页 35 - NXP 产品 - 嵌入式 - 微控制器

LPC1751FBD80K

NXP

IC MCU 32BIT 32KB FLASH 80LQFP

Core Processor: ARM® Cortex®-M3
Core Size: 32-Bit Single-Core
Speed: 100MHz
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O: 52
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Data Converters: A/D 6x12b SAR
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Supplier Device Package: 80-LQFP (12x12)

封装: -

库存1,233

32-Bit Single-Core

100MHz

CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB

Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT

52

32KB (32K x 8)

FLASH

-

8K x 8

2.4V ~ 3.6V

A/D 6x12b SAR

Internal

-40°C ~ 85°C (TA)

Surface Mount

80-LQFP

80-LQFP (12x12)

SPC5604CK0VLH6

NXP

IC MCU 32BIT 512KB FLASH 64LQFP

Core Processor: e200z0h
Core Size: 32-Bit Single-Core
Speed: 64MHz
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 45
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 48K x 8
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Data Converters: A/D 28x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

封装: -

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32-Bit Single-Core

64MHz

CANbus, I2C, LINbus, SCI, SPI

DMA, POR, PWM, WDT

45

512KB (512K x 8)

FLASH

64K x 8

48K x 8

3V ~ 5.5V

A/D 28x10b

Internal

-40°C ~ 105°C (TA)

Surface Mount

64-LQFP

64-LQFP (10x10)

MC56F83663VLH

NXP

IC MCU 32BIT 128KB FLASH 64LQFP

Core Processor: 56800EX
Core Size: 32-Bit Single-Core
Speed: 100MHz
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Number of I/O: 54
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 48K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Data Converters: A/D 20x12b; D/A 2x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

封装: -

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32-Bit Single-Core

100MHz

CANbus, I2C, LINbus, SCI, SPI

Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT

54

128KB (128K x 8)

FLASH

-

48K x 8

2.7V ~ 3.6V

A/D 20x12b; D/A 2x12b

Internal

-40°C ~ 105°C (TA)

Surface Mount

64-LQFP

64-LQFP (10x10)

FD32K144HRT0VLHT

NXP

S32K144 32-BIT MCU, ARM CORTEX-M

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封装: -

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-

FD32K144HRT0VLFR

NXP

S32K144, 512K FLASH, 64K RAM

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封装: -

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-

FD32K144HRT0VLFT

NXP

S32K144, 512K FLASH, 64K RAM

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封装: -

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-

FD32K144HRT0VMHR

NXP

S32K144, 100 MAPBGA

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封装: -

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-

FD32K144HRT0VMHT

NXP

S32K144, 100 MAPBGA

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封装: -

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-

FB32K116BFT0MFMT

NXP

S32K116, M0+, FLASH 128K, RAM 17

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封装: -

Request a Quote

-

FB32K116BFT0MFMR

NXP

S32K116, M0+, FLASH 128K, RAM 17

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封装: -

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-

SPC5603BAMLH6

NXP

IC MCU 32BIT 384KB FLASH 64LQFP

Core Processor: e200z0
Core Size: 32-Bit
Speed: 64MHz
Connectivity: CANbus, FlexRay, LINbus, SCI, SPI
Peripherals: POR, LVD, PWM, WDT
Number of I/O: 45
Program Memory Size: 384KB (384K x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 28K x 8
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Data Converters: A/D 36x10b SAR
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

封装: -

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32-Bit

64MHz

CANbus, FlexRay, LINbus, SCI, SPI

POR, LVD, PWM, WDT

45

384KB (384K x 8)

FLASH

64K x 8

28K x 8

3V ~ 3.6V

A/D 36x10b SAR

Internal

-40°C ~ 125°C (TA)

Surface Mount

64-LQFP

64-LQFP (10x10)

S912ZVC19AMKHR

NXP

IC MCU 16BIT 192KB FLASH 64LQFP

Core Processor: S12Z
Core Size: 16-Bit
Speed: 32MHz
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 42
Program Memory Size: 192KB (192K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 12K x 8
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Data Converters: A/D 16x10b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Supplier Device Package: 64-LQFP (10x10)

封装: -

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16-Bit

32MHz

CANbus, I2C, SCI, SPI

DMA, LVD, POR, PWM, WDT

42

192KB (192K x 8)

FLASH

2K x 8

12K x 8

5.5V ~ 18V

A/D 16x10b SAR

External, Internal

-40°C ~ 125°C (TA)

Surface Mount

64-LQFP Exposed Pad

64-LQFP (10x10)

LPC55S14JBD64Y

NXP

IC MCU 32BIT 128KB FLASH 64HTQFP

Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit Single-Core
Speed: 150MHz
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O: 36
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 80K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 10x16b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-TQFP Exposed Pad
Supplier Device Package: 64-HTQFP (10x10)

封装: -

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32-Bit Single-Core

150MHz

CAN FD, Flexcomm, I2C, SPI, UART/USART, USB

Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT

36

128KB (128K x 8)

FLASH

-

80K x 8

1.8V ~ 3.6V

A/D 10x16b SAR

External, Internal

-40°C ~ 105°C (TA)

Surface Mount

64-TQFP Exposed Pad

64-HTQFP (10x10)

LPC55S14JBD64K

NXP

IC MCU 32BIT 128KB FLASH 64HTQFP

Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit Single-Core
Speed: 150MHz
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O: 36
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 80K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 10x16b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-TQFP Exposed Pad
Supplier Device Package: 64-HTQFP (10x10)

封装: -

Request a Quote

32-Bit Single-Core

150MHz

CAN FD, Flexcomm, I2C, SPI, UART/USART, USB

Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT

36

128KB (128K x 8)

FLASH

-

80K x 8

1.8V ~ 3.6V

A/D 10x16b SAR

External, Internal

-40°C ~ 105°C (TA)

Surface Mount

64-TQFP Exposed Pad

64-HTQFP (10x10)

LPC55S14JBD64E

NXP

IC MCU 32BIT 128KB FLASH 64HTQFP

Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit Single-Core
Speed: 150MHz
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O: 36
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 80K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 10x16b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-TQFP Exposed Pad
Supplier Device Package: 64-HTQFP (10x10)

封装: -

库存339

32-Bit Single-Core

150MHz

CAN FD, Flexcomm, I2C, SPI, UART/USART, USB

Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT

36

128KB (128K x 8)

FLASH

-

80K x 8

1.8V ~ 3.6V

A/D 10x16b SAR

External, Internal

-40°C ~ 105°C (TA)

Surface Mount

64-TQFP Exposed Pad

64-HTQFP (10x10)

S912ZVC19AMLFR

NXP

IC MCU 16BIT 192KB FLASH 48LQFP

Core Processor: S12Z
Core Size: 16-Bit
Speed: 32MHz
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 28
Program Memory Size: 192KB (192K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 12K x 8
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Data Converters: A/D 10x10b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

封装: -

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16-Bit

32MHz

CANbus, I2C, SCI, SPI

DMA, LVD, POR, PWM, WDT

28

192KB (192K x 8)

FLASH

2K x 8

12K x 8

5.5V ~ 18V

A/D 10x10b SAR

External, Internal

-40°C ~ 125°C (TA)

Surface Mount

48-LQFP

48-LQFP (7x7)

LPC11U36FBD64-40EL

NXP

IC MCU 32BIT 96KB FLASH 64LQFP

Core Processor: ARM® Cortex®-M0
Core Size: 32-Bit Dual-Core
Speed: 50MHz
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Number of I/O: 54
Program Memory Size: 96KB (96K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 10K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 8x10b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

封装: -

Request a Quote

32-Bit Dual-Core

50MHz

I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB

Brown-out Detect/Reset, POR, WDT

54

96KB (96K x 8)

FLASH

4K x 8

10K x 8

1.8V ~ 3.6V

A/D 8x10b SAR

External, Internal

-40°C ~ 85°C (TA)

Surface Mount

64-LQFP

64-LQFP (10x10)

LPC5512JBD100E

NXP

IC MCU 32BIT 64KB FLASH 100HLQFP

Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit Single-Core
Speed: 150MHz
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O: 64
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 48K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 10x16b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Supplier Device Package: 100-HLQFP (14x14)

封装: -

库存117

32-Bit Single-Core

150MHz

CAN FD, Flexcomm, I2C, SPI, UART/USART, USB

Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT

64

64KB (64K x 8)

FLASH

-

48K x 8

1.8V ~ 3.6V

A/D 10x16b SAR

External, Internal

-40°C ~ 105°C (TA)

Surface Mount

100-LQFP Exposed Pad

100-HLQFP (14x14)

LPC5512JBD100K

NXP

IC MCU 32BIT 64KB FLASH 100LQFP

Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit Single-Core
Speed: 150MHz
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O: 64
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 48K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 10x16b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Supplier Device Package: 100-HLQFP (14x14)

封装: -

Request a Quote

32-Bit Single-Core

150MHz

CAN FD, Flexcomm, I2C, SPI, UART/USART, USB

Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT

64

64KB (64K x 8)

FLASH

-

48K x 8

1.8V ~ 3.6V

A/D 10x16b SAR

External, Internal

-40°C ~ 105°C (TA)

Surface Mount

100-LQFP Exposed Pad

100-HLQFP (14x14)

LPC5512JBD100Y

NXP

IC MCU 32BIT 64KB FLASH 100LQFP

Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit Single-Core
Speed: 150MHz
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O: 64
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 48K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 10x16b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Supplier Device Package: 100-HLQFP (14x14)

封装: -

Request a Quote

32-Bit Single-Core

150MHz

CAN FD, Flexcomm, I2C, SPI, UART/USART, USB

Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT

64

64KB (64K x 8)

FLASH

-

48K x 8

1.8V ~ 3.6V

A/D 10x16b SAR

External, Internal

-40°C ~ 105°C (TA)

Surface Mount

100-LQFP Exposed Pad

100-HLQFP (14x14)

S912ZVMC64AVKHR

NXP

S12Z CORE,64K FLASH,CAN,64LQFP

Core Processor: S12Z
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 31
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Data Converters: A/D 9x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Supplier Device Package: 64-HLQFP (10x10)

封装: -

Request a Quote

16-Bit

50MHz

CANbus, SCI, SPI

DMA, POR, PWM, WDT

31

64KB (64K x 8)

FLASH

512 x 8

4K x 8

3.5V ~ 40V

A/D 9x12b SAR

External, Internal

-40°C ~ 105°C (TA)

Surface Mount

64-LQFP Exposed Pad

64-HLQFP (10x10)

LPC55S26JEV98K

NXP

IC MCU 32BIT 256KB FLASH 98VFBGA

Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit Single-Core
Speed: 150MHz
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O: 64
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 144K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 10x16b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 98-VFBGA
Supplier Device Package: 98-VFBGA (7x7)

封装: -

库存3,366

32-Bit Single-Core

150MHz

Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB

Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT

64

256KB (256K x 8)

FLASH

-

144K x 8

1.8V ~ 3.6V

A/D 10x16b

External, Internal

-40°C ~ 105°C (TA)

Surface Mount

98-VFBGA

98-VFBGA (7x7)

LPC55S26JEV98E

NXP

IC MCU 32BIT 256KB FLASH 98VFBGA

Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit Single-Core
Speed: 150MHz
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O: 64
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 144K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 10x16b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 98-VFBGA
Supplier Device Package: 98-VFBGA (7x7)

封装: -

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32-Bit Single-Core

150MHz

Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB

Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT

64

256KB (256K x 8)

FLASH

-

144K x 8

1.8V ~ 3.6V

A/D 10x16b

External, Internal

-40°C ~ 105°C (TA)

Surface Mount

98-VFBGA

98-VFBGA (7x7)

LPC55S26JEV98Y

NXP

IC MCU 32BIT 256KB FLASH 98VFBGA

Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit Single-Core
Speed: 150MHz
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O: 64
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 144K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 10x16b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 98-VFBGA
Supplier Device Package: 98-VFBGA (7x7)

封装: -

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32-Bit Single-Core

150MHz

Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB

Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT

64

256KB (256K x 8)

FLASH

-

144K x 8

1.8V ~ 3.6V

A/D 10x16b

External, Internal

-40°C ~ 105°C (TA)

Surface Mount

98-VFBGA

98-VFBGA (7x7)

SPC5775BSK3MME2R

NXP

NXP 32-BIT MCU, 4MB FLASH FCACS

Core Processor: e200z7
Core Size: 32-Bit Dual-Core
Speed: 220MHz
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCAN, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR
Number of I/O: -
Program Memory Size: 4MB (4M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Data Converters: -
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 416-BGA
Supplier Device Package: 416-MAPBGA (27x27)

封装: -

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32-Bit Dual-Core

220MHz

CANbus, EBI/EMI, Ethernet, FlexCAN, LINbus, SCI, SPI

DMA, LVD, POR

-

4MB (4M x 8)

FLASH

-

512K x 8

3V ~ 5.5V

-

External

-40°C ~ 125°C (TA)

Surface Mount

416-BGA

416-MAPBGA (27x27)

LPC11E36FBD64-501

NXP

IC MCU 32BIT FLASH

Core Processor: ARM® Cortex®-M0
Core Size: 32-Bit Single-Core
Speed: 50MHz
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: -
Number of I/O: 54
Program Memory Size: -
Program Memory Type: -
EEPROM Size: 4K x 8
RAM Size: 12K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: -
Supplier Device Package: -

封装: -

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32-Bit Single-Core

50MHz

I2C, Microwire, SmartCard, SPI, SSP, UART/USART

-

54

-

4K x 8

12K x 8

1.8V ~ 3.6V

A/D 8x10b

Internal

-40°C ~ 85°C (TA)

Surface Mount

-

FC32K146HAT0MLLT

NXP

IC

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封装: -

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-

FC32K146HAT0MLLR

NXP

IC

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封装: -

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-

LPC802M011JDH20J

NXP

LPC802M011JDH20

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 15MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O: 16
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Data Converters: A/D 12x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-TSSOP

封装: -

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32-Bit

15MHz

I2C, SPI, UART/USART

Brown-out Detect/Reset, POR, PWM, WDT

16

16KB (16K x 8)

FLASH

-

2K x 8

1.71V ~ 3.6V

A/D 12x12b SAR

External, Internal

-40°C ~ 105°C (TA)

Surface Mount

20-TSSOP (0.173", 4.40mm Width)

20-TSSOP

SP5744BSK1AMMH6R

NXP

IC MCU 32B 1.5MB FLASH 100MAPBGA

Core Processor: e200z4
Core Size: 32-Bit Single-Core
Speed: 160MHz
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Number of I/O: 65
Program Memory Size: 1.5MB (1.5M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 192K x 8
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Data Converters: A/D 36x10b, 16x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Supplier Device Package: 100-MAPBGA (11x11)

封装: -

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32-Bit Single-Core

160MHz

CANbus, Ethernet, FlexRay, I2C, LINbus, SPI

DMA, I2S, POR, WDT

65

1.5MB (1.5M x 8)

FLASH

64K x 8

192K x 8

3.15V ~ 5.5V

A/D 36x10b, 16x12b

Internal

-40°C ~ 85°C (TA)

Surface Mount

100-LFBGA

100-MAPBGA (11x11)