图片 |
零件编号 |
制造商 |
描述 |
封装 |
库存 |
数量 |
Core Size | Speed | Connectivity | Peripherals | Number of I/O | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC MCU 32BIT 256KB FLASH 44LGA
|
封装: 44-VFLGA |
库存6,224 |
|
32-Bit | 50MHz | I2C, SPI, UART/USART | DMA, LVD, POR, PWM, WDT | 26 | 256KB (256K x 8) | FLASH | - | 66K x 8 | 1.85 V ~ 3.6 V | - | External | -40°C ~ 85°C (TA) | - | 44-VFLGA | 44-MAPLGA (5x5) |
||
NXP |
IC MCU 32BIT 256KB FLASH 44LGA
|
封装: 44-VFLGA |
库存3,440 |
|
32-Bit | 50MHz | I2C, SCI, SPI, USB OTG | DMA, I2S, LVD, POR, PWM, WDT | 31 | 256KB (256K x 8) | FLASH | - | 64K x 8 | 1.85 V ~ 3.6 V | - | External | -40°C ~ 85°C (TA) | - | 44-VFLGA | 44-MAPLGA (5x5) |
||
NXP |
IC MCU 32BIT ROMLESS 364MAPBGA
|
封装: 364-LFBGA |
库存6,800 |
|
32-Bit Dual-Core | 500MHz | CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG | DMA, LVD, WDT | - | - | ROMless | - | 1.5MB | 3 V ~ 3.6 V | A/D Dual x 12b, D/A Dual x 12b | Internal | -40°C ~ 85°C (TA) | - | 364-LFBGA | 364-MAPBGA (17x17) |
||
NXP |
IC MCU 32BIT ROMLESS 364MAPBGA
|
封装: 364-LFBGA |
库存2,656 |
|
32-Bit Dual-Core | 500MHz | CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG | DMA, LVD, WDT | - | - | ROMless | - | 1.5MB | 3 V ~ 3.6 V | A/D Dual x 12b, D/A Dual x 12b | Internal | -40°C ~ 85°C (TA) | - | 364-LFBGA | 364-MAPBGA (17x17) |
||
NXP |
IC MCU 32BIT ROMLESS 364MAPBGA
|
封装: 364-LFBGA |
库存7,648 |
|
32-Bit Dual-Core | 400MHz | CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG | DMA, LVD, WDT | - | - | ROMless | - | 1.5MB | 3 V ~ 3.6 V | A/D Dual x 12b, D/A Dual x 12b | Internal | -40°C ~ 85°C (TA) | - | 364-LFBGA | 364-MAPBGA (17x17) |
||
NXP |
IC MCU 32BIT ROMLESS 364MAPBGA
|
封装: 364-LFBGA |
库存2,256 |
|
32-Bit Dual-Core | 500MHz | CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG | DMA, LVD, WDT | - | - | ROMless | - | 1.5MB | 3 V ~ 3.6 V | A/D Dual x 12b, D/A Dual x 12b | Internal | -40°C ~ 85°C (TA) | - | 364-LFBGA | 364-MAPBGA (17x17) |
||
NXP |
IC MCU 32BIT ROMLESS 364MAPBGA
|
封装: 364-LFBGA |
库存2,816 |
|
32-Bit Dual-Core | 400MHz | CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG | DMA, LVD, WDT | - | - | ROMless | - | 1.5MB | 3 V ~ 3.6 V | A/D Dual x 12b, D/A Dual x 12b | Internal | -40°C ~ 85°C (TA) | - | 364-LFBGA | 364-MAPBGA (17x17) |
||
NXP |
IC MCU 32BIT ROMLESS 364MAPBGA
|
封装: 364-LFBGA |
库存3,840 |
|
32-Bit Single-Core | 500MHz | CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG | DMA, LVD, WDT | - | - | ROMless | - | 1.5MB | 3 V ~ 3.6 V | A/D Dual x 12b, D/A Dual x 12b | Internal | -40°C ~ 85°C (TA) | - | 364-LFBGA | 364-MAPBGA (17x17) |
||
NXP |
IC MCU 32BIT ROMLESS 364MAPBGA
|
封装: 364-LFBGA |
库存6,168 |
|
32-Bit Single-Core | 500MHz | CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG | DMA, LVD, WDT | - | - | ROMless | - | 1.5MB | 3 V ~ 3.6 V | A/D Dual x 12b, D/A Dual x 12b | Internal | -40°C ~ 85°C (TA) | - | 364-LFBGA | 364-MAPBGA (17x17) |
||
NXP |
IC MCU 32BIT ROMLESS 364MAPBGA
|
封装: 364-LFBGA |
库存2,800 |
|
32-Bit Single-Core | 500MHz | CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG | DMA, LVD, WDT | - | - | ROMless | - | 1.5MB | 3 V ~ 3.6 V | A/D Dual x 12b, D/A Dual x 12b | Internal | -40°C ~ 85°C (TA) | - | 364-LFBGA | 364-MAPBGA (17x17) |
||
NXP |
IC MCU 32BIT ROMLESS 364MAPBGA
|
封装: 364-LFBGA |
库存2,352 |
|
32-Bit Single-Core | 400MHz | CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG | DMA, LVD, WDT | - | - | ROMless | - | 1.5MB | 3 V ~ 3.6 V | A/D Dual x 12b, D/A Dual x 12b | Internal | -40°C ~ 85°C (TA) | - | 364-LFBGA | 364-MAPBGA (17x17) |
||
NXP |
IC MCU 32BIT ROMLESS 364MAPBGA
|
封装: 364-LFBGA |
库存3,312 |
|
32-Bit Single-Core | 500MHz | CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG | DMA, LVD, WDT | - | - | ROMless | - | 1.5MB | 3 V ~ 3.6 V | A/D Dual x 12b, D/A Dual x 12b | Internal | -40°C ~ 85°C (TA) | - | 364-LFBGA | 364-MAPBGA (17x17) |
||
NXP |
IC MCU 32BIT ROMLESS 364MAPBGA
|
封装: 364-LFBGA |
库存7,744 |
|
32-Bit Single-Core | 400MHz | CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG | DMA, LVD, WDT | - | - | ROMless | - | 1.5MB | 3 V ~ 3.6 V | A/D Dual x 12b, D/A Dual x 12b | Internal | -40°C ~ 85°C (TA) | - | 364-LFBGA | 364-MAPBGA (17x17) |
||
NXP |
IC MCU 32BIT ROMLESS 176LQFP
|
封装: 176-LQFP Exposed Pad |
库存6,320 |
|
32-Bit Single-Core | 266MHz | CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG | DMA, LVD, WDT | - | - | ROMless | - | 1.5MB | 3 V ~ 3.6 V | A/D Dual x 12b, D/A Dual x 12b | Internal | -40°C ~ 85°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP-EP (24x24) |
||
NXP |
IC MCU 32BIT ROMLESS 176LQFP
|
封装: 176-LQFP Exposed Pad |
库存23,724 |
|
32-Bit Single-Core | 266MHz | CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG | DMA, LVD, WDT | - | - | ROMless | - | 1.5MB | 3 V ~ 3.6 V | A/D Dual x 12b, D/A Dual x 12b | Internal | -40°C ~ 85°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP-EP (24x24) |
||
NXP |
IC MCU 32BIT ROMLESS 364MAPBGA
|
封装: 364-LFBGA |
库存7,408 |
|
32-Bit Dual-Core | 500MHz | CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG | DMA, LVD, WDT | - | - | ROMless | - | 1.5MB | 3 V ~ 3.6 V | A/D Dual x 12b, D/A Dual x 12b | Internal | -40°C ~ 85°C (TA) | - | 364-LFBGA | 364-MAPBGA (17x17) |
||
NXP |
IC MCU 32BIT ROMLESS 364MAPBGA
|
封装: 364-LFBGA |
库存2,000 |
|
32-Bit Dual-Core | 400MHz | CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG | LCD, SAI | 136 | - | ROMless | - | 1.5MB | 3 V ~ 3.6 V | A/D 10x12b | Internal | -40°C ~ 85°C (TA) | - | 364-LFBGA | 364-MAPBGA (17x17) |
||
NXP |
IC MCU 32BIT ROMLESS 364MAPBGA
|
封装: 364-LFBGA |
库存7,632 |
|
32-Bit Dual-Core | 400MHz | CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG | LCD, SAI | 136 | - | ROMless | - | 1.5MB | 3 V ~ 3.6 V | A/D 10x12b | Internal | -40°C ~ 85°C (TA) | - | 364-LFBGA | 364-MAPBGA (17x17) |
||
NXP |
IC MCU 32BIT ROMLESS 364MAPBGA
|
封装: 364-LFBGA |
库存5,312 |
|
32-Bit Dual-Core | 400MHz | CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG | LCD, SAI | 136 | - | ROMless | - | 1MB | 3 V ~ 3.6 V | A/D 10x12b | Internal | -40°C ~ 85°C (TA) | - | 364-LFBGA | 364-MAPBGA (17x17) |
||
NXP |
IC MCU 32BIT ROMLESS 364MAPBGA
|
封装: 364-LFBGA |
库存3,136 |
|
32-Bit Dual-Core | 400MHz | CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG | LCD, SAI | 136 | - | ROMless | - | 1.5MB | 3 V ~ 3.6 V | A/D 10x12b | Internal | -40°C ~ 85°C (TA) | - | 364-LFBGA | 364-MAPBGA (17x17) |
||
NXP |
IC MCU 32BIT ROMLESS 364MAPBGA
|
封装: 364-LFBGA |
库存2,288 |
|
32-Bit Single-Core | 400MHz | CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG | LCD, SAI | 136 | - | ROMless | - | 1.5MB | 3 V ~ 3.6 V | A/D 10x12b | Internal | -40°C ~ 85°C (TA) | - | 364-LFBGA | 364-MAPBGA (17x17) |
||
NXP |
IC MCU 32BIT ROMLESS 364MAPBGA
|
封装: 364-LFBGA |
库存2,960 |
|
32-Bit Single-Core | 400MHz | CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG | LCD, SAI | 136 | - | ROMless | - | 1.5MB | 3 V ~ 3.6 V | A/D 10x12b | Internal | -40°C ~ 85°C (TA) | - | 364-LFBGA | 364-MAPBGA (17x17) |
||
NXP |
IC MCU 32BIT ROMLESS 176LQFP
|
封装: 176-LQFP Exposed Pad |
库存4,000 |
|
32-Bit Dual-Core | 266MHz | CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG | LCD, SAI | 115 | - | ROMless | - | 1.5MB | 3 V ~ 3.6 V | A/D 10x12b | Internal | -40°C ~ 85°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP-EP (24x24) |
||
NXP |
IC MCU 32BIT ROMLESS 176LQFP
|
封装: 176-LQFP Exposed Pad |
库存2,976 |
|
32-Bit Dual-Core | 266MHz | CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG | LCD, SAI | 115 | - | ROMless | - | 1.5MB | 3 V ~ 3.6 V | A/D 10x12b | Internal | -40°C ~ 85°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP-EP (24x24) |
||
NXP |
IC MCU 32BIT ROMLESS 176LQFP
|
封装: 176-LQFP Exposed Pad |
库存5,536 |
|
32-Bit Single-Core | 266MHz | CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG | LCD, SAI | 115 | - | ROMless | - | 1.5MB | 3 V ~ 3.6 V | A/D 10x12b | Internal | -40°C ~ 85°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP-EP (24x24) |
||
NXP |
IC MCU 32BIT ROMLESS 176LQFP
|
封装: 176-LQFP Exposed Pad |
库存5,040 |
|
32-Bit Single-Core | 266MHz | CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG | LCD, SAI | 115 | - | ROMless | - | 1.5MB | 3 V ~ 3.6 V | A/D 10x12b | Internal | -40°C ~ 85°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP-EP (24x24) |
||
NXP |
IC MCU 32BIT 1.5MB FLASH 208LQFP
|
封装: 208-LQFP |
库存3,312 |
|
32-Bit | 120MHz | CAN, I2C, LIN, SCI, SPI | DMA, POR, PWM, WDT | 177 | 1.5MB (1.5M x 8) | FLASH | 4K x 16 | 128K x 8 | 3 V ~ 5.5 V | A/D 43x10b/12b | Internal | -40°C ~ 105°C (TA) | - | 208-LQFP | 208-LQFP (28x28) |
||
NXP |
IC MCU 32BIT 768KB FLASH 144LQFP
|
封装: 144-LQFP |
库存4,000 |
|
32-Bit | 60MHz | CAN, EBI/EMI, LIN, SCI, SPI, UART/USART | DMA, POR, PWM, WDT | 80 | 768KB (768K x 8) | FLASH | - | 48K x 8 | 4.5 V ~ 5.25 V | A/D 32x12b | Internal | -40°C ~ 150°C (TA) | - | 144-LQFP | 144-LQFP (20x20) |
||
NXP |
IC MCU 32BIT ROMLESS 160MAPBGA
|
封装: - |
库存110,616 |
|
32-Bit | 140MHz | I2C, IDE, Memory Card, SPI, UART/USART | DMA, I2S, POR, Serial Audio, WDT | 47 | - | ROMless | - | 96K x 8 | 3 V ~ 3.6 V | A/D 4x12b | External | -20°C ~ 70°C (TA) | - | - | 160-MAPBGA (15x15) |
||
NXP |
IC MCU 16BIT 48KB FLASH 32LQFP
|
封装: 32-LQFP |
库存2,448 |
|
16-Bit | 25MHz | IrDA, LIN, SCI, SPI | LVD, POR, PWM, WDT | 16 | 48KB (48K x 8) | FLASH | 512 x 8 | 2K x 8 | 3.13 V ~ 5.5 V | A/D 2x10b | Internal | -40°C ~ 85°C (TA) | - | 32-LQFP | 32-LQFP (7x7) |