图片 |
零件编号 |
制造商 |
描述 |
封装 |
库存 |
数量 |
RF Family/Standard | Protocol | Modulation | Frequency | Data Rate (Max) | Power - Output | Sensitivity | Memory Size | Serial Interfaces | GPIO | Voltage - Supply | Current - Receiving | Current - Transmitting | Operating Temperature | Package / Case |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Toshiba Semiconductor and Storage |
BLUETOOTH V4.1 LOW ENERGY STANDA
|
封装: 40-VFQFN Exposed Pad |
库存4,428 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - | 40-VFQFN Exposed Pad |
||
Toshiba Semiconductor and Storage |
V4.2 BLUETOOTH SMART IC IMPLEMEN
|
封装: 60-VFQFN Exposed Pad |
库存6,120 |
|
Bluetooth | Bluetooth v4.2 | GFSK | 2.4GHz | - | 0dBm | -93dBm | 256kB Flash, 384kB ROM, 192kB RAM | I2C, SPI | 17 | 2 V ~ 3.6 V | 3.3mA | 3.3mA | -40°C ~ 85°C | 60-VFQFN Exposed Pad |
||
Toshiba Semiconductor and Storage |
V4.2 BLUETOOTH SMART IC IMPLEMEN
|
封装: 60-VFQFN Exposed Pad |
库存3,508 |
|
Bluetooth | Bluetooth v4.2 | - | 2.4GHz | - | 0dBm | -93dBm | - | I2C, SPI, UART | - | 1.8 V ~ 3.6 V | 3.3mA | 3.3mA | -40°C ~ 85°C | 60-VFQFN Exposed Pad |
||
Toshiba Semiconductor and Storage |
COMBO WIRELESS CHIP SUPPORTING W
|
封装: - |
库存3,744 |
|
Bluetooth, WiFi | 802.11a/b/g/n, Bluetooth v4.2 | - | 2.4GHz | 150Mbps | 18dBm | -95dBm | - | I2C, I2S, SPI, UART, USB | - | 3.3V | - | - | -40°C ~ 85°C | - |
||
Toshiba Semiconductor and Storage |
TRANSFERJET WIRELESS TRANSCEIVER
|
封装: Module |
库存4,194 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - | Module |
||
Toshiba Semiconductor and Storage |
V4.2 BLUETOOTH SMART IC IMPLEMEN
|
封装: 60-VFQFN Exposed Pad |
库存5,112 |
|
Bluetooth | Bluetooth v4.2 | GFSK | 2.4GHz | - | 0dBm | -94dBm | 256kB Flash, 384kB ROM, 192kB RAM | I2C, SPI | 17 | 2 V ~ 3.6 V | 3.3mA | 3.3mA | -40°C ~ 85°C | 60-VFQFN Exposed Pad |
||
Toshiba Semiconductor and Storage |
IC RF TXRX BLUETOOTH 64-FBGA
|
封装: 64-FBGA |
库存17,460 |
|
Bluetooth | Bluetooth v3.0 | - | 2.4GHz | 2Mbps | 2dBm | -90dBm | - | I2C, SPI, UART | - | 1.8 V ~ 3.3 V | 63mA | 63mA | -40°C ~ 85°C | 64-FBGA |
||
Toshiba Semiconductor and Storage |
COMBO WIRELESS CHIP SUPPORTING B
|
封装: 52-TFBGA |
库存22,746 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - | 52-TFBGA |
||
Toshiba Semiconductor and Storage |
IC RF TXRX BLUETOOTH 64-FBGA
|
封装: 64-FBGA |
库存17,772 |
|
Bluetooth | Bluetooth v4.0 | - | 2.4GHz | 2Mbps | 2dBm | -90dBm | - | I2C, SPI, UART | - | 1.8 V ~ 3.6 V | 63mA | 63mA | -40°C ~ 85°C | 64-FBGA |
||
Toshiba Semiconductor and Storage |
IC RF TXRX ISM<1GHZ 36-VFQFN
|
封装: 36-VFQFN Exposed Pad |
库存17,214 |
|
General ISM < 1GHz | - | ASK, FSK | 315MHz, 434MHz, 868MHz, 915MHz | - | 10dBm | -121dBm | - | SPI | - | 2 V ~ 3.3 V, 2.4 V ~ 5.5 V | 9.2mA ~ 11.1mA | 4.8mA ~ 12mA | -40°C ~ 110°C | 36-VFQFN Exposed Pad |
||
Toshiba Semiconductor and Storage |
BLUETOOTH SMART IC WITH INTEGRAT
|
封装: 40-VFQFN Exposed Pad |
库存20,808 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - | 40-VFQFN Exposed Pad |
||
Toshiba Semiconductor and Storage |
IC RF TXRX BLUETOOTH 64-FBGA
|
封装: 64-FBGA |
库存18,192 |
|
Bluetooth | Bluetooth v4.0 | - | 2.4GHz | 2Mbps | 2dBm | -90dBm | - | I2C, I2S, SPI, UART | - | 1.8 V ~ 3.3 V | 63mA | 63mA | -40°C ~ 85°C | 64-FBGA |
||
Toshiba Semiconductor and Storage |
BLUETOOTH V4.1 LOW ENERGY STANDA
|
封装: 40-VFQFN Exposed Pad |
库存20,550 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - | 40-VFQFN Exposed Pad |