页 102 - Intel 产品 | 深圳黑森尔电子

零件编号	制造商	描述	封装	库存
EPF10K100EBC356-1N	Intel	IC FPGA 274 I/O 356BGA Number of LABs/CLBs: 624 Number of Logic Elements/Cells: 4992 Total RAM Bits: 49152 Number of I/O: 274 Number of Gates: 257000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Package / Case: 356-LBGA Supplier Device Package: 356-BGA (35x35)	封装: 356-LBGA	库存5,520
5SGSMD5K2F40C1N	Intel	IC FPGA 696 I/O 1517FBGA Number of LABs/CLBs: 172600 Number of Logic Elements/Cells: 457000 Total RAM Bits: 46769152 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封装: 1517-BBGA, FCBGA	库存4,112
EP2SGX90FF1508C4	Intel	IC FPGA 650 I/O 1508FBGA Number of LABs/CLBs: 4548 Number of Logic Elements/Cells: 90960 Total RAM Bits: 4520448 Number of I/O: 650 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1508-BBGA, FCBGA Supplier Device Package: 1508-FBGA (30x30)	封装: 1508-BBGA, FCBGA	库存7,408
5AGXBB7D4F40C5N	Intel	IC FPGA 704 I/O 1517FBGA Number of LABs/CLBs: 23780 Number of Logic Elements/Cells: 504000 Total RAM Bits: 27695104 Number of I/O: 704 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA Supplier Device Package: 1517-FBGA (40x40)	封装: 1517-BBGA	库存2,144
EP2AGX95EF29I3N	Intel	IC FPGA 372 I/O 780FBGA Number of LABs/CLBs: 3747 Number of Logic Elements/Cells: 89178 Total RAM Bits: 6839296 Number of I/O: 372 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29)	封装: 780-BBGA, FCBGA	库存5,232
10AX022E3F27E1HG	Intel	IC FPGA 240 I/O 672FBGA Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 Total RAM Bits: 13752320 Number of I/O: 240 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27x27)	封装: 672-BBGA, FCBGA	库存5,088
EP2AGX45DF25C5N	Intel	IC FPGA 252 I/O 572FBGA Number of LABs/CLBs: 1805 Number of Logic Elements/Cells: 42959 Total RAM Bits: 3517440 Number of I/O: 252 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 572-BGA, FCBGA Supplier Device Package: 572-FBGA, FC (25x25)	封装: 572-BGA, FCBGA	库存3,040
5CEFA9F31I7N	Intel	IC FPGA 480 I/O 896FBGA Number of LABs/CLBs: 113560 Number of Logic Elements/Cells: 301000 Total RAM Bits: 14251008 Number of I/O: 480 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 896-BGA Supplier Device Package: 896-FBGA (31x31)	封装: 896-BGA	库存5,680
EP3C25E144A7N	Intel	IC FPGA 82 I/O 144EQFP Number of LABs/CLBs: 1539 Number of Logic Elements/Cells: 24624 Total RAM Bits: 608256 Number of I/O: 82 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 144-LQFP Exposed Pad Supplier Device Package: 144-EQFP (20x20)	封装: 144-LQFP Exposed Pad	库存7,200
10CL080YF484C8G	Intel	484-PIN FBGA Number of LABs/CLBs: 5079 Number of Logic Elements/Cells: 81264 Total RAM Bits: 2810880 Number of I/O: 289 Number of Gates: - Voltage - Supply: 1.2V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-FBGA Supplier Device Package: 484-FBGA (23x23)	封装: 484-FBGA	库存2,176
EP3C16U484C8	Intel	IC FPGA 346 I/O 484UBGA Number of LABs/CLBs: 963 Number of Logic Elements/Cells: 15408 Total RAM Bits: 516096 Number of I/O: 346 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-FBGA Supplier Device Package: 484-UBGA (19x19)	封装: 484-FBGA	库存4,672
10M08SAU324I7G	Intel	324-PIN UBGA Number of LABs/CLBs: - Number of Logic Elements/Cells: - Total RAM Bits: - Number of I/O: - Number of Gates: - Voltage - Supply: - Mounting Type: - Operating Temperature: - Package / Case: - Supplier Device Package: -	封装: -	库存4,912
EPM7192SQI160-10	Intel	IC CPLD 192MC 10NS 160QFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 10.0ns Voltage Supply - Internal: 4.5 V ~ 5.5 V Number of Logic Elements/Blocks: 12 Number of Macrocells: 192 Number of Gates: 3750 Number of I/O: 124 Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 160-BQFP Supplier Device Package: 160-PQFP (28x28)	封装: 160-BQFP	库存5,760
EPM7064LI44-15	Intel	IC CPLD 64MC 15NS 44PLCC Programmable Type: EE PLD Delay Time tpd(1) Max: 15.0ns Voltage Supply - Internal: 4.5 V ~ 5.5 V Number of Logic Elements/Blocks: 4 Number of Macrocells: 64 Number of Gates: 1250 Number of I/O: 36 Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59)	封装: 44-LCC (J-Lead)	库存7,568
EPM570M256C4N	Intel	IC CPLD 440MC 5.4NS 256MBGA Programmable Type: In System Programmable Delay Time tpd(1) Max: 5.4ns Voltage Supply - Internal: 2.5V, 3.3V Number of Logic Elements/Blocks: 570 Number of Macrocells: 440 Number of Gates: - Number of I/O: 160 Operating Temperature: 0°C ~ 85°C (TJ) Mounting Type: Surface Mount Package / Case: 256-TFBGA Supplier Device Package: 256-MBGA (11x11)	封装: 256-TFBGA	库存5,024
RK80532EC041512	Intel	MPU XEON PROCESSOR, X86 ARCH. 64 Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	封装: -	Request a Quote
NH82801GBM	Intel	IC CONTROLLER 652MBGA Type: Controller Applications: - Mounting Type: Surface Mount Package / Case: 652-BBGA Supplier Device Package: 652-mBGA (31x31)	封装: -	Request a Quote
N82586	Intel	IC SIGNAL COPROCESSOR 68PLCC Type: Signal Coprocessor Applications: - Mounting Type: Surface Mount Package / Case: 68-LCC (J-Lead) Supplier Device Package: 68-PLCC	封装: -	Request a Quote
1SX250HN3F43E3VG	Intel	IC FPGA STRATIX 10 1760FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2500K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5x42.5)	封装: -	Request a Quote
5SGXMA7H2F35C1WN	Intel	IC FPGA 552 I/O 1152FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 51200000 Number of I/O: 552 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封装: -	Request a Quote
AGFB014R24C2I2V	Intel	IC FPGA AGILEX-F 2340FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.4M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封装: -	Request a Quote
1SG211HN3F43E2LG	Intel	IC FPGA 688 I/O 1760FBGA Number of LABs/CLBs: 263750 Number of Logic Elements/Cells: 2110000 Total RAM Bits: - Number of I/O: 688 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5x42.5)	封装: -	Request a Quote
AGFA019R31C2I2VB	Intel	IC FPGA AGILEX-F 3184BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.9M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 3184-BFBGA Exposed Pad Supplier Device Package: 3184-BGA (56x45)	封装: -	Request a Quote
EP4SGX360KF40I3G	Intel	IC FPGA 744 I/O 1517FBGA Number of LABs/CLBs: - Number of Logic Elements/Cells: - Total RAM Bits: - Number of I/O: - Number of Gates: - Voltage - Supply: - Mounting Type: - Operating Temperature: - Package / Case: - Supplier Device Package: -	封装: -	Request a Quote
5SGXMABK2H40C3G	Intel	IC FPGA 696 I/O 1517HBGA Number of LABs/CLBs: 359200 Number of Logic Elements/Cells: 952000 Total RAM Bits: 53248000 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-HBGA (45x45)	封装: -	Request a Quote
1SG280HH1F55E1VG	Intel	IC FPGA 1160 I/O 2912BGA Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 Total RAM Bits: - Number of I/O: 1160 Number of Gates: - Voltage - Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2912-BBGA, FCBGA Supplier Device Package: 2912-FBGA, FC (55x55)	封装: -	Request a Quote
MD8749H	Intel	RISC MCU, CMOS Core Processor: MCS-48 Core Size: 8-Bit Speed: 11MHz Connectivity: - Peripherals: - Number of I/O: 27 Program Memory Size: 2KB (2K x 8) Program Memory Type: ROM EEPROM Size: - RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: - Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Through Hole Package / Case: 40-CDIP Supplier Device Package: 40-CDIP	封装: -	Request a Quote
EP3SL340F1517C4G	Intel	IC FPGA 976 I/O 1517FBGA Number of LABs/CLBs: - Number of Logic Elements/Cells: - Total RAM Bits: - Number of I/O: - Number of Gates: - Voltage - Supply: - Mounting Type: - Operating Temperature: - Package / Case: - Supplier Device Package: -	封装: -	Request a Quote
5SGXEA5K2F35C3G	Intel	IC FPGA 432 I/O 1152FBGA Number of LABs/CLBs: 185000 Number of Logic Elements/Cells: 490000 Total RAM Bits: 46080000 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封装: -	Request a Quote
FAGD1652148BA	Intel	IC LASER DRIVER 2.5GBIT Type: - Data Rate: - Number of Channels: - Voltage - Supply: - Current - Supply: - Current - Modulation: - Current - Bias: - Operating Temperature: - Package / Case: - Supplier Device Package: - Mounting Type: -	封装: -	Request a Quote

EPF10K100EBC356-1N

Intel

IC FPGA 274 I/O 356BGA

Number of LABs/CLBs: 624
Number of Logic Elements/Cells: 4992
Total RAM Bits: 49152
Number of I/O: 274
Number of Gates: 257000
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Package / Case: 356-LBGA
Supplier Device Package: 356-BGA (35x35)

封装: 356-LBGA

库存5,520

5SGSMD5K2F40C1N

Intel

IC FPGA 696 I/O 1517FBGA

Number of LABs/CLBs: 172600
Number of Logic Elements/Cells: 457000
Total RAM Bits: 46769152
Number of I/O: 696
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封装: 1517-BBGA, FCBGA

库存4,112

EP2SGX90FF1508C4

Intel

IC FPGA 650 I/O 1508FBGA

Number of LABs/CLBs: 4548
Number of Logic Elements/Cells: 90960
Total RAM Bits: 4520448
Number of I/O: 650
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1508-BBGA, FCBGA
Supplier Device Package: 1508-FBGA (30x30)

封装: 1508-BBGA, FCBGA

库存7,408

5AGXBB7D4F40C5N

Intel

IC FPGA 704 I/O 1517FBGA

Number of LABs/CLBs: 23780
Number of Logic Elements/Cells: 504000
Total RAM Bits: 27695104
Number of I/O: 704
Number of Gates: -
Voltage - Supply: 1.07 V ~ 1.13 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA
Supplier Device Package: 1517-FBGA (40x40)

封装: 1517-BBGA

库存2,144

EP2AGX95EF29I3N

Intel

IC FPGA 372 I/O 780FBGA

Number of LABs/CLBs: 3747
Number of Logic Elements/Cells: 89178
Total RAM Bits: 6839296
Number of I/O: 372
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-FBGA (29x29)

封装: 780-BBGA, FCBGA

库存5,232

10AX022E3F27E1HG

Intel

IC FPGA 240 I/O 672FBGA

Number of LABs/CLBs: 80330
Number of Logic Elements/Cells: 220000
Total RAM Bits: 13752320
Number of I/O: 240
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 672-BBGA, FCBGA
Supplier Device Package: 672-FBGA (27x27)

封装: 672-BBGA, FCBGA

库存5,088

EP2AGX45DF25C5N

Intel

IC FPGA 252 I/O 572FBGA

Number of LABs/CLBs: 1805
Number of Logic Elements/Cells: 42959
Total RAM Bits: 3517440
Number of I/O: 252
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 572-BGA, FCBGA
Supplier Device Package: 572-FBGA, FC (25x25)

封装: 572-BGA, FCBGA

库存3,040

5CEFA9F31I7N

Intel

IC FPGA 480 I/O 896FBGA

Number of LABs/CLBs: 113560
Number of Logic Elements/Cells: 301000
Total RAM Bits: 14251008
Number of I/O: 480
Number of Gates: -
Voltage - Supply: 1.07 V ~ 1.13 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 896-BGA
Supplier Device Package: 896-FBGA (31x31)

封装: 896-BGA

库存5,680

EP3C25E144A7N

Intel

IC FPGA 82 I/O 144EQFP

Number of LABs/CLBs: 1539
Number of Logic Elements/Cells: 24624
Total RAM Bits: 608256
Number of I/O: 82
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Package / Case: 144-LQFP Exposed Pad
Supplier Device Package: 144-EQFP (20x20)

封装: 144-LQFP Exposed Pad

库存7,200

10CL080YF484C8G

Intel

484-PIN FBGA

Number of LABs/CLBs: 5079
Number of Logic Elements/Cells: 81264
Total RAM Bits: 2810880
Number of I/O: 289
Number of Gates: -
Voltage - Supply: 1.2V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-FBGA
Supplier Device Package: 484-FBGA (23x23)

封装: 484-FBGA

库存2,176

EP3C16U484C8

Intel

IC FPGA 346 I/O 484UBGA

Number of LABs/CLBs: 963
Number of Logic Elements/Cells: 15408
Total RAM Bits: 516096
Number of I/O: 346
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-FBGA
Supplier Device Package: 484-UBGA (19x19)

封装: 484-FBGA

库存4,672

10M08SAU324I7G

Intel

324-PIN UBGA

Number of LABs/CLBs: -
Number of Logic Elements/Cells: -
Total RAM Bits: -
Number of I/O: -
Number of Gates: -
Voltage - Supply: -
Mounting Type: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

封装: -

库存4,912

EPM7192SQI160-10

Intel

IC CPLD 192MC 10NS 160QFP

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 10.0ns
Voltage Supply - Internal: 4.5 V ~ 5.5 V
Number of Logic Elements/Blocks: 12
Number of Macrocells: 192
Number of Gates: 3750
Number of I/O: 124
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Supplier Device Package: 160-PQFP (28x28)

封装: 160-BQFP

库存5,760

EPM7064LI44-15

Intel

IC CPLD 64MC 15NS 44PLCC

Programmable Type: EE PLD
Delay Time tpd(1) Max: 15.0ns
Voltage Supply - Internal: 4.5 V ~ 5.5 V
Number of Logic Elements/Blocks: 4
Number of Macrocells: 64
Number of Gates: 1250
Number of I/O: 36
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 44-LCC (J-Lead)
Supplier Device Package: 44-PLCC (16.59x16.59)

封装: 44-LCC (J-Lead)

库存7,568

EPM570M256C4N

Intel

IC CPLD 440MC 5.4NS 256MBGA

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 5.4ns
Voltage Supply - Internal: 2.5V, 3.3V
Number of Logic Elements/Blocks: 570
Number of Macrocells: 440
Number of Gates: -
Number of I/O: 160
Operating Temperature: 0°C ~ 85°C (TJ)
Mounting Type: Surface Mount
Package / Case: 256-TFBGA
Supplier Device Package: 256-MBGA (11x11)

封装: 256-TFBGA

库存5,024

RK80532EC041512

Intel

MPU XEON PROCESSOR, X86 ARCH. 64

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

封装: -

Request a Quote

NH82801GBM

Intel

IC CONTROLLER 652MBGA

Type: Controller
Applications: -
Mounting Type: Surface Mount
Package / Case: 652-BBGA
Supplier Device Package: 652-mBGA (31x31)

封装: -

Request a Quote

N82586

Intel

IC SIGNAL COPROCESSOR 68PLCC

Type: Signal Coprocessor
Applications: -
Mounting Type: Surface Mount
Package / Case: 68-LCC (J-Lead)
Supplier Device Package: 68-PLCC

封装: -

Request a Quote

1SX250HN3F43E3VG

Intel

IC FPGA STRATIX 10 1760FBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 2500K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FBGA (42.5x42.5)

封装: -

Request a Quote

5SGXMA7H2F35C1WN

Intel

IC FPGA 552 I/O 1152FBGA

Number of LABs/CLBs: 234720
Number of Logic Elements/Cells: 622000
Total RAM Bits: 51200000
Number of I/O: 552
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封装: -

Request a Quote

AGFB014R24C2I2V

Intel

IC FPGA AGILEX-F 2340FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 1.4M Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封装: -

Request a Quote

1SG211HN3F43E2LG

Intel

IC FPGA 688 I/O 1760FBGA

Number of LABs/CLBs: 263750
Number of Logic Elements/Cells: 2110000
Total RAM Bits: -
Number of I/O: 688
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FBGA (42.5x42.5)

封装: -

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AGFA019R31C2I2VB

Intel

IC FPGA AGILEX-F 3184BGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 1.9M Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 3184-BFBGA Exposed Pad
Supplier Device Package: 3184-BGA (56x45)

封装: -

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EP4SGX360KF40I3G

Intel

IC FPGA 744 I/O 1517FBGA

Number of LABs/CLBs: -
Number of Logic Elements/Cells: -
Total RAM Bits: -
Number of I/O: -
Number of Gates: -
Voltage - Supply: -
Mounting Type: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

封装: -

Request a Quote

5SGXMABK2H40C3G

Intel

IC FPGA 696 I/O 1517HBGA

Number of LABs/CLBs: 359200
Number of Logic Elements/Cells: 952000
Total RAM Bits: 53248000
Number of I/O: 696
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-HBGA (45x45)

封装: -

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1SG280HH1F55E1VG

Intel

IC FPGA 1160 I/O 2912BGA

Number of LABs/CLBs: 350000
Number of Logic Elements/Cells: 2800000
Total RAM Bits: -
Number of I/O: 1160
Number of Gates: -
Voltage - Supply: 0.77V ~ 0.97V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 2912-BBGA, FCBGA
Supplier Device Package: 2912-FBGA, FC (55x55)

封装: -

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MD8749H

Intel

RISC MCU, CMOS

Core Processor: MCS-48
Core Size: 8-Bit
Speed: 11MHz
Connectivity: -
Peripherals: -
Number of I/O: 27
Program Memory Size: 2KB (2K x 8)
Program Memory Type: ROM
EEPROM Size: -
RAM Size: 128 x 8
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Data Converters: -
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Through Hole
Package / Case: 40-CDIP
Supplier Device Package: 40-CDIP

封装: -

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EP3SL340F1517C4G

Intel

IC FPGA 976 I/O 1517FBGA

Number of LABs/CLBs: -
Number of Logic Elements/Cells: -
Total RAM Bits: -
Number of I/O: -
Number of Gates: -
Voltage - Supply: -
Mounting Type: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

封装: -

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5SGXEA5K2F35C3G

Intel

IC FPGA 432 I/O 1152FBGA

Number of LABs/CLBs: 185000
Number of Logic Elements/Cells: 490000
Total RAM Bits: 46080000
Number of I/O: 432
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封装: -

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FAGD1652148BA

Intel

IC LASER DRIVER 2.5GBIT

Type: -
Data Rate: -
Number of Channels: -
Voltage - Supply: -
Current - Supply: -
Current - Modulation: -
Current - Bias: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -
Mounting Type: -

封装: -

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