页 155 - Intel 产品 | 深圳黑森尔电子

零件编号	制造商	描述	封装	库存
S87C581SF76	Intel	IC MCU 8BIT 32KB OTP 44MQFP Core Processor: MCS 51 Core Size: 8-Bit Speed: 16MHz Connectivity: SIO Peripherals: - Number of I/O: 32 Program Memory Size: 32KB (32K x 8) Program Memory Type: OTP EEPROM Size: - RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 4 V ~ 6 V Data Converters: - Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 44-QFP Supplier Device Package: -	封装: 44-QFP	库存3,680
S87C521SF76	Intel	IC MCU 8BIT 8KB OTP 44MQFP Core Processor: MCS 51 Core Size: 8-Bit Speed: 16MHz Connectivity: SIO Peripherals: - Number of I/O: 32 Program Memory Size: 8KB (8K x 8) Program Memory Type: OTP EEPROM Size: - RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 4 V ~ 6 V Data Converters: - Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 44-QFP Supplier Device Package: -	封装: 44-QFP	库存6,400
10AS027E2F27E1SG	Intel	IC SOC FPGA 240 I/O 672FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 270K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27x27)	封装: 672-BBGA, FCBGA	库存6,816
1SX250LU3F50I2VG	Intel	2397-PIN FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2500K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封装: -	库存2,960
10AS027H3F34E2SG	Intel	1152-PIN FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 270K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封装: -	库存3,392
EPC1PI8N	Intel	IC CONFIG DEVICE 1MBIT 8DIP Programmable Type: OTP Memory Size: 1Mb Voltage - Supply: 3 V ~ 3.6 V, 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Package / Case: 8-DIP (0.300", 7.62mm) Supplier Device Package: 8-PDIP	封装: 8-DIP (0.300", 7.62mm)	库存10,020
EPF10K200EFC672-2	Intel	IC FPGA 470 I/O 672FBGA Number of LABs/CLBs: 1248 Number of Logic Elements/Cells: 9984 Total RAM Bits: 98304 Number of I/O: 470 Number of Gates: 513000 Voltage - Supply: 2.3 V ~ 2.7 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Package / Case: 672-BBGA Supplier Device Package: 672-FBGA (27x27)	封装: 672-BBGA	库存5,344
EP1K50FC484-1N	Intel	IC FPGA 249 I/O 484FBGA Number of LABs/CLBs: 360 Number of Logic Elements/Cells: 2880 Total RAM Bits: 40960 Number of I/O: 249 Number of Gates: 199000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	封装: 484-BBGA	库存4,384
5SGXMA4K2F35I2N	Intel	IC FPGA 432 I/O 1152FBGA Number of LABs/CLBs: 158500 Number of Logic Elements/Cells: 420000 Total RAM Bits: 43983872 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封装: 1152-BBGA, FCBGA	库存2,272
10AX090S3F45E2SG	Intel	IC FPGA 624 I/O 1932FCBGA Number of LABs/CLBs: 339620 Number of Logic Elements/Cells: 900000 Total RAM Bits: 59234304 Number of I/O: 624 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	封装: 1932-BBGA, FCBGA	库存3,680
10AX057K2F35I2LG	Intel	IC FPGA 396 I/O 1152FCBGA Number of LABs/CLBs: 217080 Number of Logic Elements/Cells: 570000 Total RAM Bits: 42082304 Number of I/O: 396 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.98 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35)	封装: 1152-BBGA, FCBGA	库存6,640
10AX027H1F34I1HG	Intel	IC FPGA 384 I/O 1152FCBGA Number of LABs/CLBs: 101620 Number of Logic Elements/Cells: 270000 Total RAM Bits: 17870848 Number of I/O: 384 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.98 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封装: 1152-BBGA, FCBGA	库存6,976
10AX032E1F27I1HG	Intel	IC FPGA 240 I/O 672FBGA Number of LABs/CLBs: 119900 Number of Logic Elements/Cells: 320000 Total RAM Bits: 21040128 Number of I/O: 240 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.98 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27x27)	封装: 672-BBGA, FCBGA	库存2,448
10AX022E4F27I3LG	Intel	672-PIN FBGA Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 Total RAM Bits: 13752320 Number of I/O: 240 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.98 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA, FC (27x27)	封装: 672-BBGA, FCBGA	库存7,792
EP2AGX65DF29C5	Intel	IC FPGA 364 I/O 780FBGA Number of LABs/CLBs: 2530 Number of Logic Elements/Cells: 60214 Total RAM Bits: 5371904 Number of I/O: 364 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29)	封装: 780-BBGA, FCBGA	库存3,568
5CGXBC3B6F23C7N	Intel	IC FPGA 208 I/O 484FBGA Number of LABs/CLBs: 11900 Number of Logic Elements/Cells: 31500 Total RAM Bits: 1381376 Number of I/O: 208 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FBGA (23x23)	封装: 484-BGA	库存7,856
EP2C35F672C8N	Intel	IC FPGA 475 I/O 672FBGA Number of LABs/CLBs: 2076 Number of Logic Elements/Cells: 33216 Total RAM Bits: 483840 Number of I/O: 475 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 672-BGA Supplier Device Package: 672-FBGA (27x27)	封装: 672-BGA	库存12,204
5CEFA5M13I7N	Intel	IC FPGA 175 I/O 383MBGA Number of LABs/CLBs: 29080 Number of Logic Elements/Cells: 77000 Total RAM Bits: 5001216 Number of I/O: 175 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 383-TFBGA Supplier Device Package: 383-MBGA (13x13)	封装: 383-TFBGA	库存4,224
EPM7160STC100-7	Intel	IC CPLD 160MC 7.5NS 100TQFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 7.5ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 10 Number of Macrocells: 160 Number of Gates: 3200 Number of I/O: 84 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 100-TQFP Supplier Device Package: 100-TQFP (14x14)	封装: 100-TQFP	库存4,432
EP3SE50F484I4G	Intel	IC FPGA 296 I/O 484FBGA Number of LABs/CLBs: 1900 Number of Logic Elements/Cells: 47500 Total RAM Bits: 5760000 Number of I/O: 296 Number of Gates: - Voltage - Supply: 0.86V ~ 1.15V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BBGA, FCBGA Supplier Device Package: 484-FBGA (23x23)	封装: 484-BBGA, FCBGA	库存3,360
5SGXMBBR3H43I3LG	Intel	IC FPGA 600 I/O 1760HBGA Number of LABs/CLBs: 359200 Number of Logic Elements/Cells: 952000 Total RAM Bits: 53248000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45x45)	封装: -	Request a Quote
1SG250HN3F43E3VG	Intel	IC FPGA 688 I/O 1760FBGA Number of LABs/CLBs: 312500 Number of Logic Elements/Cells: 2500000 Total RAM Bits: - Number of I/O: 688 Number of Gates: - Voltage - Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5x42.5)	封装: -	Request a Quote
AGIB022R31B2E3E	Intel	IC FPGA AGILEX-I 3184FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.2M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封装: -	Request a Quote
RH80532GC029512	Intel	IC MPU 2 1.7GHZ 478FCPGA Core Processor: Mobile Intel® Pentium® 4 Processor - M Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.7GHz Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 1.3V Operating Temperature: 100°C (TJ) Security Features: - Package / Case: 478-BFCPGA Supplier Device Package: 478-FCPGA (35x35)	封装: -	Request a Quote
5SGSMD3H1F35C1G	Intel	IC FPGA 432 I/O 1152FBGA Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Total RAM Bits: 13312000 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封装: -	Request a Quote
EP4SGX530KF43C2G	Intel	IC FPGA 880 I/O 1760FBGA Number of LABs/CLBs: - Number of Logic Elements/Cells: - Total RAM Bits: - Number of I/O: - Number of Gates: - Voltage - Supply: - Mounting Type: - Operating Temperature: - Package / Case: - Supplier Device Package: -	封装: -	Request a Quote
AGIB027R31B1I2VB	Intel	IC FPGA AGILEX-I 3184BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.7M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 3184-BFBGA Exposed Pad Supplier Device Package: 3184-BGA (56x45)	封装: -	Request a Quote
5SGXMA3H3F35I4G	Intel	IC FPGA 600 I/O 1152FBGA Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 Total RAM Bits: 19456000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封装: -	Request a Quote
5SGXMBBR1H43C2G	Intel	IC FPGA 600 I/O 1760HBGA Number of LABs/CLBs: 359200 Number of Logic Elements/Cells: 952000 Total RAM Bits: 53248000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45x45)	封装: -	Request a Quote
AGIB027R29B1E1VR3	Intel	IC FPGA AGILEX-I 2957BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.7M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2957-BFBGA Exposed Pad Supplier Device Package: 2957-BGA (56x45)	封装: -	Request a Quote

S87C581SF76

Intel

IC MCU 8BIT 32KB OTP 44MQFP

Core Processor: MCS 51
Core Size: 8-Bit
Speed: 16MHz
Connectivity: SIO
Peripherals: -
Number of I/O: 32
Program Memory Size: 32KB (32K x 8)
Program Memory Type: OTP
EEPROM Size: -
RAM Size: 256 x 8
Voltage - Supply (Vcc/Vdd): 4 V ~ 6 V
Data Converters: -
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 44-QFP
Supplier Device Package: -

封装: 44-QFP

库存3,680

S87C521SF76

Intel

IC MCU 8BIT 8KB OTP 44MQFP

Core Processor: MCS 51
Core Size: 8-Bit
Speed: 16MHz
Connectivity: SIO
Peripherals: -
Number of I/O: 32
Program Memory Size: 8KB (8K x 8)
Program Memory Type: OTP
EEPROM Size: -
RAM Size: 256 x 8
Voltage - Supply (Vcc/Vdd): 4 V ~ 6 V
Data Converters: -
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 44-QFP
Supplier Device Package: -

封装: 44-QFP

库存6,400

10AS027E2F27E1SG

Intel

IC SOC FPGA 240 I/O 672FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 270K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 672-BBGA, FCBGA
Supplier Device Package: 672-FBGA (27x27)

封装: 672-BBGA, FCBGA

库存6,816

1SX250LU3F50I2VG

Intel

2397-PIN FBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 2500K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封装: -

库存2,960

10AS027H3F34E2SG

Intel

1152-PIN FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 270K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封装: -

库存3,392

EPC1PI8N

Intel

IC CONFIG DEVICE 1MBIT 8DIP

Programmable Type: OTP
Memory Size: 1Mb
Voltage - Supply: 3 V ~ 3.6 V, 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Package / Case: 8-DIP (0.300", 7.62mm)
Supplier Device Package: 8-PDIP

封装: 8-DIP (0.300", 7.62mm)

库存10,020

EPF10K200EFC672-2

Intel

IC FPGA 470 I/O 672FBGA

Number of LABs/CLBs: 1248
Number of Logic Elements/Cells: 9984
Total RAM Bits: 98304
Number of I/O: 470
Number of Gates: 513000
Voltage - Supply: 2.3 V ~ 2.7 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Package / Case: 672-BBGA
Supplier Device Package: 672-FBGA (27x27)

封装: 672-BBGA

库存5,344

EP1K50FC484-1N

Intel

IC FPGA 249 I/O 484FBGA

Number of LABs/CLBs: 360
Number of Logic Elements/Cells: 2880
Total RAM Bits: 40960
Number of I/O: 249
Number of Gates: 199000
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

封装: 484-BBGA

库存4,384

5SGXMA4K2F35I2N

Intel

IC FPGA 432 I/O 1152FBGA

Number of LABs/CLBs: 158500
Number of Logic Elements/Cells: 420000
Total RAM Bits: 43983872
Number of I/O: 432
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封装: 1152-BBGA, FCBGA

库存2,272

10AX090S3F45E2SG

Intel

IC FPGA 624 I/O 1932FCBGA

Number of LABs/CLBs: 339620
Number of Logic Elements/Cells: 900000
Total RAM Bits: 59234304
Number of I/O: 624
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1932-BBGA, FCBGA
Supplier Device Package: 1932-FBGA, FC (45x45)

封装: 1932-BBGA, FCBGA

库存3,680

10AX057K2F35I2LG

Intel

IC FPGA 396 I/O 1152FCBGA

Number of LABs/CLBs: 217080
Number of Logic Elements/Cells: 570000
Total RAM Bits: 42082304
Number of I/O: 396
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.98 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FCBGA (35x35)

封装: 1152-BBGA, FCBGA

库存6,640

10AX027H1F34I1HG

Intel

IC FPGA 384 I/O 1152FCBGA

Number of LABs/CLBs: 101620
Number of Logic Elements/Cells: 270000
Total RAM Bits: 17870848
Number of I/O: 384
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.98 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封装: 1152-BBGA, FCBGA

库存6,976

10AX032E1F27I1HG

Intel

IC FPGA 240 I/O 672FBGA

Number of LABs/CLBs: 119900
Number of Logic Elements/Cells: 320000
Total RAM Bits: 21040128
Number of I/O: 240
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.98 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 672-BBGA, FCBGA
Supplier Device Package: 672-FBGA (27x27)

封装: 672-BBGA, FCBGA

库存2,448

10AX022E4F27I3LG

Intel

672-PIN FBGA

Number of LABs/CLBs: 80330
Number of Logic Elements/Cells: 220000
Total RAM Bits: 13752320
Number of I/O: 240
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.98 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 672-BBGA, FCBGA
Supplier Device Package: 672-FBGA, FC (27x27)

封装: 672-BBGA, FCBGA

库存7,792

EP2AGX65DF29C5

Intel

IC FPGA 364 I/O 780FBGA

Number of LABs/CLBs: 2530
Number of Logic Elements/Cells: 60214
Total RAM Bits: 5371904
Number of I/O: 364
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-FBGA (29x29)

封装: 780-BBGA, FCBGA

库存3,568

5CGXBC3B6F23C7N

Intel

IC FPGA 208 I/O 484FBGA

Number of LABs/CLBs: 11900
Number of Logic Elements/Cells: 31500
Total RAM Bits: 1381376
Number of I/O: 208
Number of Gates: -
Voltage - Supply: 1.07 V ~ 1.13 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FBGA (23x23)

封装: 484-BGA

库存7,856

EP2C35F672C8N

Intel

IC FPGA 475 I/O 672FBGA

Number of LABs/CLBs: 2076
Number of Logic Elements/Cells: 33216
Total RAM Bits: 483840
Number of I/O: 475
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 672-BGA
Supplier Device Package: 672-FBGA (27x27)

封装: 672-BGA

库存12,204

5CEFA5M13I7N

Intel

IC FPGA 175 I/O 383MBGA

Number of LABs/CLBs: 29080
Number of Logic Elements/Cells: 77000
Total RAM Bits: 5001216
Number of I/O: 175
Number of Gates: -
Voltage - Supply: 1.07 V ~ 1.13 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 383-TFBGA
Supplier Device Package: 383-MBGA (13x13)

封装: 383-TFBGA

库存4,224

EPM7160STC100-7

Intel

IC CPLD 160MC 7.5NS 100TQFP

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 7.5ns
Voltage Supply - Internal: 4.75 V ~ 5.25 V
Number of Logic Elements/Blocks: 10
Number of Macrocells: 160
Number of Gates: 3200
Number of I/O: 84
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Supplier Device Package: 100-TQFP (14x14)

封装: 100-TQFP

库存4,432

EP3SE50F484I4G

Intel

IC FPGA 296 I/O 484FBGA

Number of LABs/CLBs: 1900
Number of Logic Elements/Cells: 47500
Total RAM Bits: 5760000
Number of I/O: 296
Number of Gates: -
Voltage - Supply: 0.86V ~ 1.15V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BBGA, FCBGA
Supplier Device Package: 484-FBGA (23x23)

封装: 484-BBGA, FCBGA

库存3,360

5SGXMBBR3H43I3LG

Intel

IC FPGA 600 I/O 1760HBGA

Number of LABs/CLBs: 359200
Number of Logic Elements/Cells: 952000
Total RAM Bits: 53248000
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-HBGA (45x45)

封装: -

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1SG250HN3F43E3VG

Intel

IC FPGA 688 I/O 1760FBGA

Number of LABs/CLBs: 312500
Number of Logic Elements/Cells: 2500000
Total RAM Bits: -
Number of I/O: 688
Number of Gates: -
Voltage - Supply: 0.77V ~ 0.97V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FBGA (42.5x42.5)

封装: -

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AGIB022R31B2E3E

Intel

IC FPGA AGILEX-I 3184FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.2M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封装: -

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RH80532GC029512

Intel

IC MPU 2 1.7GHZ 478FCPGA

Core Processor: Mobile Intel® Pentium® 4 Processor - M
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.7GHz
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 1.3V
Operating Temperature: 100°C (TJ)
Security Features: -
Package / Case: 478-BFCPGA
Supplier Device Package: 478-FCPGA (35x35)

封装: -

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5SGSMD3H1F35C1G

Intel

IC FPGA 432 I/O 1152FBGA

Number of LABs/CLBs: 89000
Number of Logic Elements/Cells: 236000
Total RAM Bits: 13312000
Number of I/O: 432
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封装: -

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EP4SGX530KF43C2G

Intel

IC FPGA 880 I/O 1760FBGA

Number of LABs/CLBs: -
Number of Logic Elements/Cells: -
Total RAM Bits: -
Number of I/O: -
Number of Gates: -
Voltage - Supply: -
Mounting Type: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

封装: -

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AGIB027R31B1I2VB

Intel

IC FPGA AGILEX-I 3184BGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.7M Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 3184-BFBGA Exposed Pad
Supplier Device Package: 3184-BGA (56x45)

封装: -

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5SGXMA3H3F35I4G

Intel

IC FPGA 600 I/O 1152FBGA

Number of LABs/CLBs: 128300
Number of Logic Elements/Cells: 340000
Total RAM Bits: 19456000
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封装: -

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5SGXMBBR1H43C2G

Intel

IC FPGA 600 I/O 1760HBGA

Number of LABs/CLBs: 359200
Number of Logic Elements/Cells: 952000
Total RAM Bits: 53248000
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-HBGA (45x45)

封装: -

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AGIB027R29B1E1VR3

Intel

IC FPGA AGILEX-I 2957BGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.7M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 2957-BFBGA Exposed Pad
Supplier Device Package: 2957-BGA (56x45)

封装: -

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