页 104 - Intel 产品 | 深圳黑森尔电子

零件编号	制造商	描述	封装	库存
1SX250LH2F55I2VG	Intel	2912-PIN FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2500K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封装: -	库存3,296
10AS032E2F29E2LG	Intel	780-PIN FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 320K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封装: -	库存2,400
10AX115U4F45I4SGES	Intel	IC FPGA 480 I/O 1932FCBGA Number of LABs/CLBs: 427200 Number of Logic Elements/Cells: 1150000 Total RAM Bits: 68857856 Number of I/O: 480 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	封装: 1932-BBGA, FCBGA	库存5,952
EPF10K100EQC208-2X	Intel	IC FPGA 147 I/O 208QFP Number of LABs/CLBs: 624 Number of Logic Elements/Cells: 4992 Total RAM Bits: 49152 Number of I/O: 147 Number of Gates: 257000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	封装: 208-BFQFP	库存2,912
EP20K200EFC672-2	Intel	IC FPGA 376 I/O 672FBGA Number of LABs/CLBs: 832 Number of Logic Elements/Cells: 8320 Total RAM Bits: 106496 Number of I/O: 376 Number of Gates: 526000 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 672-BBGA Supplier Device Package: 672-FBGA (27x27)	封装: 672-BBGA	库存6,912
EPF81500AQC240-2	Intel	IC FPGA 181 I/O 240QFP Number of LABs/CLBs: 162 Number of Logic Elements/Cells: 1296 Total RAM Bits: - Number of I/O: 181 Number of Gates: 16000 Voltage - Supply: 4.75 V ~ 5.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Package / Case: 240-BFQFP Supplier Device Package: 240-PQFP (32x32)	封装: 240-BFQFP	库存6,432
EP1S40F1020I6N	Intel	IC FPGA 773 I/O 1020FBGA Number of LABs/CLBs: 4125 Number of Logic Elements/Cells: 41250 Total RAM Bits: 3423744 Number of I/O: 773 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1020-BBGA Supplier Device Package: 1020-FBGA (33x33)	封装: 1020-BBGA	库存3,888
EP1K100FI484-2	Intel	IC FPGA 333 I/O 484FBGA Number of LABs/CLBs: 624 Number of Logic Elements/Cells: 4992 Total RAM Bits: 49152 Number of I/O: 333 Number of Gates: 257000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	封装: 484-BBGA	库存4,464
5SGXEBBR2H43I3L	Intel	IC FPGA 600 I/O 1760HBGA Number of LABs/CLBs: 359200 Number of Logic Elements/Cells: 952000 Total RAM Bits: 65561600 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45x45)	封装: 1760-BBGA, FCBGA	库存7,264
EP3SE260H780I4	Intel	IC FPGA 488 I/O 780HBGA Number of LABs/CLBs: 10200 Number of Logic Elements/Cells: 255000 Total RAM Bits: 16672768 Number of I/O: 488 Number of Gates: - Voltage - Supply: 0.86 V ~ 1.15 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33x33)	封装: 780-BBGA, FCBGA	库存3,904
5SGSED6N2F45C2L	Intel	IC FPGA 840 I/O 1932FBGA Number of LABs/CLBs: 220000 Number of Logic Elements/Cells: 583000 Total RAM Bits: 54553600 Number of I/O: 840 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	封装: 1932-BBGA, FCBGA	库存5,920
5SGXEA7K2F40C1N	Intel	IC FPGA 696 I/O 1517FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 59939840 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封装: 1517-BBGA, FCBGA	库存7,552
5SGXMA5K3F35I4N	Intel	IC FPGA 432 I/O 1152FBGA Number of LABs/CLBs: 185000 Number of Logic Elements/Cells: 490000 Total RAM Bits: 53105664 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封装: 1152-BBGA, FCBGA	库存4,112
5SGXMA3K2F35I2LN	Intel	IC FPGA 432 I/O 1152FBGA Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 Total RAM Bits: 23704576 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封装: 1152-BBGA, FCBGA	库存2,912
EP2AGX260FF35I3N	Intel	IC FPGA 612 I/O 1152FBGA Number of LABs/CLBs: 10260 Number of Logic Elements/Cells: 244188 Total RAM Bits: 12038144 Number of I/O: 612 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封装: 1152-BBGA, FCBGA	库存6,208
5AGXBB1D4F31C4N	Intel	IC FPGA 384 I/O 896FBGA Number of LABs/CLBs: 14151 Number of Logic Elements/Cells: 300000 Total RAM Bits: 17358848 Number of I/O: 384 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 896-BBGA, FCBGA Supplier Device Package: 896-FBGA (31x31)	封装: 896-BBGA, FCBGA	库存3,008
EP3C40Q240C8N	Intel	IC FPGA 128 I/O 240QFP Number of LABs/CLBs: 2475 Number of Logic Elements/Cells: 39600 Total RAM Bits: 1161216 Number of I/O: 128 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 240-BFQFP Supplier Device Package: 240-PQFP (32x32)	封装: 240-BFQFP	库存7,152
EP4CE15F23C8LN	Intel	IC FPGA 343 I/O 484FBGA Number of LABs/CLBs: 963 Number of Logic Elements/Cells: 15408 Total RAM Bits: 516096 Number of I/O: 343 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FBGA (23x23)	封装: 484-BGA	库存5,088
EP4CE6F17C9L	Intel	IC FPGA 179 I/O 256FBGA Number of LABs/CLBs: 392 Number of Logic Elements/Cells: 6272 Total RAM Bits: 276480 Number of I/O: 179 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17)	封装: 256-LBGA	库存3,248
EPM7256ERI208-20	Intel	IC CPLD 256MC 20NS 208RQFP Programmable Type: EE PLD Delay Time tpd(1) Max: 20.0ns Voltage Supply - Internal: 4.5 V ~ 5.5 V Number of Logic Elements/Blocks: 16 Number of Macrocells: 256 Number of Gates: 5000 Number of I/O: 164 Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 208-BFQFP Exposed Pad Supplier Device Package: 208-RQFP (28x28)	封装: 208-BFQFP Exposed Pad	库存7,648
EPM7096LC68-12	Intel	IC CPLD 96MC 12NS 68PLCC Programmable Type: EE PLD Delay Time tpd(1) Max: 12.0ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 6 Number of Macrocells: 96 Number of Gates: 1800 Number of I/O: 52 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 68-LCC (J-Lead) Supplier Device Package: 68-PLCC (24x24)	封装: 68-LCC (J-Lead)	库存7,680
EPM7032QI44-12	Intel	IC CPLD 32MC 12NS 44TQFP Programmable Type: EE PLD Delay Time tpd(1) Max: 12.0ns Voltage Supply - Internal: 4.5 V ~ 5.5 V Number of Logic Elements/Blocks: 2 Number of Macrocells: 32 Number of Gates: 600 Number of I/O: 36 Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 44-TQFP Supplier Device Package: 44-TQFP (10x10)	封装: 44-TQFP	库存32,736
5SGSED6N1F45C2LG	Intel	IC FPGA 840 I/O 1932FBGA Number of LABs/CLBs: 220000 Number of Logic Elements/Cells: 583000 Total RAM Bits: 46080000 Number of I/O: 840 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	封装: -	Request a Quote
RH80536GC0292M	Intel	IC MPU 735 1.7GHZ 478FCPGA Core Processor: Intel® Pentium® M Processor 735 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.7GHz Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 0.988V, 1.34V Operating Temperature: 0°C ~ 100°C (TJ) Security Features: - Package / Case: 478-BFCPGA Supplier Device Package: 478-FCPGA (35x35)	封装: -	Request a Quote
EP4SE820H35C3G	Intel	IC FPGA 744 I/O 1152HBGA Number of LABs/CLBs: - Number of Logic Elements/Cells: - Total RAM Bits: - Number of I/O: - Number of Gates: - Voltage - Supply: - Mounting Type: - Operating Temperature: - Package / Case: - Supplier Device Package: -	封装: -	Request a Quote
AGFA012R24C2E1V	Intel	IC FPGA AGILEX-F 2340FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.2M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封装: -	Request a Quote
5SGXEABN2F45C2LG	Intel	IC FPGA 840 I/O 1932FBGA Number of LABs/CLBs: 359200 Number of Logic Elements/Cells: 952000 Total RAM Bits: 53248000 Number of I/O: 840 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	封装: -	Request a Quote
A82061	Intel	ERROR DETECTION IC Logic Type: Error Detection and Correction Supply Voltage: 4.5V ~ 5.5V Number of Bits: 16 Operating Temperature: 0°C ~ 70°C Mounting Type: Through Hole Package / Case: 68-BPGA Supplier Device Package: 68-PGA (29.46x29.46)	封装: -	Request a Quote
5SGXEA7N3F45C2G	Intel	IC FPGA 840 I/O 1932FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 51200000 Number of I/O: 840 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	封装: -	Request a Quote
AGFB014R24B3I3E	Intel	IC FPGA AGILEX-F 2486FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.4M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封装: -	Request a Quote

1SX250LH2F55I2VG

Intel

2912-PIN FBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 2500K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封装: -

库存3,296

10AS032E2F29E2LG

Intel

780-PIN FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 320K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封装: -

库存2,400

10AX115U4F45I4SGES

Intel

IC FPGA 480 I/O 1932FCBGA

Number of LABs/CLBs: 427200
Number of Logic Elements/Cells: 1150000
Total RAM Bits: 68857856
Number of I/O: 480
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1932-BBGA, FCBGA
Supplier Device Package: 1932-FBGA, FC (45x45)

封装: 1932-BBGA, FCBGA

库存5,952

EPF10K100EQC208-2X

Intel

IC FPGA 147 I/O 208QFP

Number of LABs/CLBs: 624
Number of Logic Elements/Cells: 4992
Total RAM Bits: 49152
Number of I/O: 147
Number of Gates: 257000
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

封装: 208-BFQFP

库存2,912

EP20K200EFC672-2

Intel

IC FPGA 376 I/O 672FBGA

Number of LABs/CLBs: 832
Number of Logic Elements/Cells: 8320
Total RAM Bits: 106496
Number of I/O: 376
Number of Gates: 526000
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 672-BBGA
Supplier Device Package: 672-FBGA (27x27)

封装: 672-BBGA

库存6,912

EPF81500AQC240-2

Intel

IC FPGA 181 I/O 240QFP

Number of LABs/CLBs: 162
Number of Logic Elements/Cells: 1296
Total RAM Bits: -
Number of I/O: 181
Number of Gates: 16000
Voltage - Supply: 4.75 V ~ 5.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Package / Case: 240-BFQFP
Supplier Device Package: 240-PQFP (32x32)

封装: 240-BFQFP

库存6,432

EP1S40F1020I6N

Intel

IC FPGA 773 I/O 1020FBGA

Number of LABs/CLBs: 4125
Number of Logic Elements/Cells: 41250
Total RAM Bits: 3423744
Number of I/O: 773
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1020-BBGA
Supplier Device Package: 1020-FBGA (33x33)

封装: 1020-BBGA

库存3,888

EP1K100FI484-2

Intel

IC FPGA 333 I/O 484FBGA

Number of LABs/CLBs: 624
Number of Logic Elements/Cells: 4992
Total RAM Bits: 49152
Number of I/O: 333
Number of Gates: 257000
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

封装: 484-BBGA

库存4,464

5SGXEBBR2H43I3L

Intel

IC FPGA 600 I/O 1760HBGA

Number of LABs/CLBs: 359200
Number of Logic Elements/Cells: 952000
Total RAM Bits: 65561600
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-HBGA (45x45)

封装: 1760-BBGA, FCBGA

库存7,264

EP3SE260H780I4

Intel

IC FPGA 488 I/O 780HBGA

Number of LABs/CLBs: 10200
Number of Logic Elements/Cells: 255000
Total RAM Bits: 16672768
Number of I/O: 488
Number of Gates: -
Voltage - Supply: 0.86 V ~ 1.15 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-HBGA (33x33)

封装: 780-BBGA, FCBGA

库存3,904

5SGSED6N2F45C2L

Intel

IC FPGA 840 I/O 1932FBGA

Number of LABs/CLBs: 220000
Number of Logic Elements/Cells: 583000
Total RAM Bits: 54553600
Number of I/O: 840
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1932-BBGA, FCBGA
Supplier Device Package: 1932-FBGA, FC (45x45)

封装: 1932-BBGA, FCBGA

库存5,920

5SGXEA7K2F40C1N

Intel

IC FPGA 696 I/O 1517FBGA

Number of LABs/CLBs: 234720
Number of Logic Elements/Cells: 622000
Total RAM Bits: 59939840
Number of I/O: 696
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封装: 1517-BBGA, FCBGA

库存7,552

5SGXMA5K3F35I4N

Intel

IC FPGA 432 I/O 1152FBGA

Number of LABs/CLBs: 185000
Number of Logic Elements/Cells: 490000
Total RAM Bits: 53105664
Number of I/O: 432
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封装: 1152-BBGA, FCBGA

库存4,112

5SGXMA3K2F35I2LN

Intel

IC FPGA 432 I/O 1152FBGA

Number of LABs/CLBs: 128300
Number of Logic Elements/Cells: 340000
Total RAM Bits: 23704576
Number of I/O: 432
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封装: 1152-BBGA, FCBGA

库存2,912

EP2AGX260FF35I3N

Intel

IC FPGA 612 I/O 1152FBGA

Number of LABs/CLBs: 10260
Number of Logic Elements/Cells: 244188
Total RAM Bits: 12038144
Number of I/O: 612
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封装: 1152-BBGA, FCBGA

库存6,208

5AGXBB1D4F31C4N

Intel

IC FPGA 384 I/O 896FBGA

Number of LABs/CLBs: 14151
Number of Logic Elements/Cells: 300000
Total RAM Bits: 17358848
Number of I/O: 384
Number of Gates: -
Voltage - Supply: 1.07 V ~ 1.13 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 896-BBGA, FCBGA
Supplier Device Package: 896-FBGA (31x31)

封装: 896-BBGA, FCBGA

库存3,008

EP3C40Q240C8N

Intel

IC FPGA 128 I/O 240QFP

Number of LABs/CLBs: 2475
Number of Logic Elements/Cells: 39600
Total RAM Bits: 1161216
Number of I/O: 128
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 240-BFQFP
Supplier Device Package: 240-PQFP (32x32)

封装: 240-BFQFP

库存7,152

EP4CE15F23C8LN

Intel

IC FPGA 343 I/O 484FBGA

Number of LABs/CLBs: 963
Number of Logic Elements/Cells: 15408
Total RAM Bits: 516096
Number of I/O: 343
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FBGA (23x23)

封装: 484-BGA

库存5,088

EP4CE6F17C9L

Intel

IC FPGA 179 I/O 256FBGA

Number of LABs/CLBs: 392
Number of Logic Elements/Cells: 6272
Total RAM Bits: 276480
Number of I/O: 179
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FBGA (17x17)

封装: 256-LBGA

库存3,248

EPM7256ERI208-20

Intel

IC CPLD 256MC 20NS 208RQFP

Programmable Type: EE PLD
Delay Time tpd(1) Max: 20.0ns
Voltage Supply - Internal: 4.5 V ~ 5.5 V
Number of Logic Elements/Blocks: 16
Number of Macrocells: 256
Number of Gates: 5000
Number of I/O: 164
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 208-BFQFP Exposed Pad
Supplier Device Package: 208-RQFP (28x28)

封装: 208-BFQFP Exposed Pad

库存7,648

EPM7096LC68-12

Intel

IC CPLD 96MC 12NS 68PLCC

Programmable Type: EE PLD
Delay Time tpd(1) Max: 12.0ns
Voltage Supply - Internal: 4.75 V ~ 5.25 V
Number of Logic Elements/Blocks: 6
Number of Macrocells: 96
Number of Gates: 1800
Number of I/O: 52
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 68-LCC (J-Lead)
Supplier Device Package: 68-PLCC (24x24)

封装: 68-LCC (J-Lead)

库存7,680

EPM7032QI44-12

Intel

IC CPLD 32MC 12NS 44TQFP

Programmable Type: EE PLD
Delay Time tpd(1) Max: 12.0ns
Voltage Supply - Internal: 4.5 V ~ 5.5 V
Number of Logic Elements/Blocks: 2
Number of Macrocells: 32
Number of Gates: 600
Number of I/O: 36
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 44-TQFP
Supplier Device Package: 44-TQFP (10x10)

封装: 44-TQFP

库存32,736

5SGSED6N1F45C2LG

Intel

IC FPGA 840 I/O 1932FBGA

Number of LABs/CLBs: 220000
Number of Logic Elements/Cells: 583000
Total RAM Bits: 46080000
Number of I/O: 840
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1932-BBGA, FCBGA
Supplier Device Package: 1932-FBGA, FC (45x45)

封装: -

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RH80536GC0292M

Intel

IC MPU 735 1.7GHZ 478FCPGA

Core Processor: Intel® Pentium® M Processor 735
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.7GHz
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 0.988V, 1.34V
Operating Temperature: 0°C ~ 100°C (TJ)
Security Features: -
Package / Case: 478-BFCPGA
Supplier Device Package: 478-FCPGA (35x35)

封装: -

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EP4SE820H35C3G

Intel

IC FPGA 744 I/O 1152HBGA

Number of LABs/CLBs: -
Number of Logic Elements/Cells: -
Total RAM Bits: -
Number of I/O: -
Number of Gates: -
Voltage - Supply: -
Mounting Type: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

封装: -

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AGFA012R24C2E1V

Intel

IC FPGA AGILEX-F 2340FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 1.2M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封装: -

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5SGXEABN2F45C2LG

Intel

IC FPGA 840 I/O 1932FBGA

Number of LABs/CLBs: 359200
Number of Logic Elements/Cells: 952000
Total RAM Bits: 53248000
Number of I/O: 840
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1932-BBGA, FCBGA
Supplier Device Package: 1932-FBGA, FC (45x45)

封装: -

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A82061

Intel

ERROR DETECTION IC

Logic Type: Error Detection and Correction
Supply Voltage: 4.5V ~ 5.5V
Number of Bits: 16
Operating Temperature: 0°C ~ 70°C
Mounting Type: Through Hole
Package / Case: 68-BPGA
Supplier Device Package: 68-PGA (29.46x29.46)

封装: -

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5SGXEA7N3F45C2G

Intel

IC FPGA 840 I/O 1932FBGA

Number of LABs/CLBs: 234720
Number of Logic Elements/Cells: 622000
Total RAM Bits: 51200000
Number of I/O: 840
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1932-BBGA, FCBGA
Supplier Device Package: 1932-FBGA, FC (45x45)

封装: -

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AGFB014R24B3I3E

Intel

IC FPGA AGILEX-F 2486FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 1.4M Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封装: -

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