图片 |
零件编号 |
制造商 |
描述 |
封装 |
库存 |
数量 |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Micron Technology Inc. |
IC SRAM 18MBIT PARALLEL 165FBGA
|
封装: - |
Request a Quote |
|
SRAM | SRAM - Standard | 18Mbit | Parallel | 133 MHz | - | 4.2 ns | 3.135V ~ 3.465V | 0°C ~ 70°C (TA) | Surface Mount | 165-TBGA | 165-FBGA (13x15) |
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Micron Technology Inc. |
LPDDR4 32G 512MX64 FBGA
|
封装: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4X | 32Gbit | Parallel | 2.133 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V | -40°C ~ 95°C (TC) | Surface Mount | 556-TFBGA | 556-WFBGA (12.4x12.4) |
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Micron Technology Inc. |
IC FLASH 512GBIT EMMC 153VFBGA
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封装: - |
库存5,874 |
|
FLASH | FLASH - NAND | 512Gbit | eMMC | 200 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 153-VFBGA | 153-VFBGA (11.5x13) |
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Micron Technology Inc. |
EMMC 512G
|
封装: - |
Request a Quote |
|
FLASH | FLASH - NAND (SLC) | 512Gbit | eMMC_5.1 | 200 MHz | - | - | 2.7V ~ 3.6V | -25°C ~ 85°C (TA) | Surface Mount | 153-VFBGA | 153-VFBGA (11.5x13) |
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Micron Technology Inc. |
LPDDR5 32G 512MX64 FBGA QDP
|
封装: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR5 | 32Gbit | Parallel | 3.2 GHz | - | - | - | -25°C ~ 85°C | - | - | - |
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Micron Technology Inc. |
IC FLASH 512GBIT PAR 132VBGA
|
封装: - |
Request a Quote |
|
FLASH | FLASH - NAND (TLC) | 512Gbit | Parallel | 333 MHz | - | - | 2.5V ~ 3.6V | 0°C ~ 70°C (TA) | Surface Mount | 132-VBGA | 132-VBGA (12x18) |
||
Micron Technology Inc. |
LPDDR5 32G 512MX64 FBGA QDP
|
封装: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR5 | 32Gbit | Parallel | 3.2 GHz | - | - | - | -40°C ~ 125°C | Surface Mount | 441-TFBGA | 441-TFBGA (14x14) |
||
Micron Technology Inc. |
LPDDR5 FBGA Y42M
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
LPDDR5 48G 1.5GX32 FBGA
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
UMCP 1056G
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC SRAM 4MBIT PARALLEL 100TQFP
|
封装: - |
Request a Quote |
|
SRAM | SRAM - Standard | 4Mbit | Parallel | 66 MHz | - | 10 ns | 3.135V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x20.1) |
||
Micron Technology Inc. |
DRAM LPDDR4 128G 2GX64 FBGA 8DP
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
DRAM LPDDR4 128G 2GX64 FBGA 8DP
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
LPDDR4 12G QDP
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
GDDR6 16GBIT 32 180/252 TFBGA 2
|
封装: - |
Request a Quote |
|
DRAM | SGRAM - GDDR6 | 16Gbit | POD_135 | 9 GHz | - | - | 1.3095V ~ 1.391V | 0°C ~ 95°C (TC) | Surface Mount | 180-TFBGA | 180-FBGA (12x14) |
||
Micron Technology Inc. |
IC SRAM 2MBIT PARALLEL 100TQFP
|
封装: - |
Request a Quote |
|
SRAM | SRAM - Standard | 2Mbit | Parallel | 133 MHz | - | 4 ns | 3.135V ~ 3.6V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x20.1) |
||
Micron Technology Inc. |
SPECIAL/CUSTOM LPDDR4
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
LPDDR5 16GBIT 32 315/315 TFBGA 1
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC DRAM 12GBIT 1.866GHZ 200WFBGA
|
封装: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4 | 12Gbit | - | 1.866 GHz | - | - | 1.1V | -40°C ~ 105°C (TC) | Surface Mount | 200-WFBGA | 200-WFBGA (10x14.5) |
||
Micron Technology Inc. |
GDDR6 16G 512MX32 FBGA DDP
|
封装: - |
库存3,732 |
|
DRAM | SGRAM - GDDR6 | 16Gbit | POD_135 | 8 GHz | - | - | 1.3095V ~ 1.3905V | 0°C ~ 95°C (TC) | Surface Mount | 180-TFBGA | 180-FBGA (12x14) |
||
Micron Technology Inc. |
GDDR6 16GBIT 32 180/252 TFBGA 2
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
GDDR6 16G 512MX32 FBGA DDP
|
封装: - |
库存3,759 |
|
DRAM | SGRAM - GDDR6 | 16Gbit | POD_135 | 7 GHz | - | - | 1.3095V ~ 1.3905V | 0°C ~ 95°C (TC) | Surface Mount | 180-TFBGA | 180-FBGA (12x14) |
||
Micron Technology Inc. |
FLASH NOR 8Mb 5v SOIC (Btm Bt-Bl
|
封装: - |
Request a Quote |
|
FLASH | FLASH - NOR | 8Mbit | Parallel | - | 55ns | 55 ns | 4.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 44-SOIC | 44-SOIC (0.496", 12.60mm Width) |
||
Micron Technology Inc. |
LPDDR5 96G 3GX32 FBGA
|
封装: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR5 | 96Gbit | Parallel | 3.2 GHz | - | - | - | -25°C ~ 85°C | - | - | - |
||
Micron Technology Inc. |
IC FLASH 128MBIT SPI/QUAD 166MHZ
|
封装: - |
Request a Quote |
|
FLASH | FLASH - NOR | 128Mbit | SPI - Quad I/O | 166 MHz | 1.8ms | 5 ns | 1.7V ~ 2V | -40°C ~ 85°C (TA) | - | - | - |
||
Micron Technology Inc. |
LPDDR5 128GBIT 64 441/441 TFBGA
|
封装: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR5 | 128Gbit | Parallel | 4.266 GHz | - | - | 1.05V | -40°C ~ 105°C | Surface Mount | 441-TFBGA | 441-TFBGA (14x14) |
||
Micron Technology Inc. |
LPDDR5 QDP Y4BM
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
DDR4 16G 2GX8 FBGA
|
封装: - |
Request a Quote |
|
DRAM | SDRAM - DDR4 | 16Gbit | POD | 1.6 GHz | 15ns | 19 ns | 1.14V ~ 1.26V | -40°C ~ 95°C (TC) | Surface Mount | 78-TFBGA | 78-FBGA (9x11) |
||
Micron Technology Inc. |
IC DRAM 4GBIT PARALLEL 96FBGA
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | Surface Mount | 96-TFBGA | 96-FBGA (7.5x13) |
||
Micron Technology Inc. |
IC DRAM 24GBIT 2.133GHZ FBGA QDP
|
封装: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4 | 24Gbit | - | 2.133 GHz | - | - | 1.1V | -30°C ~ 85°C (TC) | - | - | - |