页 8 - 嵌入式 - 微控制器，微处理器，FPGA 模块 | 集成电路（IC）

零件编号	制造商	描述	封装	库存	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
CC-MX-PG47-ZM-1	Digi International	MODULE CONNECTCORE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	库存4,624	-	-	-	-	-	-	-	-
TE0741-02-070-2IF	Trenz Electronic GmbH	SOM KINTEX-7 70T 32MB FLASH AES Module/Board Type: FPGA Core Processor: Kintex-7 70T Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: - Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存7,424	Kintex-7 70T	-	200MHz	32MB	-	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	-40°C ~ 85°C
DC-ME-01T-CLI-1	Digi International	MODULE ME 8MB SDRAM 2MB FLASH Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 2MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存2,848	ARM7TDMI, NS7520	-	55MHz	2MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 85°C
3359-EX-227-RC-X	Critical Link LLC	MITYSOM-3359 Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, AM3359 Co-Processor: NEON SIMD Speed: 720MHz Flash Size: 256MB (NAND), 8MB (NOR) RAM Size: 64KB (Internal), 256MB (External) Connector Type: SO-DIMM-204 Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存7,280	ARM? Cortex?-A8, AM3359	NEON SIMD	720MHz	256MB (NAND), 8MB (NOR)	64KB (Internal), 256MB (External)	SO-DIMM-204	2.66" x 1.5" (67.6mm x 38.1mm)	0°C ~ 70°C
M5475DFE	NXP	MODULE FIRE ENGINE Module/Board Type: MPU Core Core Processor: ColdFire V4e, MCF5475 Co-Processor: - Speed: 266MHz Flash Size: 2MB (Boot) RAM Size: 64MB Connector Type: - Size / Dimension: 3.7" x 4.5" (93.4mm x 114.3mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存7,984	ColdFire V4e, MCF5475	-	266MHz	2MB (Boot)	64MB	-	3.7" x 4.5" (93.4mm x 114.3mm)	0°C ~ 70°C
CENGLH79520-10-403HCR	Logic	CARD ENGINE 32MB SDRAM Module/Board Type: MPU Core Core Processor: ARM720T, LH79520 Co-Processor: - Speed: 77.4MHz Flash Size: 16MB RAM Size: 32MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存3,136	ARM720T, LH79520	-	77.4MHz	16MB	32MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
CENGLH7A404-11-403EI	Logic	CARD ENGINE 32MB SDRAM Module/Board Type: MPU Core Core Processor: ARM922T, LH7A404 Co-Processor: - Speed: 200MHz Flash Size: 16MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存5,984	ARM922T, LH7A404	-	200MHz	16MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	-40°C ~ 85°C
DC-ME-01T-PS-50	Digi International	MOD ME 8MB SDRAM 2MB FLSH 50PCK Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 2MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存3,296	ARM7TDMI, NS7520	-	55MHz	2MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 85°C
DC-ME-Y401-C-B	Digi International	ME 9210 8MB SDRAM 2MB FLASH 50PK Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9210 Co-Processor: - Speed: 75MHz Flash Size: 2MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 80°C	封装: -	库存6,544	ARM926EJ-S, NS9210	-	75MHz	2MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 80°C
TE0712-02-35-2I	Trenz Electronic GmbH	SOM ARTIX-7 XC7A35T-2I 1GB DDR3 Module/Board Type: FPGA Core Processor: Artix-7 A35T Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存5,536	Artix-7 A35T	-	200MHz	32MB	1GB	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	-40°C ~ 85°C
SOMDIMM-RX63N	Future Designs Inc.	DIMM 16MB 10/100 RX63N REV2 Module/Board Type: MCU Core Core Processor: RX600, RX63N Co-Processor: - Speed: 100MHz Flash Size: 2MB RAM Size: 128KB Connector Type: SO-DIMM-200 Size / Dimension: - Operating Temperature: -	封装: -	库存3,856	RX600, RX63N	-	100MHz	2MB	128KB	SO-DIMM-200	-	-
DC-ME4-01T-C-50	Digi International	ME 8MB SDRAM 4MB FLASH 50 PAK Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 4MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存4,480	ARM7TDMI, NS7520	-	55MHz	4MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 85°C
20-101-1138	Digi International	RCM4300 RABBITCORE Module/Board Type: MPU Core Core Processor: Rabbit 4000 Co-Processor: - Speed: 58.98MHz Flash Size: 2MB (Internal), microSD Slot (External) RAM Size: 1.5MB Connector Type: IDC Header 2x25, 2x5, 1xmicroSD Card Size / Dimension: 1.84" x 2.85" (47mm x 72mm) Operating Temperature: -20°C ~ 85°C	封装: -	库存7,188	Rabbit 4000	-	58.98MHz	2MB (Internal), microSD Slot (External)	1.5MB	IDC Header 2x25, 2x5, 1xmicroSD Card	1.84" x 2.85" (47mm x 72mm)	-20°C ~ 85°C
TE0820-02-02EG-1EA	Trenz Electronic GmbH	SOM USCALE+ XCZU2EG-1S 1GB DDR4 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	库存5,712	-	-	-	-	-	-	-	-
DC-ME-01T-TYS	Digi International	MODULE DIGI CONNECT ME Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	库存4,688	-	-	-	-	-	-	-	-
TE0745-02-45-2IA	Trenz Electronic GmbH	SOM ZYNQ 1GB DDR3 Module/Board Type: MCU, FPGA Core Processor: ARM® Cortex®-A9 Co-Processor: Zynq-7000 (Z-7045) Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec UFPS Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存6,816	ARM® Cortex®-A9	Zynq-7000 (Z-7045)	-	32MB	1GB	Samtec UFPS	2.05" x 2.99" (52mm x 76mm)	-40°C ~ 85°C
XPP1004000-02R	Lantronix, Inc.	XPORT PRO ROHS EXTENDED RAM, EXT Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	库存4,784	-	-	-	-	-	-	-	-
XP1001000-05R	Lantronix, Inc.	XPORT ROHS EXTENDED TEMP. -40 TO Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	库存34,728	-	-	-	-	-	-	-	-
TE0803-02-04CG-1EB	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 256MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU4CG-1SFVC784E Co-Processor: - Speed: - Flash Size: 256MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: 0°C ~ 85°C	封装: -	库存6,512	Zynq UltraScale+ XCZU4CG-1SFVC784E	-	-	256MB	2GB	B2B	2.05" x 2.99" (52mm x 76mm)	0°C ~ 85°C
TE0715-04-52I33-A	Trenz Electronic GmbH	IC SOC MODULE 1GB DDR3L Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7015) Speed: 125MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7015)	125MHz	32MB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0823-01-3PIU1F	Trenz Electronic GmbH	ICOBOARD Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I Speed: - Flash Size: 128MB RAM Size: 1GB Connector Type: USB Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	ARM Cortex-A53, ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I	-	128MB	1GB	USB	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0808-05-9GI21-A	Trenz Electronic GmbH	USOM+ MPSOC ZYNQ USCALE FPGA Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU9EG-2FFVC900I Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	Zynq UltraScale+ XCZU9EG-2FFVC900I	-	-	128MB	4GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	-40°C ~ 85°C
DC-VA-H264-8B-30-1080-MXC-ZL	System-On-Chip (SOC) Technologies Inc.	IC MOD ARTIX-7 A200T 256KB 32MB Module/Board Type: FPGA Core Core Processor: Artix-7 A200T Co-Processor: - Speed: - Flash Size: 32MB RAM Size: 256KB Connector Type: SO-DIMM-204 Size / Dimension: 2.700" L x 2.000" W (68.00mm x 51.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote	Artix-7 A200T	-	-	32MB	256KB	SO-DIMM-204	2.700" L x 2.000" W (68.00mm x 51.00mm)	0°C ~ 85°C
TE0720-03-2IFA	Trenz Electronic GmbH	IC SOC MODULE XILINX ZYNQ Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: B2B Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7020)	-	32MB	1GB	B2B	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0745-02-91C31-A	Trenz Electronic GmbH	MOD SOM DDR3L 1GB Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7045) Speed: - Flash Size: 64MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket - 480 Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7045)	-	64MB	1GB	Board-to-Board (BTB) Socket - 480	2.050" L x 2.990" W (52.00mm x 76.00mm)	-40°C ~ 85°C
G650-05369-01	OKdo	CORAL 2GB SOM Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	库存15	-	-	-	-	-	-	-	-
TE0808-04-06EG-1EK	Trenz Electronic GmbH	IC MOD SOM MPSOC Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU6EG-1FFVC900E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote	Zynq UltraScale+ XCZU6EG-1FFVC900E	-	-	128MB	4GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	0°C ~ 85°C
TE0713-03-82C46-A	Trenz Electronic GmbH	IC SOM ARTIX-7 FPGA DDR3 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	Request a Quote	-	-	-	-	-	-	-	-
TE0712-02-72C36-A	Trenz Electronic GmbH	FPGA MODULE ARTIX7 Module/Board Type: FPGA Core Core Processor: Artix-7 A100T Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote	Artix-7 A100T	-	200MHz	32MB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
TE0741-04-B2C-1-A	Trenz Electronic GmbH	IC MOD KINTEX-7 160T 200MHZ 32MB Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	Request a Quote	-	-	-	-	-	-	-	-

CC-MX-PG47-ZM-1

Digi International

MODULE CONNECTCORE

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

库存4,624

-

TE0741-02-070-2IF

Trenz Electronic GmbH

SOM KINTEX-7 70T 32MB FLASH AES

Module/Board Type: FPGA
Core Processor: Kintex-7 70T
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: -
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存7,424

Kintex-7 70T

-

200MHz

32MB

-

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

-40°C ~ 85°C

DC-ME-01T-CLI-1

Digi International

MODULE ME 8MB SDRAM 2MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 2MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存2,848

ARM7TDMI, NS7520

-

55MHz

2MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 85°C

3359-EX-227-RC-X

Critical Link LLC

MITYSOM-3359

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8, AM3359
Co-Processor: NEON SIMD
Speed: 720MHz
Flash Size: 256MB (NAND), 8MB (NOR)
RAM Size: 64KB (Internal), 256MB (External)
Connector Type: SO-DIMM-204
Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存7,280

ARM? Cortex?-A8, AM3359

NEON SIMD

720MHz

256MB (NAND), 8MB (NOR)

64KB (Internal), 256MB (External)

SO-DIMM-204

2.66" x 1.5" (67.6mm x 38.1mm)

0°C ~ 70°C

M5475DFE

NXP

MODULE FIRE ENGINE

Module/Board Type: MPU Core
Core Processor: ColdFire V4e, MCF5475
Co-Processor: -
Speed: 266MHz
Flash Size: 2MB (Boot)
RAM Size: 64MB
Connector Type: -
Size / Dimension: 3.7" x 4.5" (93.4mm x 114.3mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存7,984

ColdFire V4e, MCF5475

-

266MHz

2MB (Boot)

64MB

-

3.7" x 4.5" (93.4mm x 114.3mm)

0°C ~ 70°C

CENGLH79520-10-403HCR

Logic

CARD ENGINE 32MB SDRAM

Module/Board Type: MPU Core
Core Processor: ARM720T, LH79520
Co-Processor: -
Speed: 77.4MHz
Flash Size: 16MB
RAM Size: 32MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存3,136

ARM720T, LH79520

-

77.4MHz

16MB

32MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

0°C ~ 70°C

CENGLH7A404-11-403EI

Logic

CARD ENGINE 32MB SDRAM

Module/Board Type: MPU Core
Core Processor: ARM922T, LH7A404
Co-Processor: -
Speed: 200MHz
Flash Size: 16MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存5,984

ARM922T, LH7A404

-

200MHz

16MB

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

-40°C ~ 85°C

DC-ME-01T-PS-50

Digi International

MOD ME 8MB SDRAM 2MB FLSH 50PCK

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 2MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存3,296

ARM7TDMI, NS7520

-

55MHz

2MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 85°C

DC-ME-Y401-C-B

Digi International

ME 9210 8MB SDRAM 2MB FLASH 50PK

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9210
Co-Processor: -
Speed: 75MHz
Flash Size: 2MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 80°C

封装: -

库存6,544

ARM926EJ-S, NS9210

-

75MHz

2MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 80°C

TE0712-02-35-2I

Trenz Electronic GmbH

SOM ARTIX-7 XC7A35T-2I 1GB DDR3

Module/Board Type: FPGA
Core Processor: Artix-7 A35T
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存5,536

Artix-7 A35T

-

200MHz

32MB

1GB

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

-40°C ~ 85°C

SOMDIMM-RX63N

Future Designs Inc.

DIMM 16MB 10/100 RX63N REV2

Module/Board Type: MCU Core
Core Processor: RX600, RX63N
Co-Processor: -
Speed: 100MHz
Flash Size: 2MB
RAM Size: 128KB
Connector Type: SO-DIMM-200
Size / Dimension: -
Operating Temperature: -

封装: -

库存3,856

RX600, RX63N

-

100MHz

2MB

128KB

SO-DIMM-200

-

DC-ME4-01T-C-50

Digi International

ME 8MB SDRAM 4MB FLASH 50 PAK

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 4MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存4,480

ARM7TDMI, NS7520

-

55MHz

4MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 85°C

20-101-1138

Digi International

RCM4300 RABBITCORE

Module/Board Type: MPU Core
Core Processor: Rabbit 4000
Co-Processor: -
Speed: 58.98MHz
Flash Size: 2MB (Internal), microSD Slot (External)
RAM Size: 1.5MB
Connector Type: IDC Header 2x25, 2x5, 1xmicroSD Card
Size / Dimension: 1.84" x 2.85" (47mm x 72mm)
Operating Temperature: -20°C ~ 85°C

封装: -

库存7,188

Rabbit 4000

-

58.98MHz

2MB (Internal), microSD Slot (External)

1.5MB

IDC Header 2x25, 2x5, 1xmicroSD Card

1.84" x 2.85" (47mm x 72mm)

-20°C ~ 85°C

TE0820-02-02EG-1EA

Trenz Electronic GmbH

SOM USCALE+ XCZU2EG-1S 1GB DDR4

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

库存5,712

-

DC-ME-01T-TYS

Digi International

MODULE DIGI CONNECT ME

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

库存4,688

-

TE0745-02-45-2IA

Trenz Electronic GmbH

SOM ZYNQ 1GB DDR3

Module/Board Type: MCU, FPGA
Core Processor: ARM® Cortex®-A9
Co-Processor: Zynq-7000 (Z-7045)
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec UFPS
Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存6,816

ARM® Cortex®-A9

Zynq-7000 (Z-7045)

-

32MB

1GB

Samtec UFPS

2.05" x 2.99" (52mm x 76mm)

-40°C ~ 85°C

XPP1004000-02R

Lantronix, Inc.

XPORT PRO ROHS EXTENDED RAM, EXT

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

库存4,784

-

XP1001000-05R

Lantronix, Inc.

XPORT ROHS EXTENDED TEMP. -40 TO

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

库存34,728

-

TE0803-02-04CG-1EB

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 256MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU4CG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 256MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
Operating Temperature: 0°C ~ 85°C

封装: -

库存6,512

Zynq UltraScale+ XCZU4CG-1SFVC784E

-

256MB

2GB

B2B

2.05" x 2.99" (52mm x 76mm)

0°C ~ 85°C

TE0715-04-52I33-A

Trenz Electronic GmbH

IC SOC MODULE 1GB DDR3L

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7015)
Speed: 125MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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ARM Cortex-A9

Zynq-7000 (Z-7015)

125MHz

32MB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0823-01-3PIU1F

Trenz Electronic GmbH

ICOBOARD

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I
Speed: -
Flash Size: 128MB
RAM Size: 1GB
Connector Type: USB
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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ARM Cortex-A53, ARM® Cortex®-R5

Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I

-

128MB

1GB

USB

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0808-05-9GI21-A

Trenz Electronic GmbH

USOM+ MPSOC ZYNQ USCALE FPGA

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU9EG-2FFVC900I
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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Zynq UltraScale+ XCZU9EG-2FFVC900I

-

128MB

4GB

B2B

2.050" L x 2.990" W (52.00mm x 76.00mm)

-40°C ~ 85°C

DC-VA-H264-8B-30-1080-MXC-ZL

System-On-Chip (SOC) Technologies Inc.

IC MOD ARTIX-7 A200T 256KB 32MB

Module/Board Type: FPGA Core
Core Processor: Artix-7 A200T
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: 256KB
Connector Type: SO-DIMM-204
Size / Dimension: 2.700" L x 2.000" W (68.00mm x 51.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

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Artix-7 A200T

-

32MB

256KB

SO-DIMM-204

2.700" L x 2.000" W (68.00mm x 51.00mm)

0°C ~ 85°C

TE0720-03-2IFA

Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: B2B
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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ARM Cortex-A9

Zynq-7000 (Z-7020)

-

32MB

1GB

B2B

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0745-02-91C31-A

Trenz Electronic GmbH

MOD SOM DDR3L 1GB

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7045)
Speed: -
Flash Size: 64MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket - 480
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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ARM Cortex-A9

Zynq-7000 (Z-7045)

-

64MB

1GB

Board-to-Board (BTB) Socket - 480

2.050" L x 2.990" W (52.00mm x 76.00mm)

-40°C ~ 85°C

G650-05369-01

OKdo

CORAL 2GB SOM

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

库存15

-

TE0808-04-06EG-1EK

Trenz Electronic GmbH

IC MOD SOM MPSOC

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU6EG-1FFVC900E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

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Zynq UltraScale+ XCZU6EG-1FFVC900E

-

128MB

4GB

B2B

2.050" L x 2.990" W (52.00mm x 76.00mm)

0°C ~ 85°C

TE0713-03-82C46-A

Trenz Electronic GmbH

IC SOM ARTIX-7 FPGA DDR3

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

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-

TE0712-02-72C36-A

Trenz Electronic GmbH

FPGA MODULE ARTIX7

Module/Board Type: FPGA Core
Core Processor: Artix-7 A100T
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

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Artix-7 A100T

-

200MHz

32MB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 85°C

TE0741-04-B2C-1-A

Trenz Electronic GmbH

IC MOD KINTEX-7 160T 200MHZ 32MB

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

Request a Quote

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