页 10 - 嵌入式 - 微控制器，微处理器，FPGA 模块 | 集成电路（IC）

零件编号	制造商	描述	封装	库存	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
CC-9C-V226-Z1-B	Digi International	MODULE 9C 32MB SDRAM 64MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9360 Co-Processor: - Speed: 155MHz Flash Size: 64MB RAM Size: 32MB Connector Type: SO-DIMM-144 Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存5,488	ARM926EJ-S, NS9360	-	155MHz	64MB	32MB	SO-DIMM-144	3.59" x 2.06" (91.2mm x 52.2mm)	-40°C ~ 85°C
CC-9M-QA25-Z1-B	Digi International	MOD 9M 32MB SDRAM 32MB FLASH 25 Module/Board Type: MPU Core Core Processor: ARM920T, SC2443 Co-Processor: - Speed: 400MHz Flash Size: 32MB RAM Size: 32MB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.36" x 1.73" (60mm x 44mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存6,272	ARM920T, SC2443	-	400MHz	32MB	32MB	Board-to-Board (BTB) Socket - 240	2.36" x 1.73" (60mm x 44mm)	0°C ~ 70°C
M5485AFEE-D	Logic	MODULE MCF5485 FIRE ENGINE Module/Board Type: MPU Core Core Processor: ColdFire V4e, MCF5485 Co-Processor: - Speed: 200MHz Flash Size: 2MB (Boot) RAM Size: 64MB Connector Type: - Size / Dimension: 3.7" x 4.5" (95mm x 114mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存6,144	ColdFire V4e, MCF5485	-	200MHz	2MB (Boot)	64MB	-	3.7" x 4.5" (95mm x 114mm)	-40°C ~ 85°C
CENGPXA270-416-10-550HIR	Logic	CARD ENGING 64MB SDRAM Module/Board Type: MCU Core Core Processor: PXA270 Co-Processor: - Speed: 416MHz Flash Size: 64MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存6,912	PXA270	-	416MHz	64MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	-40°C ~ 85°C
SOMLX800-11-000GC	Logic	MODULE SOM LX800 GEODE WO/SODIMM Module/Board Type: MPU Core Core Processor: Geode, LX 800 Co-Processor: - Speed: 500MHz Flash Size: - RAM Size: - Connector Type: - Size / Dimension: 3.78" x 4.53" (96mm x 115mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存5,808	Geode, LX 800	-	500MHz	-	-	-	3.78" x 4.53" (96mm x 115mm)	0°C ~ 70°C
CENGLH7A404-11-402EC	Logic	CARD ENGINE 32MB SDRAM Module/Board Type: MPU Core Core Processor: ARM922T, LH7A404 Co-Processor: - Speed: 200MHz Flash Size: 16MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存4,768	ARM922T, LH7A404	-	200MHz	16MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
CC-7U-Z113-Z1-B	Digi International	UMOD CONNECTCORE 7U 16MB SDRAM Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 8MB RAM Size: 16MB Connector Type: 48-DIP Size / Dimension: 2.48" x 0.73" (62.9mm x 18.5mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存2,272	ARM7TDMI, NS7520	-	55MHz	8MB	16MB	48-DIP	2.48" x 0.73" (62.9mm x 18.5mm)	0°C ~ 70°C
TE0630-01IBF	Trenz Electronic GmbH	SOM SPARTAN-6 1GB DDR3 Module/Board Type: FPGA, USB Core Core Processor: Spartan-6 LX-75 Co-Processor: Cypress EZ-USB FX2LP Speed: 100MHz Flash Size: 8MB RAM Size: 128MB Connector Type: B2B Size / Dimension: 1.6" x 1.9" (40.5mm x 47.5mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存4,784	Spartan-6 LX-75	Cypress EZ-USB FX2LP	100MHz	8MB	128MB	B2B	1.6" x 1.9" (40.5mm x 47.5mm)	-40°C ~ 85°C
1808-FG-225-RC	Critical Link LLC	MITYSOM-1808F SOM AM1808 Module/Board Type: MPU, FPGA Core Core Processor: ARM926EJ-S, AM1808 Co-Processor: Spartan-6, XC6SLX16 Speed: 456MHz Flash Size: 256MB (NAND), 8MB (NOR) RAM Size: 8KB (Internal), 128MB (External) Connector Type: SO-DIMM-200 Size / Dimension: 2.66" x 2" (67.6mm x 50.8mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存6,752	ARM926EJ-S, AM1808	Spartan-6, XC6SLX16	456MHz	256MB (NAND), 8MB (NOR)	8KB (Internal), 128MB (External)	SO-DIMM-200	2.66" x 2" (67.6mm x 50.8mm)	0°C ~ 70°C
TE0720-03-1CR	Trenz Electronic GmbH	SOM SOC 7Z020-1CLG484C 256MB DDR Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存7,072	ARM Cortex-A9	Zynq-7000 (Z-7020)	-	32MB	1GB	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	0°C ~ 70°C
20-101-1112	Digi International	MODULE RABBITCORE RCM4010 Module/Board Type: MPU Core Core Processor: Rabbit 4000 Co-Processor: - Speed: 58.98MHz Flash Size: 512KB RAM Size: 512KB Connector Type: IDC Header 2x25, 2x5 Size / Dimension: 1.84" x 2.42" (47mm x 61mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存5,936	Rabbit 4000	-	58.98MHz	512KB	512KB	IDC Header 2x25, 2x5	1.84" x 2.42" (47mm x 61mm)	0°C ~ 70°C
CC-9C-V212-Z6	Digi International	MODULE 9C 16MB SDRAM 4MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9360 Co-Processor: - Speed: 155MHz Flash Size: 4MB RAM Size: 16MB Connector Type: SO-DIMM-144 Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存3,872	ARM926EJ-S, NS9360	-	155MHz	4MB	16MB	SO-DIMM-144	3.59" x 2.06" (91.2mm x 52.2mm)	-40°C ~ 85°C
20-101-1131	Digi International	MODULE RCM4200 RABBITCORE Module/Board Type: MPU Core Core Processor: Rabbit 4000 Co-Processor: - Speed: 58.98MHz Flash Size: 512KB (Internal), 8MB (External) RAM Size: 1MB Connector Type: IDC Header 2x25, 2x5 Size / Dimension: 1.84" x 2.42" (47mm x 61mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存6,688	Rabbit 4000	-	58.98MHz	512KB (Internal), 8MB (External)	1MB	IDC Header 2x25, 2x5	1.84" x 2.42" (47mm x 61mm)	-40°C ~ 85°C
20-101-1132	Digi International	MODULE RCM4210 RABBITCORE Module/Board Type: MPU Core Core Processor: Rabbit 4000 Co-Processor: - Speed: 29.49MHz Flash Size: 512KB (Internal), 4MB (External) RAM Size: 512KB Connector Type: IDC Header 2x25, 2x5 Size / Dimension: 1.84" x 2.42" (47mm x 61mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存7,744	Rabbit 4000	-	29.49MHz	512KB (Internal), 4MB (External)	512KB	IDC Header 2x25, 2x5	1.84" x 2.42" (47mm x 61mm)	-40°C ~ 85°C
OSD3358-512M-BAS	Octavo Systems LLC	IC SIP BASED ON TI AM3358 400BGA Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, AM3358 Co-Processor: - Speed: 1GHz Flash Size: - RAM Size: 512MB Connector Type: 400-BGA Size / Dimension: 1.06" x 1.06" (27.0mm x 27.0mm) Operating Temperature: 0°C ~ 85°C	封装: -	库存7,776	ARM? Cortex?-A8, AM3358	-	1GHz	-	512MB	400-BGA	1.06" x 1.06" (27.0mm x 27.0mm)	0°C ~ 85°C
TE0820-02-03EG-1EA	Trenz Electronic GmbH	SOM USCALE+ XCZU3EG-1S 1GB DDR4 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	库存5,360	-	-	-	-	-	-	-	-
SOMAM1808-10-1503QHCR	Logic	AM1808 SOM-M1 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	库存6,120	-	-	-	-	-	-	-	-
CC-MX-JN7A-Z1	Digi International	CONNECTCORE I.MX6UL SOM Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A7 Co-Processor: NEON™ MPE Speed: 528MHz Flash Size: 1GB RAM Size: 1GB Connector Type: - Size / Dimension: 1.14" x 1.14" (29mm x 29mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存6,640	ARM® Cortex®-A7	NEON™ MPE	528MHz	1GB	1GB	-	1.14" x 1.14" (29mm x 29mm)	-40°C ~ 85°C
TE0745-02-81C11-A	Trenz Electronic GmbH	SOM MIT XILINX ZYNQ Module/Board Type: MCU, FPGA Core Processor: ARM® Cortex®-A9 Co-Processor: Zynq-7000 (Z-7035) Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec ST5 Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存4,192	ARM® Cortex®-A9	Zynq-7000 (Z-7035)	-	32MB	1GB	Samtec ST5	2.05" x 2.99" (52mm x 76mm)	-40°C ~ 85°C
TE0813-01-3AE11-A	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU3CG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote	Zynq UltraScale+ XCZU3CG-1SFVC784E	-	-	128MB	2GB	Board-to-Board (BTB) Socket - 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
AM0010-02-5DE21MA	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq™ UltraScale+™ ZU5EV-1E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 2.220" L x 1.575" W (56.40mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote	Zynq™ UltraScale+™ ZU5EV-1E	-	-	128MB	4GB	Board-to-Board (BTB) Socket	2.220" L x 1.575" W (56.40mm x 40.00mm)	0°C ~ 85°C
A20-SOM204-1G-M	Olimex LTD	IC Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A7 Co-Processor: - Speed: 1GHz Flash Size: 16MB RAM Size: 1GB Connector Type: 204 Pin Size / Dimension: 3.307" L x 2.638" W (84.00mm x 67.00mm) Operating Temperature: 0°C ~ 70°C	封装: -	Request a Quote	ARM® Cortex®-A7	-	1GHz	16MB	1GB	204 Pin	3.307" L x 2.638" W (84.00mm x 67.00mm)	0°C ~ 70°C
TE0720-03-31C33MA	Trenz Electronic GmbH	IC SOC MODULE XILINX ZYNQ Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7014S) Speed: 766MHz Flash Size: 8GB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C	封装: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7014S)	766MHz	8GB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 70°C
SM-K26-XCL2GC	AMD	IC MOD SOM K26C ZYNQ MPSOC Module/Board Type: FPGA Core Core Processor: ARM® Cortex®-A53 Co-Processor: Arm® Cortex®-R5F Speed: 533MHz, 1.333GHz Flash Size: 16GB eMMC, 64MB QSPI RAM Size: 4GB Connector Type: 2 x 240 Pin Size / Dimension: 3.030" L x 2.360" W (77.00mm x 60.00mm) Operating Temperature: 0°C ~ 85°C (TJ)	封装: -	库存405	ARM® Cortex®-A53	Arm® Cortex®-R5F	533MHz, 1.333GHz	16GB eMMC, 64MB QSPI	4GB	2 x 240 Pin	3.030" L x 2.360" W (77.00mm x 60.00mm)	0°C ~ 85°C (TJ)
TE0745-03-82I31-A	Trenz Electronic GmbH	SOM WITH AMD ZYNQ 7035-2I, 1 GBY Module/Board Type: MPU Core Core Processor: ARM Cortex-A9 Co-Processor: Xilinx Zynq 7035 SoC XC7Z035-2FBG676I Speed: - Flash Size: 64MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket - 250 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	ARM Cortex-A9	Xilinx Zynq 7035 SoC XC7Z035-2FBG676I	-	64MB	1GB	Board-to-Board (BTB) Socket - 250	2.990" L x 2.050" W (76.00mm x 52.00mm)	-40°C ~ 85°C
L138-DG-325-RI	Critical Link LLC	MITYDSP-L138F SOM W/ OMAP-L138 Module/Board Type: MPU, DSP, FPGA Core Core Processor: ARM926EJ-S, OMAP-L138 Co-Processor: TMS320C674x (DSP), Spartan-6, XC6SLX16 (FPGA) Speed: 375MHz Flash Size: 256MB (NAND), 16MB (NOR) RAM Size: 128MB Connector Type: SO-DIMM-200 Size / Dimension: 2.660" L x 2.000" W (67.60mm x 50.80mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	ARM926EJ-S, OMAP-L138	TMS320C674x (DSP), Spartan-6, XC6SLX16 (FPGA)	375MHz	256MB (NAND), 16MB (NOR)	128MB	SO-DIMM-200	2.660" L x 2.000" W (67.60mm x 50.80mm)	-40°C ~ 85°C
TE0712-02-71I36-A	Trenz Electronic GmbH	FPGA MODULE ARTIX7 Module/Board Type: FPGA Core Core Processor: Artix-7 A100T Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	Artix-7 A100T	-	200MHz	32MB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0630-03-82I12-A	Trenz Electronic GmbH	FPGA MODULE WITH AMD SPARTAN 6 L Module/Board Type: FPGA Core Processor: Xilinx Spartan™ 6 XC6SLX150-2CSG484I Co-Processor: - Speed: - Flash Size: 8MB RAM Size: 128MB Connector Type: Board-to-Board (BTB) Socket - 80 Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	Xilinx Spartan™ 6 XC6SLX150-2CSG484I	-	-	8MB	128MB	Board-to-Board (BTB) Socket - 80	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0600-04-72C11-A	Trenz Electronic GmbH	IC MODULE GIGABEE Module/Board Type: FPGA Core Processor: Xilinx Spartan™ 6 XC6SLX100-2FGG484C Co-Processor: - Speed: 125MHz Flash Size: 16MB RAM Size: 128MB Connector Type: B2B Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C	封装: -	Request a Quote	Xilinx Spartan™ 6 XC6SLX100-2FGG484C	-	125MHz	16MB	128MB	B2B	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 70°C
MCV-X2DB	ARIES Embedded	SoM CycloneV SoC-FPGA Module/Board Type: FPGA Core Processor: ARM Cortex-A9 (Dual Core) Co-Processor: - Speed: 800MHz Flash Size: 4GB RAM Size: 1GB Connector Type: 360 Pin Size / Dimension: 2.910" L x 1.650" W (74.00mm x 42.00mm) Operating Temperature: 0°C ~ 70°C	封装: -	Request a Quote	ARM Cortex-A9 (Dual Core)	-	800MHz	4GB	1GB	360 Pin	2.910" L x 1.650" W (74.00mm x 42.00mm)	0°C ~ 70°C

CC-9C-V226-Z1-B

Digi International

MODULE 9C 32MB SDRAM 64MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9360
Co-Processor: -
Speed: 155MHz
Flash Size: 64MB
RAM Size: 32MB
Connector Type: SO-DIMM-144
Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存5,488

ARM926EJ-S, NS9360

-

155MHz

64MB

32MB

SO-DIMM-144

3.59" x 2.06" (91.2mm x 52.2mm)

-40°C ~ 85°C

CC-9M-QA25-Z1-B

Digi International

MOD 9M 32MB SDRAM 32MB FLASH 25

Module/Board Type: MPU Core
Core Processor: ARM920T, SC2443
Co-Processor: -
Speed: 400MHz
Flash Size: 32MB
RAM Size: 32MB
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.36" x 1.73" (60mm x 44mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存6,272

ARM920T, SC2443

-

400MHz

32MB

Board-to-Board (BTB) Socket - 240

2.36" x 1.73" (60mm x 44mm)

0°C ~ 70°C

M5485AFEE-D

Logic

MODULE MCF5485 FIRE ENGINE

Module/Board Type: MPU Core
Core Processor: ColdFire V4e, MCF5485
Co-Processor: -
Speed: 200MHz
Flash Size: 2MB (Boot)
RAM Size: 64MB
Connector Type: -
Size / Dimension: 3.7" x 4.5" (95mm x 114mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存6,144

ColdFire V4e, MCF5485

-

200MHz

2MB (Boot)

64MB

-

3.7" x 4.5" (95mm x 114mm)

-40°C ~ 85°C

CENGPXA270-416-10-550HIR

Logic

CARD ENGING 64MB SDRAM

Module/Board Type: MCU Core
Core Processor: PXA270
Co-Processor: -
Speed: 416MHz
Flash Size: 64MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存6,912

PXA270

-

416MHz

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

-40°C ~ 85°C

SOMLX800-11-000GC

Logic

MODULE SOM LX800 GEODE WO/SODIMM

Module/Board Type: MPU Core
Core Processor: Geode, LX 800
Co-Processor: -
Speed: 500MHz
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: 3.78" x 4.53" (96mm x 115mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存5,808

Geode, LX 800

-

500MHz

-

3.78" x 4.53" (96mm x 115mm)

0°C ~ 70°C

CENGLH7A404-11-402EC

Logic

CARD ENGINE 32MB SDRAM

Module/Board Type: MPU Core
Core Processor: ARM922T, LH7A404
Co-Processor: -
Speed: 200MHz
Flash Size: 16MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存4,768

ARM922T, LH7A404

-

200MHz

16MB

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

0°C ~ 70°C

CC-7U-Z113-Z1-B

Digi International

UMOD CONNECTCORE 7U 16MB SDRAM

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 8MB
RAM Size: 16MB
Connector Type: 48-DIP
Size / Dimension: 2.48" x 0.73" (62.9mm x 18.5mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存2,272

ARM7TDMI, NS7520

-

55MHz

8MB

16MB

48-DIP

2.48" x 0.73" (62.9mm x 18.5mm)

0°C ~ 70°C

TE0630-01IBF

Trenz Electronic GmbH

SOM SPARTAN-6 1GB DDR3

Module/Board Type: FPGA, USB Core
Core Processor: Spartan-6 LX-75
Co-Processor: Cypress EZ-USB FX2LP
Speed: 100MHz
Flash Size: 8MB
RAM Size: 128MB
Connector Type: B2B
Size / Dimension: 1.6" x 1.9" (40.5mm x 47.5mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存4,784

Spartan-6 LX-75

Cypress EZ-USB FX2LP

100MHz

8MB

128MB

B2B

1.6" x 1.9" (40.5mm x 47.5mm)

-40°C ~ 85°C

1808-FG-225-RC

Critical Link LLC

MITYSOM-1808F SOM AM1808

Module/Board Type: MPU, FPGA Core
Core Processor: ARM926EJ-S, AM1808
Co-Processor: Spartan-6, XC6SLX16
Speed: 456MHz
Flash Size: 256MB (NAND), 8MB (NOR)
RAM Size: 8KB (Internal), 128MB (External)
Connector Type: SO-DIMM-200
Size / Dimension: 2.66" x 2" (67.6mm x 50.8mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存6,752

ARM926EJ-S, AM1808

Spartan-6, XC6SLX16

456MHz

256MB (NAND), 8MB (NOR)

8KB (Internal), 128MB (External)

SO-DIMM-200

2.66" x 2" (67.6mm x 50.8mm)

0°C ~ 70°C

TE0720-03-1CR

Trenz Electronic GmbH

SOM SOC 7Z020-1CLG484C 256MB DDR

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存7,072

ARM Cortex-A9

Zynq-7000 (Z-7020)

-

32MB

1GB

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

0°C ~ 70°C

20-101-1112

Digi International

MODULE RABBITCORE RCM4010

Module/Board Type: MPU Core
Core Processor: Rabbit 4000
Co-Processor: -
Speed: 58.98MHz
Flash Size: 512KB
RAM Size: 512KB
Connector Type: IDC Header 2x25, 2x5
Size / Dimension: 1.84" x 2.42" (47mm x 61mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存5,936

Rabbit 4000

-

58.98MHz

512KB

IDC Header 2x25, 2x5

1.84" x 2.42" (47mm x 61mm)

0°C ~ 70°C

CC-9C-V212-Z6

Digi International

MODULE 9C 16MB SDRAM 4MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9360
Co-Processor: -
Speed: 155MHz
Flash Size: 4MB
RAM Size: 16MB
Connector Type: SO-DIMM-144
Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存3,872

ARM926EJ-S, NS9360

-

155MHz

4MB

16MB

SO-DIMM-144

3.59" x 2.06" (91.2mm x 52.2mm)

-40°C ~ 85°C

20-101-1131

Digi International

MODULE RCM4200 RABBITCORE

Module/Board Type: MPU Core
Core Processor: Rabbit 4000
Co-Processor: -
Speed: 58.98MHz
Flash Size: 512KB (Internal), 8MB (External)
RAM Size: 1MB
Connector Type: IDC Header 2x25, 2x5
Size / Dimension: 1.84" x 2.42" (47mm x 61mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存6,688

Rabbit 4000

-

58.98MHz

512KB (Internal), 8MB (External)

1MB

IDC Header 2x25, 2x5

1.84" x 2.42" (47mm x 61mm)

-40°C ~ 85°C

20-101-1132

Digi International

MODULE RCM4210 RABBITCORE

Module/Board Type: MPU Core
Core Processor: Rabbit 4000
Co-Processor: -
Speed: 29.49MHz
Flash Size: 512KB (Internal), 4MB (External)
RAM Size: 512KB
Connector Type: IDC Header 2x25, 2x5
Size / Dimension: 1.84" x 2.42" (47mm x 61mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存7,744

Rabbit 4000

-

29.49MHz

512KB (Internal), 4MB (External)

512KB

IDC Header 2x25, 2x5

1.84" x 2.42" (47mm x 61mm)

-40°C ~ 85°C

OSD3358-512M-BAS

Octavo Systems LLC

IC SIP BASED ON TI AM3358 400BGA

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8, AM3358
Co-Processor: -
Speed: 1GHz
Flash Size: -
RAM Size: 512MB
Connector Type: 400-BGA
Size / Dimension: 1.06" x 1.06" (27.0mm x 27.0mm)
Operating Temperature: 0°C ~ 85°C

封装: -

库存7,776

ARM? Cortex?-A8, AM3358

-

1GHz

-

512MB

400-BGA

1.06" x 1.06" (27.0mm x 27.0mm)

0°C ~ 85°C

TE0820-02-03EG-1EA

Trenz Electronic GmbH

SOM USCALE+ XCZU3EG-1S 1GB DDR4

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

库存5,360

-

SOMAM1808-10-1503QHCR

Logic

AM1808 SOM-M1

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

库存6,120

-

CC-MX-JN7A-Z1

Digi International

CONNECTCORE I.MX6UL SOM

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A7
Co-Processor: NEON™ MPE
Speed: 528MHz
Flash Size: 1GB
RAM Size: 1GB
Connector Type: -
Size / Dimension: 1.14" x 1.14" (29mm x 29mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存6,640

ARM® Cortex®-A7

NEON™ MPE

528MHz

1GB

-

1.14" x 1.14" (29mm x 29mm)

-40°C ~ 85°C

TE0745-02-81C11-A

Trenz Electronic GmbH

SOM MIT XILINX ZYNQ

Module/Board Type: MCU, FPGA
Core Processor: ARM® Cortex®-A9
Co-Processor: Zynq-7000 (Z-7035)
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec ST5
Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存4,192

ARM® Cortex®-A9

Zynq-7000 (Z-7035)

-

32MB

1GB

Samtec ST5

2.05" x 2.99" (52mm x 76mm)

-40°C ~ 85°C

TE0813-01-3AE11-A

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU3CG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

Request a Quote

Zynq UltraScale+ XCZU3CG-1SFVC784E

-

128MB

2GB

Board-to-Board (BTB) Socket - 240

2.990" L x 2.050" W (76.00mm x 52.00mm)

0°C ~ 85°C

AM0010-02-5DE21MA

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ ZU5EV-1E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 2.220" L x 1.575" W (56.40mm x 40.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

Request a Quote

Zynq™ UltraScale+™ ZU5EV-1E

-

128MB

4GB

Board-to-Board (BTB) Socket

2.220" L x 1.575" W (56.40mm x 40.00mm)

0°C ~ 85°C

A20-SOM204-1G-M

Olimex LTD

IC

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A7
Co-Processor: -
Speed: 1GHz
Flash Size: 16MB
RAM Size: 1GB
Connector Type: 204 Pin
Size / Dimension: 3.307" L x 2.638" W (84.00mm x 67.00mm)
Operating Temperature: 0°C ~ 70°C

封装: -

Request a Quote

ARM® Cortex®-A7

-

1GHz

16MB

1GB

204 Pin

3.307" L x 2.638" W (84.00mm x 67.00mm)

0°C ~ 70°C

TE0720-03-31C33MA

Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7014S)
Speed: 766MHz
Flash Size: 8GB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C

封装: -

Request a Quote

ARM Cortex-A9

Zynq-7000 (Z-7014S)

766MHz

8GB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 70°C

SM-K26-XCL2GC

AMD

IC MOD SOM K26C ZYNQ MPSOC

Module/Board Type: FPGA Core
Core Processor: ARM® Cortex®-A53
Co-Processor: Arm® Cortex®-R5F
Speed: 533MHz, 1.333GHz
Flash Size: 16GB eMMC, 64MB QSPI
RAM Size: 4GB
Connector Type: 2 x 240 Pin
Size / Dimension: 3.030" L x 2.360" W (77.00mm x 60.00mm)
Operating Temperature: 0°C ~ 85°C (TJ)

封装: -

库存405

ARM® Cortex®-A53

Arm® Cortex®-R5F

533MHz, 1.333GHz

16GB eMMC, 64MB QSPI

4GB

2 x 240 Pin

3.030" L x 2.360" W (77.00mm x 60.00mm)

0°C ~ 85°C (TJ)

TE0745-03-82I31-A

Trenz Electronic GmbH

SOM WITH AMD ZYNQ 7035-2I, 1 GBY

Module/Board Type: MPU Core
Core Processor: ARM Cortex-A9
Co-Processor: Xilinx Zynq 7035 SoC XC7Z035-2FBG676I
Speed: -
Flash Size: 64MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket - 250
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

Request a Quote

ARM Cortex-A9

Xilinx Zynq 7035 SoC XC7Z035-2FBG676I

-

64MB

1GB

Board-to-Board (BTB) Socket - 250

2.990" L x 2.050" W (76.00mm x 52.00mm)

-40°C ~ 85°C

L138-DG-325-RI

Critical Link LLC

MITYDSP-L138F SOM W/ OMAP-L138

Module/Board Type: MPU, DSP, FPGA Core
Core Processor: ARM926EJ-S, OMAP-L138
Co-Processor: TMS320C674x (DSP), Spartan-6, XC6SLX16 (FPGA)
Speed: 375MHz
Flash Size: 256MB (NAND), 16MB (NOR)
RAM Size: 128MB
Connector Type: SO-DIMM-200
Size / Dimension: 2.660" L x 2.000" W (67.60mm x 50.80mm)
Operating Temperature: -40°C ~ 85°C

封装: -

Request a Quote

ARM926EJ-S, OMAP-L138

TMS320C674x (DSP), Spartan-6, XC6SLX16 (FPGA)

375MHz

256MB (NAND), 16MB (NOR)

128MB

SO-DIMM-200

2.660" L x 2.000" W (67.60mm x 50.80mm)

-40°C ~ 85°C

TE0712-02-71I36-A

Trenz Electronic GmbH

FPGA MODULE ARTIX7

Module/Board Type: FPGA Core
Core Processor: Artix-7 A100T
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

Request a Quote

Artix-7 A100T

-

200MHz

32MB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0630-03-82I12-A

Trenz Electronic GmbH

FPGA MODULE WITH AMD SPARTAN 6 L

Module/Board Type: FPGA
Core Processor: Xilinx Spartan™ 6 XC6SLX150-2CSG484I
Co-Processor: -
Speed: -
Flash Size: 8MB
RAM Size: 128MB
Connector Type: Board-to-Board (BTB) Socket - 80
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

Request a Quote

Xilinx Spartan™ 6 XC6SLX150-2CSG484I

-

8MB

128MB

Board-to-Board (BTB) Socket - 80

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0600-04-72C11-A

Trenz Electronic GmbH

IC MODULE GIGABEE

Module/Board Type: FPGA
Core Processor: Xilinx Spartan™ 6 XC6SLX100-2FGG484C
Co-Processor: -
Speed: 125MHz
Flash Size: 16MB
RAM Size: 128MB
Connector Type: B2B
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C

封装: -

Request a Quote

Xilinx Spartan™ 6 XC6SLX100-2FGG484C

-

125MHz

16MB

128MB

B2B

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 70°C

MCV-X2DB

ARIES Embedded

SoM CycloneV SoC-FPGA

Module/Board Type: FPGA
Core Processor: ARM Cortex-A9 (Dual Core)
Co-Processor: -
Speed: 800MHz
Flash Size: 4GB
RAM Size: 1GB
Connector Type: 360 Pin
Size / Dimension: 2.910" L x 1.650" W (74.00mm x 42.00mm)
Operating Temperature: 0°C ~ 70°C

封装: -

Request a Quote

ARM Cortex-A9 (Dual Core)

-

800MHz

4GB

1GB

360 Pin

2.910" L x 1.650" W (74.00mm x 42.00mm)

0°C ~ 70°C