页 49 - NXP 产品 - 嵌入式 - 微控制器

S912ZVL96F0VLFR

NXP

IC MCU 16BIT 96KB FLASH 48LQFP

Core Processor: S12Z
Core Size: 16-Bit
Speed: 32MHz
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 34
Program Memory Size: 96KB (96K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Data Converters: A/D 10x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

封装: -

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16-Bit

32MHz

CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART

LVD, POR, PWM, WDT

34

96KB (96K x 8)

FLASH

2K x 8

8K x 8

5.5V ~ 18V

A/D 10x10b

Internal

-40°C ~ 105°C (TA)

Surface Mount

48-LQFP

48-LQFP (7x7)

S32K314NHT1MMMST

NXP

S32K344 PHANTOM, 257MAPBGA, PROD

Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit
Speed: 160MHz
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Number of I/O: 218
Program Memory Size: 4MB (4M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 24x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 257-LFBGA
Supplier Device Package: 257-LFBGA (14x14)

封装: -

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32-Bit

160MHz

CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART

DMA, I2S, Serial Audio, WDT

218

4MB (4M x 8)

FLASH

-

512K x 8

2.7V ~ 5.5V

A/D 24x12b

Internal

-40°C ~ 125°C

Surface Mount

257-LFBGA

257-LFBGA (14x14)

S9S12ZVL16AMLCR

NXP

S12Z CPU, 16K FLASH

Core Processor: S12Z
Core Size: 16-Bit
Speed: 32MHz
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 19
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: 128 x 8
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Data Converters: A/D 6x10b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

封装: -

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16-Bit

32MHz

I2C, IrDA, LINbus, SCI, SPI, UART/USART

LVD, POR, PWM, WDT

19

16KB (16K x 8)

FLASH

128 x 8

1K x 8

3.5V ~ 40V

A/D 6x10b

External, Internal

-40°C ~ 125°C (TA)

Surface Mount

32-LQFP

32-LQFP (7x7)

S9S12ZVL16AMLFR

NXP

S12Z CPU, 16K FLASH

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封装: -

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-

S32K314NHT1VPBSR

NXP

S32K314 ARM CORTEX-M7, 160 MHZ,

Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit
Speed: 160MHz
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Number of I/O: 218
Program Memory Size: 4MB (4M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 24x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 172-QFP
Supplier Device Package: 172-QFP (16x16)

封装: -

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32-Bit

160MHz

CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART

DMA, I2S, Serial Audio, WDT

218

4MB (4M x 8)

FLASH

-

512K x 8

2.7V ~ 5.5V

A/D 24x12b

Internal

-40°C ~ 105°C

Surface Mount

172-QFP

172-QFP (16x16)

S32K314NHT1VPBST

NXP

S32K314 ARM CORTEX-M7, 160 MHZ,

Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit
Speed: 160MHz
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Number of I/O: 218
Program Memory Size: 4MB (4M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 24x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 172-QFP
Supplier Device Package: 172-QFP (16x16)

封装: -

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32-Bit

160MHz

CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART

DMA, I2S, Serial Audio, WDT

218

4MB (4M x 8)

FLASH

-

512K x 8

2.7V ~ 5.5V

A/D 24x12b

Internal

-40°C ~ 105°C

Surface Mount

172-QFP

172-QFP (16x16)

MIMXRT106DDVL6B

NXP

IC MCU

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封装: -

库存1,440

-

S9KEAZN16AMLHR

NXP

IC MCU 32BIT 16KB FLASH 64LQFP

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Speed: 40MHz
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 57
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: 256 x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 16x12b SAR
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

封装: -

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32-Bit Single-Core

40MHz

I2C, LINbus, SPI, UART/USART

LVD, POR, PWM, WDT

57

16KB (16K x 8)

FLASH

256 x 8

2K x 8

2.7V ~ 5.5V

A/D 16x12b SAR

Internal

-40°C ~ 125°C (TA)

Surface Mount

64-LQFP

64-LQFP (10x10)

MCXN946VDFT

NXP

IC MCX N94 150MHZ DUAL CORE NPU

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封装: -

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-

K32L2A31VLH1A

NXP

K32 L2A 64LQFP

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 72MHz
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Number of I/O: 50
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

封装: -

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32-Bit

72MHz

FlexIO, I2C, SPI, TSI, UART/USART, USB

DMA, LCD, PWM, WDT

50

256KB (256K x 8)

FLASH

-

128K x 8

1.71V ~ 3.6V

-

Internal

-40°C ~ 105°C (TA)

Surface Mount

64-LQFP

64-LQFP (10x10)

S9S12VR48AAVLCR

NXP

IC MCU 16BIT 48KB FLASH 32LQFP

Core Processor: HCS12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 16
Program Memory Size: 48KB (48K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Data Converters: A/D 2x10b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

封装: -

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16-Bit

25MHz

IrDA, LINbus, SCI, SPI

LVD, POR, PWM, WDT

16

48KB (48K x 8)

FLASH

512 x 8

2K x 8

3.5V ~ 40V

A/D 2x10b

External, Internal

-40°C ~ 105°C (TA)

Surface Mount

32-LQFP

32-LQFP (7x7)

S9S12VR48AAVLFR

NXP

IC MCU 16BIT 48KB FLASH 48LQFP

Core Processor: HCS12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 28
Program Memory Size: 48KB (48K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Data Converters: A/D 6x10b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

封装: -

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16-Bit

25MHz

IrDA, LINbus, SCI, SPI

LVD, POR, PWM, WDT

28

48KB (48K x 8)

FLASH

512 x 8

2K x 8

3.5V ~ 40V

A/D 6x10b

External, Internal

-40°C ~ 105°C (TA)

Surface Mount

48-LQFP

48-LQFP (7x7)

LPC845M301JHI33K

NXP

IC MCU 32BIT 64KB FLASH 32HVQFN

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 30MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O: 29
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 12x12b SAR; D/A 1x10b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-HVQFN (5x5)

封装: -

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32-Bit

30MHz

I2C, SPI, UART/USART

Brown-out Detect/Reset, DMA, POR, PWM, WDT

29

64KB (64K x 8)

FLASH

-

16K x 8

1.8V ~ 3.6V

A/D 12x12b SAR; D/A 1x10b

External, Internal

-40°C ~ 105°C (TA)

Surface Mount

32-VFQFN Exposed Pad

32-HVQFN (5x5)

MCF53016CMJ240J

NXP

IC MCU 32BIT ROMLESS 256MAPBGA

Core Processor: Coldfire V3
Core Size: 32-Bit Single-Core
Speed: 240MHz
Connectivity: EBI/EMI, Ethernet, I2C, Memory Card, SPI, SSI, UART/USART, USB, USB OTG
Peripherals: DMA, PWM, WDT
Number of I/O: 83
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 1.08V ~ 3.6V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Supplier Device Package: 256-MAPBGA (17x17)

封装: -

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32-Bit Single-Core

240MHz

EBI/EMI, Ethernet, I2C, Memory Card, SPI, SSI, UART/USART, USB, USB OTG

DMA, PWM, WDT

83

-

ROMless

-

128K x 8

1.08V ~ 3.6V

-

Internal

-40°C ~ 85°C

Surface Mount

256-LBGA

256-MAPBGA (17x17)

LPC845M301JHI48Y

NXP

IC MCU 32BIT 64KB FLASH 48HVQFN

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Speed: 30MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, Capacitive Touch, DMA, POR, PWM, WDT
Number of I/O: 42
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 12x12b; D/A 1x10b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-HVQFN (7x7)

封装: -

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32-Bit Single-Core

30MHz

I2C, SPI, UART/USART

Brown-out Detect/Reset, Capacitive Touch, DMA, POR, PWM, WDT

42

64KB (64K x 8)

FLASH

-

16K x 8

1.8V ~ 3.6V

A/D 12x12b; D/A 1x10b

External, Internal

-40°C ~ 105°C (TA)

Surface Mount

48-VFQFN Exposed Pad

48-HVQFN (7x7)

LPC845M301JHI48K

NXP

IC MCU 32BIT 64KB FLASH 48HVQFN

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Speed: 30MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, Capacitive Touch, DMA, POR, PWM, WDT
Number of I/O: 42
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 12x12b; D/A 2x10b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-HVQFN (7x7)

封装: -

库存4,236

32-Bit Single-Core

30MHz

I2C, SPI, UART/USART

Brown-out Detect/Reset, Capacitive Touch, DMA, POR, PWM, WDT

42

64KB (64K x 8)

FLASH

-

16K x 8

1.8V ~ 3.6V

A/D 12x12b; D/A 2x10b

External, Internal

-40°C ~ 105°C (TA)

Surface Mount

48-VFQFN Exposed Pad

48-HVQFN (7x7)

S912ZVML64AVKH

NXP

S12Z CORE, 64K FLASH, LIN, 64LQF

Core Processor: S12Z
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 24
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Data Converters: A/D 9x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Supplier Device Package: 64-HLQFP (10x10)

封装: -

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16-Bit

50MHz

CANbus, LINbus, SCI, SPI

DMA, POR, PWM, WDT

24

64KB (64K x 8)

FLASH

512 x 8

4K x 8

3.5V ~ 40V

A/D 9x12b SAR

External, Internal

-40°C ~ 105°C (TA)

Surface Mount

64-LQFP Exposed Pad

64-HLQFP (10x10)

MIMXRT1052DVL6BR

NXP

IC MCU 32BIT ROMLESS 196LFBGA

Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit Single-Core
Speed: 600MHz
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Number of I/O: 127
Program Memory Size: -
Program Memory Type: External Program Memory
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Data Converters: A/D 20x12b
Oscillator Type: External, Internal
Operating Temperature: 0°C ~ 95°C (TJ)
Mounting Type: Surface Mount
Package / Case: 196-LFBGA
Supplier Device Package: 196-LFBGA (10x10)

封装: -

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32-Bit Single-Core

600MHz

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG

Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT

127

-

External Program Memory

-

512K x 8

3V ~ 3.6V

A/D 20x12b

External, Internal

0°C ~ 95°C (TJ)

Surface Mount

196-LFBGA

196-LFBGA (10x10)

S912ZVML64AWKH

NXP

S12Z CORE, 64K FLASH, LIN, 64LQF

Core Processor: S12Z
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 24
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Data Converters: A/D 9x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Supplier Device Package: 64-HLQFP (10x10)

封装: -

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16-Bit

50MHz

CANbus, LINbus, SCI, SPI

DMA, POR, PWM, WDT

24

64KB (64K x 8)

FLASH

512 x 8

4K x 8

3.5V ~ 40V

A/D 9x12b SAR

External, Internal

-40°C ~ 150°C (TA)

Surface Mount

64-LQFP Exposed Pad

64-HLQFP (10x10)

S912ZVML64AMKH

NXP

S12Z CORE, 64K FLASH, LIN, 64LQF

Core Processor: S12Z
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 24
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Data Converters: A/D 9x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Supplier Device Package: 64-HLQFP (10x10)

封装: -

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16-Bit

50MHz

CANbus, LINbus, SCI, SPI

DMA, POR, PWM, WDT

24

64KB (64K x 8)

FLASH

512 x 8

4K x 8

3.5V ~ 40V

A/D 9x12b SAR

External, Internal

-40°C ~ 125°C (TA)

Surface Mount

64-LQFP Exposed Pad

64-HLQFP (10x10)

S9S12G96J0CLFR

NXP

IC MCU 16BIT 96KB FLASH 48LQFP

Core Processor: S12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 40
Program Memory Size: 96KB (96K x 8)
Program Memory Type: FLASH
EEPROM Size: 3K x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

封装: -

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16-Bit

25MHz

CANbus, IrDA, LINbus, SCI, SPI

LVD, POR, PWM, WDT

40

96KB (96K x 8)

FLASH

3K x 8

8K x 8

3.13V ~ 5.5V

A/D 12x10b

Internal

-40°C ~ 85°C (TA)

Surface Mount

48-LQFP

48-LQFP (7x7)

S9S12G96J0CLHR

NXP

IC MCU 16BIT 96KB FLASH 64LQFP

Core Processor: S12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 54
Program Memory Size: 96KB (96K x 8)
Program Memory Type: FLASH
EEPROM Size: 3K x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

封装: -

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16-Bit

25MHz

CANbus, IrDA, LINbus, SCI, SPI

LVD, POR, PWM, WDT

54

96KB (96K x 8)

FLASH

3K x 8

8K x 8

3.13V ~ 5.5V

A/D 12x10b

Internal

-40°C ~ 85°C (TA)

Surface Mount

64-LQFP

64-LQFP (10x10)

S912ZVLA64AVFMR

NXP

S12Z CPU, 64K FLASH

Core Processor: S12Z
Core Size: 16-Bit
Speed: 32MHz
Connectivity: CANbus, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 34
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 1K x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Data Converters: A/D 6x10b; D/A 1x8b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-QFN-EP (5x5)

封装: -

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16-Bit

32MHz

CANbus, SPI

LVD, POR, PWM, WDT

34

64KB (64K x 8)

FLASH

1K x 8

4K x 8

5.5V ~ 18V

A/D 6x10b; D/A 1x8b

External, Internal

-40°C ~ 105°C (TA)

Surface Mount

32-VFQFN Exposed Pad

32-QFN-EP (5x5)

SPC5607BAMLQ6

NXP

IC MCU 32BIT 1.5MB FLASH 144LQFP

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 64MHz
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 149
Program Memory Size: 1.5MB (1.5M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 96K x 8
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Data Converters: A/D 34x10b, 24x12b SAR
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

封装: -

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32-Bit

64MHz

CANbus, I2C, LINbus, SCI, SPI

DMA, POR, PWM, WDT

149

1.5MB (1.5M x 8)

FLASH

64K x 8

96K x 8

3V ~ 5.5V

A/D 34x10b, 24x12b SAR

Internal

-40°C ~ 125°C (TA)

Surface Mount

144-LQFP

144-LQFP (20x20)

S912ZVMBA4F0WLF

NXP

IC MCU 16BIT 48KB FLASH 48LQFP

Core Processor: S12Z
Core Size: 16-Bit
Speed: 32MHz
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 15
Program Memory Size: 48KB (48K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Data Converters: A/D 5x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

封装: -

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16-Bit

32MHz

I2C, IrDA, LINbus, SCI, SPI, UART/USART

DMA, LVD, POR, PWM, WDT

15

48KB (48K x 8)

FLASH

512 x 8

4K x 8

5.5V ~ 18V

A/D 5x10b

Internal

-40°C ~ 150°C (TA)

Surface Mount

48-LQFP

48-LQFP (7x7)

S912ZVL12AMLFR

NXP

S12Z CPU, 6128K FLASH

Core Processor: S12Z
Core Size: 16-Bit
Speed: 32MHz
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 34
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Data Converters: A/D 10x10b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

封装: -

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16-Bit

32MHz

CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART

LVD, POR, PWM, WDT

34

128KB (128K x 8)

FLASH

512 x 8

8K x 8

5.5V ~ 18V

A/D 10x10b

External, Internal

-40°C ~ 125°C (TA)

Surface Mount

48-LQFP

48-LQFP (7x7)

SP5746BHK1AMMH6R

NXP

IC MCU 32BIT 3MB FLASH 100MAPBGA

Core Processor: e200z4
Core Size: 32-Bit Single-Core
Speed: 160MHz
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 65
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 384K x 8
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Data Converters: A/D 36x10b, 16x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Supplier Device Package: 100-MAPBGA (11x11)

封装: -

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32-Bit Single-Core

160MHz

CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG

DMA, LVD, POR, WDT

65

3MB (3M x 8)

FLASH

64K x 8

384K x 8

3.15V ~ 5.5V

A/D 36x10b, 16x12b

Internal

-40°C ~ 125°C (TA)

Surface Mount

100-LFBGA

100-MAPBGA (11x11)

SPC5675KFK0MMM2

NXP

IC MCU 32BIT 2MB FLASH 257MAPBGA

Core Processor: e200z7d
Core Size: 32-Bit Dual-Core
Speed: 180MHz
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 16
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Data Converters: A/D 22x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 257-LFBGA
Supplier Device Package: 257-LFBGA (14x14)

封装: -

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32-Bit Dual-Core

180MHz

CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI

DMA, POR, PWM, WDT

16

2MB (2M x 8)

FLASH

64K x 8

512K x 8

1.14V ~ 5.5V

A/D 22x12b

Internal

-40°C ~ 125°C (TA)

Surface Mount

257-LFBGA

257-LFBGA (14x14)

K32L2A31VLL1A

NXP

K32 L2A 100LQFP

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 72MHz
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Number of I/O: 86
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

封装: -

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32-Bit

72MHz

FlexIO, I2C, SPI, TSI, UART/USART, USB

DMA, LCD, PWM, WDT

86

256KB (256K x 8)

FLASH

-

128K x 8

1.71V ~ 3.6V

-

Internal

-40°C ~ 105°C (TA)

Surface Mount

100-LQFP

100-LQFP (14x14)

SPC5746CFK1ACMH6

NXP

IC MCU 32BIT 3MB FLASH 100MAPBGA

Core Processor: e200z2, e200z4
Core Size: 32-Bit Dual-Core
Speed: 80MHz, 200MHz
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 65
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: 128K x 8
RAM Size: 384K x 8
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Data Converters: A/D 36x10b, 16x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Supplier Device Package: 100-MAPBGA (11x11)

封装: -

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32-Bit Dual-Core

80MHz, 200MHz

CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG

DMA, LVD, POR, WDT

65

3MB (3M x 8)

FLASH

128K x 8

384K x 8

3.15V ~ 5.5V

A/D 36x10b, 16x12b

Internal

-40°C ~ 85°C (TA)

Surface Mount

100-LFBGA

100-MAPBGA (11x11)