Epson Electronics America Inc-Semiconductor Div 产品

S1D13709F00A100

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 80TQFP

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 80-TQFP
• Supplier Device Package: 80-TQFP (12x12)

封装: 80-TQFP

S1D15711D00B000

Epson Electronics America Inc-Semiconductor Div

IC DRIVER LCD

• Type: Display Driver
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Chip

封装: Die

S1D13L01F00A100

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 128QFP

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 128-LQFP
• Supplier Device Package: 128-QFP (14x14)

封装: 128-LQFP

S1D13781F00A100

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 100LQFP

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP
• Supplier Device Package: 100-QFP15 (14x14)

封装: 100-LQFP

S1R72C05B08E100

Epson Electronics America Inc-Semiconductor Div

IC CONTROLLER USB 121BGA

• Protocol: USB
• Function: Host Controller
• Interface: USB
• Standards: USB 2.0
• Voltage - Supply: 1.8V, 3.3V
• Current - Supply: 75mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 121-TFBGA
• Supplier Device Package: 121-TFBGA (8x8)

封装: 121-TFBGA

S1R72V27B05H100

Epson Electronics America Inc-Semiconductor Div

IC CONTROLLER USB 81BGA

• Protocol: USB
• Function: Host Controller
• Interface: USB
• Standards: USB 2.0
• Voltage - Supply: 1.8V, 3.3V
• Current - Supply: 40.2mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 60-TFBGA
• Supplier Device Package: 60-FBGA (5x5)

封装: 60-TFBGA

S1C17W22F00B100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 64KB FLASH 128TQFP

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 4.2MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: LCD, PWM, RFC, WDT
• Number of I/O: 41
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.2 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 128-TQFP
• Supplier Device Package: -

封装: 128-TQFP

S1C17704B402100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 64KB FLASH 161VFBGA

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 8.2MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: LCD, PWM, WDT
• Number of I/O: 28
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 161-VFBGA
• Supplier Device Package: 161-VFBGA (7x7)

封装: 161-VFBGA

S1C17W22F101100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 64KB FLASH 128TQFP

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 4.2MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: LCD, PWM, RFC, WDT
• Number of I/O: 41
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.2 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 128-TQFP
• Supplier Device Package: 128-TQFP (14x14)

封装: 128-TQFP

S1C17F57D00E200

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 32KB FLASH DIE

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 4.2MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: PWM, WDT
• Number of I/O: 29
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: Die
• Supplier Device Package: -

封装: Die

S1C31W74B201000

Epson Electronics America Inc-Semiconductor Div

32-BIT SNGL CHIP MICROCONTROLLER

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 21MHz
• Connectivity: I2C, IrDA, QSPI, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
• Number of I/O: 71
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 181-VFBGA
• Supplier Device Package: 181-VFBGA (8x8)

封装: 181-VFBGA

S1V3G340F00A900

Epson Electronics America Inc-Semiconductor Div

OSC TEXT TO SPEECH LSI 52QFP

• Function: Voice Processor
• Applications: Signal Mixing
• Number of Channels: 1
• Interface: SPI
• Voltage - Supply: 2.2 V ~ 5.5 V
• Operating Temperature: -
• Specifications: -
• Package / Case: 52-LQFP
• Supplier Device Package: 52-QFP (10x10)

封装: 52-LQFP

S1C31W74B201000-348

Epson Electronics America Inc-Semiconductor Div

32BIT-MCU ARM CORETEX M0+ 21.7MH

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

S1C17W14F102100-90

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 48KB FLASH 4KB

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

S1C17W15F005100-160

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 64KB FLASH 4KB

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

S1C17W18F103100

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 128KB FLASH 8K

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

S1C17W15F004100

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 64KB FLASH 4KB

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

S1C17W15F005100

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 64KB FLASH 4KB

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

S1C17W03F102100-490

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ16KB FLASH 2KB

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

S1C17W13F001100

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 48KB FLASH 2KB

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

S2D13515F00A100-36

Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER FOR AUTOMOTIVE UP

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 256-LQFP
• Supplier Device Package: 256-QFP22 (28x28)

封装: 256-LQFP

S1D13A04F00A100-90

Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER BUILT-IN 160KB SR

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 128-TQFP
• Supplier Device Package: 128-TQFP15 (14x14)

封装: 128-TQFP

S1D13L02F00A100-36

Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER BUILT-IN 1024KB S

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 208-LQFP
• Supplier Device Package: 208-QFP22 (28x28)

封装: 208-LQFP

S1D13709F00A100-119

Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER BUILT-IN 32KB SRA

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 80-TQFP
• Supplier Device Package: 80-TQFP14 (12x12)

封装: 80-TQFP

S1D13781F00A100-90

Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER BUILT-IN 384KB SR

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP
• Supplier Device Package: 100-QFP15 (14x14)

封装: 100-LQFP

S1D13746B01B600-416

Epson Electronics America Inc-Semiconductor Div

TV OUT CONTROLLER; 312KB SRAM+ A

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 160-TFBGA
• Supplier Device Package: 100-PFBGA (7x7)

封装: 160-TFBGA

S1D13A04F00A100

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 128TQFP

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 128-TQFP
• Supplier Device Package: 128-TQFP (14x14)

封装: 128-TQFP

S1C17F63F101100-90

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 32KB FLASH 100QFP15

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 16.8MHz
• Connectivity: I2C, IrDA, SmartCard, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
• Number of I/O: 17
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 7x12b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP
• Supplier Device Package: 100-QFP15 (14x14)

封装: -

Request a Quote

S1C17M22F001100-250

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 16KB FLASH 48TQFP12

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 21MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT
• Number of I/O: 39
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 8x12b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 48-TQFP
• Supplier Device Package: 48-TQFP12 (7x7)

封装: -

Request a Quote

S1S60000F00A500

Epson Electronics America Inc-Semiconductor Div

IC NETWORK CONTROLLER

• Protocol: -
• Function: -
• Interface: -
• Standards: -
• Voltage - Supply: -
• Current - Supply: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

封装: -

Request a Quote