页 154 - Intel 产品 | 深圳黑森尔电子
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Intel 产品

记录 9,824
页  154/328
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数量
EPC2LI20NGA
Intel

IC FPGA FBGA

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: -
  • Number of I/O: -
  • Number of Gates: -
  • Voltage - Supply: -
  • Mounting Type: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
封装: -
库存3,200
10M40DCF484I6G
Intel

IC FPGA 360 I/O 484FBGA

  • Number of LABs/CLBs: 2500
  • Number of Logic Elements/Cells: 40000
  • Total RAM Bits: 1290240
  • Number of I/O: 360
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FBGA (23x23)
封装: 484-BGA
库存5,088
EP20K200BI356-3
Intel

IC FPGA

  • Number of LABs/CLBs: 832
  • Number of Logic Elements/Cells: 8320
  • Total RAM Bits: 106496
  • Number of I/O: 277
  • Number of Gates: 526000
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 356-LBGA
  • Supplier Device Package: 356-BGA (35x35)
封装: 356-LBGA
库存2,640
EP20K160EFC400-2X
Intel

IC FPGA

  • Number of LABs/CLBs: 640
  • Number of Logic Elements/Cells: 6400
  • Total RAM Bits: 81920
  • Number of I/O: -
  • Number of Gates: 404000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 400-BGA
  • Supplier Device Package: 400-BGA
封装: 400-BGA
库存2,496
EPF10K50EQC208-1
Intel

IC FPGA 147 I/O 208QFP

  • Number of LABs/CLBs: 360
  • Number of Logic Elements/Cells: 2880
  • Total RAM Bits: 40960
  • Number of I/O: 147
  • Number of Gates: 199000
  • Voltage - Supply: 2.3 V ~ 2.7 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
封装: 208-BFQFP
库存5,104
EPF10K200SFC672-1
Intel

IC FPGA 470 I/O 672FBGA

  • Number of LABs/CLBs: 1248
  • Number of Logic Elements/Cells: 9984
  • Total RAM Bits: 98304
  • Number of I/O: 470
  • Number of Gates: 513000
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Package / Case: 672-BBGA
  • Supplier Device Package: 672-FBGA (27x27)
封装: 672-BBGA
库存4,256
5SGXMABN2F45I2
Intel

IC FPGA 840 I/O 1932FBGA

  • Number of LABs/CLBs: 359200
  • Number of Logic Elements/Cells: 952000
  • Total RAM Bits: 65561600
  • Number of I/O: 840
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
封装: 1932-BBGA, FCBGA
库存4,928
5SGXEB6R1F43C2LN
Intel

IC FPGA 600 I/O 1760FBGA

  • Number of LABs/CLBs: 225400
  • Number of Logic Elements/Cells: 597000
  • Total RAM Bits: 61688832
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
封装: 1760-BBGA, FCBGA
库存3,344
5SGSED8K2F40C2LN
Intel

IC FPGA 696 I/O 1517FBGA

  • Number of LABs/CLBs: 262400
  • Number of Logic Elements/Cells: 695000
  • Total RAM Bits: 60968960
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封装: 1517-BBGA, FCBGA
库存2,048
5AGTFD7H3F35I5N
Intel

IC FPGA 544 I/O 1152FBGA

  • Number of LABs/CLBs: 23780
  • Number of Logic Elements/Cells: 504000
  • Total RAM Bits: 27695104
  • Number of I/O: 544
  • Number of Gates: -
  • Voltage - Supply: 1.07 V ~ 1.13 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA Exposed Pad
  • Supplier Device Package: 1152-FBGA (35x35)
封装: 1152-BBGA, FCBGA Exposed Pad
库存4,864
10AX066K4F35E3SG
Intel

IC FPGA 396 I/O 1152FCBGA

  • Number of LABs/CLBs: 250540
  • Number of Logic Elements/Cells: 660000
  • Total RAM Bits: 49610752
  • Number of I/O: 396
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FCBGA (35x35)
封装: 1152-BBGA, FCBGA
库存5,040
10AX048E3F29I2SG
Intel

780-PIN FBGA

  • Number of LABs/CLBs: 183590
  • Number of Logic Elements/Cells: 480000
  • Total RAM Bits: 5664768
  • Number of I/O: 360
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-FBGA (29x29)
封装: 780-BBGA, FCBGA
库存2,384
EPM7192SQC160-15AB
Intel

IC CPLD 192MC 15NS 160QFP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 15.0ns
  • Voltage Supply - Internal: 4.75 V ~ 5.25 V
  • Number of Logic Elements/Blocks: 12
  • Number of Macrocells: 192
  • Number of Gates: 3750
  • Number of I/O: 124
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 160-BQFP
  • Supplier Device Package: 160-PQFP (28x28)
封装: 160-BQFP
库存2,912
EPM3512AFC256-7N
Intel

IC CPLD 512MC 7.5NS 256FBGA

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 7.5ns
  • Voltage Supply - Internal: 3 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 32
  • Number of Macrocells: 512
  • Number of Gates: 10000
  • Number of I/O: 208
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
封装: 256-BGA
库存3,344
hot EPM7032LI44-15
Intel

IC CPLD 32MC 15NS 44PLCC

  • Programmable Type: EE PLD
  • Delay Time tpd(1) Max: 15.0ns
  • Voltage Supply - Internal: 4.5 V ~ 5.5 V
  • Number of Logic Elements/Blocks: 2
  • Number of Macrocells: 32
  • Number of Gates: 600
  • Number of I/O: 36
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 44-LCC (J-Lead)
  • Supplier Device Package: 44-PLCC (16.59x16.59)
封装: 44-LCC (J-Lead)
库存4,608
EPM570ZM256I8N
Intel

IC CPLD 440MC 9NS 256MBGA

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 9.0ns
  • Voltage Supply - Internal: 1.71 V ~ 1.89 V
  • Number of Logic Elements/Blocks: 570
  • Number of Macrocells: 440
  • Number of Gates: -
  • Number of I/O: 160
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 256-TFBGA
  • Supplier Device Package: 256-MBGA (11x11)
封装: 256-TFBGA
库存3,904
EPM570T144C4N
Intel

IC CPLD 440MC 5.4NS 144TQFP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 5.4ns
  • Voltage Supply - Internal: 2.5V, 3.3V
  • Number of Logic Elements/Blocks: 570
  • Number of Macrocells: 440
  • Number of Gates: -
  • Number of I/O: 116
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
封装: 144-LQFP
库存7,404
AGFC019R24C2E2VB
Intel

IC FPGA AGILEX-F 2340BGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 1.9M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2340-BFBGA Exposed Pad
  • Supplier Device Package: 2340-BGA (45x42)
封装: -
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5SGXEA4H2F35I2LG
Intel

IC FPGA 552 I/O 1152FBGA

  • Number of LABs/CLBs: 158500
  • Number of Logic Elements/Cells: 420000
  • Total RAM Bits: 37888000
  • Number of I/O: 552
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封装: -
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AGFB022R25A1E1V
Intel

IC FPGA AGILEX-F 2581FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.2M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
封装: -
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AGIC041R29D1E2VB
Intel

IC FPGA AGILEX-I 2957BGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 4M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2957-BFBGA Exposed Pad
  • Supplier Device Package: 2957-BGA (56x45)
封装: -
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AGIB019R18A2E2VB
Intel

IC FPGA AGILEX-I 1805BGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 1.9M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1805-BBGA Exposed Pad
  • Supplier Device Package: 1805-BGA (42.5x42.5)
封装: -
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AGID019R31B1I1VB
Intel

IC FPGA AGILEX-I 3184BGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 1.9M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 3184-BFBGA Exposed Pad
  • Supplier Device Package: 3184-BGA (56x45)
封装: -
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5SGXMA5K1F40C2NCV
Intel

IC FPGA 696 I/O 1517FBGA

  • Number of LABs/CLBs: 185000
  • Number of Logic Elements/Cells: 490000
  • Total RAM Bits: 46080000
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.87V ~ 0.93V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封装: -
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AGFB006R16A2E4X
Intel

IC FPGA AGILEX-F 1546FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 573K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
封装: -
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1SG085HN1F43I1VG
Intel

IC FPGA 688 I/O 1760FBGA

  • Number of LABs/CLBs: 106250
  • Number of Logic Elements/Cells: 850000
  • Total RAM Bits: -
  • Number of I/O: 688
  • Number of Gates: -
  • Voltage - Supply: 0.77V ~ 0.97V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FBGA (42.5x42.5)
封装: -
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AGFB012R24B2E2V
Intel

IC FPGA AGILEX-F 2486FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 1.2M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
封装: -
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AGFB008R24C2I3V
Intel

IC FPGA AGILEX-F 2340FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 764K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
封装: -
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5SGXMA7K2F35C2LG
Intel

IC FPGA 432 I/O 1152FBGA

  • Number of LABs/CLBs: 234720
  • Number of Logic Elements/Cells: 622000
  • Total RAM Bits: 51200000
  • Number of I/O: 432
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封装: -
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AGFB012R24C2E3VAA
Intel

IC FPGA AGILEX-F 2340FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 1.2M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
封装: -
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