页 33 - 嵌入式 - 微控制器，微处理器，FPGA 模块 | 集成电路（IC）

零件编号	制造商	描述	封装	库存	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
TE0600-02IN	Trenz Electronic GmbH	SOM GIGABEE XC6SLX45 2X128MB 2I Module/Board Type: FPGA Core Processor: Spartan-6 LX-45 Co-Processor: - Speed: 125MHz Flash Size: 16MB RAM Size: 256MB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存7,456	Spartan-6 LX-45	-	125MHz	16MB	256MB	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	-40°C ~ 85°C
CC-9P-V502-MF-VS	Digi International	MODULE 9P 8MB SDRAM 4MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9215 Co-Processor: - Speed: 150MHz Flash Size: 4MB RAM Size: 8MB Connector Type: Board-to-Board (BTB) Socket - 160 Size / Dimension: 1.97" x 1.97" (50mm x 50mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存5,376	ARM926EJ-S, NS9215	-	150MHz	4MB	8MB	Board-to-Board (BTB) Socket - 160	1.97" x 1.97" (50mm x 50mm)	-40°C ~ 85°C
101-1006	Digi International	MODULE POWERCORE FLEX 3800 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 51.6MHz Flash Size: 512KB (Internal), 1MB (External) RAM Size: 1MB Connector Type: IDC Header 2x25, 2x5, 1x3mm Size / Dimension: 2.35" x 4" (60mm x 102mm) Operating Temperature: -40°C ~ 70°C	封装: -	库存5,616	Rabbit 3000	-	51.6MHz	512KB (Internal), 1MB (External)	1MB	IDC Header 2x25, 2x5, 1x3mm	2.35" x 4" (60mm x 102mm)	-40°C ~ 70°C
CENGPXA270-416-10-550EIR	Logic	CARD ENGING 64MB SDRAM Module/Board Type: MCU Core Core Processor: PXA270 Co-Processor: - Speed: 416MHz Flash Size: 64MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存7,936	PXA270	-	416MHz	64MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	-40°C ~ 85°C
20-101-0961	Digi International	MODULE RABBITCORE RCM3720 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 22.1MHz Flash Size: 512KB (Internal), 1MB (External) RAM Size: 256KB Connector Type: IDC Header 2x20 Size / Dimension: 1.2" x 2.95" (30mm x 75mm) Operating Temperature: -40°C ~ 70°C	封装: -	库存3,840	Rabbit 3000	-	22.1MHz	512KB (Internal), 1MB (External)	256KB	IDC Header 2x20	1.2" x 2.95" (30mm x 75mm)	-40°C ~ 70°C
FS-353	Digi International	MODULE 7U 16MB SDRAM 8MB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	库存7,568	-	-	-	-	-	-	-	-
CENGLH7A400-10-403EC	Logic	CARD ENGINE 16MB FLASH 32MB RAM Module/Board Type: MPU Core Core Processor: ARM922T, LH7A400 Co-Processor: - Speed: 200MHz Flash Size: 16MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存7,168	ARM922T, LH7A400	-	200MHz	16MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
101-0508	Digi International	MODULE RABBITCORE RCM3010 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 30MHz Flash Size: 256KB RAM Size: 128KB Connector Type: 2 IDC Headers 2x17 Size / Dimension: 1.85" x 2.73" (47mm x 69mm) Operating Temperature: -40°C ~ 70°C	封装: -	库存2,080	Rabbit 3000	-	30MHz	256KB	128KB	2 IDC Headers 2x17	1.85" x 2.73" (47mm x 69mm)	-40°C ~ 70°C
TE0841-01-035-1C	Trenz Electronic GmbH	SOM USCALE XCKU035-1C 1GB DDR4 Module/Board Type: FPGA Core Processor: Kintex UltraScale KU35 Co-Processor: - Speed: - Flash Size: 32MB RAM Size: 4GB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存6,208	Kintex UltraScale KU35	-	-	32MB	4GB	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	0°C ~ 70°C
5CSX-H6-53B-RC	Critical Link LLC	MITYSOM-5CSX W/ ALTERA CYCLONE V Module/Board Type: MPU, FPGA Core Core Processor: ARM? Cortex?-A9, Cyclone V SX/SE Co-Processor: NEON SIMD Speed: 800MHz Flash Size: 48MB RAM Size: 512MB Connector Type: Edge Connector Size / Dimension: 3.2" x 1.5" (82mm x 39mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存3,376	ARM? Cortex?-A9, Cyclone V SX/SE	NEON SIMD	800MHz	48MB	512MB	Edge Connector	3.2" x 1.5" (82mm x 39mm)	0°C ~ 70°C
20-101-1068	Digi International	MODULE RABBITCORE RCM3315 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 44.2MHz Flash Size: 512KB (Internal), 4MB (External) RAM Size: 1MB Connector Type: 2 IDC Headers 2x17, 1 IDC Header 2x5 Size / Dimension: 1.85" x 2.73" (47mm x 69mm) Operating Temperature: -40°C ~ 70°C	封装: -	库存2,512	Rabbit 3000	-	44.2MHz	512KB (Internal), 4MB (External)	1MB	2 IDC Headers 2x17, 1 IDC Header 2x5	1.85" x 2.73" (47mm x 69mm)	-40°C ~ 70°C
TE0741-03-160-2CF	Trenz Electronic GmbH	SOM KINTEX-7 160T 32MB FLASH AES Module/Board Type: FPGA Core Processor: Kintex-7 160T Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: - Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存4,640	Kintex-7 160T	-	200MHz	32MB	-	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	0°C ~ 70°C
20-101-1306	Digi International	CORE MODULE RCM5750 Module/Board Type: MPU Core Core Processor: Rabbit 5000 Co-Processor: - Speed: 50MHz Flash Size: 1MB (Internal), 2MB (External) RAM Size: 128KB (Internal), 512KB (External) Connector Type: Edge Connector - 52 Size / Dimension: 1.2" x 2" (30mm x 51mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存2,608	Rabbit 5000	-	50MHz	1MB (Internal), 2MB (External)	128KB (Internal), 512KB (External)	Edge Connector - 52	1.2" x 2" (30mm x 51mm)	-40°C ~ 85°C
DC-ME-01T-S-50	Digi International	ME 8MB SDRAM 2MB FLASH 50 PACK Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 2MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存4,608	ARM7TDMI, NS7520	-	55MHz	2MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 85°C
SOMAM3703-20-1780AGCR	Logic	SYSTEM ON MODULE TORP AM3703 Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, AM3703 Co-Processor: - Speed: 800MHz Flash Size: 512MB RAM Size: 256MB Connector Type: Board-to-Board (BTB) Socket - 200 Size / Dimension: 0.59" x 1.06" (15mm x 27mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存7,008	ARM? Cortex?-A8, AM3703	-	800MHz	512MB	256MB	Board-to-Board (BTB) Socket - 200	0.59" x 1.06" (15mm x 27mm)	0°C ~ 70°C
DC-ME-Y402-C	Digi International	ME 9210 8MB SDRAM 4MB FLASH SGL Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9210 Co-Processor: - Speed: 75MHz Flash Size: 4MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 80°C	封装: -	库存15,156	ARM926EJ-S, NS9210	-	75MHz	4MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 80°C
XPP100200S-02R	Lantronix, Inc.	XPORT PRO EXTENDED SRAM, EXTENDE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	库存3,888	-	-	-	-	-	-	-	-
SOMAM1808-10-1603QHIR	Logic	AM1808 SOM-M1 I-TEMP Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	库存6,080	-	-	-	-	-	-	-	-
XPP1003000-04R	Lantronix, Inc.	XPORT PRO ROHS EXTENDED RAM, EXT Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	库存5,904	-	-	-	-	-	-	-	-
TE0817-01-4BE21-A	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq™ UltraScale+™ XCZU4EG-1FBVB900E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote	Zynq™ UltraScale+™ XCZU4EG-1FBVB900E	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
TE0820-05-5DR21MA	Trenz Electronic GmbH	MOD MPSOC 2GB DDR4 Module/Board Type: MPU Core Core Processor: - Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	Request a Quote	-	-	-	128MB	2GB	-	-	-
L138-FG-326-RC	Critical Link LLC	MITYDSP-L138F SOM W/ OMAP-L138 Module/Board Type: MPU, DSP, FPGA Core Core Processor: ARM926EJ-S, OMAP-L138 Co-Processor: TMS320C674x (DSP), Spartan-6, XC6SLX16 (FPGA) Speed: 456MHz Flash Size: 256MB (NAND), 16MB (NOR) RAM Size: 256MB Connector Type: SO-DIMM-200 Size / Dimension: 2.660" L x 2.000" W (67.60mm x 50.80mm) Operating Temperature: 0°C ~ 70°C	封装: -	Request a Quote	ARM926EJ-S, OMAP-L138	TMS320C674x (DSP), Spartan-6, XC6SLX16 (FPGA)	456MHz	256MB (NAND), 16MB (NOR)	256MB	SO-DIMM-200	2.660" L x 2.000" W (67.60mm x 50.80mm)	0°C ~ 70°C
TE0820-05-2BE21MAJ	Trenz Electronic GmbH	MOD MPSOC 2GB DDR4 Module/Board Type: MPU Core Core Processor: ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: Pin(s) Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote	ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E	-	128MB	2GB	Pin(s)	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
TE0807-03-4BE21-A	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq™ UltraScale+™ XCZU4EG-1FBVB900E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket - 160 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote	Zynq™ UltraScale+™ XCZU4EG-1FBVB900E	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 160	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
TE0720-03-61Q33ML	Trenz Electronic GmbH	IC SOC MODULE XILINX ZYNQ Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: - Flash Size: 8GB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7020)	-	8GB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TEC0850-03-BBEX1-C	Trenz Electronic GmbH	IC MODULE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	Request a Quote	-	-	-	-	-	-	-	-
XP1001000-05R-J	Lantronix, Inc.	XPORT XE, EXTENDED TEMPERATURE, Module/Board Type: - Core Processor: DSTni-EX Co-Processor: XPort AR Speed: 25MHz Flash Size: 512KB RAM Size: 256KB Connector Type: RJ-45 Size / Dimension: 1.330" L x 0.640" W (33.90mm x 16.25mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	DSTni-EX	XPort AR	25MHz	512KB	256KB	RJ-45	1.330" L x 0.640" W (33.90mm x 16.25mm)	-40°C ~ 85°C
6231-HX-XXA-RC	Critical Link LLC	SOM WITH TI SITARA AM6231, 800MH Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53 Co-Processor: NEON SIMD Speed: 800MHz Flash Size: - RAM Size: 1GB Connector Type: SO-DIMM-260 Size / Dimension: 2.740" L x 1.500" W (69.60mm x 38.10mm) Operating Temperature: 0°C ~ 70°C	封装: -	Request a Quote	ARM® Cortex®-A53	NEON SIMD	800MHz	-	1GB	SO-DIMM-260	2.740" L x 1.500" W (69.60mm x 38.10mm)	0°C ~ 70°C
ME-AA1-270-3E4-D11E-R2	Enclustra FPGA Solutions	SOM ARRIA 10 10AS027 2GB Module/Board Type: FPGA Core Core Processor: ARM® Dual-Core Cortex-A9 Co-Processor: - Speed: 1.5GHz Flash Size: 16GB RAM Size: 2GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote	ARM® Dual-Core Cortex-A9	-	1.5GHz	16GB	2GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	0°C ~ 85°C
6254-TX-XXD-RI	Critical Link LLC	SOM WITH TI SITARA AM6254, 1.4GH Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53 Co-Processor: NEON SIMD Speed: 1GHz Flash Size: - RAM Size: 2GB Connector Type: SO-DIMM-260 Size / Dimension: 2.740" L x 1.500" W (69.60mm x 38.10mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存57	ARM® Cortex®-A53	NEON SIMD	1GHz	-	2GB	SO-DIMM-260	2.740" L x 1.500" W (69.60mm x 38.10mm)	-40°C ~ 85°C

TE0600-02IN

Trenz Electronic GmbH

SOM GIGABEE XC6SLX45 2X128MB 2I

Module/Board Type: FPGA
Core Processor: Spartan-6 LX-45
Co-Processor: -
Speed: 125MHz
Flash Size: 16MB
RAM Size: 256MB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存7,456

Spartan-6 LX-45

-

125MHz

16MB

256MB

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

-40°C ~ 85°C

CC-9P-V502-MF-VS

Digi International

MODULE 9P 8MB SDRAM 4MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9215
Co-Processor: -
Speed: 150MHz
Flash Size: 4MB
RAM Size: 8MB
Connector Type: Board-to-Board (BTB) Socket - 160
Size / Dimension: 1.97" x 1.97" (50mm x 50mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存5,376

ARM926EJ-S, NS9215

-

150MHz

4MB

8MB

Board-to-Board (BTB) Socket - 160

1.97" x 1.97" (50mm x 50mm)

-40°C ~ 85°C

101-1006

Digi International

MODULE POWERCORE FLEX 3800

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 51.6MHz
Flash Size: 512KB (Internal), 1MB (External)
RAM Size: 1MB
Connector Type: IDC Header 2x25, 2x5, 1x3mm
Size / Dimension: 2.35" x 4" (60mm x 102mm)
Operating Temperature: -40°C ~ 70°C

封装: -

库存5,616

Rabbit 3000

-

51.6MHz

512KB (Internal), 1MB (External)

1MB

IDC Header 2x25, 2x5, 1x3mm

2.35" x 4" (60mm x 102mm)

-40°C ~ 70°C

CENGPXA270-416-10-550EIR

Logic

CARD ENGING 64MB SDRAM

Module/Board Type: MCU Core
Core Processor: PXA270
Co-Processor: -
Speed: 416MHz
Flash Size: 64MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存7,936

PXA270

-

416MHz

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

-40°C ~ 85°C

20-101-0961

Digi International

MODULE RABBITCORE RCM3720

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 22.1MHz
Flash Size: 512KB (Internal), 1MB (External)
RAM Size: 256KB
Connector Type: IDC Header 2x20
Size / Dimension: 1.2" x 2.95" (30mm x 75mm)
Operating Temperature: -40°C ~ 70°C

封装: -

库存3,840

Rabbit 3000

-

22.1MHz

512KB (Internal), 1MB (External)

256KB

IDC Header 2x20

1.2" x 2.95" (30mm x 75mm)

-40°C ~ 70°C

FS-353

Digi International

MODULE 7U 16MB SDRAM 8MB FLASH

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

库存7,568

-

CENGLH7A400-10-403EC

Logic

CARD ENGINE 16MB FLASH 32MB RAM

Module/Board Type: MPU Core
Core Processor: ARM922T, LH7A400
Co-Processor: -
Speed: 200MHz
Flash Size: 16MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存7,168

ARM922T, LH7A400

-

200MHz

16MB

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

0°C ~ 70°C

101-0508

Digi International

MODULE RABBITCORE RCM3010

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 30MHz
Flash Size: 256KB
RAM Size: 128KB
Connector Type: 2 IDC Headers 2x17
Size / Dimension: 1.85" x 2.73" (47mm x 69mm)
Operating Temperature: -40°C ~ 70°C

封装: -

库存2,080

Rabbit 3000

-

30MHz

256KB

128KB

2 IDC Headers 2x17

1.85" x 2.73" (47mm x 69mm)

-40°C ~ 70°C

TE0841-01-035-1C

Trenz Electronic GmbH

SOM USCALE XCKU035-1C 1GB DDR4

Module/Board Type: FPGA
Core Processor: Kintex UltraScale KU35
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: 4GB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存6,208

Kintex UltraScale KU35

-

32MB

4GB

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

0°C ~ 70°C

5CSX-H6-53B-RC

Critical Link LLC

MITYSOM-5CSX W/ ALTERA CYCLONE V

Module/Board Type: MPU, FPGA Core
Core Processor: ARM? Cortex?-A9, Cyclone V SX/SE
Co-Processor: NEON SIMD
Speed: 800MHz
Flash Size: 48MB
RAM Size: 512MB
Connector Type: Edge Connector
Size / Dimension: 3.2" x 1.5" (82mm x 39mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存3,376

ARM? Cortex?-A9, Cyclone V SX/SE

NEON SIMD

800MHz

48MB

512MB

Edge Connector

3.2" x 1.5" (82mm x 39mm)

0°C ~ 70°C

20-101-1068

Digi International

MODULE RABBITCORE RCM3315

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 44.2MHz
Flash Size: 512KB (Internal), 4MB (External)
RAM Size: 1MB
Connector Type: 2 IDC Headers 2x17, 1 IDC Header 2x5
Size / Dimension: 1.85" x 2.73" (47mm x 69mm)
Operating Temperature: -40°C ~ 70°C

封装: -

库存2,512

Rabbit 3000

-

44.2MHz

512KB (Internal), 4MB (External)

1MB

2 IDC Headers 2x17, 1 IDC Header 2x5

1.85" x 2.73" (47mm x 69mm)

-40°C ~ 70°C

TE0741-03-160-2CF

Trenz Electronic GmbH

SOM KINTEX-7 160T 32MB FLASH AES

Module/Board Type: FPGA
Core Processor: Kintex-7 160T
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: -
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存4,640

Kintex-7 160T

-

200MHz

32MB

-

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

0°C ~ 70°C

20-101-1306

Digi International

CORE MODULE RCM5750

Module/Board Type: MPU Core
Core Processor: Rabbit 5000
Co-Processor: -
Speed: 50MHz
Flash Size: 1MB (Internal), 2MB (External)
RAM Size: 128KB (Internal), 512KB (External)
Connector Type: Edge Connector - 52
Size / Dimension: 1.2" x 2" (30mm x 51mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存2,608

Rabbit 5000

-

50MHz

1MB (Internal), 2MB (External)

128KB (Internal), 512KB (External)

Edge Connector - 52

1.2" x 2" (30mm x 51mm)

-40°C ~ 85°C

DC-ME-01T-S-50

Digi International

ME 8MB SDRAM 2MB FLASH 50 PACK

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 2MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存4,608

ARM7TDMI, NS7520

-

55MHz

2MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 85°C

SOMAM3703-20-1780AGCR

Logic

SYSTEM ON MODULE TORP AM3703

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8, AM3703
Co-Processor: -
Speed: 800MHz
Flash Size: 512MB
RAM Size: 256MB
Connector Type: Board-to-Board (BTB) Socket - 200
Size / Dimension: 0.59" x 1.06" (15mm x 27mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存7,008

ARM? Cortex?-A8, AM3703

-

800MHz

512MB

256MB

Board-to-Board (BTB) Socket - 200

0.59" x 1.06" (15mm x 27mm)

0°C ~ 70°C

DC-ME-Y402-C

Digi International

ME 9210 8MB SDRAM 4MB FLASH SGL

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9210
Co-Processor: -
Speed: 75MHz
Flash Size: 4MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 80°C

封装: -

库存15,156

ARM926EJ-S, NS9210

-

75MHz

4MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 80°C

XPP100200S-02R

Lantronix, Inc.

XPORT PRO EXTENDED SRAM, EXTENDE

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

库存3,888

-

SOMAM1808-10-1603QHIR

Logic

AM1808 SOM-M1 I-TEMP

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

库存6,080

-

XPP1003000-04R

Lantronix, Inc.

XPORT PRO ROHS EXTENDED RAM, EXT

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

库存5,904

-

TE0817-01-4BE21-A

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ XCZU4EG-1FBVB900E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

Request a Quote

Zynq™ UltraScale+™ XCZU4EG-1FBVB900E

-

128MB

4GB

Board-to-Board (BTB) Socket - 240

2.990" L x 2.050" W (76.00mm x 52.00mm)

0°C ~ 85°C

TE0820-05-5DR21MA

Trenz Electronic GmbH

MOD MPSOC 2GB DDR4

Module/Board Type: MPU Core
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

Request a Quote

-

128MB

2GB

-

L138-FG-326-RC

Critical Link LLC

MITYDSP-L138F SOM W/ OMAP-L138

Module/Board Type: MPU, DSP, FPGA Core
Core Processor: ARM926EJ-S, OMAP-L138
Co-Processor: TMS320C674x (DSP), Spartan-6, XC6SLX16 (FPGA)
Speed: 456MHz
Flash Size: 256MB (NAND), 16MB (NOR)
RAM Size: 256MB
Connector Type: SO-DIMM-200
Size / Dimension: 2.660" L x 2.000" W (67.60mm x 50.80mm)
Operating Temperature: 0°C ~ 70°C

封装: -

Request a Quote

ARM926EJ-S, OMAP-L138

TMS320C674x (DSP), Spartan-6, XC6SLX16 (FPGA)

456MHz

256MB (NAND), 16MB (NOR)

256MB

SO-DIMM-200

2.660" L x 2.000" W (67.60mm x 50.80mm)

0°C ~ 70°C

TE0820-05-2BE21MAJ

Trenz Electronic GmbH

MOD MPSOC 2GB DDR4

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

Request a Quote

ARM® Cortex®-R5

Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E

-

128MB

2GB

Pin(s)

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 85°C

TE0807-03-4BE21-A

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ XCZU4EG-1FBVB900E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket - 160
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

Request a Quote

Zynq™ UltraScale+™ XCZU4EG-1FBVB900E

-

128MB

4GB

Board-to-Board (BTB) Socket - 160

2.990" L x 2.050" W (76.00mm x 52.00mm)

0°C ~ 85°C

TE0720-03-61Q33ML

Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Speed: -
Flash Size: 8GB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

Request a Quote

ARM Cortex-A9

Zynq-7000 (Z-7020)

-

8GB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TEC0850-03-BBEX1-C

Trenz Electronic GmbH

IC MODULE

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

Request a Quote

-

XP1001000-05R-J

Lantronix, Inc.

XPORT XE, EXTENDED TEMPERATURE,

Module/Board Type: -
Core Processor: DSTni-EX
Co-Processor: XPort AR
Speed: 25MHz
Flash Size: 512KB
RAM Size: 256KB
Connector Type: RJ-45
Size / Dimension: 1.330" L x 0.640" W (33.90mm x 16.25mm)
Operating Temperature: -40°C ~ 85°C

封装: -

Request a Quote

DSTni-EX

XPort AR

25MHz

512KB

256KB

RJ-45

1.330" L x 0.640" W (33.90mm x 16.25mm)

-40°C ~ 85°C

6231-HX-XXA-RC

Critical Link LLC

SOM WITH TI SITARA AM6231, 800MH

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53
Co-Processor: NEON SIMD
Speed: 800MHz
Flash Size: -
RAM Size: 1GB
Connector Type: SO-DIMM-260
Size / Dimension: 2.740" L x 1.500" W (69.60mm x 38.10mm)
Operating Temperature: 0°C ~ 70°C

封装: -

Request a Quote

ARM® Cortex®-A53

NEON SIMD

800MHz

-

1GB

SO-DIMM-260

2.740" L x 1.500" W (69.60mm x 38.10mm)

0°C ~ 70°C

ME-AA1-270-3E4-D11E-R2

Enclustra FPGA Solutions

SOM ARRIA 10 10AS027 2GB

Module/Board Type: FPGA Core
Core Processor: ARM® Dual-Core Cortex-A9
Co-Processor: -
Speed: 1.5GHz
Flash Size: 16GB
RAM Size: 2GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

Request a Quote

ARM® Dual-Core Cortex-A9

-

1.5GHz

16GB

2GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

0°C ~ 85°C

6254-TX-XXD-RI

Critical Link LLC

SOM WITH TI SITARA AM6254, 1.4GH

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53
Co-Processor: NEON SIMD
Speed: 1GHz
Flash Size: -
RAM Size: 2GB
Connector Type: SO-DIMM-260
Size / Dimension: 2.740" L x 1.500" W (69.60mm x 38.10mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存57

ARM® Cortex®-A53

NEON SIMD

1GHz

-

2GB

SO-DIMM-260

2.740" L x 1.500" W (69.60mm x 38.10mm)

-40°C ~ 85°C