NXP 产品

BAP70-04W,115

NXP

DIODE PIN 50V 100MA SOT323

• Diode Type: PIN - 1 Pair Series Connection
• Voltage - Peak Reverse (Max): 50V
• Current - Max: 100mA
• Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
• Resistance @ If, F: 1.9 Ohm @ 100mA, 100MHz
• Power Dissipation (Max): 260mW
• Operating Temperature: -65°C ~ 150°C (TJ)
• Package / Case: SC-70, SOT-323
• Supplier Device Package: SOT-323-3

封装: SC-70, SOT-323

MCZ33810EK

NXP

IC IGNITION INJECTOR 32-SOIC

• Applications: Automotive
• Current - Supply: 10mA
• Voltage - Supply: 4.5 V ~ 36 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 32-SOIC EP

封装: 32-SSOP (0.295", 7.50mm Width) Exposed Pad

PCF8545ATT/AJ

NXP

IC LCD DRIVER UNIV 56TSSOP

• Display Type: LCD
• Configuration: 320 Segment
• Interface: I2C
• Digits or Characters: -
• Current - Supply: 30µA
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 95°C
• Mounting Type: Surface Mount
• Package / Case: 56-TFSOP (0.240", 6.10mm Width)
• Supplier Device Package: 56-TSSOP

封装: 56-TFSOP (0.240", 6.10mm Width)

GTL2003BQ,118

NXP

IC TRANSLATOR 8BIT LV 20-DHVQFN

• Translator Type: Voltage Level
• Channel Type: Bidirectional
• Number of Circuits: 1
• Channels per Circuit: 8
• Voltage - VCCA: 0.8V ~ 5.5V
• Voltage - VCCB: 0.8V ~ 5.5V
• Input Signal: -
• Output Signal: -
• Output Type: Open Drain
• Data Rate: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Features: Auto-Direction Sensing
• Mounting Type: Surface Mount
• Package / Case: 20-VFQFN Exposed Pad
• Supplier Device Package: 20-DHVQFN (4.5x 2.5)

封装: 20-VFQFN Exposed Pad

N74F132D,623

NXP

IC GATE NAND 4CH 2-INP 14-SO

• Logic Type: NAND Gate
• Number of Circuits: 4
• Number of Inputs: 2
• Features: Schmitt Trigger
• Voltage - Supply: 4.5 V ~ 5.5 V
• Current - Quiescent (Max): -
• Current - Output High, Low: 1mA, 20mA
• Logic Level - Low: 0.8V
• Logic Level - High: 2V
• Max Propagation Delay @ V, Max CL: 8.5ns @ 5V, 50pF
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Supplier Device Package: 14-SO
• Package / Case: 14-SOIC (0.154", 3.90mm Width)

封装: 14-SOIC (0.154", 3.90mm Width)

74LVC109D,118

NXP

IC JK TYPE POS TRG DUAL 16SOIC

• Function: Set(Preset) and Reset
• Type: JK Type
• Output Type: Differential
• Number of Elements: 2
• Number of Bits per Element: 1
• Clock Frequency: 330MHz
• Max Propagation Delay @ V, Max CL: 6.8ns @ 3.3V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: 24mA, 24mA
• Voltage - Supply: 1.65 V ~ 3.6 V
• Current - Quiescent (Iq): 10µA
• Input Capacitance: 5pF
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)

封装: 16-SOIC (0.154", 3.90mm Width)

SCC2681AE1A44,518

NXP

IC DUART 44PLCC

• Features: Configurable GPIO, Internal Oscillator, Timer/Counter
• Number of Channels: 2, DUART
• FIFO's: -
• Protocol: -
• Data Rate (Max): 1Mbps
• Voltage - Supply: 5V
• With Auto Flow Control: Yes
• With IrDA Encoder/Decoder: -
• With False Start Bit Detection: Yes
• With Modem Control: -
• Mounting Type: Surface Mount
• Package / Case: 44-LCC (J-Lead)
• Supplier Device Package: 44-PLCC (16.59x16.59)

封装: 44-LCC (J-Lead)

PCA9670PW,112

NXP

IC I/O EXPANDER I2C 8B 16TSSOP

• Number of I/O: 8
• Interface: I2C
• Interrupt Output: No
• Features: POR
• Output Type: Push-Pull
• Current - Output Source/Sink: 100µA, 25mA
• Clock Frequency: 1MHz
• Voltage - Supply: 2.3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

封装: 16-TSSOP (0.173", 4.40mm Width)

CBTL06DP212EE,118

NXP

IC MUX 6CH DISPLAY PORT 48TFBGA

• Applications: DisplayPort, PCIe
• Multiplexer/Demultiplexer Circuit: 2:1, 4:1
• Switch Circuit: -
• Number of Channels: 6
• On-State Resistance (Max): 6.5 Ohm (Typ)
• Voltage - Supply, Single (V+): 3 V ~ 3.6 V
• Voltage - Supply, Dual (V±): -
• -3db Bandwidth: 5GHz
• Features: Bi-Directional
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: 48-TFBGA
• Supplier Device Package: 48-TFBGA (5x5)

封装: 48-TFBGA

MPC8536BVTAQGA

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 (3)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

封装: 783-BBGA, FCBGA

SPC5200CBV400B

NXP

IC MPU MPC52XX 400MHZ 272BGA

• Core Processor: PowerPC G2_LE
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (1)
• SATA: -
• USB: USB 1.1 (2)
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: -40°C ~ 85°C (TA)
• Security Features: -
• Package / Case: 272-BBGA
• Supplier Device Package: 272-PBGA (27x27)

封装: 272-BBGA

P89LPC9381FA,112

NXP

IC MCU 8BIT 4KB FLASH 28PLCC

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 18MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
• Number of I/O: 26
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-LCC (J-Lead)
• Supplier Device Package: 28-PLCC (11.51x11.51)

封装: 28-LCC (J-Lead)

SPC5674FF3MVR3

NXP

IC MCU 32BIT 4MB FLASH 416BGA

• Core Processor: e200z7
• Core Size: 32-Bit
• Speed: 264MHz
• Connectivity: CAN, SCI, SPI
• Peripherals: DMA, POR, PWM
• Number of I/O: 32
• Program Memory Size: 4MB (4M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256K x 8
• Voltage - Supply (Vcc/Vdd): 1.08 V ~ 1.32 V
• Data Converters: A/D 64x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 416-BBGA
• Supplier Device Package: 416-PBGA (27x27)

封装: 416-BBGA

MC9S08AC8MFGE

NXP

IC MCU 8BIT 8KB FLASH 44LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 34
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 768 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 44-LQFP
• Supplier Device Package: 44-LQFP (10x10)

封装: 44-LQFP

LPC1112FHI33/102,5

NXP

IC MCU 32BIT 16KB FLASH 33HVQFN

• Core Processor: ARM? Cortex?-M0
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number of I/O: 28
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: -

封装: 32-VFQFN Exposed Pad

MKE02Z64VLH4

NXP

IC MCU 32BIT 64KB FLASH 64LQFP

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 40MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: LVD, PWM, WDT
• Number of I/O: 57
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b, D/A 2x6b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

封装: 64-LQFP

MK60DX256VMC10

NXP

IC MCU 32BIT 256KB FLASH 121BGA

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 86
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 38x16b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 121-LBGA
• Supplier Device Package: 121-MAPBGA (8x8)

封装: 121-LBGA

PCF8563TS/5,118

NXP

IC RTC CLK/CALENDAR I2C 8-TSSOP

• Type: Clock/Calendar
• Features: Alarm, Leap Year, Watchdog Timer
• Memory Size: -
• Time Format: HH:MM:SS (24 hr)
• Date Format: YY-MM-DD-dd
• Interface: I2C, 2-Wire Serial
• Voltage - Supply: 1.8 V ~ 5.5 V
• Voltage - Supply, Battery: -
• Current - Timekeeping (Max): 0.6µA ~ 0.75µA @ 2V ~ 5V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 8-TSSOP

封装: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

MF1SPLUS6001DA4/02

NXP

IC SMART CARD 2KB EEPROM MOA4

• Type: RFID Transponder
• Frequency: 13.56MHz
• Standards: ISO 14443, MIFARE
• Interface: UART
• Voltage - Supply: -
• Operating Temperature: -25°C ~ 70°C
• Package / Case: MOA4, Smart Card Module
• Supplier Device Package: PLLMC

封装: MOA4, Smart Card Module

PCF7900NHN/C0K,112

NXP

IC XMITTER UHF 16HVQFN

• Frequency: 315MHz, 434MHz, 868MHz, 915MHz
• Applications: General Purpose
• Modulation or Protocol: UHF
• Data Rate (Max): -
• Power - Output: 6dBm
• Current - Transmitting: 7mA
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Memory Size: -
• Features: -
• Voltage - Supply: -
• Operating Temperature: -
• Package / Case: 16-VFQFN Exposed Pad

封装: 16-VFQFN Exposed Pad

900MHZ-AMP-EVK

NXP

KIT EVALUATION AMPLIFIER 900MHZ

• Type: Amplifier
• Frequency: 900MHz
• For Use With/Related Products: MBC13720
• Supplied Contents: Board

封装: -

MW5IC2030NBR1

NXP

IC PWR AMP RF 26V 30W TO-272-16

• Frequency: 1.93GHz ~ 1.99GHz
• P1dB: -
• Gain: 23dB
• Noise Figure: -
• RF Type: Cellular, CDMA, EDGE, GSM, TDMA, W-CDMA
• Voltage - Supply: 26V
• Current - Supply: 160mA
• Test Frequency: -
• Package / Case: TO-272-16 Variant, Flat Leads
• Supplier Device Package: TO-272 WB-16

封装: TO-272-16 Variant, Flat Leads

MC33FS6501CAER2

NXP

SYSTEM BASIS CHIP DCDC 0.8A VCO

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: -1.0 V ~ 40 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP (7x7)

封装: 48-LQFP Exposed Pad

MKV44F128VLF16

NXP

KINETIS V 32-BIT MCU ARM CORTEX

• Core Processor: ARM® Cortex®-M4
• Core Size: 32-Bit
• Speed: 168MHz
• Connectivity: CANbus, I²C, SPI, UART/USART
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number of I/O: -
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 24K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 21x12b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

封装: 48-LQFP

S9S08EL16F1MTL

NXP

8-BIT MCU S08 CORE 16KB FLASH

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 22
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 28-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 28-TSSOP

封装: 28-TSSOP (0.173", 4.40mm Width)

S9S12GN48BCLC

NXP

S12 CORE48K FLASH

• Core Processor: 12V1
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: IrDA, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 26
• Program Memory Size: 48KB (48K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1.5K x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

封装: 32-LQFP

SE050C2HQ1/Z01SDZ

NXP

ECC RSA AES DES MIFARE KDF CL-IF

• Type: IoT Secure Element
• Applications: Industry 4.0
• Mounting Type: Surface Mount
• Package / Case: 20-XFQFN Exposed Pad
• Supplier Device Package: 20-HX2QFN (3x3)

封装: 20-XFQFN Exposed Pad

T4241NSE7NQB

NXP

IC MPU QORIQ T4 1.3GHZ 1932BGA

• Core Processor: PowerPC e6500
• Number of Cores/Bus Width: 24 Core, 64-Bit
• Speed: 1.3GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 1Gbps (13), 10Gbps (2)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 1.8V, 2.5V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FCPBGA (45x45)

封装: -

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MPF5302AMBA0ESR2

NXP

IC REG BUCK ADJ 15A 24HWQFN

• Function: Step-Down
• Output Configuration: Positive
• Topology: Buck
• Output Type: Adjustable
• Number of Outputs: 1
• Voltage - Input (Min): 2.7V
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 0.5V
• Voltage - Output (Max): 1.2V
• Current - Output: 15A
• Frequency - Switching: 2MHz ~ 3MHz
• Synchronous Rectifier: No
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 24-PowerWFQFN
• Supplier Device Package: 24-HWQFN (4.5x3.5)

封装: -

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MC33FS8410G0KSR2

NXP

SAFETY POWER MANAGEMENT IC, QFN5

• Applications: System Basis Chip
• Current - Supply: 15mA
• Voltage - Supply: 60V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-HVQFN (8x8)

封装: -

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