200 Pin
Size / Dimension: 2.660" L x 1.180" W (67.60mm x 30.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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ARM Cortex-A9

Zynq-7000 (Z-7020)

50MHz

1GB (NAND)

1.024GB

200 Pin

2.660" L x 1.180" W (67.60mm x 30.00mm)

-40°C ~ 85°C

TE0600-03IC4

Trenz Electronic GmbH

IC MODULE GIGABEE

Module/Board Type: FPGA Core
Core Processor: Spartan-6 LX-45
Co-Processor: -
Speed: 125MHz
Flash Size: 16MB
RAM Size: 256MB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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Spartan-6 LX-45

-

125MHz

16MB

256MB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

DC-VA-H264-10B-60-1080-MD00C-A200T

System-On-Chip (SOC) Technologies Inc.

MOD H264 DEC 60FPS 1080 SODIMM

Module/Board Type: DSP, FPGA Core
Core Processor: -
Co-Processor: Xilinx Artix-7 XC7A200T
Speed: -
Flash Size: 32MB
RAM Size: 512MB
Connector Type: SO-DIMM
Size / Dimension: -
Operating Temperature: -

封装: -

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-

Xilinx Artix-7 XC7A200T

-

32MB

512MB

SO-DIMM

-

TE0630-02IBFC1

Trenz Electronic GmbH

FPGA MODULE SPARTAN-6

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

Request a Quote

-

ME-XU7-15EG-2I-D12E-R3

Enclustra FPGA Solutions

IC MOD ARM 533MHZ/1.333GHZ 2GB

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU
Co-Processor: -
Speed: 533MHz, 1.333GHz
Flash Size: 16GB
RAM Size: 2GB, 4GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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ARM® Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU

-

533MHz, 1.333GHz

16GB

2GB, 4GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

-40°C ~ 85°C

TE0741-05-B2I-1-A

Trenz Electronic GmbH

MODULE FPGA KINTEX

Module/Board Type: FPGA
Core Processor: Xilinx Kintex-7 FPGA XC7K160T-2FBG676I
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: -
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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Xilinx Kintex-7 FPGA XC7K160T-2FBG676I

-

32MB

-

Board-to-Board (BTB) Socket

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0820-04-2AE21FA

Trenz Electronic GmbH

MOD MPSOC ZU2CG-1E 2GB DDR4 IND

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

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Zynq UltraScale+ XCZU2CG-1SFVC784E

-

128MB

2GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 85°C

TE0813-02-2BE81-A

Trenz Electronic GmbH

MPSOC MODULE WITH AMD ZYNQ ULTRA

Module/Board Type: MPU Core
Core Processor: Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket - 4 x 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

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Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E

-

128MB

4GB

Board-to-Board (BTB) Socket - 4 x 240

2.990" L x 2.050" W (76.00mm x 52.00mm)

0°C ~ 85°C

CC-WST-DX58-NK

Digi

CC STM32MP133 802.11 BLUETOOTH

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Co-Processor: -
Speed: 209MHz, 650MHz
Flash Size: 256MB
RAM Size: 256MB
Connector Type: Pin(s)
Size / Dimension: 1.142" L x 1.142" W (29.00mm x 29.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存6

ARM® Cortex®-A7, ARM® Cortex®-M4

-

209MHz, 650MHz

256MB

Pin(s)

1.142" L x 1.142" W (29.00mm x 29.00mm)

-40°C ~ 85°C

TE0745-02-92I31-F

Trenz Electronic GmbH

MOD SOM DDR3L 1GB

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7045)
Speed: -
Flash Size: 64MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket - 480
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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ARM Cortex-A9

Zynq-7000 (Z-7045)

-

64MB

1GB

Board-to-Board (BTB) Socket - 480

2.050" L x 2.990" W (52.00mm x 76.00mm)

-40°C ~ 85°C

TE0712-02-72C03-M

Trenz Electronic GmbH

IC MODULE ARTIX7

Module/Board Type: FPGA Core
Core Processor: -
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

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-

200MHz

32MB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 85°C