页 54 - Intel 产品 | 深圳黑森尔电子
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Intel 产品

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页  54/328
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10AS057K1F35E1SG
Intel

IC SOC FPGA 396 I/O 1152FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 570K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FCBGA (35x35)
封装: 1152-BBGA, FCBGA
库存2,208
hot 5CSEMA4U23C8N
Intel

IC FPGA 188 I/O 672UBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz
  • Primary Attributes: FPGA - 40K Logic Elements
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 672-FBGA
  • Supplier Device Package: 672-UBGA (23x23)
封装: 672-FBGA
库存4,368
10AX027H2F34I1SG
Intel

IC FPGA 384 I/O 1152FCBGA

  • Number of LABs/CLBs: 101620
  • Number of Logic Elements/Cells: 270000
  • Total RAM Bits: 17870848
  • Number of I/O: 384
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.98 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封装: 1152-BBGA, FCBGA
库存3,280
EP2A40B652C8
Intel

IC FPGA

  • Number of LABs/CLBs: 3840
  • Number of Logic Elements/Cells: 38400
  • Total RAM Bits: 655360
  • Number of I/O: -
  • Number of Gates: 3000000
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
封装: -
库存4,928
EP20K100EBC356-1
Intel

IC FPGA 246 I/O 356BGA

  • Number of LABs/CLBs: 416
  • Number of Logic Elements/Cells: 4160
  • Total RAM Bits: 53248
  • Number of I/O: 246
  • Number of Gates: 263000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 356-LBGA
  • Supplier Device Package: 356-BGA (35x35)
封装: 356-LBGA
库存5,568
EP1S20F780C5
Intel

IC FPGA 586 I/O 780FBGA

  • Number of LABs/CLBs: 1846
  • Number of Logic Elements/Cells: 18460
  • Total RAM Bits: 1669248
  • Number of I/O: 586
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-FBGA (29x29)
封装: 780-BBGA, FCBGA
库存7,584
EP4S40G2F40I3N
Intel

IC FPGA 654 I/O 1517FBGA

  • Number of LABs/CLBs: 9120
  • Number of Logic Elements/Cells: 228000
  • Total RAM Bits: 17544192
  • Number of I/O: 654
  • Number of Gates: -
  • Voltage - Supply: 0.92 V ~ 0.98 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封装: 1517-BBGA, FCBGA
库存6,768
5SGXEA4H3F35C2N
Intel

IC FPGA 552 I/O 1152FBGA

  • Number of LABs/CLBs: 158500
  • Number of Logic Elements/Cells: 420000
  • Total RAM Bits: 43983872
  • Number of I/O: 552
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封装: 1152-BBGA, FCBGA
库存5,568
5SGXEABK3H40C3N
Intel

IC FPGA 696 I/O 1517HBGA

  • Number of LABs/CLBs: 359200
  • Number of Logic Elements/Cells: 952000
  • Total RAM Bits: 65561600
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-HBGA (45x45)
封装: 1517-BBGA, FCBGA
库存7,504
EP2AGX95DF25C6
Intel

IC FPGA 260 I/O 572FBGA

  • Number of LABs/CLBs: 3747
  • Number of Logic Elements/Cells: 89178
  • Total RAM Bits: 6839296
  • Number of I/O: 260
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 572-BGA, FCBGA
  • Supplier Device Package: 572-FBGA, FC (25x25)
封装: 572-BGA, FCBGA
库存4,528
10AX016E3F27I1HG
Intel

IC FPGA 240 I/O 672FBGA

  • Number of LABs/CLBs: 61510
  • Number of Logic Elements/Cells: 160000
  • Total RAM Bits: 10086400
  • Number of I/O: 240
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.98 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 672-BBGA, FCBGA
  • Supplier Device Package: 672-FBGA (27x27)
封装: 672-BBGA, FCBGA
库存3,808
5AGXMA7D6F27C6N
Intel

IC FPGA 336 I/O 672FBGA

  • Number of LABs/CLBs: 11460
  • Number of Logic Elements/Cells: 242000
  • Total RAM Bits: 15470592
  • Number of I/O: 336
  • Number of Gates: -
  • Voltage - Supply: 1.07 V ~ 1.13 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 672-BBGA, FCBGA
  • Supplier Device Package: 672-FBGA (27x27)
封装: 672-BBGA, FCBGA
库存6,736
EP4CE22E22C6
Intel

IC FPGA 79 I/O 144EQFP

  • Number of LABs/CLBs: 1395
  • Number of Logic Elements/Cells: 22320
  • Total RAM Bits: 608256
  • Number of I/O: 79
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 144-LQFP Exposed Pad
  • Supplier Device Package: 144-EQFP (20x20)
封装: 144-LQFP Exposed Pad
库存2,688
EP3C16M164C7N
Intel

IC FPGA 92 I/O 164MBGA

  • Number of LABs/CLBs: 963
  • Number of Logic Elements/Cells: 15408
  • Total RAM Bits: 516096
  • Number of I/O: 92
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 164-TFBGA
  • Supplier Device Package: 164-MBGA (8x8)
封装: 164-TFBGA
库存3,584
hot EPM3064ALC44-10N
Intel

IC CPLD 64MC 10NS 44PLCC

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 10.0ns
  • Voltage Supply - Internal: 3 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 4
  • Number of Macrocells: 64
  • Number of Gates: 1250
  • Number of I/O: 34
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 44-LCC (J-Lead)
  • Supplier Device Package: 44-PLCC (16.59x16.59)
封装: 44-LCC (J-Lead)
库存5,200
5AGXMA5D4F27I5G
Intel

IC FPGA 336 I/O 672FBGA

  • Number of LABs/CLBs: 8962
  • Number of Logic Elements/Cells: 190000
  • Total RAM Bits: 13284352
  • Number of I/O: 336
  • Number of Gates: -
  • Voltage - Supply: 1.07V ~ 1.13V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 672-BBGA, FCBGA
  • Supplier Device Package: 672-FBGA (27x27)
封装: 672-BBGA, FCBGA
库存2,416
N8274
Intel

MULTI PROTOCOL CONTROLLER, MOS

  • Protocol: -
  • Function: Controller
  • Interface: Serial
  • Standards: -
  • Voltage - Supply: 4.5V ~ 5.5V
  • Current - Supply: 200mA
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Package / Case: 44-LCC (J-Lead)
  • Supplier Device Package: 44-PLCC
封装: -
Request a Quote
MT28F010-12-B
Intel

IC FLASH 1MBIT PARALLEL 32PLCC

  • Memory Type: Non-Volatile
  • Memory Format: FLASH
  • Technology: FLASH
  • Memory Size: 1Mbit
  • Memory Interface: Parallel
  • Clock Frequency: -
  • Write Cycle Time - Word, Page: 120ns
  • Access Time: 120 ns
  • Voltage - Supply: 4.5V ~ 5.5V
  • Operating Temperature: -55°C ~ 125°C (TC)
  • Mounting Type: Surface Mount
  • Package / Case: 32-LCC (J-Lead)
  • Supplier Device Package: 32-PLCC
封装: -
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5SGXMA4K3F40I3NCV
Intel

IC FPGA 600 I/O 1517FBGA

  • Number of LABs/CLBs: 158500
  • Number of Logic Elements/Cells: 420000
  • Total RAM Bits: 37888000
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封装: -
Request a Quote
AGFC019R25A1E1V
Intel

IC FPGA AGILEX-F 2581FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 1.9M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
封装: -
Request a Quote
AGIA035R39A1E2V
Intel

IC

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 3.54M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 3948-BFBGA Exposed Pad
  • Supplier Device Package: 3948-BGA (56x56)
封装: -
Request a Quote
1SX280HH1F55I1VG
Intel

IC FPGA STRATIX 10 2912FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 2800K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 2912-BBGA, FCBGA
  • Supplier Device Package: 2912-FBGA, FC (55x55)
封装: -
Request a Quote
AGIB027R29A1I1V
Intel

IC

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.7M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 2957-BFBGA Exposed Pad
  • Supplier Device Package: 2957-BGA (56x45)
封装: -
Request a Quote
UM80536UC600512
Intel

CELERON PROCESSOR

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
封装: -
Request a Quote
5SGXEA5H2F35C2G
Intel

IC FPGA 552 I/O 1152FBGA

  • Number of LABs/CLBs: 185000
  • Number of Logic Elements/Cells: 490000
  • Total RAM Bits: 46080000
  • Number of I/O: 552
  • Number of Gates: -
  • Voltage - Supply: 0.87V ~ 0.93V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封装: -
Request a Quote
LF80538NE0411ME
Intel

MPU CELERON PROCESSOR, X86 ARCH.

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
封装: -
Request a Quote
AGIB019R18A1E1VB
Intel

IC FPGA AGILEX-I 1805BGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 1.9M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1805-BBGA Exposed Pad
  • Supplier Device Package: 1805-BGA (42.5x42.5)
封装: -
Request a Quote
AGFC023R25A1I1V
Intel

IC FPGA AGILEX-F 2581FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.3M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
封装: -
Request a Quote
5SGXMB6R1F40C1G
Intel

IC FPGA 432 I/O 1517FBGA

  • Number of LABs/CLBs: 225400
  • Number of Logic Elements/Cells: 597000
  • Total RAM Bits: 53248000
  • Number of I/O: 432
  • Number of Gates: -
  • Voltage - Supply: 0.87V ~ 0.93V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-FBGA (40x40)
  • Supplier Device Package: 1517-FBGA (40x40)
封装: -
Request a Quote
NT80960JT10016
Intel

IC MPU I960 100MHZ 132QFP

  • Core Processor: i960
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 100MHz
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 3.3V
  • Operating Temperature: 0°C ~ 100°C (TC)
  • Security Features: -
  • Package / Case: 132-QFP
  • Supplier Device Package: 132-QFP
封装: -
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