NXP 产品

MMRF1308HSR5

NXP

FET RF 2CH 133V 230MHZ

• Transistor Type: LDMOS (Dual)
• Frequency: 230MHz
• Gain: 25dB
• Voltage - Test: 50V
• Current Rating: -
• Noise Figure: -
• Current - Test: 100mA
• Power - Output: 600W
• Voltage - Rated: 133V
• Package / Case: NI-1230-4S
• Supplier Device Package: NI-1230-4S

封装: NI-1230-4S

BA277,335

NXP

DIODE BAND-SWITCHING 35V SOD523

• Diode Type: Standard - Single
• Voltage - Peak Reverse (Max): 35V
• Current - Max: 100mA
• Capacitance @ Vr, F: 1.2pF @ 6V, 1MHz
• Resistance @ If, F: -
• Power Dissipation (Max): 715mW
• Operating Temperature: -65°C ~ 150°C (TJ)
• Package / Case: SC-79, SOD-523
• Supplier Device Package: SOD-523

封装: SC-79, SOD-523

MC33730EK

NXP

IC REG TRPL BCK/LDO 32SOIC

• Topology: Step-Down (Buck) (1), Linear (LDO) (2)
• Function: Automotive
• Number of Outputs: 3
• Frequency - Switching: 100kHz ~ 500kHz
• Voltage/Current - Output 1: 5V, 2A
• Voltage/Current - Output 2: Adjustable, 15mA
• Voltage/Current - Output 3: Adjustable, 15mA
• w/LED Driver: No
• w/Supervisor: No
• w/Sequencer: No
• Voltage - Supply: 6 V ~ 26.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 32-SOIC EP

封装: 32-SSOP (0.295", 7.50mm Width) Exposed Pad

MPC18730EP

NXP

IC PMIC PROGR 5-OUTPUTS 64-QFN

• Applications: Handheld/Mobile Devices
• Current - Supply: 9mA
• Voltage - Supply: 0.9 V ~ 4.2 V
• Operating Temperature: -10°C ~ 65°C
• Mounting Type: Surface Mount
• Package / Case: 64-WFQFN
• Supplier Device Package: 64-QFN (9x9)

封装: 64-WFQFN

MC33289DWR2

NXP

IC SWITCH DUAL H-SIDE 20-SOIC

• Applications: Automotive
• Current - Supply: 6mA
• Voltage - Supply: 6 V ~ 27 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SOIC

封装: 20-SOIC (0.295", 7.50mm Width)

74LV273DB,118

NXP

IC D-TYPE POS TRG SNGL 20SSOP

• Function: Master Reset
• Type: D-Type
• Output Type: Non-Inverted
• Number of Elements: 1
• Number of Bits per Element: 8
• Clock Frequency: 100MHz
• Max Propagation Delay @ V, Max CL: 19ns @ 5V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: 12mA, 12mA
• Voltage - Supply: 1 V ~ 5.5 V
• Current - Quiescent (Iq): 160µA
• Input Capacitance: 3.5pF
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-SSOP (0.209", 5.30mm Width)

封装: 20-SSOP (0.209", 5.30mm Width)

BGD816L,112

NXP

IC AMP GAIN PWR 860MHZ SOT115J

• Applications: CATV
• Output Type: -
• Number of Circuits: 1
• -3db Bandwidth: -
• Slew Rate: -
• Current - Supply: 360mA
• Current - Output / Channel: -
• Voltage - Supply, Single/Dual (±): -
• Mounting Type: -
• Package / Case: SOT-115J
• Supplier Device Package: SOT115J

封装: SOT-115J

TDA8922BJ/N2,112

NXP

IC AMP AUDIO PWR 88W STER 23SIL

• Type: Class D
• Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
• Max Output Power x Channels @ Load: 88W x 1 @ 6 Ohm; 50W x 2 @ 6 Ohm
• Voltage - Supply: ±12.5 V ~ 30 V
• Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
• Mounting Type: Through Hole
• Operating Temperature: -40°C ~ 85°C (TA)
• Supplier Device Package: DBS23P
• Package / Case: 23-SIP Formed Leads

封装: 23-SIP Formed Leads

SCC68692C1A44,518

NXP

IC DUART 44PLCC

• Features: Configurable GPIO, Internal Oscillator, Timer/Counter
• Number of Channels: 2, DUART
• FIFO's: -
• Protocol: -
• Data Rate (Max): 1Mbps
• Voltage - Supply: 5V
• With Auto Flow Control: Yes
• With IrDA Encoder/Decoder: -
• With False Start Bit Detection: Yes
• With Modem Control: -
• Mounting Type: Surface Mount
• Package / Case: 44-LCC (J-Lead)
• Supplier Device Package: 44-PLCC (16.59x16.59)

封装: 44-LCC (J-Lead)

TJA1054T/N1M,518

NXP

IC TXRX CAN FAULT TOL 14SOIC

• Type: Transceiver
• Protocol: CAN
• Number of Drivers/Receivers: 1/1
• Duplex: Half
• Receiver Hysteresis: -
• Data Rate: -
• Voltage - Supply: 4.75 V ~ 5.25 V
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SO

封装: 14-SOIC (0.154", 3.90mm Width)

UJA1168TK/FDJ

NXP

IC SBC CAN MINI HS 14HVSON

• Type: Transceiver
• Protocol: CAN
• Number of Drivers/Receivers: 1/1
• Duplex: Full
• Receiver Hysteresis: 200mV
• Data Rate: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 14-VDFN Exposed Pad
• Supplier Device Package: 14-HVSON (3x4.5)

封装: 14-VDFN Exposed Pad

MC7448VU1000NC

NXP

IC MPU MPC74XX 1.0GHZ 360FCCBGA

• Core Processor: PowerPC G4
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Multimedia; SIMD
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 1.5V, 1.8V, 2.5V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 360-CBGA, FCCBGA
• Supplier Device Package: 360-FCCBGA (25x25)

封装: 360-CBGA, FCCBGA

KMPC862PCVR80B

NXP

IC MPU MPC8XX 80MHZ 357BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 80MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (4), 10/100 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

封装: 357-BBGA

LPC3240FET296,551

NXP

IC MCU 32BIT ROMLESS 296TFBGA

• Core Processor: ARM9?
• Core Size: 16/32-Bit
• Speed: 266MHz
• Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: DMA, I2S, Motor Control PWM, PWM, WDT
• Number of I/O: 51
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 256K x 8
• Voltage - Supply (Vcc/Vdd): 0.9 V ~ 3.6 V
• Data Converters: A/D 3x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 296-TFBGA
• Supplier Device Package: 296-TFBGA (15x15)

封装: 296-TFBGA

LPC4088FBD144,551

NXP

IC MCU 32BIT 512KB FLASH 144LQFP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
• Number of I/O: -
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4032 x 8
• RAM Size: 96K x 8
• Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
• Data Converters: A/D 8x12b, D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

封装: 144-LQFP

MC56F84553VLH

NXP

IC MCU 32BIT 96KB FLASH 64LQFP

• Core Processor: 56800EX
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: CAN, I2C, LIN, SCI, SPI
• Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
• Number of I/O: 54
• Program Memory Size: 96KB (96K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x12b, 8x16b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

封装: 64-LQFP

MKM34Z128ACLL5

NXP

IC MCU 32BIT 128KB FLASH 100LQFP

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: DMA, LCD, WDT
• Number of I/O: 68
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 12x16b, 4x24b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

封装: 100-LQFP

MK60DX256ZVLL10

NXP

IC MCU 32BIT 256KB FLASH 100LQFP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 66
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 33x16b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

封装: 100-LQFP

LPC11E37HFBD64/4QL

NXP

IC MCU 32BIT 128KB FLASH 64LQFP

• Core Processor: ARM? Cortex?-M0
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 54
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 10K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

封装: 64-LQFP

MPC962308D-1H

NXP

IC CLOCK BUFFER 1:8 16-SOIC

• Type: Fanout Distribution, Spread Spectrum Clock Generator, Zero Delay Buffer
• PLL: Yes with Bypass
• Input: LVCMOS
• Output: LVCMOS
• Number of Circuits: 1
• Ratio - Input:Output: 1:8
• Differential - Input:Output: No/No
• Frequency - Max: 133.3MHz
• Divider/Multiplier: No/No
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SOIC

封装: 16-SOIC (0.154", 3.90mm Width)

MFRC63002HN,157

NXP

IC CONTACTLESS READER 32HVQFN

• Type: RFID Reader
• Frequency: 13.56MHz
• Standards: ISO 14443, MIFARE
• Interface: I2C, SPI, UART
• Voltage - Supply: 3 V ~ 5.5 V
• Operating Temperature: -25°C ~ 85°C
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (5x5)

封装: 32-VFQFN Exposed Pad

JN5148/Z01,518

NXP

IC RF TXRX+MCU 802.15.4 56-VFQFN

• Type: TxRx + MCU
• RF Family/Standard: 802.15.4
• Protocol: Zigbee?
• Modulation: O-QPSK
• Frequency: 2.4GHz
• Data Rate (Max): 667kbps
• Power - Output: 2.75dBm
• Sensitivity: -96.5dBm
• Memory Size: 128kB ROM, 128kB RAM
• Serial Interfaces: I2C, JTAG, SPI, UART
• GPIO: 21
• Voltage - Supply: 2 V ~ 3.6 V
• Current - Receiving: 17.5mA
• Current - Transmitting: 15mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 56-VFQFN Exposed Pad

封装: 56-VFQFN Exposed Pad

MW4IC915GNBR1

NXP

IC PWR AMP RF 26V 15W TO272-16GW

• Frequency: 750MHz ~ 1GHz
• P1dB: -
• Gain: 30dB
• Noise Figure: -
• RF Type: Cellular, CDMA, EDGE, GSM, TDMA, W-CDMA
• Voltage - Supply: 26V
• Current - Supply: 60mA
• Test Frequency: -
• Package / Case: TO-272-16 Variant, Gull Wing
• Supplier Device Package: TO-272 WB-16 GULL

封装: TO-272-16 Variant, Gull Wing

BGA2011,115

NXP

MMIC AMPLIFIER 900MHZ 6TSSOP

• Frequency: 900MHz
• P1dB: 10dBm (10mW)
• Gain: 19dB
• Noise Figure: 1.5dB
• RF Type: CDMA, DECT, PHS
• Voltage - Supply: 4.5V
• Current - Supply: 10mA ~ 20mA
• Test Frequency: 900MHz
• Package / Case: 6-TSSOP, SC-88, SOT-363
• Supplier Device Package: 6-TSSOP

封装: 6-TSSOP, SC-88, SOT-363

T1042NSE7PQPB

NXP

QORIQ 4X E5500 1400MHZ DDR3L/

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

封装: -

MCIMX6DP6AVT8AB

NXP

IC MPU I.MX6DP ENHAN 624FCBGA

• Core Processor: ARM® Cortex®-A9
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 852MHZ
• Co-Processors/DSP: Multimedia; NEON™ SIMD
• RAM Controllers: LPDDR2, DDR3L, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
• Ethernet: 10/100/1000 Mbps (1)
• SATA: SATA 3Gbps (1)
• USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
• Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
• Operating Temperature: -40°C ~ 125°C (TJ)
• Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
• Package / Case: 624-FBGA, FCBGA
• Supplier Device Package: 624-FCBGA (21x21)

封装: 624-FBGA, FCBGA

S912ZVML32F3MKHR

NXP

MAGNIV 16-BIT MCU S12Z CORE 32

• Core Processor: S12Z
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CANbus, LINbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 31
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V
• Data Converters: A/D 9x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP Exposed Pad
• Supplier Device Package: 64-LQFP-EP (10x10)

封装: 64-LQFP Exposed Pad

S9S08AW32E5MFUER

NXP

8-BIT MCU S08 CORE 32KB FLASH

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 54
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 64-QFP
• Supplier Device Package: 64-QFP (14x14)

封装: 64-QFP

MC33FS8430G4KSR2

NXP

SAFETY POWER MANAGEMENT IC, QFN5

• Applications: System Basis Chip
• Current - Supply: 15mA
• Voltage - Supply: 60V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-HVQFN (8x8)

封装: -

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MFS2301BMBA0EP

NXP

IC

• Applications: -
• Current - Supply: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

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