页 32 - 嵌入式 - 微控制器，微处理器，FPGA 模块 | 集成电路（IC）

零件编号	制造商	描述	封装	库存	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
TE0745-01-45-2I	Trenz Electronic GmbH	SOM SOC Z7 XC7Z045-2FBG676I 1GB Module/Board Type: MCU, FPGA Core Processor: ARM? Cortex?-A9 Co-Processor: Zynq-7000 (Z-7045) Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec UFPS Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存3,792	ARM? Cortex?-A9	Zynq-7000 (Z-7045)	-	32MB	1GB	Samtec UFPS	2.05" x 2.99" (52mm x 76mm)	-40°C ~ 85°C
SOMAM3703-31-1780AKIR	Logic	SYSTEM ON MODULE WIRELESS TORP Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, AM3703 Co-Processor: - Speed: 800MHz Flash Size: 512MB RAM Size: 256MB Connector Type: Board-to-Board (BTB) Socket - 200 Size / Dimension: - Operating Temperature: -40°C ~ 85°C	封装: -	库存5,760	ARM? Cortex?-A8, AM3703	-	800MHz	512MB	256MB	Board-to-Board (BTB) Socket - 200	-	-40°C ~ 85°C
20-101-1184	Digi International	MPU MODULE RABBIT 2000 TWO PACK Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	库存5,872	-	-	-	-	-	-	-	-
MOD5270BXME	NXP	MOD NETBURNER MOD5270 100 UNITS Module/Board Type: MCU, Ethernet Core Core Processor: ColdFire 5270 Co-Processor: - Speed: 95MHz Flash Size: 512KB RAM Size: 2.064MB Connector Type: RJ-45, 2x50 Header Size / Dimension: 2.6" x 2" (66.04mm x 50.8mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存2,768	ColdFire 5270	-	95MHz	512KB	2.064MB	RJ-45, 2x50 Header	2.6" x 2" (66.04mm x 50.8mm)	0°C ~ 70°C
SS1-IC	Parallax Inc.	MODULE SPIN STAMP MCU 24-DIP Module/Board Type: MPU Core Core Processor: Propeller, P8X32A-M44 Co-Processor: - Speed: 10MHz Flash Size: 32KB ROM RAM Size: 32KB Connector Type: 24-DIP Size / Dimension: 1.2" x 0.63" (31mm x 16mm) Operating Temperature: -	封装: -	库存3,152	Propeller, P8X32A-M44	-	10MHz	32KB ROM	32KB	24-DIP	1.2" x 0.63" (31mm x 16mm)	-
BS2I-IC	Parallax Inc.	MODULE BASIC STAMP 2 INDUSTRIAL Module/Board Type: MCU Core Core Processor: PIC16C57C Co-Processor: - Speed: 20MHz Flash Size: 2KB EEPROM RAM Size: 32B Connector Type: - Size / Dimension: 1.2" x 0.6" (30mm x 15mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存6,960	PIC16C57C	-	20MHz	2KB EEPROM	32B	-	1.2" x 0.6" (30mm x 15mm)	-40°C ~ 85°C
CC-9C-V212-25	Digi International	MODULE 9C 16MB SDRAM 4MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9360 Co-Processor: - Speed: 155MHz Flash Size: 4MB RAM Size: 16MB Connector Type: SO-DIMM-144 Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存3,760	ARM926EJ-S, NS9360	-	155MHz	4MB	16MB	SO-DIMM-144	3.59" x 2.06" (91.2mm x 52.2mm)	-40°C ~ 85°C
CC-9P-V524-LX-B	Digi International	MOD 9P 32MB SDRAM 16MB FLSH 25PK Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9215 Co-Processor: - Speed: 150MHz Flash Size: 16MB RAM Size: 32MB Connector Type: Board-to-Board (BTB) Socket - 160 Size / Dimension: 1.97" x 1.97" (50mm x 50mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存6,816	ARM926EJ-S, NS9215	-	150MHz	16MB	32MB	Board-to-Board (BTB) Socket - 160	1.97" x 1.97" (50mm x 50mm)	-40°C ~ 85°C
5CSX-H6-4YA-RC	Critical Link LLC	MITYSOM-5CSX W/ ALTERA CYCLONE V Module/Board Type: MPU, FPGA Core Core Processor: ARM? Cortex?-A9, Cyclone V SX/SE Co-Processor: NEON SIMD Speed: 800MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Edge Connector Size / Dimension: 3.2" x 1.5" (82mm x 39mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存7,920	ARM? Cortex?-A9, Cyclone V SX/SE	NEON SIMD	800MHz	32MB	1GB	Edge Connector	3.2" x 1.5" (82mm x 39mm)	0°C ~ 70°C
TE0710-02-35-2IF	Trenz Electronic GmbH	SOM ARTIX-7 35T 512 MBYTE DDR3 Module/Board Type: FPGA Core Processor: Artix-7 A35T Co-Processor: - Speed: 100MHz Flash Size: 32MB RAM Size: 512MB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存3,712	Artix-7 A35T	-	100MHz	32MB	512MB	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	-40°C ~ 85°C
20-101-1197	Digi International	MODULE RABBITCORE RCM3910 ROHS Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 44.2MHz Flash Size: 512KB (Internal), 32MB (External), microSD Slot (External) RAM Size: 1MB Connector Type: 2 IDC Headers 2x17, 1 IDC Header 2x5, 1xmicroSD Card Size / Dimension: 1.85" x 2.73" (47mm x 69mm) Operating Temperature: -20°C ~ 85°C	封装: -	库存7,280	Rabbit 3000	-	44.2MHz	512KB (Internal), 32MB (External), microSD Slot (External)	1MB	2 IDC Headers 2x17, 1 IDC Header 2x5, 1xmicroSD Card	1.85" x 2.73" (47mm x 69mm)	-20°C ~ 85°C
DC-ME-01T-MF	Digi International	MODULE ME 8MB SDRAM 2MB FLASH Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 2MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存5,680	ARM7TDMI, NS7520	-	55MHz	2MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 85°C
1810-DG-225-RC	Critical Link LLC	MITYDSP-1810F SOM OMAP-L138 Module/Board Type: MPU, FPGA Core Core Processor: ARM926EJ-S, AM1810 Co-Processor: Spartan-6, XC6SLX16 Speed: 375MHz Flash Size: 256MB (NAND), 8MB (NOR) RAM Size: 8KB (Internal), 128MB (External) Connector Type: SO-DIMM-200 Size / Dimension: 2.66" x 2" (67.6mm x 50.8mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存7,296	ARM926EJ-S, AM1810	Spartan-6, XC6SLX16	375MHz	256MB (NAND), 8MB (NOR)	8KB (Internal), 128MB (External)	SO-DIMM-200	2.66" x 2" (67.6mm x 50.8mm)	0°C ~ 70°C
3359-GX-226-RC	Critical Link LLC	MITYSOM-3359 PROCESSOR CARD Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, AM3359 Co-Processor: NEON SIMD Speed: 720MHz Flash Size: 256MB (NAND), 8MB (NOR) RAM Size: 64KB (Internal), 256MB (External) Connector Type: SO-DIMM-204 Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存6,976	ARM? Cortex?-A8, AM3359	NEON SIMD	720MHz	256MB (NAND), 8MB (NOR)	64KB (Internal), 256MB (External)	SO-DIMM-204	2.66" x 1.5" (67.6mm x 38.1mm)	0°C ~ 70°C
20-101-1196	Digi International	MODULE RABBITCORE RCM3900 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 44.2MHz Flash Size: 512KB (Internal), 32MB (External), microSD Slot (External) RAM Size: 1MB Connector Type: 2 IDC Headers 2x17, 1 IDC Header 2x5, 1xmicroSD Card Size / Dimension: 1.85" x 2.73" (47mm x 69mm) Operating Temperature: -20°C ~ 85°C	封装: -	库存5,024	Rabbit 3000	-	44.2MHz	512KB (Internal), 32MB (External), microSD Slot (External)	1MB	2 IDC Headers 2x17, 1 IDC Header 2x5, 1xmicroSD Card	1.85" x 2.73" (47mm x 69mm)	-20°C ~ 85°C
TE0841-02-41C21-A	Trenz Electronic GmbH	IC MODULE USCALE 2GB Module/Board Type: MCU, FPGA Core Processor: Kintex UltraScale KU40 Co-Processor: - Speed: - Flash Size: 64MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存2,560	Kintex UltraScale KU40	-	-	64MB	2GB	B2B	1.97" x 1.57" (50mm x 40mm)	0°C ~ 70°C
ME-XU8-4CG-1I-D11E-R2-1	Enclustra FPGA Solutions	SOM ZYNQ XU8 US+ ZU4CG Module/Board Type: MPU, FPGA Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: - Speed: 533MHz, 1.333GHz Flash Size: 16GB RAM Size: 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	-	533MHz, 1.333GHz	16GB	4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	-40°C ~ 85°C
5728-PX-4AA-RI	Critical Link LLC	TEXAS INSTRUMENTS AM5728 SOM (32 Module/Board Type: MPU, FPGA Core Core Processor: ARM® Cortex®-A15 Co-Processor: - Speed: 1.5GHz Flash Size: 32MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) - 100, Edge Connector - 310 Size / Dimension: 3.460" L x 2.730" W (87.88mm x 69.34mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	ARM® Cortex®-A15	-	1.5GHz	32MB	1GB	Board-to-Board (BTB) - 100, Edge Connector - 310	3.460" L x 2.730" W (87.88mm x 69.34mm)	-40°C ~ 85°C
TE0820-05-S002C1	Trenz Electronic GmbH	MOD MPSOC 2GB DDR4 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	Request a Quote	-	-	-	-	-	-	-	-
M100PF-3AC	ARIES Embedded	SOM POLARFIRE FPGA MPF300T Module/Board Type: FPGA Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: - Operating Temperature: 0°C ~ 70°C	封装: -	Request a Quote	-	-	-	-	1GB	Board-to-Board (BTB) Socket	-	0°C ~ 70°C
TE0820-05-2BI21ML	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784I Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: 2 x 100 Pin Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	Zynq UltraScale+ XCZU2EG-1SFVC784I	ARM® Cortex®-A53, ARM® Cortex®-R5	-	128MB	2GB	2 x 100 Pin	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0818-02-6BE81-A	Trenz Electronic GmbH	ULTRASOM+ MPSOC MODULE WITH ZYNQ Module/Board Type: MPU Core Core Processor: Xilinx Zynq UltraScale+ XCZU6EG-1FFVC900E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket - 4 x 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote	Xilinx Zynq UltraScale+ XCZU6EG-1FFVC900E	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 4 x 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
ME-XU1-9EG-1E-D11E-G1-R4-2	Enclustra FPGA Solutions	SOM ZYNQ XU1 US+ ZU9EG Module/Board Type: FPGA Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: - Speed: 600MHz, 1.5GHz Flash Size: 16GB RAM Size: 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	-	600MHz, 1.5GHz	16GB	4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	0°C ~ 85°C
TE0813-01-5DE11-A	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU5EV-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote	Zynq UltraScale+ XCZU5EV-1SFVC784E	-	-	128MB	2GB	Board-to-Board (BTB) Socket - 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
TE0630-03-52I12-A	Trenz Electronic GmbH	FPGA MODULE WITH AMD SPARTAN 6 L Module/Board Type: FPGA Core Processor: Xilinx Spartan™ 6 XC6SLX45-2CSG484I Co-Processor: - Speed: - Flash Size: 8MB RAM Size: 128MB Connector Type: Board-to-Board (BTB) Socket - 80 Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	Xilinx Spartan™ 6 XC6SLX45-2CSG484I	-	-	8MB	128MB	Board-to-Board (BTB) Socket - 80	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0807-03-4AI21-A	Trenz Electronic GmbH	MPSOC ZYNQ USCALE 4GB DDR4 Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU4CG-1FBVB900I Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	Zynq UltraScale+ XCZU4CG-1FBVB900I	-	-	128MB	4GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	-40°C ~ 85°C
TE0821-01-2AE31PA	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784E Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: 2 x 100 Pin Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote	Zynq UltraScale+ XCZU2CG-1SFVC784E	ARM® Cortex®-A53, ARM® Cortex®-R5	-	128MB	4GB	2 x 100 Pin	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
6252-IX-X8D-RI	Critical Link LLC	SOM WITH TI SITARA AM6252, 1GHZ, Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53 Co-Processor: NEON SIMD Speed: 1GHz Flash Size: 16GB eMMC RAM Size: 2GB Connector Type: SO-DIMM-260 Size / Dimension: 2.740" L x 1.500" W (69.60mm x 38.10mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	ARM® Cortex®-A53	NEON SIMD	1GHz	16GB eMMC	2GB	SO-DIMM-260	2.740" L x 1.500" W (69.60mm x 38.10mm)	-40°C ~ 85°C
TE0710-03-42I21-A	Trenz Electronic GmbH	DUAL FAST ETHERNET FPGA MODULE W Module/Board Type: FPGA Core Processor: Artix™ 7 XC7A35T-2CSG324I Co-Processor: - Speed: - Flash Size: 32MB RAM Size: 512MB Connector Type: 2 x 100 Pin Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	Artix™ 7 XC7A35T-2CSG324I	-	-	32MB	512MB	2 x 100 Pin	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
ME-XU1-15EG-2I-D12E-R5-0	Enclustra FPGA Solutions	SOM ZYNQ XU1 US+ ZU15EG Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU15EG-2FFVC900I Speed: 600MHz, 1.5GHz Flash Size: 16GB RAM Size: 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU15EG-2FFVC900I	600MHz, 1.5GHz	16GB	4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	-40°C ~ 85°C

TE0745-01-45-2I

Trenz Electronic GmbH

SOM SOC Z7 XC7Z045-2FBG676I 1GB

Module/Board Type: MCU, FPGA
Core Processor: ARM? Cortex?-A9
Co-Processor: Zynq-7000 (Z-7045)
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec UFPS
Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存3,792

ARM? Cortex?-A9

Zynq-7000 (Z-7045)

-

32MB

1GB

Samtec UFPS

2.05" x 2.99" (52mm x 76mm)

-40°C ~ 85°C

SOMAM3703-31-1780AKIR

Logic

SYSTEM ON MODULE WIRELESS TORP

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8, AM3703
Co-Processor: -
Speed: 800MHz
Flash Size: 512MB
RAM Size: 256MB
Connector Type: Board-to-Board (BTB) Socket - 200
Size / Dimension: -
Operating Temperature: -40°C ~ 85°C

封装: -

库存5,760

ARM? Cortex?-A8, AM3703

-

800MHz

512MB

256MB

Board-to-Board (BTB) Socket - 200

-

-40°C ~ 85°C

20-101-1184

Digi International

MPU MODULE RABBIT 2000 TWO PACK

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

库存5,872

-

MOD5270BXME

NXP

MOD NETBURNER MOD5270 100 UNITS

Module/Board Type: MCU, Ethernet Core
Core Processor: ColdFire 5270
Co-Processor: -
Speed: 95MHz
Flash Size: 512KB
RAM Size: 2.064MB
Connector Type: RJ-45, 2x50 Header
Size / Dimension: 2.6" x 2" (66.04mm x 50.8mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存2,768

ColdFire 5270

-

95MHz

512KB

2.064MB

RJ-45, 2x50 Header

2.6" x 2" (66.04mm x 50.8mm)

0°C ~ 70°C

SS1-IC

Parallax Inc.

MODULE SPIN STAMP MCU 24-DIP

Module/Board Type: MPU Core
Core Processor: Propeller, P8X32A-M44
Co-Processor: -
Speed: 10MHz
Flash Size: 32KB ROM
RAM Size: 32KB
Connector Type: 24-DIP
Size / Dimension: 1.2" x 0.63" (31mm x 16mm)
Operating Temperature: -

封装: -

库存3,152

Propeller, P8X32A-M44

-

10MHz

32KB ROM

32KB

24-DIP

1.2" x 0.63" (31mm x 16mm)

-

BS2I-IC

Parallax Inc.

MODULE BASIC STAMP 2 INDUSTRIAL

Module/Board Type: MCU Core
Core Processor: PIC16C57C
Co-Processor: -
Speed: 20MHz
Flash Size: 2KB EEPROM
RAM Size: 32B
Connector Type: -
Size / Dimension: 1.2" x 0.6" (30mm x 15mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存6,960

PIC16C57C

-

20MHz

2KB EEPROM

32B

-

1.2" x 0.6" (30mm x 15mm)

-40°C ~ 85°C

CC-9C-V212-25

Digi International

MODULE 9C 16MB SDRAM 4MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9360
Co-Processor: -
Speed: 155MHz
Flash Size: 4MB
RAM Size: 16MB
Connector Type: SO-DIMM-144
Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存3,760

ARM926EJ-S, NS9360

-

155MHz

4MB

16MB

SO-DIMM-144

3.59" x 2.06" (91.2mm x 52.2mm)

-40°C ~ 85°C

CC-9P-V524-LX-B

Digi International

MOD 9P 32MB SDRAM 16MB FLSH 25PK

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9215
Co-Processor: -
Speed: 150MHz
Flash Size: 16MB
RAM Size: 32MB
Connector Type: Board-to-Board (BTB) Socket - 160
Size / Dimension: 1.97" x 1.97" (50mm x 50mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存6,816

ARM926EJ-S, NS9215

-

150MHz

16MB

32MB

Board-to-Board (BTB) Socket - 160

1.97" x 1.97" (50mm x 50mm)

-40°C ~ 85°C

5CSX-H6-4YA-RC

Critical Link LLC

MITYSOM-5CSX W/ ALTERA CYCLONE V

Module/Board Type: MPU, FPGA Core
Core Processor: ARM? Cortex?-A9, Cyclone V SX/SE
Co-Processor: NEON SIMD
Speed: 800MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Edge Connector
Size / Dimension: 3.2" x 1.5" (82mm x 39mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存7,920

ARM? Cortex?-A9, Cyclone V SX/SE

NEON SIMD

800MHz

32MB

1GB

Edge Connector

3.2" x 1.5" (82mm x 39mm)

0°C ~ 70°C

TE0710-02-35-2IF

Trenz Electronic GmbH

SOM ARTIX-7 35T 512 MBYTE DDR3

Module/Board Type: FPGA
Core Processor: Artix-7 A35T
Co-Processor: -
Speed: 100MHz
Flash Size: 32MB
RAM Size: 512MB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存3,712

Artix-7 A35T

-

100MHz

32MB

512MB

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

-40°C ~ 85°C

20-101-1197

Digi International

MODULE RABBITCORE RCM3910 ROHS

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 44.2MHz
Flash Size: 512KB (Internal), 32MB (External), microSD Slot (External)
RAM Size: 1MB
Connector Type: 2 IDC Headers 2x17, 1 IDC Header 2x5, 1xmicroSD Card
Size / Dimension: 1.85" x 2.73" (47mm x 69mm)
Operating Temperature: -20°C ~ 85°C

封装: -

库存7,280

Rabbit 3000

-

44.2MHz

512KB (Internal), 32MB (External), microSD Slot (External)

1MB

2 IDC Headers 2x17, 1 IDC Header 2x5, 1xmicroSD Card

1.85" x 2.73" (47mm x 69mm)

-20°C ~ 85°C

DC-ME-01T-MF

Digi International

MODULE ME 8MB SDRAM 2MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 2MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存5,680

ARM7TDMI, NS7520

-

55MHz

2MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 85°C

1810-DG-225-RC

Critical Link LLC

MITYDSP-1810F SOM OMAP-L138

Module/Board Type: MPU, FPGA Core
Core Processor: ARM926EJ-S, AM1810
Co-Processor: Spartan-6, XC6SLX16
Speed: 375MHz
Flash Size: 256MB (NAND), 8MB (NOR)
RAM Size: 8KB (Internal), 128MB (External)
Connector Type: SO-DIMM-200
Size / Dimension: 2.66" x 2" (67.6mm x 50.8mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存7,296

ARM926EJ-S, AM1810

Spartan-6, XC6SLX16

375MHz

256MB (NAND), 8MB (NOR)

8KB (Internal), 128MB (External)

SO-DIMM-200

2.66" x 2" (67.6mm x 50.8mm)

0°C ~ 70°C

3359-GX-226-RC

Critical Link LLC

MITYSOM-3359 PROCESSOR CARD

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8, AM3359
Co-Processor: NEON SIMD
Speed: 720MHz
Flash Size: 256MB (NAND), 8MB (NOR)
RAM Size: 64KB (Internal), 256MB (External)
Connector Type: SO-DIMM-204
Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存6,976

ARM? Cortex?-A8, AM3359

NEON SIMD

720MHz

256MB (NAND), 8MB (NOR)

64KB (Internal), 256MB (External)

SO-DIMM-204

2.66" x 1.5" (67.6mm x 38.1mm)

0°C ~ 70°C

20-101-1196

Digi International

MODULE RABBITCORE RCM3900

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 44.2MHz
Flash Size: 512KB (Internal), 32MB (External), microSD Slot (External)
RAM Size: 1MB
Connector Type: 2 IDC Headers 2x17, 1 IDC Header 2x5, 1xmicroSD Card
Size / Dimension: 1.85" x 2.73" (47mm x 69mm)
Operating Temperature: -20°C ~ 85°C

封装: -

库存5,024

Rabbit 3000

-

44.2MHz

512KB (Internal), 32MB (External), microSD Slot (External)

1MB

2 IDC Headers 2x17, 1 IDC Header 2x5, 1xmicroSD Card

1.85" x 2.73" (47mm x 69mm)

-20°C ~ 85°C

TE0841-02-41C21-A

Trenz Electronic GmbH

IC MODULE USCALE 2GB

Module/Board Type: MCU, FPGA
Core Processor: Kintex UltraScale KU40
Co-Processor: -
Speed: -
Flash Size: 64MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存2,560

Kintex UltraScale KU40

-

64MB

2GB

B2B

1.97" x 1.57" (50mm x 40mm)

0°C ~ 70°C

ME-XU8-4CG-1I-D11E-R2-1

Enclustra FPGA Solutions

SOM ZYNQ XU8 US+ ZU4CG

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: -
Speed: 533MHz, 1.333GHz
Flash Size: 16GB
RAM Size: 4GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

Request a Quote

ARM® Cortex®-A53, ARM® Cortex®-R5

-

533MHz, 1.333GHz

16GB

4GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

-40°C ~ 85°C

5728-PX-4AA-RI

Critical Link LLC

TEXAS INSTRUMENTS AM5728 SOM (32

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Cortex®-A15
Co-Processor: -
Speed: 1.5GHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) - 100, Edge Connector - 310
Size / Dimension: 3.460" L x 2.730" W (87.88mm x 69.34mm)
Operating Temperature: -40°C ~ 85°C

封装: -

Request a Quote

ARM® Cortex®-A15

-

1.5GHz

32MB

1GB

Board-to-Board (BTB) - 100, Edge Connector - 310

3.460" L x 2.730" W (87.88mm x 69.34mm)

-40°C ~ 85°C

TE0820-05-S002C1

Trenz Electronic GmbH

MOD MPSOC 2GB DDR4

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

Request a Quote

-

M100PF-3AC

ARIES Embedded

SOM POLARFIRE FPGA MPF300T

Module/Board Type: FPGA
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: -
Operating Temperature: 0°C ~ 70°C

封装: -

Request a Quote

-

1GB

Board-to-Board (BTB) Socket

-

0°C ~ 70°C

TE0820-05-2BI21ML

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784I
Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: 2 x 100 Pin
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

Request a Quote

Zynq UltraScale+ XCZU2EG-1SFVC784I

ARM® Cortex®-A53, ARM® Cortex®-R5

-

128MB

2GB

2 x 100 Pin

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0818-02-6BE81-A

Trenz Electronic GmbH

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Module/Board Type: MPU Core
Core Processor: Xilinx Zynq UltraScale+ XCZU6EG-1FFVC900E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket - 4 x 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

Request a Quote

Xilinx Zynq UltraScale+ XCZU6EG-1FFVC900E

-

128MB

4GB

Board-to-Board (BTB) Socket - 4 x 240

2.990" L x 2.050" W (76.00mm x 52.00mm)

0°C ~ 85°C

ME-XU1-9EG-1E-D11E-G1-R4-2

Enclustra FPGA Solutions

SOM ZYNQ XU1 US+ ZU9EG

Module/Board Type: FPGA
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: -
Speed: 600MHz, 1.5GHz
Flash Size: 16GB
RAM Size: 4GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

Request a Quote

ARM® Cortex®-A53, ARM® Cortex®-R5

-

600MHz, 1.5GHz

16GB

4GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

0°C ~ 85°C

TE0813-01-5DE11-A

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU5EV-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

Request a Quote

Zynq UltraScale+ XCZU5EV-1SFVC784E

-

128MB

2GB

Board-to-Board (BTB) Socket - 240

2.990" L x 2.050" W (76.00mm x 52.00mm)

0°C ~ 85°C

TE0630-03-52I12-A

Trenz Electronic GmbH

FPGA MODULE WITH AMD SPARTAN 6 L

Module/Board Type: FPGA
Core Processor: Xilinx Spartan™ 6 XC6SLX45-2CSG484I
Co-Processor: -
Speed: -
Flash Size: 8MB
RAM Size: 128MB
Connector Type: Board-to-Board (BTB) Socket - 80
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

Request a Quote

Xilinx Spartan™ 6 XC6SLX45-2CSG484I

-

8MB

128MB

Board-to-Board (BTB) Socket - 80

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0807-03-4AI21-A

Trenz Electronic GmbH

MPSOC ZYNQ USCALE 4GB DDR4

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU4CG-1FBVB900I
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

Request a Quote

Zynq UltraScale+ XCZU4CG-1FBVB900I

-

128MB

4GB

B2B

2.050" L x 2.990" W (52.00mm x 76.00mm)

-40°C ~ 85°C

TE0821-01-2AE31PA

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784E
Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: 2 x 100 Pin
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

Request a Quote

Zynq UltraScale+ XCZU2CG-1SFVC784E

ARM® Cortex®-A53, ARM® Cortex®-R5

-

128MB

4GB

2 x 100 Pin

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 85°C

6252-IX-X8D-RI

Critical Link LLC

SOM WITH TI SITARA AM6252, 1GHZ,

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53
Co-Processor: NEON SIMD
Speed: 1GHz
Flash Size: 16GB eMMC
RAM Size: 2GB
Connector Type: SO-DIMM-260
Size / Dimension: 2.740" L x 1.500" W (69.60mm x 38.10mm)
Operating Temperature: -40°C ~ 85°C

封装: -

Request a Quote

ARM® Cortex®-A53

NEON SIMD

1GHz

16GB eMMC

2GB

SO-DIMM-260

2.740" L x 1.500" W (69.60mm x 38.10mm)

-40°C ~ 85°C

TE0710-03-42I21-A

Trenz Electronic GmbH

DUAL FAST ETHERNET FPGA MODULE W

Module/Board Type: FPGA
Core Processor: Artix™ 7 XC7A35T-2CSG324I
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: 512MB
Connector Type: 2 x 100 Pin
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

Request a Quote

Artix™ 7 XC7A35T-2CSG324I

-

32MB

512MB

2 x 100 Pin

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

ME-XU1-15EG-2I-D12E-R5-0

Enclustra FPGA Solutions

SOM ZYNQ XU1 US+ ZU15EG

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU15EG-2FFVC900I
Speed: 600MHz, 1.5GHz
Flash Size: 16GB
RAM Size: 4GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

Request a Quote

ARM® Cortex®-A53, ARM® Cortex®-R5

Xilinx Zynq UltraScale+ XCZU15EG-2FFVC900I

600MHz, 1.5GHz

16GB

4GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

-40°C ~ 85°C