页 256 - Intel 产品 | 深圳黑森尔电子

零件编号	制造商	描述	封装	库存
10AS066N1F40E1SG	Intel	IC SOC FPGA 588 I/O 1517FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 660K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	封装: 1517-BBGA, FCBGA	库存4,464
5CSEBA4U23C8N	Intel	IC FPGA 188 I/O 672UBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz Primary Attributes: FPGA - 40K Logic Elements Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 672-FBGA Supplier Device Package: 672-UBGA (23x23)	封装: 672-FBGA	库存7,136
10AX032H1F34I1SG	Intel	IC FPGA 384 I/O 1152FCBGA Number of LABs/CLBs: 119900 Number of Logic Elements/Cells: 320000 Total RAM Bits: 21040128 Number of I/O: 384 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.98 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封装: 1152-BBGA, FCBGA	库存4,400
10AX032E1F29I1SG	Intel	IC FPGA 360 I/O 780FBGA Number of LABs/CLBs: 119900 Number of Logic Elements/Cells: 320000 Total RAM Bits: 21040128 Number of I/O: 360 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.98 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29)	封装: 780-BBGA, FCBGA	库存4,608
EP20K100EQC208-1X	Intel	IC FPGA 151 I/O 208QFP Number of LABs/CLBs: 416 Number of Logic Elements/Cells: 4160 Total RAM Bits: 53248 Number of I/O: 151 Number of Gates: 263000 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	封装: 208-BFQFP	库存2,768
EPF6016ATC144-2	Intel	IC FPGA 117 I/O 144TQFP Number of LABs/CLBs: 132 Number of Logic Elements/Cells: 1320 Total RAM Bits: - Number of I/O: 117 Number of Gates: 16000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	封装: 144-LQFP	库存4,720
5SGSED8K3F40I3	Intel	IC FPGA 696 I/O 1517FBGA Number of LABs/CLBs: 262400 Number of Logic Elements/Cells: 695000 Total RAM Bits: 60968960 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封装: 1517-BBGA, FCBGA	库存6,288
5SGXEA7K3F40C2L	Intel	IC FPGA 696 I/O 1517FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 59939840 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封装: 1517-BBGA, FCBGA	库存4,912
EP2AGZ350FF35C4N	Intel	IC FPGA 554 I/O 1152FBGA Number of LABs/CLBs: 13940 Number of Logic Elements/Cells: 348500 Total RAM Bits: 21270528 Number of I/O: 554 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封装: 1152-BBGA, FCBGA	库存4,960
5SGXMABK3H40C2LN	Intel	IC FPGA 696 I/O 1517HBGA Number of LABs/CLBs: 359200 Number of Logic Elements/Cells: 952000 Total RAM Bits: 65561600 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-HBGA (45x45)	封装: 1517-BBGA, FCBGA	库存4,448
EP2AGX125EF35C4N	Intel	IC FPGA 452 I/O 1152FBGA Number of LABs/CLBs: 4964 Number of Logic Elements/Cells: 118143 Total RAM Bits: 8315904 Number of I/O: 452 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封装: 1152-BBGA, FCBGA	库存7,968
5AGXMB1G4F40C4N	Intel	IC FPGA 704 I/O 1517FBGA Number of LABs/CLBs: 14151 Number of Logic Elements/Cells: 300000 Total RAM Bits: 17358848 Number of I/O: 704 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA Supplier Device Package: 1517-FBGA (40x40)	封装: 1517-BBGA	库存7,200
10AX027E1F27I1HG	Intel	IC FPGA 240 I/O 672FBGA Number of LABs/CLBs: 101620 Number of Logic Elements/Cells: 270000 Total RAM Bits: 17870848 Number of I/O: 240 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.98 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27x27)	封装: 672-BBGA, FCBGA	库存2,528
5CGXFC5F7M11C8N	Intel	IC FPGA 129 I/O 301MBGA Number of LABs/CLBs: 29080 Number of Logic Elements/Cells: 77000 Total RAM Bits: 5001216 Number of I/O: 129 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 301-TFBGA Supplier Device Package: 301-MBGA (11x11)	封装: 301-TFBGA	库存5,584
EP2C20AF484A7N	Intel	IC FPGA 315 I/O 484FBGA Number of LABs/CLBs: 1172 Number of Logic Elements/Cells: 18752 Total RAM Bits: 239616 Number of I/O: 315 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FBGA (23x23)	封装: 484-BGA	库存2,320
10M40DAF256C7G	Intel	IC FPGA 178 I/O 256FBGA Number of LABs/CLBs: 2500 Number of Logic Elements/Cells: 40000 Total RAM Bits: 1290240 Number of I/O: 178 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17)	封装: 256-LBGA	库存4,240
EPM7096LI84-15	Intel	IC CPLD 96MC 15NS 84PLCC Programmable Type: EE PLD Delay Time tpd(1) Max: 15.0ns Voltage Supply - Internal: 4.5 V ~ 5.5 V Number of Logic Elements/Blocks: 6 Number of Macrocells: 96 Number of Gates: 1800 Number of I/O: 68 Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 84-LCC (J-Lead) Supplier Device Package: 84-PLCC (29.31x29.31)	封装: 84-LCC (J-Lead)	库存2,528
EPM7096LC68-7	Intel	IC CPLD 96MC 7.5NS 68PLCC Programmable Type: EE PLD Delay Time tpd(1) Max: 7.5ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 6 Number of Macrocells: 96 Number of Gates: 1800 Number of I/O: 52 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 68-LCC (J-Lead) Supplier Device Package: 68-PLCC (24x24)	封装: 68-LCC (J-Lead)	库存4,896
5M160ZT100I5N	Intel	IC CPLD 128MC 7.5NS 100TQFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 7.5ns Voltage Supply - Internal: 1.71 V ~ 1.89 V Number of Logic Elements/Blocks: 160 Number of Macrocells: 128 Number of Gates: - Number of I/O: 79 Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 100-TQFP Supplier Device Package: 100-TQFP (14x14)	封装: 100-TQFP	库存8,184
EP2AGX95EF35C4G	Intel	IC FPGA 452 I/O 1152FBGA Number of LABs/CLBs: 3747 Number of Logic Elements/Cells: 89178 Total RAM Bits: 6839296 Number of I/O: 452 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封装: 1152-BBGA, FCBGA	库存2,272
EP3SL50F484C2G	Intel	IC FPGA 296 I/O 484FBGA Number of LABs/CLBs: 1900 Number of Logic Elements/Cells: 47500 Total RAM Bits: 2184192 Number of I/O: 296 Number of Gates: - Voltage - Supply: 0.86V ~ 1.15V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BBGA, FCBGA Supplier Device Package: 484-FBGA (23x23)	封装: 484-BBGA, FCBGA	库存5,040
RGE7501MC	Intel	INTEL E7501 CHIPSET MEMORY CONTR Controller Type: Controller Hub Voltage - Supply: - Operating Temperature: - Package / Case: 1005-BBGA, FCBGA Supplier Device Package: 1005-FCBGA (42.5x42.5)	封装: -	Request a Quote
1SX250HN1F43I2VG	Intel	IC FPGA STRATIX 10 1760FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2500K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5x42.5)	封装: -	Request a Quote
5SGXEA9K3H40C3G	Intel	IC FPGA 696 I/O 1517HBGA Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Total RAM Bits: 53248000 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-HBGA (45x45)	封装: -	Request a Quote
5SGXMA9N3F45C4G	Intel	IC FPGA 840 I/O 1932FBGA Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Total RAM Bits: 53248000 Number of I/O: 840 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	封装: -	Request a Quote
AGID023R18A1E1V	Intel	IC FPGA AGILEX-I 1805FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.3M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封装: -	Request a Quote
1SX250HU3F50E1VG	Intel	IC FPGA STRATIX 10 2397FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2500K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50x50)	封装: -	Request a Quote
1SX065HH3F35E1VG	Intel	IC FPGA STRATIX10SX 1152FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 650K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封装: -	Request a Quote
10CL010YM164A7G	Intel	IC FPGA 101 I/O 164MBGA Number of LABs/CLBs: 645 Number of Logic Elements/Cells: 10320 Total RAM Bits: 423936 Number of I/O: 101 Number of Gates: - Voltage - Supply: 1.2V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 164-TFBGA Supplier Device Package: 164-MBGA (8x8)	封装: -	库存1,029
1SX250HH2F55E2VG	Intel	IC FPGA STRATIX 10 2912FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2500K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2912-BBGA, FCBGA Supplier Device Package: 2912-FBGA, FC (55x55)	封装: -	Request a Quote

10AS066N1F40E1SG

Intel

IC SOC FPGA 588 I/O 1517FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 660K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCBGA (40x40)

封装: 1517-BBGA, FCBGA

库存4,464

5CSEBA4U23C8N

Intel

IC FPGA 188 I/O 672UBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz
Primary Attributes: FPGA - 40K Logic Elements
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 672-FBGA
Supplier Device Package: 672-UBGA (23x23)

封装: 672-FBGA

库存7,136

10AX032H1F34I1SG

Intel

IC FPGA 384 I/O 1152FCBGA

Number of LABs/CLBs: 119900
Number of Logic Elements/Cells: 320000
Total RAM Bits: 21040128
Number of I/O: 384
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.98 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封装: 1152-BBGA, FCBGA

库存4,400

10AX032E1F29I1SG

Intel

IC FPGA 360 I/O 780FBGA

Number of LABs/CLBs: 119900
Number of Logic Elements/Cells: 320000
Total RAM Bits: 21040128
Number of I/O: 360
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.98 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-FBGA (29x29)

封装: 780-BBGA, FCBGA

库存4,608

EP20K100EQC208-1X

Intel

IC FPGA 151 I/O 208QFP

Number of LABs/CLBs: 416
Number of Logic Elements/Cells: 4160
Total RAM Bits: 53248
Number of I/O: 151
Number of Gates: 263000
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

封装: 208-BFQFP

库存2,768

EPF6016ATC144-2

Intel

IC FPGA 117 I/O 144TQFP

Number of LABs/CLBs: 132
Number of Logic Elements/Cells: 1320
Total RAM Bits: -
Number of I/O: 117
Number of Gates: 16000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)

封装: 144-LQFP

库存4,720

5SGSED8K3F40I3

Intel

IC FPGA 696 I/O 1517FBGA

Number of LABs/CLBs: 262400
Number of Logic Elements/Cells: 695000
Total RAM Bits: 60968960
Number of I/O: 696
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封装: 1517-BBGA, FCBGA

库存6,288

5SGXEA7K3F40C2L

Intel

IC FPGA 696 I/O 1517FBGA

Number of LABs/CLBs: 234720
Number of Logic Elements/Cells: 622000
Total RAM Bits: 59939840
Number of I/O: 696
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封装: 1517-BBGA, FCBGA

库存4,912

EP2AGZ350FF35C4N

Intel

IC FPGA 554 I/O 1152FBGA

Number of LABs/CLBs: 13940
Number of Logic Elements/Cells: 348500
Total RAM Bits: 21270528
Number of I/O: 554
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封装: 1152-BBGA, FCBGA

库存4,960

5SGXMABK3H40C2LN

Intel

IC FPGA 696 I/O 1517HBGA

Number of LABs/CLBs: 359200
Number of Logic Elements/Cells: 952000
Total RAM Bits: 65561600
Number of I/O: 696
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-HBGA (45x45)

封装: 1517-BBGA, FCBGA

库存4,448

EP2AGX125EF35C4N

Intel

IC FPGA 452 I/O 1152FBGA

Number of LABs/CLBs: 4964
Number of Logic Elements/Cells: 118143
Total RAM Bits: 8315904
Number of I/O: 452
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封装: 1152-BBGA, FCBGA

库存7,968

5AGXMB1G4F40C4N

Intel

IC FPGA 704 I/O 1517FBGA

Number of LABs/CLBs: 14151
Number of Logic Elements/Cells: 300000
Total RAM Bits: 17358848
Number of I/O: 704
Number of Gates: -
Voltage - Supply: 1.07 V ~ 1.13 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA
Supplier Device Package: 1517-FBGA (40x40)

封装: 1517-BBGA

库存7,200

10AX027E1F27I1HG

Intel

IC FPGA 240 I/O 672FBGA

Number of LABs/CLBs: 101620
Number of Logic Elements/Cells: 270000
Total RAM Bits: 17870848
Number of I/O: 240
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.98 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 672-BBGA, FCBGA
Supplier Device Package: 672-FBGA (27x27)

封装: 672-BBGA, FCBGA

库存2,528

5CGXFC5F7M11C8N

Intel

IC FPGA 129 I/O 301MBGA

Number of LABs/CLBs: 29080
Number of Logic Elements/Cells: 77000
Total RAM Bits: 5001216
Number of I/O: 129
Number of Gates: -
Voltage - Supply: 1.07 V ~ 1.13 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 301-TFBGA
Supplier Device Package: 301-MBGA (11x11)

封装: 301-TFBGA

库存5,584

EP2C20AF484A7N

Intel

IC FPGA 315 I/O 484FBGA

Number of LABs/CLBs: 1172
Number of Logic Elements/Cells: 18752
Total RAM Bits: 239616
Number of I/O: 315
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FBGA (23x23)

封装: 484-BGA

库存2,320

10M40DAF256C7G

Intel

IC FPGA 178 I/O 256FBGA

Number of LABs/CLBs: 2500
Number of Logic Elements/Cells: 40000
Total RAM Bits: 1290240
Number of I/O: 178
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FBGA (17x17)

封装: 256-LBGA

库存4,240

EPM7096LI84-15

Intel

IC CPLD 96MC 15NS 84PLCC

Programmable Type: EE PLD
Delay Time tpd(1) Max: 15.0ns
Voltage Supply - Internal: 4.5 V ~ 5.5 V
Number of Logic Elements/Blocks: 6
Number of Macrocells: 96
Number of Gates: 1800
Number of I/O: 68
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 84-LCC (J-Lead)
Supplier Device Package: 84-PLCC (29.31x29.31)

封装: 84-LCC (J-Lead)

库存2,528

EPM7096LC68-7

Intel

IC CPLD 96MC 7.5NS 68PLCC

Programmable Type: EE PLD
Delay Time tpd(1) Max: 7.5ns
Voltage Supply - Internal: 4.75 V ~ 5.25 V
Number of Logic Elements/Blocks: 6
Number of Macrocells: 96
Number of Gates: 1800
Number of I/O: 52
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 68-LCC (J-Lead)
Supplier Device Package: 68-PLCC (24x24)

封装: 68-LCC (J-Lead)

库存4,896

5M160ZT100I5N

Intel

IC CPLD 128MC 7.5NS 100TQFP

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 7.5ns
Voltage Supply - Internal: 1.71 V ~ 1.89 V
Number of Logic Elements/Blocks: 160
Number of Macrocells: 128
Number of Gates: -
Number of I/O: 79
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Supplier Device Package: 100-TQFP (14x14)

封装: 100-TQFP

库存8,184

EP2AGX95EF35C4G

Intel

IC FPGA 452 I/O 1152FBGA

Number of LABs/CLBs: 3747
Number of Logic Elements/Cells: 89178
Total RAM Bits: 6839296
Number of I/O: 452
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封装: 1152-BBGA, FCBGA

库存2,272

EP3SL50F484C2G

Intel

IC FPGA 296 I/O 484FBGA

Number of LABs/CLBs: 1900
Number of Logic Elements/Cells: 47500
Total RAM Bits: 2184192
Number of I/O: 296
Number of Gates: -
Voltage - Supply: 0.86V ~ 1.15V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BBGA, FCBGA
Supplier Device Package: 484-FBGA (23x23)

封装: 484-BBGA, FCBGA

库存5,040

RGE7501MC

Intel

INTEL E7501 CHIPSET MEMORY CONTR

Controller Type: Controller Hub
Voltage - Supply: -
Operating Temperature: -
Package / Case: 1005-BBGA, FCBGA
Supplier Device Package: 1005-FCBGA (42.5x42.5)

封装: -

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1SX250HN1F43I2VG

Intel

IC FPGA STRATIX 10 1760FBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 2500K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FBGA (42.5x42.5)

封装: -

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5SGXEA9K3H40C3G

Intel

IC FPGA 696 I/O 1517HBGA

Number of LABs/CLBs: 317000
Number of Logic Elements/Cells: 840000
Total RAM Bits: 53248000
Number of I/O: 696
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-HBGA (45x45)

封装: -

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5SGXMA9N3F45C4G

Intel

IC FPGA 840 I/O 1932FBGA

Number of LABs/CLBs: 317000
Number of Logic Elements/Cells: 840000
Total RAM Bits: 53248000
Number of I/O: 840
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1932-BBGA, FCBGA
Supplier Device Package: 1932-FBGA, FC (45x45)

封装: -

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AGID023R18A1E1V

Intel

IC FPGA AGILEX-I 1805FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.3M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封装: -

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1SX250HU3F50E1VG

Intel

IC FPGA STRATIX 10 2397FBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 2500K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 2397-BBGA, FCBGA
Supplier Device Package: 2397-FBGA, FC (50x50)

封装: -

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1SX065HH3F35E1VG

Intel

IC FPGA STRATIX10SX 1152FBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 650K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封装: -

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10CL010YM164A7G

Intel

IC FPGA 101 I/O 164MBGA

Number of LABs/CLBs: 645
Number of Logic Elements/Cells: 10320
Total RAM Bits: 423936
Number of I/O: 101
Number of Gates: -
Voltage - Supply: 1.2V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Package / Case: 164-TFBGA
Supplier Device Package: 164-MBGA (8x8)

封装: -

库存1,029

1SX250HH2F55E2VG

Intel

IC FPGA STRATIX 10 2912FBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 2500K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 2912-BBGA, FCBGA
Supplier Device Package: 2912-FBGA, FC (55x55)

封装: -

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