页 49 - Intel 产品 | 深圳黑森尔电子

零件编号	制造商	描述	封装	库存
10AS066K2F40I1HG	Intel	IC SOC FPGA 696 I/O 1517FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 660K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封装: 1517-BBGA, FCBGA	库存2,240
10AS032H2F34E2LG	Intel	1152-PIN FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 320K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封装: -	库存5,072
5CSEMA6F31C7N	Intel	IC FPGA 288 I/O 896FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: FPGA - 110K Logic Elements Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 896-BGA Supplier Device Package: 896-FBGA (31x31)	封装: 896-BGA	库存7,824
EP20K400EF672C1XDO	Intel	IC FPGA Number of LABs/CLBs: 1664 Number of Logic Elements/Cells: 16640 Total RAM Bits: 212992 Number of I/O: 488 Number of Gates: 1052000 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 672-BBGA Supplier Device Package: 672-FBGA (27x27)	封装: 672-BBGA	库存7,120
EP20K400BC652-1XV	Intel	IC FPGA 502 I/O 652BGA Number of LABs/CLBs: 1664 Number of Logic Elements/Cells: 16640 Total RAM Bits: 212992 Number of I/O: 502 Number of Gates: 1052000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 652-BGA Supplier Device Package: 652-BGA (45x45)	封装: 652-BGA	库存5,520
10M08DAF484I7G	Intel	IC FPGA 250 I/O 484FBGA Number of LABs/CLBs: 500 Number of Logic Elements/Cells: 8000 Total RAM Bits: 387072 Number of I/O: 250 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FBGA (23x23)	封装: 484-BGA	库存6,264
5SGSED6N2F45C2	Intel	IC FPGA 840 I/O 1932FBGA Number of LABs/CLBs: 220000 Number of Logic Elements/Cells: 583000 Total RAM Bits: 54553600 Number of I/O: 840 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	封装: 1932-BBGA, FCBGA	库存2,800
10AX115S3F45E2LG	Intel	IC FPGA 624 I/O 1932FCBGA Number of LABs/CLBs: 427200 Number of Logic Elements/Cells: 1150000 Total RAM Bits: 68857856 Number of I/O: 624 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	封装: 1932-BBGA, FCBGA	库存6,016
EP4SGX290FH29I3N	Intel	IC FPGA 289 I/O 780HBGA Number of LABs/CLBs: 11648 Number of Logic Elements/Cells: 291200 Total RAM Bits: 17661952 Number of I/O: 289 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33x33)	封装: 780-BBGA, FCBGA	库存2,384
EP3SL110F780I4	Intel	IC FPGA 488 I/O 780FBGA Number of LABs/CLBs: 4300 Number of Logic Elements/Cells: 107500 Total RAM Bits: 4992000 Number of I/O: 488 Number of Gates: - Voltage - Supply: 0.86 V ~ 1.15 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29)	封装: 780-BBGA, FCBGA	库存7,680
EP2SGX30CF780C4	Intel	IC FPGA 361 I/O 780FBGA Number of LABs/CLBs: 1694 Number of Logic Elements/Cells: 33880 Total RAM Bits: 1369728 Number of I/O: 361 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA Supplier Device Package: 780-FBGA (29x29)	封装: 780-BBGA	库存4,720
5CGXFC7C6F23C6N	Intel	IC FPGA 240 I/O 484FBGA Number of LABs/CLBs: 56480 Number of Logic Elements/Cells: 149500 Total RAM Bits: 7880704 Number of I/O: 240 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FBGA (23x23)	封装: 484-BGA	库存6,732
5CGXFC7C7F23C8N	Intel	IC FPGA 240 I/O 484FBGA Number of LABs/CLBs: 56480 Number of Logic Elements/Cells: 149500 Total RAM Bits: 7880704 Number of I/O: 240 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FBGA (23x23)	封装: 484-BGA	库存6,096
10M08SAE144I7P	Intel	IC FPGA 101 I/O 144EQFP Number of LABs/CLBs: 500 Number of Logic Elements/Cells: 8000 Total RAM Bits: 387072 Number of I/O: 101 Number of Gates: - Voltage - Supply: 2.85 V ~ 3.465 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 144-LQFP Exposed Pad Supplier Device Package: 144-EQFP (20x20)	封装: 144-LQFP Exposed Pad	库存4,896
EP4CE10E22I7N	Intel	IC FPGA 91 I/O 144EQFP Number of LABs/CLBs: 645 Number of Logic Elements/Cells: 10320 Total RAM Bits: 423936 Number of I/O: 91 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 144-LQFP Exposed Pad Supplier Device Package: 144-EQFP (20x20)	封装: 144-LQFP Exposed Pad	库存15,060
EPM3032ALC44-4	Intel	IC CPLD 32MC 4.5NS 44PLCC Programmable Type: In System Programmable Delay Time tpd(1) Max: 4.5ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 2 Number of Macrocells: 32 Number of Gates: 600 Number of I/O: 34 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59)	封装: 44-LCC (J-Lead)	库存8,496
EPM7256SQC208-10	Intel	IC CPLD 256MC 10NS 208QFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 10.0ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 16 Number of Macrocells: 256 Number of Gates: 5000 Number of I/O: 164 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	封装: 208-BFQFP	库存6,560
EPM2210F256C4	Intel	IC CPLD 1700MC 7NS 256FBGA Programmable Type: In System Programmable Delay Time tpd(1) Max: 7.0ns Voltage Supply - Internal: 2.5V, 3.3V Number of Logic Elements/Blocks: 2210 Number of Macrocells: 1700 Number of Gates: - Number of I/O: 204 Operating Temperature: 0°C ~ 85°C (TJ) Mounting Type: Surface Mount Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	封装: 256-BGA	库存8,736
DCF1932FA1	Intel	IC MECHANICAL SAMPLE Type: Mechanical Sample Applications: - Mounting Type: - Package / Case: - Supplier Device Package: -	封装: -	库存4,176
5AGXMA7G4F31C4G	Intel	IC FPGA 384 I/O 896FBGA Number of LABs/CLBs: 11460 Number of Logic Elements/Cells: 242000 Total RAM Bits: 15470592 Number of I/O: 384 Number of Gates: - Voltage - Supply: 1.07V ~ 1.13V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 896-BBGA, FCBGA Supplier Device Package: 896-FBGA (31x31)	封装: 896-BBGA, FCBGA	库存4,240
EP3SE50F780C4G	Intel	IC FPGA 488 I/O 780FBGA Number of LABs/CLBs: 1900 Number of Logic Elements/Cells: 47500 Total RAM Bits: 5760000 Number of I/O: 488 Number of Gates: - Voltage - Supply: 0.86V ~ 1.15V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29)	封装: 780-BBGA, FCBGA	库存3,840
5AGXMA1D4F27I5G	Intel	IC FPGA 336 I/O 672FBGA Number of LABs/CLBs: 3537 Number of Logic Elements/Cells: 75000 Total RAM Bits: 8666112 Number of I/O: 336 Number of Gates: - Voltage - Supply: 1.07V ~ 1.13V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27x27)	封装: 672-BBGA, FCBGA	库存4,000
5962-9453202MXA	Intel	IC MPU 80860 33MHZ 168CPGA Core Processor: 80860 Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 33MHz Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 5V Operating Temperature: -55°C ~ 125°C (TC) Security Features: - Package / Case: 168-BCPGA Supplier Device Package: 168-CPGA (44.45x44.45)	封装: -	Request a Quote
5SGXMA9K1H40C2G	Intel	IC FPGA 696 I/O 1517HBGA Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Total RAM Bits: 53248000 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-HBGA (45x45)	封装: -	Request a Quote
EP4SGX290FF35I3G	Intel	IC FPGA 564 I/O 1152FBGA Number of LABs/CLBs: - Number of Logic Elements/Cells: - Total RAM Bits: - Number of I/O: - Number of Gates: - Voltage - Supply: - Mounting Type: - Operating Temperature: - Package / Case: - Supplier Device Package: -	封装: -	Request a Quote
EP4SGXDF29I3NAB	Intel	IC FPGA STRATIX IV GX FLIP CHIP Number of LABs/CLBs: - Number of Logic Elements/Cells: - Total RAM Bits: - Number of I/O: - Number of Gates: - Voltage - Supply: - Mounting Type: - Operating Temperature: - Package / Case: - Supplier Device Package: -	封装: -	Request a Quote
5SGXMA7H2F35I3LG	Intel	IC FPGA 552 I/O 1152FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 51200000 Number of I/O: 552 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封装: -	Request a Quote
AGFB012R24B3I3E	Intel	IC FPGA AGILEX-F 2486FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.2M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封装: -	Request a Quote
1ST085EN2F43E2VG	Intel	IC FPGA 440 I/O 1760FBGA Number of LABs/CLBs: 106250 Number of Logic Elements/Cells: 850000 Total RAM Bits: - Number of I/O: 440 Number of Gates: - Voltage - Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5x42.5)	封装: -	Request a Quote
5SGXMA5H2F35I3G	Intel	IC FPGA 552 I/O 1152FBGA Number of LABs/CLBs: 185000 Number of Logic Elements/Cells: 490000 Total RAM Bits: 46080000 Number of I/O: 552 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封装: -	Request a Quote

10AS066K2F40I1HG

Intel

IC SOC FPGA 696 I/O 1517FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 660K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封装: 1517-BBGA, FCBGA

库存2,240

10AS032H2F34E2LG

Intel

1152-PIN FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 320K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封装: -

库存5,072

5CSEMA6F31C7N

Intel

IC FPGA 288 I/O 896FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: FPGA - 110K Logic Elements
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 896-BGA
Supplier Device Package: 896-FBGA (31x31)

封装: 896-BGA

库存7,824

EP20K400EF672C1XDO

Intel

IC FPGA

Number of LABs/CLBs: 1664
Number of Logic Elements/Cells: 16640
Total RAM Bits: 212992
Number of I/O: 488
Number of Gates: 1052000
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 672-BBGA
Supplier Device Package: 672-FBGA (27x27)

封装: 672-BBGA

库存7,120

EP20K400BC652-1XV

Intel

IC FPGA 502 I/O 652BGA

Number of LABs/CLBs: 1664
Number of Logic Elements/Cells: 16640
Total RAM Bits: 212992
Number of I/O: 502
Number of Gates: 1052000
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 652-BGA
Supplier Device Package: 652-BGA (45x45)

封装: 652-BGA

库存5,520

10M08DAF484I7G

Intel

IC FPGA 250 I/O 484FBGA

Number of LABs/CLBs: 500
Number of Logic Elements/Cells: 8000
Total RAM Bits: 387072
Number of I/O: 250
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FBGA (23x23)

封装: 484-BGA

库存6,264

5SGSED6N2F45C2

Intel

IC FPGA 840 I/O 1932FBGA

Number of LABs/CLBs: 220000
Number of Logic Elements/Cells: 583000
Total RAM Bits: 54553600
Number of I/O: 840
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1932-BBGA, FCBGA
Supplier Device Package: 1932-FBGA, FC (45x45)

封装: 1932-BBGA, FCBGA

库存2,800

10AX115S3F45E2LG

Intel

IC FPGA 624 I/O 1932FCBGA

Number of LABs/CLBs: 427200
Number of Logic Elements/Cells: 1150000
Total RAM Bits: 68857856
Number of I/O: 624
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1932-BBGA, FCBGA
Supplier Device Package: 1932-FBGA, FC (45x45)

封装: 1932-BBGA, FCBGA

库存6,016

EP4SGX290FH29I3N

Intel

IC FPGA 289 I/O 780HBGA

Number of LABs/CLBs: 11648
Number of Logic Elements/Cells: 291200
Total RAM Bits: 17661952
Number of I/O: 289
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-HBGA (33x33)

封装: 780-BBGA, FCBGA

库存2,384

EP3SL110F780I4

Intel

IC FPGA 488 I/O 780FBGA

Number of LABs/CLBs: 4300
Number of Logic Elements/Cells: 107500
Total RAM Bits: 4992000
Number of I/O: 488
Number of Gates: -
Voltage - Supply: 0.86 V ~ 1.15 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-FBGA (29x29)

封装: 780-BBGA, FCBGA

库存7,680

EP2SGX30CF780C4

Intel

IC FPGA 361 I/O 780FBGA

Number of LABs/CLBs: 1694
Number of Logic Elements/Cells: 33880
Total RAM Bits: 1369728
Number of I/O: 361
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 780-BBGA
Supplier Device Package: 780-FBGA (29x29)

封装: 780-BBGA

库存4,720

5CGXFC7C6F23C6N

Intel

IC FPGA 240 I/O 484FBGA

Number of LABs/CLBs: 56480
Number of Logic Elements/Cells: 149500
Total RAM Bits: 7880704
Number of I/O: 240
Number of Gates: -
Voltage - Supply: 1.07 V ~ 1.13 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FBGA (23x23)

封装: 484-BGA

库存6,732

5CGXFC7C7F23C8N

Intel

IC FPGA 240 I/O 484FBGA

Number of LABs/CLBs: 56480
Number of Logic Elements/Cells: 149500
Total RAM Bits: 7880704
Number of I/O: 240
Number of Gates: -
Voltage - Supply: 1.07 V ~ 1.13 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FBGA (23x23)

封装: 484-BGA

库存6,096

10M08SAE144I7P

Intel

IC FPGA 101 I/O 144EQFP

Number of LABs/CLBs: 500
Number of Logic Elements/Cells: 8000
Total RAM Bits: 387072
Number of I/O: 101
Number of Gates: -
Voltage - Supply: 2.85 V ~ 3.465 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 144-LQFP Exposed Pad
Supplier Device Package: 144-EQFP (20x20)

封装: 144-LQFP Exposed Pad

库存4,896

EP4CE10E22I7N

Intel

IC FPGA 91 I/O 144EQFP

Number of LABs/CLBs: 645
Number of Logic Elements/Cells: 10320
Total RAM Bits: 423936
Number of I/O: 91
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 144-LQFP Exposed Pad
Supplier Device Package: 144-EQFP (20x20)

封装: 144-LQFP Exposed Pad

库存15,060

EPM3032ALC44-4

Intel

IC CPLD 32MC 4.5NS 44PLCC

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 4.5ns
Voltage Supply - Internal: 3 V ~ 3.6 V
Number of Logic Elements/Blocks: 2
Number of Macrocells: 32
Number of Gates: 600
Number of I/O: 34
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 44-LCC (J-Lead)
Supplier Device Package: 44-PLCC (16.59x16.59)

封装: 44-LCC (J-Lead)

库存8,496

EPM7256SQC208-10

Intel

IC CPLD 256MC 10NS 208QFP

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 10.0ns
Voltage Supply - Internal: 4.75 V ~ 5.25 V
Number of Logic Elements/Blocks: 16
Number of Macrocells: 256
Number of Gates: 5000
Number of I/O: 164
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

封装: 208-BFQFP

库存6,560

EPM2210F256C4

Intel

IC CPLD 1700MC 7NS 256FBGA

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 7.0ns
Voltage Supply - Internal: 2.5V, 3.3V
Number of Logic Elements/Blocks: 2210
Number of Macrocells: 1700
Number of Gates: -
Number of I/O: 204
Operating Temperature: 0°C ~ 85°C (TJ)
Mounting Type: Surface Mount
Package / Case: 256-BGA
Supplier Device Package: 256-FBGA (17x17)

封装: 256-BGA

库存8,736

DCF1932FA1

Intel

IC MECHANICAL SAMPLE

Type: Mechanical Sample
Applications: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封装: -

库存4,176

5AGXMA7G4F31C4G

Intel

IC FPGA 384 I/O 896FBGA

Number of LABs/CLBs: 11460
Number of Logic Elements/Cells: 242000
Total RAM Bits: 15470592
Number of I/O: 384
Number of Gates: -
Voltage - Supply: 1.07V ~ 1.13V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 896-BBGA, FCBGA
Supplier Device Package: 896-FBGA (31x31)

封装: 896-BBGA, FCBGA

库存4,240

EP3SE50F780C4G

Intel

IC FPGA 488 I/O 780FBGA

Number of LABs/CLBs: 1900
Number of Logic Elements/Cells: 47500
Total RAM Bits: 5760000
Number of I/O: 488
Number of Gates: -
Voltage - Supply: 0.86V ~ 1.15V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-FBGA (29x29)

封装: 780-BBGA, FCBGA

库存3,840

5AGXMA1D4F27I5G

Intel

IC FPGA 336 I/O 672FBGA

Number of LABs/CLBs: 3537
Number of Logic Elements/Cells: 75000
Total RAM Bits: 8666112
Number of I/O: 336
Number of Gates: -
Voltage - Supply: 1.07V ~ 1.13V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 672-BBGA, FCBGA
Supplier Device Package: 672-FBGA (27x27)

封装: 672-BBGA, FCBGA

库存4,000

5962-9453202MXA

Intel

IC MPU 80860 33MHZ 168CPGA

Core Processor: 80860
Number of Cores/Bus Width: 1 Core, 64-Bit
Speed: 33MHz
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 5V
Operating Temperature: -55°C ~ 125°C (TC)
Security Features: -
Package / Case: 168-BCPGA
Supplier Device Package: 168-CPGA (44.45x44.45)

封装: -

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5SGXMA9K1H40C2G

Intel

IC FPGA 696 I/O 1517HBGA

Number of LABs/CLBs: 317000
Number of Logic Elements/Cells: 840000
Total RAM Bits: 53248000
Number of I/O: 696
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-HBGA (45x45)

封装: -

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EP4SGX290FF35I3G

Intel

IC FPGA 564 I/O 1152FBGA

Number of LABs/CLBs: -
Number of Logic Elements/Cells: -
Total RAM Bits: -
Number of I/O: -
Number of Gates: -
Voltage - Supply: -
Mounting Type: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

封装: -

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EP4SGXDF29I3NAB

Intel

IC FPGA STRATIX IV GX FLIP CHIP

Number of LABs/CLBs: -
Number of Logic Elements/Cells: -
Total RAM Bits: -
Number of I/O: -
Number of Gates: -
Voltage - Supply: -
Mounting Type: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

封装: -

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5SGXMA7H2F35I3LG

Intel

IC FPGA 552 I/O 1152FBGA

Number of LABs/CLBs: 234720
Number of Logic Elements/Cells: 622000
Total RAM Bits: 51200000
Number of I/O: 552
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封装: -

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AGFB012R24B3I3E

Intel

IC FPGA AGILEX-F 2486FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 1.2M Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封装: -

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1ST085EN2F43E2VG

Intel

IC FPGA 440 I/O 1760FBGA

Number of LABs/CLBs: 106250
Number of Logic Elements/Cells: 850000
Total RAM Bits: -
Number of I/O: 440
Number of Gates: -
Voltage - Supply: 0.77V ~ 0.97V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FBGA (42.5x42.5)

封装: -

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5SGXMA5H2F35I3G

Intel

IC FPGA 552 I/O 1152FBGA

Number of LABs/CLBs: 185000
Number of Logic Elements/Cells: 490000
Total RAM Bits: 46080000
Number of I/O: 552
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封装: -

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