页 42 - Intel 产品 | 深圳黑森尔电子
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Intel 产品

记录 9,824
页  42/328
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数量
EP1K100QC208-1GZ
Intel

IC FPGA

  • Number of LABs/CLBs: 624
  • Number of Logic Elements/Cells: 4992
  • Total RAM Bits: 49152
  • Number of I/O: 147
  • Number of Gates: 257000
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
封装: 208-BFQFP
库存7,648
EPF10K100ABI356-3
Intel

IC FPGA 274 I/O 356BGA

  • Number of LABs/CLBs: 624
  • Number of Logic Elements/Cells: 4992
  • Total RAM Bits: 24576
  • Number of I/O: 274
  • Number of Gates: 158000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Package / Case: 356-LBGA
  • Supplier Device Package: 356-BGA (35x35)
封装: 356-LBGA
库存7,216
EP20K1000EFC33-1
Intel

IC FPGA 708 I/O 1020FBGA

  • Number of LABs/CLBs: 3840
  • Number of Logic Elements/Cells: 38400
  • Total RAM Bits: 327680
  • Number of I/O: 708
  • Number of Gates: 1772000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1020-BBGA
  • Supplier Device Package: 1020-FBGA (33x33)
封装: 1020-BBGA
库存2,016
5SGSMD5K1F40I2N
Intel

IC FPGA 696 I/O 1517FBGA

  • Number of LABs/CLBs: 172600
  • Number of Logic Elements/Cells: 457000
  • Total RAM Bits: 46769152
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封装: 1517-BBGA, FCBGA
库存2,096
10AX115U4F45E3LG
Intel

IC FPGA 480 I/O 1932FCBGA

  • Number of LABs/CLBs: 427200
  • Number of Logic Elements/Cells: 1150000
  • Total RAM Bits: 68857856
  • Number of I/O: 480
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
封装: 1932-BBGA, FCBGA
库存2,640
EP4SGX290FF35C4
Intel

IC FPGA 564 I/O 1152FBGA

  • Number of LABs/CLBs: 11648
  • Number of Logic Elements/Cells: 291200
  • Total RAM Bits: 17661952
  • Number of I/O: 564
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封装: 1152-BBGA, FCBGA
库存7,344
10AX048K1F35I1HG
Intel

IC FPGA 396 I/O 1152FCBGA

  • Number of LABs/CLBs: 183590
  • Number of Logic Elements/Cells: 480000
  • Total RAM Bits: 5664768
  • Number of I/O: 396
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.98 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封装: 1152-BBGA, FCBGA
库存2,832
5SGXEA3K3F40C2LN
Intel

IC FPGA 696 I/O 1517FBGA

  • Number of LABs/CLBs: 128300
  • Number of Logic Elements/Cells: 340000
  • Total RAM Bits: 23704576
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封装: 1517-BBGA, FCBGA
库存3,184
EP3SE80F1152I3
Intel

IC FPGA 744 I/O 1152FBGA

  • Number of LABs/CLBs: 3200
  • Number of Logic Elements/Cells: 80000
  • Total RAM Bits: 6843392
  • Number of I/O: 744
  • Number of Gates: -
  • Voltage - Supply: 0.86 V ~ 1.15 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封装: 1152-BBGA, FCBGA
库存6,736
10AX066K4F35I3SG
Intel

IC FPGA 396 I/O 1152FCBGA

  • Number of LABs/CLBs: 250540
  • Number of Logic Elements/Cells: 660000
  • Total RAM Bits: 49610752
  • Number of I/O: 396
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FCBGA (35x35)
封装: 1152-BBGA, FCBGA
库存3,024
5SGXMA9K3H40C3N
Intel

IC FPGA 696 I/O 1517HBGA

  • Number of LABs/CLBs: 317000
  • Number of Logic Elements/Cells: 840000
  • Total RAM Bits: 64210944
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-HBGA (45x45)
封装: 1517-BBGA, FCBGA
库存6,416
EP3CLS150F780C7N
Intel

IC FPGA 413 I/O 780FBGA

  • Number of LABs/CLBs: 9428
  • Number of Logic Elements/Cells: 150848
  • Total RAM Bits: 6137856
  • Number of I/O: 413
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 780-BGA
  • Supplier Device Package: 780-FBGA (29x29)
封装: 780-BGA
库存2,544
EP2AGX125EF29C6G
Intel

IC FPGA 372 I/O 780FBGA

  • Number of LABs/CLBs: 4964
  • Number of Logic Elements/Cells: 118143
  • Total RAM Bits: 8315904
  • Number of I/O: 372
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-FBGA (29x29)
封装: 780-BBGA, FCBGA
库存7,328
10AX016E3F27E2LG
Intel

IC FPGA 240 I/O 672FBGA

  • Number of LABs/CLBs: 61510
  • Number of Logic Elements/Cells: 160000
  • Total RAM Bits: 10086400
  • Number of I/O: 240
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.98 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 672-BBGA, FCBGA
  • Supplier Device Package: 672-FBGA (27x27)
封装: 672-BBGA, FCBGA
库存6,416
5AGXBA5D6F35C6N
Intel

IC FPGA 544 I/O 1152FBGA

  • Number of LABs/CLBs: 8962
  • Number of Logic Elements/Cells: 190000
  • Total RAM Bits: 13284352
  • Number of I/O: 544
  • Number of Gates: -
  • Voltage - Supply: 1.07 V ~ 1.13 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA Exposed Pad
  • Supplier Device Package: 1152-FBGA (35x35)
封装: 1152-BBGA, FCBGA Exposed Pad
库存4,352
5CGXFC7C6U19I7N
Intel

IC FPGA 240 I/O 484UBGA

  • Number of LABs/CLBs: 56480
  • Number of Logic Elements/Cells: 149500
  • Total RAM Bits: 7880704
  • Number of I/O: 240
  • Number of Gates: -
  • Voltage - Supply: 1.07 V ~ 1.13 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-FBGA
  • Supplier Device Package: 484-UBGA (19x19)
封装: 484-FBGA
库存8,364
EP4CE75F23C9L
Intel

IC FPGA 292 I/O 484FBGA

  • Number of LABs/CLBs: 4713
  • Number of Logic Elements/Cells: 75408
  • Total RAM Bits: 2810880
  • Number of I/O: 292
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FBGA (23x23)
封装: 484-BGA
库存2,016
EP4CE30F23A7N
Intel

IC FPGA 328 I/O 484FBGA

  • Number of LABs/CLBs: 1803
  • Number of Logic Elements/Cells: 28848
  • Total RAM Bits: 608256
  • Number of I/O: 328
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FBGA (23x23)
封装: 484-BGA
库存5,632
hot EP4CE6F17C6N
Intel

IC FPGA 179 I/O 256FBGA

  • Number of LABs/CLBs: 392
  • Number of Logic Elements/Cells: 6272
  • Total RAM Bits: 276480
  • Number of I/O: 179
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FBGA (17x17)
封装: 256-LBGA
库存7,296
hot EPM7096LC84-15
Intel

IC CPLD 96MC 15NS 84PLCC

  • Programmable Type: EE PLD
  • Delay Time tpd(1) Max: 15.0ns
  • Voltage Supply - Internal: 4.75 V ~ 5.25 V
  • Number of Logic Elements/Blocks: 6
  • Number of Macrocells: 96
  • Number of Gates: 1800
  • Number of I/O: 68
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 84-LCC (J-Lead)
  • Supplier Device Package: 84-PLCC (29.31x29.31)
封装: 84-LCC (J-Lead)
库存5,296
hot EPM3512AFC256-10
Intel

IC CPLD 512MC 10NS 256FBGA

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 10.0ns
  • Voltage Supply - Internal: 3 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 32
  • Number of Macrocells: 512
  • Number of Gates: 10000
  • Number of I/O: 208
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
封装: 256-BGA
库存7,280
5SGSED8N2F46C2LN
Intel

IC FPGA STRATIX V GS FLIP CHIP

  • Number of LABs/CLBs: 262400
  • Number of Logic Elements/Cells: 695000
  • Total RAM Bits: 52428800
  • Number of I/O: -
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: -
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
封装: -
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5SGXMB6R3F40I3LG
Intel

IC FPGA 432 I/O 1517FBGA

  • Number of LABs/CLBs: 225400
  • Number of Logic Elements/Cells: 597000
  • Total RAM Bits: 53248000
  • Number of I/O: 432
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-FBGA (40x40)
  • Supplier Device Package: 1517-FBGA (40x40)
封装: -
Request a Quote
AGIB022R31B2E3V
Intel

IC FPGA AGILEX-I 3184FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.2M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
封装: -
Request a Quote
1SG280LU3F50I3XG
Intel

IC FPGA 704 I/O 2397BGA

  • Number of LABs/CLBs: 350000
  • Number of Logic Elements/Cells: 2800000
  • Total RAM Bits: -
  • Number of I/O: 704
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 2397-BBGA, FCBGA
  • Supplier Device Package: 2397-FBGA, FC (50x50)
封装: -
Request a Quote
5SEEBH40C2G
Intel

IC FPGA 696 I/O 1517HBGA

  • Number of LABs/CLBs: 359250
  • Number of Logic Elements/Cells: 952000
  • Total RAM Bits: 53248000
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.87V ~ 0.93V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-HBGA (45x45)
封装: -
Request a Quote
EP4SGX360FF35C2XG
Intel

IC FPGA 564 I/O 1152FBGA

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: -
  • Number of I/O: -
  • Number of Gates: -
  • Voltage - Supply: -
  • Mounting Type: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
封装: -
Request a Quote
1SG165HU2F50E2VG
Intel

IC FPGA 704 I/O 2397BGA

  • Number of LABs/CLBs: 206250
  • Number of Logic Elements/Cells: 1650000
  • Total RAM Bits: -
  • Number of I/O: 704
  • Number of Gates: -
  • Voltage - Supply: 0.77V ~ 0.97V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2397-BBGA, FCBGA
  • Supplier Device Package: 2397-FBGA, FC (50x50)
封装: -
Request a Quote
AGFB012R24C2E2VB
Intel

IC FPGA AGILEX-F 2340BGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 1.2M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2340-BFBGA Exposed Pad
  • Supplier Device Package: 2340-BGA (45x42)
封装: -
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LPM25P2F266B
Intel

IC MPU 266MHZ

  • Core Processor: Pentium II
  • Number of Cores/Bus Width: 1 Core
  • Speed: 266MHz
  • Co-Processors/DSP: -
  • RAM Controllers: SDRAM
  • Graphics Acceleration: -
  • Display & Interface Controllers: 443BX
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 3.3V
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: Module
  • Supplier Device Package: -
封装: -
Request a Quote