图片 |
零件编号 |
制造商 |
描述 |
封装 |
库存 |
数量 |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC CESOP PROC 1024CH 552BGA
|
封装: 552-BGA |
库存5,184 |
|
TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 552-BGA | 552-PBGA (35x35) |
||
Microchip Technology |
TEMAP 84FDL, LF BUMP
|
封装: - |
库存2,816 |
|
E1, T1 | - | - | - | - | - | - | - | - |
||
Microchip Technology |
HIGH DENSITY FRAMER/MAPPER FOR 8
|
封装: - |
库存4,144 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
ARROW 8XFE PB FREE
|
封装: - |
库存3,920 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
8 CHANNEL FAST ETHERNET OVER SON
|
封装: - |
库存3,104 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
ARROW M8XFE
|
封装: - |
库存6,576 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CESOP PROCESSOR 552BGA
|
封装: 552-BGA |
库存3,504 |
|
TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 552-BGA | 552-PBGA (35x35) |
||
Microchip Technology |
8 CHANNEL 10/100 OR 1XGE ETHERNE
|
封装: - |
库存5,968 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
TEMAP 84FDL GREEN DUAL PASSIVATI
|
封装: - |
库存3,696 |
|
E1, T1 | - | - | - | - | - | - | - | - |
||
Microchip Technology |
HIGH DENSITY FRAMER/MAPPER FOR 8
|
封装: - |
库存5,184 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
SINGLE-CHIP SONET/SDH TRANSPORT
|
封装: - |
库存4,944 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
TELECOM INTERFACE ICS 32 LINK
|
封装: - |
库存3,152 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CESOP PROC 256CH 552BGA
|
封装: 552-BGA |
库存5,520 |
|
TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 552-BGA | 552-PBGA (35x35) |
||
Microchip Technology |
IC DGTL SWITCH F16KDX 272BGA
|
封装: 272-BGA |
库存4,416 |
|
- | 1 | 3V ~ 3.6V | 160mA | - | -40°C ~ 85°C | Surface Mount | 272-BGA | 272-PBGA (27x27) |
||
Microchip Technology |
32 CHANNEL T1/E1 FRAMER
|
封装: - |
库存6,816 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
32 LINK, 256 HDLC CHANNEL FRAME
|
封装: - |
库存3,904 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CESOP PROCESSOR 128CH 324BGA
|
封装: 324-BGA |
库存5,760 |
|
TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
||
Microchip Technology |
32CHANNEL T1/E1 FRAMER DEVICE WI
|
封装: - |
库存5,040 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
32CHANNEL T1/E1 FRAMER DEVICE WI
|
封装: - |
库存6,224 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CESOP PROCESSOR 128CH 552BGA
|
封装: 552-BGA |
库存5,296 |
|
TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 552-BGA | 552-PBGA (35x35) |
||
Microchip Technology |
IC CESOP PROCESSOR 64CH 324BGA
|
封装: 324-BGA |
库存2,192 |
|
TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
||
Microchip Technology |
IC VOICE ECHO CANCELLER 208LBGA
|
封装: 208-LBGA |
库存2,272 |
|
- | 1 | 1.6V ~ 2V | 10mA | - | -40°C ~ 85°C | Surface Mount | 208-LBGA | 208-LBGA (17x17) |
||
Microchip Technology |
IC CESOP PROCESSOR 32CH 324BGA
|
封装: 324-BGA |
库存5,200 |
|
TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
||
Microchip Technology |
IC DIGITAL SWITCH 16K CH 256LQFP
|
封装: 256-LQFP |
库存7,536 |
|
- | 1 | 1.71V ~ 1.89V | 240mA | - | -40°C ~ 85°C | Surface Mount | 256-LQFP | 256-LQFP (28x28) |
||
Microchip Technology |
IC TDM SWITCH 4K-CH ENH 256LQFP
|
封装: 256-LQFP |
库存2,768 |
|
- | 1 | 1.71V ~ 1.89V | 1.75mA | - | -40°C ~ 85°C | Surface Mount | 256-LQFP | 256-LQFP (28x28) |
||
Microchip Technology |
33 CHANNEL T1/E1 FRAMER
|
封装: - |
库存7,248 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC DGTL SWITCH F8KDX 196BGA
|
封装: 196-BGA |
库存2,336 |
|
- | 1 | 3V ~ 3.6V | 160mA | - | -40°C ~ 85°C | Surface Mount | 196-BGA | 196-PBGA (15x15) |
||
Microchip Technology |
IC VOICE ECHO CANCELLER 100LQFP
|
封装: 100-LQFP |
库存3,824 |
|
LIU | 1 | 1.6V ~ 2V | 40mA | - | -40°C ~ 85°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
||
Microchip Technology |
IC TDM SWITCH 4K-CH ENH 256LQFP
|
封装: 256-LQFP |
库存7,984 |
|
- | 1 | 1.71V ~ 1.89V | 175mA | - | -40°C ~ 85°C | Surface Mount | 256-LQFP | 256-LQFP (28x28) |
||
Microchip Technology |
IC TDM SWITCH 4K-CH ENH 256BGA
|
封装: 256-BGA |
库存2,512 |
|
- | 1 | 1.71V ~ 1.89V | 175mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-BGA (17x17) |