页 94 - Preci-Dip 产品 - 用于 IC 的插座，晶体管

518-77-652M35-001106

Preci-Dip

CONN SOCKET PGA 652POS GOLD

Type: PGA
Number of Positions or Pins (Grid): 652 (35 x 35)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

封装: -

库存5,112

652 (35 x 35)

0.050" (1.27mm)

Gold

Flash

Beryllium Copper

Surface Mount

Open Frame

Solder

0.050" (1.27mm)

Gold

Flash

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

518-77-652M35-001105

Preci-Dip

CONN SOCKET PGA 652POS GOLD

Type: PGA
Number of Positions or Pins (Grid): 652 (35 x 35)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

封装: -

库存2,430

652 (35 x 35)

0.050" (1.27mm)

Gold

Flash

Beryllium Copper

Through Hole

Open Frame

Solder

0.050" (1.27mm)

Gold

Flash

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

558-10-652M35-001104

Preci-Dip

BGA SURFACE MOUNT 1.27MM

Type: BGA
Number of Positions or Pins (Grid): 652 (35 x 35)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Brass
Mounting Type: Surface Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

封装: -

库存2,952

652 (35 x 35)

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

Surface Mount

Closed Frame

Solder

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

558-10-652M35-001101

Preci-Dip

PGA SOLDER TAIL 1.27MM

Type: PGA
Number of Positions or Pins (Grid): 652 (35 x 35)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

封装: -

库存7,830

652 (35 x 35)

0.050" (1.27mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

518-77-600M35-001106

Preci-Dip

CONN SOCKET PGA 600POS GOLD

Type: PGA
Number of Positions or Pins (Grid): 600 (35 x 35)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

封装: -

库存2,682

600 (35 x 35)

0.050" (1.27mm)

Gold

Flash

Beryllium Copper

Surface Mount

Open Frame

Solder

0.050" (1.27mm)

Gold

Flash

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

518-77-600M35-001105

Preci-Dip

CONN SOCKET PGA 600POS GOLD

Type: PGA
Number of Positions or Pins (Grid): 600 (35 x 35)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

封装: -

库存8,568

600 (35 x 35)

0.050" (1.27mm)

Gold

Flash

Beryllium Copper

Through Hole

Open Frame

Solder

0.050" (1.27mm)

Gold

Flash

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

558-10-600M35-001104

Preci-Dip

BGA SURFACE MOUNT 1.27MM

Type: BGA
Number of Positions or Pins (Grid): 600 (35 x 35)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Brass
Mounting Type: Surface Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

封装: -

库存3,564

600 (35 x 35)

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

Surface Mount

Closed Frame

Solder

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

518-77-576M30-001106

Preci-Dip

CONN SOCKET PGA 576POS GOLD

Type: PGA
Number of Positions or Pins (Grid): 576 (30 x 30)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

封装: -

库存3,096

576 (30 x 30)

0.050" (1.27mm)

Gold

Flash

Beryllium Copper

Surface Mount

Open Frame

Solder

0.050" (1.27mm)

Gold

Flash

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

550-10-652M35-001152

Preci-Dip

BGA SOLDER TAIL

Type: BGA
Number of Positions or Pins (Grid): 652 (35 x 35)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Brass
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

封装: -

库存3,436

652 (35 x 35)

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

518-77-576M30-001105

Preci-Dip

CONN SOCKET PGA 576POS GOLD

Type: PGA
Number of Positions or Pins (Grid): 576 (30 x 30)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

封装: -

库存3,960

576 (30 x 30)

0.050" (1.27mm)

Gold

Flash

Beryllium Copper

Through Hole

Open Frame

Solder

0.050" (1.27mm)

Gold

Flash

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

558-10-576M30-001104

Preci-Dip

BGA SURFACE MOUNT 1.27MM

Type: BGA
Number of Positions or Pins (Grid): 576 (30 x 30)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Brass
Mounting Type: Surface Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

封装: -

库存3,168

576 (30 x 30)

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

Surface Mount

Closed Frame

Solder

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

518-77-560M33-001106

Preci-Dip

CONN SOCKET PGA 560POS GOLD

Type: PGA
Number of Positions or Pins (Grid): 560 (33 x 33)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

封装: -

库存5,346

560 (33 x 33)

0.050" (1.27mm)

Gold

Flash

Beryllium Copper

Surface Mount

Open Frame

Solder

0.050" (1.27mm)

Gold

Flash

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

558-10-600M35-001101

Preci-Dip

PGA SOLDER TAIL 1.27MM

Type: PGA
Number of Positions or Pins (Grid): 600 (35 x 35)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

封装: -

库存8,910

600 (35 x 35)

0.050" (1.27mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

518-77-560M33-001105

Preci-Dip

CONN SOCKET PGA 560POS GOLD

Type: PGA
Number of Positions or Pins (Grid): 560 (33 x 33)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

封装: -

库存3,636

560 (33 x 33)

0.050" (1.27mm)

Gold

Flash

Beryllium Copper

Through Hole

Open Frame

Solder

0.050" (1.27mm)

Gold

Flash

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

558-10-560M33-001104

Preci-Dip

BGA SURFACE MOUNT 1.27MM

Type: BGA
Number of Positions or Pins (Grid): 560 (33 x 33)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Brass
Mounting Type: Surface Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

封装: -

库存2,394

560 (33 x 33)

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

Surface Mount

Closed Frame

Solder

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

558-10-500M30-001104

Preci-Dip

BGA SURFACE MOUNT 1.27MM

Type: BGA
Number of Positions or Pins (Grid): 500 (30 x 30)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Brass
Mounting Type: Surface Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

封装: -

库存4,050

500 (30 x 30)

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

Surface Mount

Closed Frame

Solder

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

514-83-652M35-001148

Preci-Dip

CONN SOCKET BGA 652POS GOLD

Type: BGA
Number of Positions or Pins (Grid): 652 (35 x 35)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封装: -

库存5,004

652 (35 x 35)

0.100" (2.54mm)

Gold

29.5µin (0.75µm)

Beryllium Copper

Surface Mount

Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

550-10-560M33-001152

Preci-Dip

BGA SOLDER TAIL

Type: BGA
Number of Positions or Pins (Grid): 560 (33 x 33)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Brass
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

封装: -

库存7,956

560 (33 x 33)

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

558-10-576M30-001101

Preci-Dip

PGA SOLDER TAIL 1.27MM

Type: PGA
Number of Positions or Pins (Grid): 576 (30 x 30)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

封装: -

库存4,140

576 (30 x 30)

0.050" (1.27mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

518-77-480M29-001106

Preci-Dip

CONN SOCKET PGA 480POS GOLD

Type: PGA
Number of Positions or Pins (Grid): 480 (29 x 29)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

封装: -

库存3,204

480 (29 x 29)

0.050" (1.27mm)

Gold

Flash

Beryllium Copper

Surface Mount

Open Frame

Solder

0.050" (1.27mm)

Gold

Flash

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

558-10-520M31-001101

Preci-Dip

PGA SOLDER TAIL 1.27MM

Type: PGA
Number of Positions or Pins (Grid): 520 (31 x 31)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

封装: -

库存3,888

520 (31 x 31)

0.050" (1.27mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

518-77-478M26-131106

Preci-Dip

CONN SOCKET PGA 478POS GOLD

Type: PGA
Number of Positions or Pins (Grid): 478 (26 x 26)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

封装: -

库存2,556

478 (26 x 26)

0.050" (1.27mm)

Gold

Flash

Beryllium Copper

Surface Mount

Open Frame

Solder

0.050" (1.27mm)

Gold

Flash

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

550-10-600M35-001152

Preci-Dip

BGA SOLDER TAIL

Type: BGA
Number of Positions or Pins (Grid): 600 (35 x 35)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Brass
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

封装: -

库存2,250

600 (35 x 35)

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

518-77-520M31-001106

Preci-Dip

CONN SOCKET PGA 520POS GOLD

Type: PGA
Number of Positions or Pins (Grid): 520 (31 x 31)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

封装: -

库存7,596

520 (31 x 31)

0.050" (1.27mm)

Gold

Flash

Beryllium Copper

Surface Mount

Open Frame

Solder

0.050" (1.27mm)

Gold

Flash

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

518-77-480M29-001105

Preci-Dip

CONN SOCKET PGA 480POS GOLD

Type: PGA
Number of Positions or Pins (Grid): 480 (29 x 29)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

封装: -

库存7,794

480 (29 x 29)

0.050" (1.27mm)

Gold

Flash

Beryllium Copper

Through Hole

Open Frame

Solder

0.050" (1.27mm)

Gold

Flash

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

558-10-480M29-001104

Preci-Dip

BGA SURFACE MOUNT 1.27MM

Type: BGA
Number of Positions or Pins (Grid): 480 (29 x 29)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Brass
Mounting Type: Surface Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

封装: -

库存3,400

480 (29 x 29)

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

Surface Mount

Closed Frame

Solder

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

518-77-478M26-131105

Preci-Dip

CONN SOCKET PGA 478POS GOLD

Type: PGA
Number of Positions or Pins (Grid): 478 (26 x 26)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

封装: -

库存3,762

478 (26 x 26)

0.050" (1.27mm)

Gold

Flash

Beryllium Copper

Through Hole

Open Frame

Solder

0.050" (1.27mm)

Gold

Flash

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

558-10-478M26-131104

Preci-Dip

BGA SURFACE MOUNT 1.27MM

Type: BGA
Number of Positions or Pins (Grid): 478 (26 x 26)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Brass
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

封装: -

库存3,562

478 (26 x 26)

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

Surface Mount

Open Frame

Solder

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

558-10-560M33-001101

Preci-Dip

PGA SOLDER TAIL 1.27MM

Type: PGA
Number of Positions or Pins (Grid): 560 (33 x 33)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

封装: -

库存2,736

560 (33 x 33)

0.050" (1.27mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

558-10-504M29-001101

Preci-Dip

PGA SOLDER TAIL 1.27MM

Type: PGA
Number of Positions or Pins (Grid): 504 (29 x 29)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

封装: -

库存6,390

504 (29 x 29)

0.050" (1.27mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

FR4 Epoxy Glass

-55°C ~ 125°C