页 41 - Intel 产品 | 深圳黑森尔电子

零件编号	制造商	描述	封装	库存
10AS032H3F35I2LG	Intel	1152-PIN FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 320K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封装: -	库存4,992
5CSEMA6U23A7N	Intel	IC FPGA 145 I/O 672UBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 700MHz Primary Attributes: FPGA - 110K Logic Elements Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 672-FBGA Supplier Device Package: 672-UBGA (23x23)	封装: 672-FBGA	库存5,360
5CSEBA4U23A7N	Intel	IC FPGA 188 I/O 672UBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 700MHz Primary Attributes: FPGA - 40K Logic Elements Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 672-FBGA Supplier Device Package: 672-UBGA (23x23)	封装: 672-FBGA	库存2,496
EPF10K50SFC484-1N	Intel	IC FPGA 220 I/O 484FBGA Number of LABs/CLBs: 360 Number of Logic Elements/Cells: 2880 Total RAM Bits: 40960 Number of I/O: 220 Number of Gates: 199000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	封装: 484-BBGA	库存7,952
EP20K200FC484-1N	Intel	IC FPGA 382 I/O 484FBGA Number of LABs/CLBs: 832 Number of Logic Elements/Cells: 8320 Total RAM Bits: 106496 Number of I/O: 382 Number of Gates: 526000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	封装: 484-BBGA	库存7,312
EP1K30TC144-2	Intel	IC FPGA 102 I/O 144TQFP Number of LABs/CLBs: 216 Number of Logic Elements/Cells: 1728 Total RAM Bits: 24576 Number of I/O: 102 Number of Gates: 119000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	封装: 144-LQFP	库存3,248
EP3C10U256I7N	Intel	IC FPGA 182 I/O 256UBGA Number of LABs/CLBs: 645 Number of Logic Elements/Cells: 10320 Total RAM Bits: 423936 Number of I/O: 182 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-LFBGA Supplier Device Package: 256-UBGA (14x14)	封装: 256-LFBGA	库存6,048
5SGXMB6R2F43C1N	Intel	IC FPGA 432 I/O 1760FBGA Number of LABs/CLBs: 225400 Number of Logic Elements/Cells: 597000 Total RAM Bits: 61688832 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA, FC (42.5x42.5)	封装: 1760-BBGA, FCBGA	库存2,816
EP3SL340F1517C4N	Intel	IC FPGA 976 I/O 1517FBGA Number of LABs/CLBs: 13500 Number of Logic Elements/Cells: 337500 Total RAM Bits: 18822144 Number of I/O: 976 Number of Gates: - Voltage - Supply: 0.86 V ~ 1.15 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封装: 1517-BBGA, FCBGA	库存5,520
EP4SE820H40C4	Intel	IC FPGA 976 I/O 1517HBGA Number of LABs/CLBs: 32522 Number of Logic Elements/Cells: 813050 Total RAM Bits: 34093056 Number of I/O: 976 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-HBGA (42.5x42.5)	封装: 1517-BBGA, FCBGA	库存2,992
5SGSED6K2F40I3LN	Intel	IC FPGA 696 I/O 1517FBGA Number of LABs/CLBs: 220000 Number of Logic Elements/Cells: 583000 Total RAM Bits: 54553600 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封装: 1517-BBGA, FCBGA	库存2,736
5SGXEA7K1F40C2LN	Intel	IC FPGA 696 I/O 1517FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 59939840 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封装: 1517-BBGA, FCBGA	库存3,568
5SEE9F45I4N	Intel	IC FPGA 840 I/O 1932FBGA Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Total RAM Bits: 64210944 Number of I/O: 840 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	封装: 1932-BBGA, FCBGA	库存7,296
5SGSMD5K3F40C2LN	Intel	IC FPGA 696 I/O 1517FBGA Number of LABs/CLBs: 172600 Number of Logic Elements/Cells: 457000 Total RAM Bits: 46769152 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封装: 1517-BBGA, FCBGA	库存3,264
5AGXBB1D4F40C5N	Intel	IC FPGA 704 I/O 1517FBGA Number of LABs/CLBs: 14151 Number of Logic Elements/Cells: 300000 Total RAM Bits: 17358848 Number of I/O: 704 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA Supplier Device Package: 1517-FBGA (40x40)	封装: 1517-BBGA	库存2,608
EP2AGX45CU17C5	Intel	IC FPGA 156 I/O 358UBGA Number of LABs/CLBs: 1805 Number of Logic Elements/Cells: 42959 Total RAM Bits: 3517440 Number of I/O: 156 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 358-LFBGA, FCBGA Supplier Device Package: 358-UBGA, FC (17x17)	封装: 358-LFBGA, FCBGA	库存7,360
EP4CE6F17C8LN	Intel	IC FPGA 179 I/O 256FBGA Number of LABs/CLBs: 392 Number of Logic Elements/Cells: 6272 Total RAM Bits: 276480 Number of I/O: 179 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17)	封装: 256-LBGA	库存6,304
EPM3032ATC44-10	Intel	IC CPLD 32MC 10NS 44TQFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 10.0ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 2 Number of Macrocells: 32 Number of Gates: 600 Number of I/O: 34 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 44-TQFP Supplier Device Package: 44-TQFP (10x10)	封装: 44-TQFP	库存3,968
EP3SL50F780C2G	Intel	IC FPGA 488 I/O 780FBGA Number of LABs/CLBs: 1900 Number of Logic Elements/Cells: 47500 Total RAM Bits: 2184192 Number of I/O: 488 Number of Gates: - Voltage - Supply: 0.86V ~ 1.15V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29)	封装: 780-BBGA, FCBGA	库存6,256
5SGXMA4H3F35I4G	Intel	IC FPGA 600 I/O 1152FBGA Number of LABs/CLBs: 158500 Number of Logic Elements/Cells: 420000 Total RAM Bits: 37888000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封装: -	Request a Quote
1SX210HN2F43E2VG	Intel	IC FPGA STRATIX 10 1760FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2100K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5x42.5)	封装: -	Request a Quote
1SG250HH1F55E2VG	Intel	IC FPGA 1160 I/O 2912BGA Number of LABs/CLBs: 312500 Number of Logic Elements/Cells: 2500000 Total RAM Bits: - Number of I/O: 1160 Number of Gates: - Voltage - Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2912-BBGA, FCBGA Supplier Device Package: 2912-FBGA, FC (55x55)	封装: -	Request a Quote
5SGXMB5R3F43C2LG	Intel	IC FPGA 600 I/O 1760FBGA Number of LABs/CLBs: 185000 Number of Logic Elements/Cells: 490000 Total RAM Bits: 41984000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FCBGA (42.5x42.5)	封装: -	Request a Quote
AGFA012R24B3I3E	Intel	IC FPGA AGILEX-F 2486FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.2M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封装: -	Request a Quote
AGFA019R25A1I1V	Intel	IC FPGA AGILEX-F 2581FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.9M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封装: -	Request a Quote
5SGXAF45NAE	Intel	IC FPGA 1932FBGA Number of LABs/CLBs: 158500 Number of Logic Elements/Cells: 420000 Total RAM Bits: 38797312 Number of I/O: - Number of Gates: - Voltage - Supply: - Mounting Type: Surface Mount Operating Temperature: - Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	封装: -	Request a Quote
5SGXEA7K1F40C1G	Intel	IC FPGA 696 I/O 1517FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 51200000 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封装: -	Request a Quote
1SX085HN1F43E2VG	Intel	IC FPGA STRATIX 10 1760FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 850K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5x42.5)	封装: -	Request a Quote
EP2AGZ300HF40C4G	Intel	IC FPGA 734 I/O 1517FBGA Number of LABs/CLBs: - Number of Logic Elements/Cells: - Total RAM Bits: - Number of I/O: - Number of Gates: - Voltage - Supply: - Mounting Type: - Operating Temperature: - Package / Case: - Supplier Device Package: -	封装: -	Request a Quote
1ST085ES3F50E3VG	Intel	IC FPGA STRATIX10TX 2397FBGA Number of LABs/CLBs: - Number of Logic Elements/Cells: 841000 Total RAM Bits: 71303168 Number of I/O: 440 Number of Gates: - Voltage - Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50x50)	封装: -	Request a Quote

10AS032H3F35I2LG

Intel

1152-PIN FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 320K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封装: -

库存4,992

5CSEMA6U23A7N

Intel

IC FPGA 145 I/O 672UBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 700MHz
Primary Attributes: FPGA - 110K Logic Elements
Operating Temperature: -40°C ~ 125°C (TJ)
Package / Case: 672-FBGA
Supplier Device Package: 672-UBGA (23x23)

封装: 672-FBGA

库存5,360

5CSEBA4U23A7N

Intel

IC FPGA 188 I/O 672UBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 700MHz
Primary Attributes: FPGA - 40K Logic Elements
Operating Temperature: -40°C ~ 125°C (TJ)
Package / Case: 672-FBGA
Supplier Device Package: 672-UBGA (23x23)

封装: 672-FBGA

库存2,496

EPF10K50SFC484-1N

Intel

IC FPGA 220 I/O 484FBGA

Number of LABs/CLBs: 360
Number of Logic Elements/Cells: 2880
Total RAM Bits: 40960
Number of I/O: 220
Number of Gates: 199000
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

封装: 484-BBGA

库存7,952

EP20K200FC484-1N

Intel

IC FPGA 382 I/O 484FBGA

Number of LABs/CLBs: 832
Number of Logic Elements/Cells: 8320
Total RAM Bits: 106496
Number of I/O: 382
Number of Gates: 526000
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

封装: 484-BBGA

库存7,312

EP1K30TC144-2

Intel

IC FPGA 102 I/O 144TQFP

Number of LABs/CLBs: 216
Number of Logic Elements/Cells: 1728
Total RAM Bits: 24576
Number of I/O: 102
Number of Gates: 119000
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)

封装: 144-LQFP

库存3,248

EP3C10U256I7N

Intel

IC FPGA 182 I/O 256UBGA

Number of LABs/CLBs: 645
Number of Logic Elements/Cells: 10320
Total RAM Bits: 423936
Number of I/O: 182
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 256-LFBGA
Supplier Device Package: 256-UBGA (14x14)

封装: 256-LFBGA

库存6,048

5SGXMB6R2F43C1N

Intel

IC FPGA 432 I/O 1760FBGA

Number of LABs/CLBs: 225400
Number of Logic Elements/Cells: 597000
Total RAM Bits: 61688832
Number of I/O: 432
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)

封装: 1760-BBGA, FCBGA

库存2,816

EP3SL340F1517C4N

Intel

IC FPGA 976 I/O 1517FBGA

Number of LABs/CLBs: 13500
Number of Logic Elements/Cells: 337500
Total RAM Bits: 18822144
Number of I/O: 976
Number of Gates: -
Voltage - Supply: 0.86 V ~ 1.15 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封装: 1517-BBGA, FCBGA

库存5,520

EP4SE820H40C4

Intel

IC FPGA 976 I/O 1517HBGA

Number of LABs/CLBs: 32522
Number of Logic Elements/Cells: 813050
Total RAM Bits: 34093056
Number of I/O: 976
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-HBGA (42.5x42.5)

封装: 1517-BBGA, FCBGA

库存2,992

5SGSED6K2F40I3LN

Intel

IC FPGA 696 I/O 1517FBGA

Number of LABs/CLBs: 220000
Number of Logic Elements/Cells: 583000
Total RAM Bits: 54553600
Number of I/O: 696
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封装: 1517-BBGA, FCBGA

库存2,736

5SGXEA7K1F40C2LN

Intel

IC FPGA 696 I/O 1517FBGA

Number of LABs/CLBs: 234720
Number of Logic Elements/Cells: 622000
Total RAM Bits: 59939840
Number of I/O: 696
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封装: 1517-BBGA, FCBGA

库存3,568

5SEE9F45I4N

Intel

IC FPGA 840 I/O 1932FBGA

Number of LABs/CLBs: 317000
Number of Logic Elements/Cells: 840000
Total RAM Bits: 64210944
Number of I/O: 840
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1932-BBGA, FCBGA
Supplier Device Package: 1932-FBGA, FC (45x45)

封装: 1932-BBGA, FCBGA

库存7,296

5SGSMD5K3F40C2LN

Intel

IC FPGA 696 I/O 1517FBGA

Number of LABs/CLBs: 172600
Number of Logic Elements/Cells: 457000
Total RAM Bits: 46769152
Number of I/O: 696
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封装: 1517-BBGA, FCBGA

库存3,264

5AGXBB1D4F40C5N

Intel

IC FPGA 704 I/O 1517FBGA

Number of LABs/CLBs: 14151
Number of Logic Elements/Cells: 300000
Total RAM Bits: 17358848
Number of I/O: 704
Number of Gates: -
Voltage - Supply: 1.07 V ~ 1.13 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA
Supplier Device Package: 1517-FBGA (40x40)

封装: 1517-BBGA

库存2,608

EP2AGX45CU17C5

Intel

IC FPGA 156 I/O 358UBGA

Number of LABs/CLBs: 1805
Number of Logic Elements/Cells: 42959
Total RAM Bits: 3517440
Number of I/O: 156
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 358-LFBGA, FCBGA
Supplier Device Package: 358-UBGA, FC (17x17)

封装: 358-LFBGA, FCBGA

库存7,360

EP4CE6F17C8LN

Intel

IC FPGA 179 I/O 256FBGA

Number of LABs/CLBs: 392
Number of Logic Elements/Cells: 6272
Total RAM Bits: 276480
Number of I/O: 179
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FBGA (17x17)

封装: 256-LBGA

库存6,304

EPM3032ATC44-10

Intel

IC CPLD 32MC 10NS 44TQFP

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 10.0ns
Voltage Supply - Internal: 3 V ~ 3.6 V
Number of Logic Elements/Blocks: 2
Number of Macrocells: 32
Number of Gates: 600
Number of I/O: 34
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 44-TQFP
Supplier Device Package: 44-TQFP (10x10)

封装: 44-TQFP

库存3,968

EP3SL50F780C2G

Intel

IC FPGA 488 I/O 780FBGA

Number of LABs/CLBs: 1900
Number of Logic Elements/Cells: 47500
Total RAM Bits: 2184192
Number of I/O: 488
Number of Gates: -
Voltage - Supply: 0.86V ~ 1.15V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-FBGA (29x29)

封装: 780-BBGA, FCBGA

库存6,256

5SGXMA4H3F35I4G

Intel

IC FPGA 600 I/O 1152FBGA

Number of LABs/CLBs: 158500
Number of Logic Elements/Cells: 420000
Total RAM Bits: 37888000
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封装: -

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1SX210HN2F43E2VG

Intel

IC FPGA STRATIX 10 1760FBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 2100K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FBGA (42.5x42.5)

封装: -

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1SG250HH1F55E2VG

Intel

IC FPGA 1160 I/O 2912BGA

Number of LABs/CLBs: 312500
Number of Logic Elements/Cells: 2500000
Total RAM Bits: -
Number of I/O: 1160
Number of Gates: -
Voltage - Supply: 0.77V ~ 0.97V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 2912-BBGA, FCBGA
Supplier Device Package: 2912-FBGA, FC (55x55)

封装: -

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5SGXMB5R3F43C2LG

Intel

IC FPGA 600 I/O 1760FBGA

Number of LABs/CLBs: 185000
Number of Logic Elements/Cells: 490000
Total RAM Bits: 41984000
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FCBGA (42.5x42.5)

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AGFA012R24B3I3E

Intel

IC FPGA AGILEX-F 2486FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 1.2M Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封装: -

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AGFA019R25A1I1V

Intel

IC FPGA AGILEX-F 2581FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 1.9M Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

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5SGXAF45NAE

Intel

IC FPGA 1932FBGA

Number of LABs/CLBs: 158500
Number of Logic Elements/Cells: 420000
Total RAM Bits: 38797312
Number of I/O: -
Number of Gates: -
Voltage - Supply: -
Mounting Type: Surface Mount
Operating Temperature: -
Package / Case: 1932-BBGA, FCBGA
Supplier Device Package: 1932-FBGA, FC (45x45)

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5SGXEA7K1F40C1G

Intel

IC FPGA 696 I/O 1517FBGA

Number of LABs/CLBs: 234720
Number of Logic Elements/Cells: 622000
Total RAM Bits: 51200000
Number of I/O: 696
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

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1SX085HN1F43E2VG

Intel

IC FPGA STRATIX 10 1760FBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 850K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FBGA (42.5x42.5)

封装: -

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EP2AGZ300HF40C4G

Intel

IC FPGA 734 I/O 1517FBGA

Number of LABs/CLBs: -
Number of Logic Elements/Cells: -
Total RAM Bits: -
Number of I/O: -
Number of Gates: -
Voltage - Supply: -
Mounting Type: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

封装: -

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1ST085ES3F50E3VG

Intel

IC FPGA STRATIX10TX 2397FBGA

Number of LABs/CLBs: -
Number of Logic Elements/Cells: 841000
Total RAM Bits: 71303168
Number of I/O: 440
Number of Gates: -
Voltage - Supply: 0.77V ~ 0.97V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 2397-BBGA, FCBGA
Supplier Device Package: 2397-FBGA, FC (50x50)

封装: -

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