页 5 - NXP 产品 | 深圳黑森尔电子

零件编号	制造商	描述	封装	库存
BLP8G10S-45PGJ	NXP	TRANS LDMOS 45W 4HSOP Transistor Type: LDMOS Frequency: 700MHz ~ 1GHz Gain: 21dB Voltage - Test: - Current Rating: - Noise Figure: - Current - Test: - Power - Output: 45W Voltage - Rated: 28V Package / Case: SOT-1223-1 Supplier Device Package: 4-HSOPF	封装: SOT-1223-1	库存5,040
MRF6VP11KHR6	NXP	FET RF 2CH 110V 130MHZ NI-1230 Transistor Type: LDMOS (Dual) Frequency: 130MHz Gain: 26dB Voltage - Test: 50V Current Rating: - Noise Figure: - Current - Test: 150mA Power - Output: 1000W Voltage - Rated: 110V Package / Case: NI-1230 Supplier Device Package: NI-1230	封装: NI-1230	库存3,280
BZX284-B43,115	NXP	DIODE ZENER 43V 400MW SOD2 Voltage - Zener (Nom) (Vz): 43V Tolerance: ±2% Power - Max: 400mW Impedance (Max) (Zzt): 80 Ohms Current - Reverse Leakage @ Vr: 50nA @ 30.1V Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: SOD-110 Supplier Device Package: SOD110	封装: SOD-110	库存7,344
SSTU32866EC/G,551	NXP	IC 25BIT CONFIG REG BUFF 96LFBGA Logic Type: 1:1, 1:2 Configurable Registered Buffer with Parity Supply Voltage: 1.7 V ~ 1.9 V Number of Bits: 25, 14 Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 96-LFBGA Supplier Device Package: 96-LFBGA (13.5x5.5)	封装: 96-LFBGA	库存2,704
TJA1145T,118	NXP	IC TRANSCEIVER CAN 14SOIC Type: Transceiver Protocol: CAN Number of Drivers/Receivers: 1/1 Duplex: Full Receiver Hysteresis: - Data Rate: - Voltage - Supply: 3.3 V ~ 5 V Operating Temperature: -40°C ~ 150°C Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Supplier Device Package: 14-SO	封装: 14-SOIC (0.154", 3.90mm Width)	库存7,584
P2020PSE2MZB	NXP	IC MPU Q OR IQ 1.2GHZ 689TEBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: Security; SEC 3.3 RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: 0°C ~ 125°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	封装: 689-BBGA Exposed Pad	库存6,080
MPC8313ECZQADD	NXP	IC MPU MPC83XX 267MHZ 516BGA Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 267MHz Co-Processors/DSP: Security; SEC 2.2 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography Package / Case: 516-BBGA Exposed Pad Supplier Device Package: 516-TEPBGA (27x27)	封装: 516-BBGA Exposed Pad	库存2,800
MPC8321ECVRADDC	NXP	IC MPU MPC83XX 266MHZ 516BGA Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (3) SATA: - USB: USB 2.0 (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography Package / Case: 516-BBGA Supplier Device Package: 516-FPBGA (27x27)	封装: 516-BBGA	库存9,936
KMPC8245LZU333D	NXP	IC MPU MPC82XX 333MHZ 352TBGA Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 333MHz Co-Processors/DSP: - RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 352-LBGA Supplier Device Package: 352-TBGA (35x35)	封装: 352-LBGA	库存6,560
MPC8260AVVPIBB	NXP	IC MPU MPC82XX 300MHZ 408TBGA Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 300MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (3) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 480-LBGA Supplier Device Package: 408-TBGA (37.5x37.5)	封装: 480-LBGA	库存5,488
MPC870CZT66	NXP	IC MPU MPC8XX 66MHZ 256BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (2) SATA: - USB: USB 2.0 (1) Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 100°C (TA) Security Features: - Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23x23)	封装: 256-BBGA	库存16,164
S9S08DZ16F1MLF	NXP	IC MCU 8BIT 16KB FLASH 48LQFP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: CAN, I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 39 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	封装: 48-LQFP	库存12,624
MC9S08SH16MWL	NXP	IC MCU 8BIT 16KB FLASH 28SOIC Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 23 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 28-SOIC (0.295", 7.50mm Width) Supplier Device Package: 28-SOIC	封装: 28-SOIC (0.295", 7.50mm Width)	库存6,384
MCF51QM64VLF	NXP	IC MCU 32BIT 64KB FLASH 48LQFP Core Processor: Coldfire V1 Core Size: 32-Bit Speed: 50MHz Connectivity: EBI/EMI, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 35 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 2x16b, 12x16b, D/A 1x12b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	封装: 48-LQFP	库存3,696
S912ZVML31F1WKH	NXP	IC MCU 16BIT 32KB FLASH 64LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 40MHz Connectivity: CAN, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 9x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: - Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP (10x10)	封装: 64-LQFP Exposed Pad	库存3,488
MC9S08EL32CTL	NXP	IC MCU 8BIT 32KB FLASH 28TSSOP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 22 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x10b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 28-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 28-TSSOP	封装: 28-TSSOP (0.173", 4.40mm Width)	库存7,956
MC9S08QE8CPG	NXP	IC MCU 8BIT 8KB FLASH 16DIP Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, LIN, SCI, SPI Peripherals: LVD, PWM, WDT Number of I/O: 12 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP	封装: 16-DIP (0.300", 7.62mm)	库存4,480
IP4238CZ10,115	NXP	TVS DIODE 5.5VWM 7.3VC 10DFN Type: Steering (Rail to Rail) Unidirectional Channels: 4 Bidirectional Channels: - Voltage - Reverse Standoff (Typ): 5.5V Voltage - Breakdown (Min): 6V Voltage - Clamping (Max) @ Ipp: 7.3V Current - Peak Pulse (10/1000µs): 25A (8/20µs) Power - Peak Pulse: - Power Line Protection: Yes Applications: Ethernet, Telecom Capacitance @ Frequency: - Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 10-XFDFN Exposed Pad Supplier Device Package: 10-DFN (2.6x2.6)	封装: 10-XFDFN Exposed Pad	库存3,294
BZA100,118	NXP	TVS DIODE 6.8VWM 11VC 20SOIC Type: Zener Unidirectional Channels: 18 Bidirectional Channels: - Voltage - Reverse Standoff (Typ): 6.8V Voltage - Breakdown (Min): - Voltage - Clamping (Max) @ Ipp: 11V Current - Peak Pulse (10/1000µs): - Power - Peak Pulse: 27.5W Power Line Protection: No Applications: General Purpose Capacitance @ Frequency: 120pF @ 1MHz Operating Temperature: - Mounting Type: Surface Mount Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SO	封装: 20-SOIC (0.295", 7.50mm Width)	库存5,238
MMA6826BKWR2	NXP	ACCELEROMETER 10BIT SPI 16QFN Type: Digital Axis: X, Y Acceleration Range: ±60g Sensitivity (LSB/g): 8.192 Sensitivity (mV/g): - Bandwidth: - Output Type: SPI Voltage - Supply: 3.135 V ~ 5.25 V Features: - Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 16-QFN Exposed Pad Supplier Device Package: 16-QFN (6x6)	封装: 16-QFN Exposed Pad	库存2,430
SL3S1213FUF,003	NXP	IC UCODE G2XL UNCASED FOIL Type: RFID Transponder Frequency: 840MHz ~ 960MHz Standards: EPC Interface: - Voltage - Supply: 1.8V Operating Temperature: -40°C ~ 85°C Package / Case: Die Supplier Device Package: Die	封装: Die	库存2,556
TDA9899HL/V2,151	NXP	IC IF PROCESSOR MULTISTD 48-LQFP Function: IF Processor Frequency: - RF Type: ATV, DVB, FM Secondary Attributes: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	封装: 48-LQFP	库存4,248
TFA9882UK/N2Z	NXP	3.4 W I2S INPUT MONO CLASS-D AUD Type: Class D Output Type: 1-Channel (Mono) Max Output Power x Channels @ Load: 3.4W x 1 @ 4 Ohm Voltage - Supply: 2.5 V ~ 5.5 V Features: Depop, I²S, Mute, Overvoltage, Short-Circuit, Thermal Protection, Undervoltage Mounting Type: - Operating Temperature: - Supplier Device Package: - Package / Case: -	封装: -	库存6,176
SAF775DHV/N208QY	NXP	CAR RADIO TUNER & AUDIO DSP Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封装: -	库存7,808
SPC5746BFK1AVMH6	NXP	SINGLE CORE 3M FLASH 384 RAM Core Processor: e200z4 Core Size: 32-Bit Speed: 160MHz Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI Peripherals: DMA, I²S, POR, WDT Number of I/O: - Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 384K x 8 Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V Data Converters: A/D 36x10b, 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LBGA Supplier Device Package: 100-MAPBGA (11x11)	封装: 100-LBGA	库存3,104
MCIMX6U6AVM10ADR	NXP	I.MX 6 SERIES 32-BIT MPU, DUAL A Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1GHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI Ethernet: 10/100/1000Mbps (1) SATA: - USB: USB 2.0 + PHY (4) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case: 624-LFBGA Supplier Device Package: 624-MAPBGA (21x21)	封装: -	Request a Quote
S9S12ZVL16ACLF	NXP	S12Z CPU, 16K FLASH Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封装: -	Request a Quote
MC33PF8200DHESR2	NXP	POWER MANAGEMENT IC I.MX8 PRE-PR Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: - Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	封装: -	Request a Quote
MIMXRT1041XFP5B	NXP	IC MCU 32BIT 128KB ROM 169LFBGA Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Single-Core Speed: 528MHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Number of I/O: 114 Program Memory Size: 128KB (128K x 8) Program Memory Type: ROM EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 12x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 169-LFBGA Supplier Device Package: 169-LFBGA (9x9)	封装: -	Request a Quote
LS1023ABE9MQB	NXP	LAYERSCAPE 64-BIT ARM CORTEX-A53 Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 1.2GHz Co-Processors/DSP: - RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 1GbE (4), 2.5GbE (2), 10GbE (1) SATA: SATA 6Gbps (1) USB: USB 3.0 + PHY (3) Voltage - I/O: - Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Boot Security Package / Case: 780-BFBGA, FCBGA Supplier Device Package: 780-FBGA (23x23)	封装: -	Request a Quote

BLP8G10S-45PGJ

NXP

TRANS LDMOS 45W 4HSOP

Transistor Type: LDMOS
Frequency: 700MHz ~ 1GHz
Gain: 21dB
Voltage - Test: -
Current Rating: -
Noise Figure: -
Current - Test: -
Power - Output: 45W
Voltage - Rated: 28V
Package / Case: SOT-1223-1
Supplier Device Package: 4-HSOPF

封装: SOT-1223-1

库存5,040

MRF6VP11KHR6

NXP

FET RF 2CH 110V 130MHZ NI-1230

Transistor Type: LDMOS (Dual)
Frequency: 130MHz
Gain: 26dB
Voltage - Test: 50V
Current Rating: -
Noise Figure: -
Current - Test: 150mA
Power - Output: 1000W
Voltage - Rated: 110V
Package / Case: NI-1230
Supplier Device Package: NI-1230

封装: NI-1230

库存3,280

BZX284-B43,115

NXP

DIODE ZENER 43V 400MW SOD2

Voltage - Zener (Nom) (Vz): 43V
Tolerance: ±2%
Power - Max: 400mW
Impedance (Max) (Zzt): 80 Ohms
Current - Reverse Leakage @ Vr: 50nA @ 30.1V
Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SOD-110
Supplier Device Package: SOD110

封装: SOD-110

库存7,344

SSTU32866EC/G,551

NXP

IC 25BIT CONFIG REG BUFF 96LFBGA

Logic Type: 1:1, 1:2 Configurable Registered Buffer with Parity
Supply Voltage: 1.7 V ~ 1.9 V
Number of Bits: 25, 14
Operating Temperature: 0°C ~ 70°C
Mounting Type: Surface Mount
Package / Case: 96-LFBGA
Supplier Device Package: 96-LFBGA (13.5x5.5)

封装: 96-LFBGA

库存2,704

TJA1145T,118

NXP

IC TRANSCEIVER CAN 14SOIC

Type: Transceiver
Protocol: CAN
Number of Drivers/Receivers: 1/1
Duplex: Full
Receiver Hysteresis: -
Data Rate: -
Voltage - Supply: 3.3 V ~ 5 V
Operating Temperature: -40°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 14-SO

封装: 14-SOIC (0.154", 3.90mm Width)

库存7,584

P2020PSE2MZB

NXP

IC MPU Q OR IQ 1.2GHZ 689TEBGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.2GHz
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (3)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: 0°C ~ 125°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

封装: 689-BBGA Exposed Pad

库存6,080

MPC8313ECZQADD

NXP

IC MPU MPC83XX 267MHZ 516BGA

Core Processor: PowerPC e300c3
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 267MHz
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: USB 2.0 + PHY (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: Cryptography
Package / Case: 516-BBGA Exposed Pad
Supplier Device Package: 516-TEPBGA (27x27)

封装: 516-BBGA Exposed Pad

库存2,800

MPC8321ECVRADDC

NXP

IC MPU MPC83XX 266MHZ 516BGA

Core Processor: PowerPC e300c2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 266MHz
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (3)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: Cryptography
Package / Case: 516-BBGA
Supplier Device Package: 516-FPBGA (27x27)

封装: 516-BBGA

库存9,936

KMPC8245LZU333D

NXP

IC MPU MPC82XX 333MHZ 352TBGA

Core Processor: PowerPC 603e
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 333MHz
Co-Processors/DSP: -
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 352-LBGA
Supplier Device Package: 352-TBGA (35x35)

封装: 352-LBGA

库存6,560

MPC8260AVVPIBB

NXP

IC MPU MPC82XX 300MHZ 408TBGA

Core Processor: PowerPC G2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 300MHz
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (3)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 480-LBGA
Supplier Device Package: 408-TBGA (37.5x37.5)

封装: 480-LBGA

库存5,488

MPC870CZT66

NXP

IC MPU MPC8XX 66MHZ 256BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 66MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (2)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 3.3V
Operating Temperature: -40°C ~ 100°C (TA)
Security Features: -
Package / Case: 256-BBGA
Supplier Device Package: 256-PBGA (23x23)

封装: 256-BBGA

库存16,164

S9S08DZ16F1MLF

NXP

IC MCU 8BIT 16KB FLASH 48LQFP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: CAN, I2C, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 39
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

封装: 48-LQFP

库存12,624

MC9S08SH16MWL

NXP

IC MCU 8BIT 16KB FLASH 28SOIC

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 23
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 28-SOIC

封装: 28-SOIC (0.295", 7.50mm Width)

库存6,384

MCF51QM64VLF

NXP

IC MCU 32BIT 64KB FLASH 48LQFP

Core Processor: Coldfire V1
Core Size: 32-Bit
Speed: 50MHz
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 35
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 2x16b, 12x16b, D/A 1x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

封装: 48-LQFP

库存3,696

S912ZVML31F1WKH

NXP

IC MCU 16BIT 32KB FLASH 64LQFP

Core Processor: S12Z
Core Size: 16-Bit
Speed: 40MHz
Connectivity: CAN, LIN, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 42
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 9x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: -
Package / Case: 64-LQFP Exposed Pad
Supplier Device Package: 64-LQFP (10x10)

封装: 64-LQFP Exposed Pad

库存3,488

MC9S08EL32CTL

NXP

IC MCU 8BIT 32KB FLASH 28TSSOP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 22
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x10b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 28-TSSOP

封装: 28-TSSOP (0.173", 4.40mm Width)

库存7,956

MC9S08QE8CPG

NXP

IC MCU 8BIT 8KB FLASH 16DIP

Core Processor: S08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: I2C, LIN, SCI, SPI
Peripherals: LVD, PWM, WDT
Number of I/O: 12
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512 x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
Data Converters: A/D 8x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 16-DIP (0.300", 7.62mm)
Supplier Device Package: 16-DIP

封装: 16-DIP (0.300", 7.62mm)

库存4,480

IP4238CZ10,115

NXP

TVS DIODE 5.5VWM 7.3VC 10DFN

Type: Steering (Rail to Rail)
Unidirectional Channels: 4
Bidirectional Channels: -
Voltage - Reverse Standoff (Typ): 5.5V
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 7.3V
Current - Peak Pulse (10/1000µs): 25A (8/20µs)
Power - Peak Pulse: -
Power Line Protection: Yes
Applications: Ethernet, Telecom
Capacitance @ Frequency: -
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 10-XFDFN Exposed Pad
Supplier Device Package: 10-DFN (2.6x2.6)

封装: 10-XFDFN Exposed Pad

库存3,294

BZA100,118

NXP

TVS DIODE 6.8VWM 11VC 20SOIC

Type: Zener
Unidirectional Channels: 18
Bidirectional Channels: -
Voltage - Reverse Standoff (Typ): 6.8V
Voltage - Breakdown (Min): -
Voltage - Clamping (Max) @ Ipp: 11V
Current - Peak Pulse (10/1000µs): -
Power - Peak Pulse: 27.5W
Power Line Protection: No
Applications: General Purpose
Capacitance @ Frequency: 120pF @ 1MHz
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 20-SO

封装: 20-SOIC (0.295", 7.50mm Width)

库存5,238

MMA6826BKWR2

NXP

ACCELEROMETER 10BIT SPI 16QFN

Type: Digital
Axis: X, Y
Acceleration Range: ±60g
Sensitivity (LSB/g): 8.192
Sensitivity (mV/g): -
Bandwidth: -
Output Type: SPI
Voltage - Supply: 3.135 V ~ 5.25 V
Features: -
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 16-QFN Exposed Pad
Supplier Device Package: 16-QFN (6x6)

封装: 16-QFN Exposed Pad

库存2,430

SL3S1213FUF,003

NXP

IC UCODE G2XL UNCASED FOIL

Type: RFID Transponder
Frequency: 840MHz ~ 960MHz
Standards: EPC
Interface: -
Voltage - Supply: 1.8V
Operating Temperature: -40°C ~ 85°C
Package / Case: Die
Supplier Device Package: Die

封装: Die

库存2,556

TDA9899HL/V2,151

NXP

IC IF PROCESSOR MULTISTD 48-LQFP

Function: IF Processor
Frequency: -
RF Type: ATV, DVB, FM
Secondary Attributes: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

封装: 48-LQFP

库存4,248

TFA9882UK/N2Z

NXP

3.4 W I2S INPUT MONO CLASS-D AUD

Type: Class D
Output Type: 1-Channel (Mono)
Max Output Power x Channels @ Load: 3.4W x 1 @ 4 Ohm
Voltage - Supply: 2.5 V ~ 5.5 V
Features: Depop, I²S, Mute, Overvoltage, Short-Circuit, Thermal Protection, Undervoltage
Mounting Type: -
Operating Temperature: -
Supplier Device Package: -
Package / Case: -

封装: -

库存6,176

SAF775DHV/N208QY

NXP

CAR RADIO TUNER & AUDIO DSP

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封装: -

库存7,808

SPC5746BFK1AVMH6

NXP

SINGLE CORE 3M FLASH 384 RAM

Core Processor: e200z4
Core Size: 32-Bit
Speed: 160MHz
Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, I²S, POR, WDT
Number of I/O: -
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 384K x 8
Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
Data Converters: A/D 36x10b, 16x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 100-LBGA
Supplier Device Package: 100-MAPBGA (11x11)

封装: 100-LBGA

库存3,104

MCIMX6U6AVM10ADR

NXP

I.MX 6 SERIES 32-BIT MPU, DUAL A

Core Processor: ARM® Cortex®-A9
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1GHz
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI
Ethernet: 10/100/1000Mbps (1)
SATA: -
USB: USB 2.0 + PHY (4)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature: -40°C ~ 125°C (TJ)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Package / Case: 624-LFBGA
Supplier Device Package: 624-MAPBGA (21x21)

封装: -

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S9S12ZVL16ACLF

NXP

S12Z CPU, 16K FLASH

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封装: -

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MC33PF8200DHESR2

NXP

POWER MANAGEMENT IC I.MX8 PRE-PR

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: -
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

封装: -

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MIMXRT1041XFP5B

NXP

IC MCU 32BIT 128KB ROM 169LFBGA

Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit Single-Core
Speed: 528MHz
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O: 114
Program Memory Size: 128KB (128K x 8)
Program Memory Type: ROM
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Data Converters: A/D 12x12b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 169-LFBGA
Supplier Device Package: 169-LFBGA (9x9)

封装: -

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LS1023ABE9MQB

NXP

LAYERSCAPE 64-BIT ARM CORTEX-A53

Core Processor: ARM® Cortex®-A53
Number of Cores/Bus Width: 2 Core, 64-Bit
Speed: 1.2GHz
Co-Processors/DSP: -
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 1GbE (4), 2.5GbE (2), 10GbE (1)
SATA: SATA 6Gbps (1)
USB: USB 3.0 + PHY (3)
Voltage - I/O: -
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: ARM TZ, Boot Security
Package / Case: 780-BFBGA, FCBGA
Supplier Device Package: 780-FBGA (23x23)

封装: -

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