页 318 - Intel 产品 | 深圳黑森尔电子

零件编号	制造商	描述	封装	库存
S80L186EB16	Intel	IC MPU I186 16MHZ 80QFP Core Processor: 80C186 Number of Cores/Bus Width: 1 Core, 16-Bit Speed: 16MHz Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 3.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 80-BQFP Supplier Device Package: 80-PQFP (14x20)	封装: 80-BQFP	库存6,272
10AS048H4F34I3SG	Intel	1152-PIN FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 480K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封装: -	库存2,016
EPCE8QC100	Intel	IC CONFIG DEVICE 100QFP Programmable Type: In System Programmable Memory Size: 8MB Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: 0°C ~ 70°C Package / Case: 100-BQFP Supplier Device Package: 100-PQFP (20x14)	封装: 100-BQFP	库存2,272
EPCQ256SI16N	Intel	IC CONFIG DEVICE 256MBIT 16SOIC Programmable Type: In System Programmable Memory Size: 256Mb Voltage - Supply: 2.7 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SOIC	封装: 16-SOIC (0.295", 7.50mm Width)	库存12,624
EP20K1500CF33C8ES	Intel	IC FPGA Number of LABs/CLBs: 5184 Number of Logic Elements/Cells: 51840 Total RAM Bits: 442368 Number of I/O: - Number of Gates: 2392000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1020-BBGA Supplier Device Package: 1020-FBGA (33x33)	封装: 1020-BBGA	库存7,904
10AX115N4F40I3SGE2	Intel	IC FPGA 600 I/O 1517FCBGA Number of LABs/CLBs: 427200 Number of Logic Elements/Cells: 1150000 Total RAM Bits: 68857856 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	封装: 1517-BBGA, FCBGA	库存7,984
10AX115N3F40I2SGE2	Intel	IC FPGA 600 I/O 1517FCBGA Number of LABs/CLBs: 427200 Number of Logic Elements/Cells: 1150000 Total RAM Bits: 68857856 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	封装: 1517-BBGA, FCBGA	库存7,344
EPF10K100ABC600-3	Intel	IC FPGA 406 I/O 600BGA Number of LABs/CLBs: 624 Number of Logic Elements/Cells: 4992 Total RAM Bits: 24576 Number of I/O: 406 Number of Gates: 158000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Package / Case: 600-BGA Supplier Device Package: 600-BGA (45x45)	封装: 600-BGA	库存3,712
EP20K60EQC240-3	Intel	IC FPGA 151 I/O 240QFP Number of LABs/CLBs: 2560 Number of Logic Elements/Cells: 2560 Total RAM Bits: 32768 Number of I/O: 151 Number of Gates: 162000 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 240-BQFP Supplier Device Package: 240-PQFP (32x32)	封装: 240-BQFP	库存7,568
EPF10K130EBC356-1	Intel	IC FPGA 274 I/O 356BGA Number of LABs/CLBs: 832 Number of Logic Elements/Cells: 6656 Total RAM Bits: 65536 Number of I/O: 274 Number of Gates: 342000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Package / Case: 356-LBGA Supplier Device Package: 356-BGA (35x35)	封装: 356-LBGA	库存6,320
EP2C20F484C8N	Intel	IC FPGA 315 I/O 484FBGA Number of LABs/CLBs: 1172 Number of Logic Elements/Cells: 18752 Total RAM Bits: 239616 Number of I/O: 315 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FBGA (23x23)	封装: 484-BGA	库存5,184
5SGXMB6R1F43C1N	Intel	IC FPGA 600 I/O 1760FBGA Number of LABs/CLBs: 225400 Number of Logic Elements/Cells: 597000 Total RAM Bits: 61688832 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA, FC (42.5x42.5)	封装: 1760-BBGA, FCBGA	库存3,120
5SGXEA7N1F40I2	Intel	IC FPGA 600 I/O 1517FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 59939840 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封装: 1517-BBGA, FCBGA	库存6,128
5SGXEB6R3F43C2LN	Intel	IC FPGA 600 I/O 1760FBGA Number of LABs/CLBs: 225400 Number of Logic Elements/Cells: 597000 Total RAM Bits: 61688832 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA, FC (42.5x42.5)	封装: 1760-BBGA, FCBGA	库存5,232
EP4SGX230FF35I4	Intel	IC FPGA 564 I/O 1152FBGA Number of LABs/CLBs: 9120 Number of Logic Elements/Cells: 228000 Total RAM Bits: 17544192 Number of I/O: 564 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封装: 1152-BBGA, FCBGA	库存4,896
EP4SGX180KF40I4N	Intel	IC FPGA 744 I/O 1517FBGA Number of LABs/CLBs: 7030 Number of Logic Elements/Cells: 175750 Total RAM Bits: 13954048 Number of I/O: 744 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封装: 1517-BBGA, FCBGA	库存5,072
EP4SGX110DF29C3N	Intel	IC FPGA 372 I/O 780FBGA Number of LABs/CLBs: 4224 Number of Logic Elements/Cells: 105600 Total RAM Bits: 9793536 Number of I/O: 372 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29)	封装: 780-BBGA, FCBGA	库存4,944
5SGSMD3E3H29C3N	Intel	IC FPGA 360 I/O 780HBGA Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Total RAM Bits: 16937984 Number of I/O: 360 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33x33)	封装: 780-BBGA, FCBGA	库存6,336
5AGXMB3G4F40I5N	Intel	IC FPGA 704 I/O 1517FBGA Number of LABs/CLBs: 17110 Number of Logic Elements/Cells: 362000 Total RAM Bits: 19822592 Number of I/O: 704 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA Supplier Device Package: 1517-FBGA (40x40)	封装: 1517-BBGA	库存7,408
EP3CLS100F780C7N	Intel	IC FPGA 413 I/O 780FBGA Number of LABs/CLBs: 6278 Number of Logic Elements/Cells: 100448 Total RAM Bits: 4451328 Number of I/O: 413 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BGA Supplier Device Package: 780-FBGA (29x29)	封装: 780-BGA	库存6,032
EPM7256AEFC256-7N	Intel	IC CPLD 256MC 7.5NS 256FBGA Programmable Type: In System Programmable Delay Time tpd(1) Max: 7.5ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 16 Number of Macrocells: 256 Number of Gates: 5000 Number of I/O: 164 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	封装: 256-BGA	库存6,752
5SGSMD3H1F35C2WN	Intel	IC FPGA 432 I/O 1152FBGA Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Total RAM Bits: 13312000 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封装: -	Request a Quote
QG82945GC	Intel	DRAM CONTROLLER, 64M X 16, CMOS, Controller Type: Dynamic RAM (DRAM) Voltage - Supply: - Operating Temperature: 99°C (TC) Package / Case: 1202-BGA, FCBGA Supplier Device Package: 1202-FCBGA (34x34)	封装: -	Request a Quote
1SX250HN1F43I2LG	Intel	IC FPGA STRATIX 10 1760FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2500K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5x42.5)	封装: -	Request a Quote
S82750LA	Intel	CONSUMER IC, PQFP160 Type: Interface Applications: Video Display Mounting Type: Surface Mount Package / Case: 160-BQFP Supplier Device Package: 160-PQFP (28x28)	封装: -	Request a Quote
5AGXFB1H4F35I3	Intel	IC FPGA 113208 I/O 1152FBGA Number of LABs/CLBs: 300000 Number of Logic Elements/Cells: 452832 Total RAM Bits: 1896448 Number of I/O: 113208 Number of Gates: 544 Voltage - Supply: 1.12V ~ 1.18V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA, FC (35x35)	封装: -	Request a Quote
AGID023R31B1I2VB	Intel	IC FPGA AGILEX-I 3184BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.3M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 3184-BFBGA Exposed Pad Supplier Device Package: 3184-BGA (56x45)	封装: -	Request a Quote
AGFA006R24C2I3V	Intel	IC FPGA AGILEX-F 2340FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 573K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封装: -	Request a Quote
1SX040HH3F35E2LG	Intel	IC FPGA STRATIX10SX 1152FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 400K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封装: -	Request a Quote
AGFA022R24C2E2VB	Intel	IC FPGA AGILEX-F 2340BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.2M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2340-BFBGA Exposed Pad Supplier Device Package: 2340-BGA (45x42)	封装: -	Request a Quote

S80L186EB16

Intel

IC MPU I186 16MHZ 80QFP

Core Processor: 80C186
Number of Cores/Bus Width: 1 Core, 16-Bit
Speed: 16MHz
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 3.0V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: -
Package / Case: 80-BQFP
Supplier Device Package: 80-PQFP (14x20)

封装: 80-BQFP

库存6,272

10AS048H4F34I3SG

Intel

1152-PIN FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 480K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封装: -

库存2,016

EPCE8QC100

Intel

IC CONFIG DEVICE 100QFP

Programmable Type: In System Programmable
Memory Size: 8MB
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: 0°C ~ 70°C
Package / Case: 100-BQFP
Supplier Device Package: 100-PQFP (20x14)

封装: 100-BQFP

库存2,272

EPCQ256SI16N

Intel

IC CONFIG DEVICE 256MBIT 16SOIC

Programmable Type: In System Programmable
Memory Size: 256Mb
Voltage - Supply: 2.7 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 16-SOIC

封装: 16-SOIC (0.295", 7.50mm Width)

库存12,624

EP20K1500CF33C8ES

Intel

IC FPGA

Number of LABs/CLBs: 5184
Number of Logic Elements/Cells: 51840
Total RAM Bits: 442368
Number of I/O: -
Number of Gates: 2392000
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1020-BBGA
Supplier Device Package: 1020-FBGA (33x33)

封装: 1020-BBGA

库存7,904

10AX115N4F40I3SGE2

Intel

IC FPGA 600 I/O 1517FCBGA

Number of LABs/CLBs: 427200
Number of Logic Elements/Cells: 1150000
Total RAM Bits: 68857856
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCBGA (40x40)

封装: 1517-BBGA, FCBGA

库存7,984

10AX115N3F40I2SGE2

Intel

IC FPGA 600 I/O 1517FCBGA

Number of LABs/CLBs: 427200
Number of Logic Elements/Cells: 1150000
Total RAM Bits: 68857856
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCBGA (40x40)

封装: 1517-BBGA, FCBGA

库存7,344

EPF10K100ABC600-3

Intel

IC FPGA 406 I/O 600BGA

Number of LABs/CLBs: 624
Number of Logic Elements/Cells: 4992
Total RAM Bits: 24576
Number of I/O: 406
Number of Gates: 158000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Package / Case: 600-BGA
Supplier Device Package: 600-BGA (45x45)

封装: 600-BGA

库存3,712

EP20K60EQC240-3

Intel

IC FPGA 151 I/O 240QFP

Number of LABs/CLBs: 2560
Number of Logic Elements/Cells: 2560
Total RAM Bits: 32768
Number of I/O: 151
Number of Gates: 162000
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 240-BQFP
Supplier Device Package: 240-PQFP (32x32)

封装: 240-BQFP

库存7,568

EPF10K130EBC356-1

Intel

IC FPGA 274 I/O 356BGA

Number of LABs/CLBs: 832
Number of Logic Elements/Cells: 6656
Total RAM Bits: 65536
Number of I/O: 274
Number of Gates: 342000
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Package / Case: 356-LBGA
Supplier Device Package: 356-BGA (35x35)

封装: 356-LBGA

库存6,320

EP2C20F484C8N

Intel

IC FPGA 315 I/O 484FBGA

Number of LABs/CLBs: 1172
Number of Logic Elements/Cells: 18752
Total RAM Bits: 239616
Number of I/O: 315
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FBGA (23x23)

封装: 484-BGA

库存5,184

5SGXMB6R1F43C1N

Intel

IC FPGA 600 I/O 1760FBGA

Number of LABs/CLBs: 225400
Number of Logic Elements/Cells: 597000
Total RAM Bits: 61688832
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)

封装: 1760-BBGA, FCBGA

库存3,120

5SGXEA7N1F40I2

Intel

IC FPGA 600 I/O 1517FBGA

Number of LABs/CLBs: 234720
Number of Logic Elements/Cells: 622000
Total RAM Bits: 59939840
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封装: 1517-BBGA, FCBGA

库存6,128

5SGXEB6R3F43C2LN

Intel

IC FPGA 600 I/O 1760FBGA

Number of LABs/CLBs: 225400
Number of Logic Elements/Cells: 597000
Total RAM Bits: 61688832
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)

封装: 1760-BBGA, FCBGA

库存5,232

EP4SGX230FF35I4

Intel

IC FPGA 564 I/O 1152FBGA

Number of LABs/CLBs: 9120
Number of Logic Elements/Cells: 228000
Total RAM Bits: 17544192
Number of I/O: 564
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封装: 1152-BBGA, FCBGA

库存4,896

EP4SGX180KF40I4N

Intel

IC FPGA 744 I/O 1517FBGA

Number of LABs/CLBs: 7030
Number of Logic Elements/Cells: 175750
Total RAM Bits: 13954048
Number of I/O: 744
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封装: 1517-BBGA, FCBGA

库存5,072

EP4SGX110DF29C3N

Intel

IC FPGA 372 I/O 780FBGA

Number of LABs/CLBs: 4224
Number of Logic Elements/Cells: 105600
Total RAM Bits: 9793536
Number of I/O: 372
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-FBGA (29x29)

封装: 780-BBGA, FCBGA

库存4,944

5SGSMD3E3H29C3N

Intel

IC FPGA 360 I/O 780HBGA

Number of LABs/CLBs: 89000
Number of Logic Elements/Cells: 236000
Total RAM Bits: 16937984
Number of I/O: 360
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-HBGA (33x33)

封装: 780-BBGA, FCBGA

库存6,336

5AGXMB3G4F40I5N

Intel

IC FPGA 704 I/O 1517FBGA

Number of LABs/CLBs: 17110
Number of Logic Elements/Cells: 362000
Total RAM Bits: 19822592
Number of I/O: 704
Number of Gates: -
Voltage - Supply: 1.07 V ~ 1.13 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA
Supplier Device Package: 1517-FBGA (40x40)

封装: 1517-BBGA

库存7,408

EP3CLS100F780C7N

Intel

IC FPGA 413 I/O 780FBGA

Number of LABs/CLBs: 6278
Number of Logic Elements/Cells: 100448
Total RAM Bits: 4451328
Number of I/O: 413
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 780-BGA
Supplier Device Package: 780-FBGA (29x29)

封装: 780-BGA

库存6,032

EPM7256AEFC256-7N

Intel

IC CPLD 256MC 7.5NS 256FBGA

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 7.5ns
Voltage Supply - Internal: 3 V ~ 3.6 V
Number of Logic Elements/Blocks: 16
Number of Macrocells: 256
Number of Gates: 5000
Number of I/O: 164
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 256-BGA
Supplier Device Package: 256-FBGA (17x17)

封装: 256-BGA

库存6,752

5SGSMD3H1F35C2WN

Intel

IC FPGA 432 I/O 1152FBGA

Number of LABs/CLBs: 89000
Number of Logic Elements/Cells: 236000
Total RAM Bits: 13312000
Number of I/O: 432
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封装: -

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QG82945GC

Intel

DRAM CONTROLLER, 64M X 16, CMOS,

Controller Type: Dynamic RAM (DRAM)
Voltage - Supply: -
Operating Temperature: 99°C (TC)
Package / Case: 1202-BGA, FCBGA
Supplier Device Package: 1202-FCBGA (34x34)

封装: -

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1SX250HN1F43I2LG

Intel

IC FPGA STRATIX 10 1760FBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 2500K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FBGA (42.5x42.5)

封装: -

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S82750LA

Intel

CONSUMER IC, PQFP160

Type: Interface
Applications: Video Display
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Supplier Device Package: 160-PQFP (28x28)

封装: -

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5AGXFB1H4F35I3

Intel

IC FPGA 113208 I/O 1152FBGA

Number of LABs/CLBs: 300000
Number of Logic Elements/Cells: 452832
Total RAM Bits: 1896448
Number of I/O: 113208
Number of Gates: 544
Voltage - Supply: 1.12V ~ 1.18V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA, FC (35x35)

封装: -

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AGID023R31B1I2VB

Intel

IC FPGA AGILEX-I 3184BGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.3M Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 3184-BFBGA Exposed Pad
Supplier Device Package: 3184-BGA (56x45)

封装: -

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AGFA006R24C2I3V

Intel

IC FPGA AGILEX-F 2340FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 573K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封装: -

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1SX040HH3F35E2LG

Intel

IC FPGA STRATIX10SX 1152FBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 400K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封装: -

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AGFA022R24C2E2VB

Intel

IC FPGA AGILEX-F 2340BGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.2M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 2340-BFBGA Exposed Pad
Supplier Device Package: 2340-BGA (45x42)

封装: -

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