图片 |
零件编号 |
制造商 |
描述 |
封装 |
库存 |
数量 |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC CLK BUFFER 1:1 1MHZ 33QFN
|
封装: 16-WFQFN Exposed Pad |
库存7,248 |
|
1 | 1:1 | No/Yes | CMOS, LVDS, PECL, Sine Wave, TTL | LVDS | 1MHz | 2.25 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:1 1MHZ 33QFN
|
封装: 16-WFQFN Exposed Pad |
库存16,056 |
|
1 | 1:1 | No/Yes | CMOS, LVDS, PECL, Sine Wave, TTL | LVDS | 1MHz | 2.25 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:1 200MHZ 8SOIC
|
封装: 8-SOIC (0.154", 3.90mm Width) |
库存6,864 |
|
1 | 1:1 | No/No | LVCMOS, Sine Wave | LVCMOS | 200MHz | 2.5 V ~ 3.3 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Microchip Technology |
IC CLK BUFFER 1:1 1MHZ 16SOIC
|
封装: 8-SOIC (0.154", 3.90mm Width) |
库存4,752 |
|
1 | 1:1 | No/Yes | CMOS, LVDS, PECL, Sine Wave, TTL | LVDS | 1MHz | 2.25 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Microchip Technology |
IC CLK BUFFER 1:1 200MHZ 8SOIC
|
封装: 8-SOIC (0.154", 3.90mm Width) |
库存7,520 |
|
1 | 1:1 | No/No | LVCMOS, Sine Wave | LVCMOS | 200MHz | 2.5 V ~ 3.3 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Microchip Technology |
IC CLK BUFFER 2:10 3GHZ 32TQFP
|
封装: 32-TQFP |
库存6,352 |
|
1 | 2:10 | Yes/Yes | HSTL, LVECL, LVPECL | LVECL, LVPECL | 3GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 2:4 2.5GHZ 16TSSOP
|
封装: 16-TSSOP (0.173", 4.40mm Width) |
库存5,472 |
|
1 | 2:4 | Yes/Yes | HSTL, LVECL, LVPECL | LVECL, LVPECL | 2.5GHz | 2.97 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 2:10 3GHZ 32TQFP
|
封装: 32-TQFP |
库存5,696 |
|
1 | 2:10 | Yes/Yes | HSTL, LVECL, LVPECL | LVECL, LVPECL | 3GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 2:4 2.5GHZ 16TSSOP
|
封装: 16-TSSOP (0.173", 4.40mm Width) |
库存9,648 |
|
1 | 2:4 | Yes/Yes | HSTL, LVECL, LVPECL | LVECL, LVPECL | 2.5GHz | 2.97 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:2 3GHZ 16MLF
|
封装: 16-VFQFN Exposed Pad, 16-MLF? |
库存5,376 |
|
1 | 1:2 | Yes/Yes | CML, LVDS, LVPECL | LVDS | 3GHz | 2.375 V ~ 2.635 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:2 3GHZ 16MLF
|
封装: 16-VFQFN Exposed Pad, 16-MLF? |
库存5,536 |
|
1 | 1:2 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 3GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:2 3GHZ 16MLF
|
封装: 16-VFQFN Exposed Pad, 16-MLF? |
库存7,456 |
|
1 | 1:2 | Yes/Yes | CML, LVDS, LVPECL | CML | 3GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:4 40MHZ 16TSSOP
|
封装: 16-TSSOP (0.173", 4.40mm Width) |
库存6,832 |
|
1 | 1:4 | No/No | Crystal | LVCMOS | 40MHz | 1.62 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 2:4 2.5GHZ 16TSSOP
|
封装: 16-TSSOP (0.173", 4.40mm Width) |
库存19,956 |
|
1 | 2:4 | Yes/Yes | HSTL, LVECL, LVPECL | LVECL, LVPECL | 2.5GHz | 2.375 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Microchip Technology |
IC CLK MULTIPLX 2:1 2.5GHZ 32MLF
|
封装: 32-VFQFN Exposed Pad, 32-MLF? |
库存4,896 |
|
2 | 2:1 | Yes/Yes | CML, LVDS, PECL | LVPECL | 2.5GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:6 150MHZ 16TSSOP
|
封装: 16-TSSOP (0.173", 4.40mm Width) |
库存11,832 |
|
1 | 1:6 | No/No | LVCMOS | LVCMOS | 150MHz | 2.25 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:2 3GHZ 8SOIC
|
封装: 8-SOIC (0.154", 3.90mm Width) |
库存4,752 |
|
1 | 1:2 | Yes/Yes | LVECL, LVPECL | LVECL, LVPECL | 3GHz | 2.375 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC CLK BUFFER 2:4 16SOIC
|
封装: 16-SOIC (0.154", 3.90mm Width) |
库存4,384 |
|
1 | 2:4 | Yes/Yes | ECL, PECL | ECL, PECL | - | 3 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Microchip Technology |
IC CLK BUFFER 1:2 3GHZ 8MSOP
|
封装: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
库存4,720 |
|
1 | 1:2 | Yes/Yes | LVECL, LVPECL | LVECL, LVPECL | 3GHz | 2.375 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
IC CLK BUFFER 2:4 267MHZ 20TSSOP
|
封装: 20-TSSOP (0.173", 4.40mm Width) |
库存6,384 |
|
1 | 2:4 | Yes/Yes | HCSL, LVDS | HCSL, LVDS | 267MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:4 150MHZ 8SOIC
|
封装: 8-SOIC (0.154", 3.90mm Width) |
库存7,088 |
|
1 | 1:4 | No/No | LVCMOS | LVCMOS | 150MHz | 2.25 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Microchip Technology |
IC CLK BUFFER 1:2 8SOIC
|
封装: 8-SOIC (0.154", 3.90mm Width) |
库存515,640 |
|
1 | 1:2 | Yes/Yes | Clock | Clock | - | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC CLK BUFFER 1:6 16QFN33
|
封装: 16-WFQFN Exposed Pad |
库存7,040 |
|
1 | 1:6 | No/No | Crystal | LVCMOS | 40MHz | 1.62 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:6 16QFN33
|
封装: 16-WFQFN Exposed Pad |
库存2,432 |
|
1 | 1:6 | No/No | Crystal | LVCMOS | 40MHz | 1.62 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:6 150MHZ 16TSSOP
|
封装: 16-TSSOP (0.173", 4.40mm Width) |
库存4,688 |
|
1 | 1:6 | No/No | LVCMOS | LVCMOS | 150MHz | 2.25 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:1 200MHZ 8TSSOP
|
封装: 8-TSSOP (0.173", 4.40mm Width) |
库存7,328 |
|
1 | 1:1 | No/No | LVCMOS, Sine Wave | LVCMOS | 200MHz | 2.5 V ~ 3.3 V | 0°C ~ 70°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 2:8 800MHZ 28PLCC
|
封装: 28-LCC (J-Lead) |
库存4,512 |
|
1 | 2:8 | Yes/Yes | LVECL, LVPECL | LVECL, LVPECL | 800MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:4 650MHZ 20TSSOP
|
封装: 20-TSSOP (0.173", 4.40mm Width) |
库存2,528 |
|
1 | 1:4 | No/Yes | LVCMOS, LVTTL | LVDS | 650MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:5 134MHZ 8SOIC
|
封装: 8-SOIC (0.154", 3.90mm Width) |
库存3,056 |
|
1 | 1:5 | No/No | CMOS | CMOS | 134MHz | 1.62 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Microchip Technology |
IC CLK BUFFER 1:2 200MHZ 6DFN
|
封装: 6-UFDFN Exposed Pad |
库存2,464 |
|
1 | 1:2 | No/No | LVCMOS | LVCMOS | 200MHz | 1.62 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 6-UFDFN Exposed Pad | 6-DFN (1.3x2) |