页 19 - Xilinx Inc. 产品 | 深圳黑森尔电子

零件编号	制造商	描述	封装	库存
XCMECH-FF668	Xilinx Inc.	FF668 MECHANICAL SAMPLE Type: Mechanical Sample Applications: - Mounting Type: - Package / Case: - Supplier Device Package: -	封装: -	库存6,080
XCZU17EG-3FFVC1760E	Xilinx Inc.	IC FPGA 512 I/O 1760FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 926K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FCBGA (42.5x42.5)	封装: 1760-BBGA, FCBGA	库存7,536
XCZU9CG-L1FFVB1156I	Xilinx Inc.	IC FPGA 328 I/O 1156FCBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq?UltraScale+? FPGA, 599K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	封装: 1156-BBGA, FCBGA	库存3,984
XCZU2EG-3SFVA625E	Xilinx Inc.	IC FPGA 180 I/O 625FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 625-BFBGA, FCBGA Supplier Device Package: 625-FCBGA (21x21)	封装: 625-BFBGA, FCBGA	库存2,768
XCZU3CG-L1SFVC784I	Xilinx Inc.	IC FPGA 252 I/O 784FCBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq?UltraScale+? FPGA, 154K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	封装: 784-BBGA, FCBGA	库存5,408
XCZU3CG-1SFVA625E	Xilinx Inc.	XCZU3CG-1SFVA625E Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq?UltraScale+? FPGA, 154K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 625-BFBGA, FCBGA Supplier Device Package: 625-FCBGA (21x21)	封装: 625-BFBGA, FCBGA	库存4,112
XC7K325T-1FFG676CES9937	Xilinx Inc.	IC FPGA 400 I/O 676FCBGA Number of LABs/CLBs: 25475 Number of Logic Elements/Cells: 326080 Total RAM Bits: 16404480 Number of I/O: 400 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封装: 676-BBGA, FCBGA	库存6,448
XC2V2000-5FGG676C	Xilinx Inc.	IC FPGA 456 I/O 676FBGA Number of LABs/CLBs: 2688 Number of Logic Elements/Cells: - Total RAM Bits: 1032192 Number of I/O: 456 Number of Gates: 2000000 Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27)	封装: 676-BGA	库存5,040
XC4010XL-2TQ176C	Xilinx Inc.	IC FPGA 145 I/O 176TQFP Number of LABs/CLBs: 400 Number of Logic Elements/Cells: 950 Total RAM Bits: 12800 Number of I/O: 145 Number of Gates: 10000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 176-LQFP Supplier Device Package: 176-TQFP (24x24)	封装: 176-LQFP	库存6,672
XC4008E-3PG191C	Xilinx Inc.	IC FPGA 144 I/O 191CPGA Number of LABs/CLBs: 324 Number of Logic Elements/Cells: 770 Total RAM Bits: 10368 Number of I/O: 144 Number of Gates: 8000 Voltage - Supply: 4.75 V ~ 5.25 V Mounting Type: Through Hole Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 191-BCPGA Supplier Device Package: 191-CPGA (47.25x47.25)	封装: 191-BCPGA	库存7,552
XC4003E-4VQ100C	Xilinx Inc.	IC FPGA 77 I/O 100VQFP Number of LABs/CLBs: 100 Number of Logic Elements/Cells: 238 Total RAM Bits: 3200 Number of I/O: 77 Number of Gates: 3000 Voltage - Supply: 4.75 V ~ 5.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 100-TQFP Supplier Device Package: 100-VQFP (14x14)	封装: 100-TQFP	库存7,776
XCVU125-2FLVB2104E	Xilinx Inc.	IC FPGA 702 I/O 2104FCBGA Number of LABs/CLBs: 89520 Number of Logic Elements/Cells: 1566600 Total RAM Bits: 90726400 Number of I/O: 702 Number of Gates: - Voltage - Supply: 0.922 V ~ 0.979 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2104-BBGA, FCBGA Supplier Device Package: 2104-FCBGA (47.5x47.5)	封装: 2104-BBGA, FCBGA	库存6,640
XCVU080-3FFVD1517E	Xilinx Inc.	IC FPGA 338 I/O 1517FCBGA Number of LABs/CLBs: 55714 Number of Logic Elements/Cells: 975000 Total RAM Bits: 51200000 Number of I/O: 338 Number of Gates: - Voltage - Supply: 0.970 V ~ 1.030 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	封装: 1517-BBGA, FCBGA	库存6,720
XC6VHX255T-1FFG1155C	Xilinx Inc.	IC FPGA 440 I/O 1156FCBGA Number of LABs/CLBs: 19800 Number of Logic Elements/Cells: 253440 Total RAM Bits: 19021824 Number of I/O: 440 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	封装: 1156-BBGA, FCBGA	库存6,656
XC6VLX240T-L1FFG784I	Xilinx Inc.	IC FPGA 400 I/O 784FCBGA Number of LABs/CLBs: 18840 Number of Logic Elements/Cells: 241152 Total RAM Bits: 15335424 Number of I/O: 400 Number of Gates: - Voltage - Supply: 0.91 V ~ 0.97 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (29x29)	封装: 784-BBGA, FCBGA	库存6,352
XC5VLX85-3FFG1153C	Xilinx Inc.	IC FPGA 560 I/O 1153FCBGA Number of LABs/CLBs: 6480 Number of Logic Elements/Cells: 82944 Total RAM Bits: 3538944 Number of I/O: 560 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1153-BBGA, FCBGA Supplier Device Package: 1153-FCBGA (35x35)	封装: 1153-BBGA, FCBGA	库存2,256
XQ4VFX100-DIE4058	Xilinx Inc.	IC FPGA VIRTEX-4FX DIE Number of LABs/CLBs: 10544 Number of Logic Elements/Cells: 94896 Total RAM Bits: 6930432 Number of I/O: 576 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: - Package / Case: Die Supplier Device Package: Die	封装: Die	库存4,752
XQ6SLX150T-3CSG484I	Xilinx Inc.	IC FPGA SPARTAN-6Q 484-CSBGA Number of LABs/CLBs: 11519 Number of Logic Elements/Cells: 147443 Total RAM Bits: 4939776 Number of I/O: 296 Number of Gates: - Voltage - Supply: 1.2 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-FBGA, CSPBGA Supplier Device Package: 484-CSPBGA (19x19)	封装: 484-FBGA, CSPBGA	库存7,776
XC6SLX150T-3FG676I	Xilinx Inc.	IC FPGA 396 I/O 676FCBGA Number of LABs/CLBs: 11519 Number of Logic Elements/Cells: 147443 Total RAM Bits: 4939776 Number of I/O: 396 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封装: 676-BBGA, FCBGA	库存7,808
XC6SLX150-3FG900I	Xilinx Inc.	IC FPGA 576 I/O 900FBGA Number of LABs/CLBs: 11519 Number of Logic Elements/Cells: 147443 Total RAM Bits: 4939776 Number of I/O: 576 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA Supplier Device Package: 900-FBGA (31x31)	封装: 900-BBGA	库存7,824
XC7A50T-1CSG324C	Xilinx Inc.	IC FPGA ARTIX7 210 I/O 324CSBGA Number of LABs/CLBs: 4075 Number of Logic Elements/Cells: 52160 Total RAM Bits: 2764800 Number of I/O: 210 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 324-LFBGA, CSPBGA Supplier Device Package: 324-CSPBGA (15x15)	封装: 324-LFBGA, CSPBGA	库存4,992
XA3S500E-4CPG132Q	Xilinx Inc.	IC FPGA 92 I/O 132CSBGA Number of LABs/CLBs: 1164 Number of Logic Elements/Cells: 10476 Total RAM Bits: 368640 Number of I/O: 92 Number of Gates: 500000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 132-TFBGA, CSPBGA Supplier Device Package: 132-CSPBGA (8x8)	封装: 132-TFBGA, CSPBGA	库存5,808
XC3S200A-4VQ100C	Xilinx Inc.	IC FPGA 68 I/O 100VQFP Number of LABs/CLBs: 448 Number of Logic Elements/Cells: 4032 Total RAM Bits: 294912 Number of I/O: 68 Number of Gates: 200000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 100-TQFP Supplier Device Package: 100-VQFP (14x14)	封装: 100-TQFP	库存3,936
XC7A200T-1FBG484C	Xilinx Inc.	IC FPGA ARTIX7 285 I/O 484FCBGA Number of LABs/CLBs: 16825 Number of Logic Elements/Cells: 215360 Total RAM Bits: 13455360 Number of I/O: 285 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BBGA, FCBGA Supplier Device Package: 484-FCBGA (23x23)	封装: 484-BBGA, FCBGA	库存8,028
XC3S1000-4FTG256C	Xilinx Inc.	IC FPGA 173 I/O 256FTBGA Number of LABs/CLBs: 1920 Number of Logic Elements/Cells: 17280 Total RAM Bits: 442368 Number of I/O: 173 Number of Gates: 1000000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FTBGA (17x17)	封装: 256-LBGA	库存6,336
XC95288XL-10CSG280C	Xilinx Inc.	IC CPLD 288MC 10NS 280CSBGA Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 10.0ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 16 Number of Macrocells: 288 Number of Gates: 6400 Number of I/O: 192 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 280-TFBGA, CSPBGA Supplier Device Package: 280-CSBGA (16x16)	封装: 280-TFBGA, CSPBGA	库存38,880
XC9572XL-7VQ64C	Xilinx Inc.	IC CPLD 72MC 7.5NS 64VQFP Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 7.5ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 4 Number of Macrocells: 72 Number of Gates: 1600 Number of I/O: 52 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 64-TQFP Supplier Device Package: 64-VQFP (10x10)	封装: 64-TQFP	库存22,728
XC7Z030-2FF676I	Xilinx Inc.	IC SOC CORTEX-A9 KINTEX7 676FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: - Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封装: 676-BBGA, FCBGA	库存3,360
XC7S50-2FTGB196I	Xilinx Inc.	XC7S50-2FTGB196I Number of LABs/CLBs: 4075 Number of Logic Elements/Cells: 52160 Total RAM Bits: 2764800 Number of I/O: 100 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 196-LBGA, CSPBGA Supplier Device Package: 196-CSBGA (15x15)	封装: 196-LBGA, CSPBGA	库存6,048
XCKU3P-L1FFVB676I	Xilinx Inc.	XCKU3P-L1FFVB676I Number of LABs/CLBs: 20340 Number of Logic Elements/Cells: 355950 Total RAM Bits: 31641600 Number of I/O: 280 Number of Gates: - Voltage - Supply: 0.698 V ~ 0.876 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封装: 676-BBGA, FCBGA	库存2,336

XCMECH-FF668

Xilinx Inc.

FF668 MECHANICAL SAMPLE

Type: Mechanical Sample
Applications: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封装: -

库存6,080

XCZU17EG-3FFVC1760E

Xilinx Inc.

IC FPGA 512 I/O 1760FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 926K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FCBGA (42.5x42.5)

封装: 1760-BBGA, FCBGA

库存7,536

XCZU9CG-L1FFVB1156I

Xilinx Inc.

IC FPGA 328 I/O 1156FCBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 1.3GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 599K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)

封装: 1156-BBGA, FCBGA

库存3,984

XCZU2EG-3SFVA625E

Xilinx Inc.

IC FPGA 180 I/O 625FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 625-BFBGA, FCBGA
Supplier Device Package: 625-FCBGA (21x21)

封装: 625-BFBGA, FCBGA

库存2,768

XCZU3CG-L1SFVC784I

Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 1.3GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 154K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 784-BBGA, FCBGA
Supplier Device Package: 784-FCBGA (23x23)

封装: 784-BBGA, FCBGA

库存5,408

XCZU3CG-1SFVA625E

Xilinx Inc.

XCZU3CG-1SFVA625E

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 1.3GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 154K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 625-BFBGA, FCBGA
Supplier Device Package: 625-FCBGA (21x21)

封装: 625-BFBGA, FCBGA

库存4,112

XC7K325T-1FFG676CES9937

Xilinx Inc.

IC FPGA 400 I/O 676FCBGA

Number of LABs/CLBs: 25475
Number of Logic Elements/Cells: 326080
Total RAM Bits: 16404480
Number of I/O: 400
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封装: 676-BBGA, FCBGA

库存6,448

XC2V2000-5FGG676C

Xilinx Inc.

IC FPGA 456 I/O 676FBGA

Number of LABs/CLBs: 2688
Number of Logic Elements/Cells: -
Total RAM Bits: 1032192
Number of I/O: 456
Number of Gates: 2000000
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 676-BGA
Supplier Device Package: 676-FBGA (27x27)

封装: 676-BGA

库存5,040

XC4010XL-2TQ176C

Xilinx Inc.

IC FPGA 145 I/O 176TQFP

Number of LABs/CLBs: 400
Number of Logic Elements/Cells: 950
Total RAM Bits: 12800
Number of I/O: 145
Number of Gates: 10000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 176-LQFP
Supplier Device Package: 176-TQFP (24x24)

封装: 176-LQFP

库存6,672

XC4008E-3PG191C

Xilinx Inc.

IC FPGA 144 I/O 191CPGA

Number of LABs/CLBs: 324
Number of Logic Elements/Cells: 770
Total RAM Bits: 10368
Number of I/O: 144
Number of Gates: 8000
Voltage - Supply: 4.75 V ~ 5.25 V
Mounting Type: Through Hole
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 191-BCPGA
Supplier Device Package: 191-CPGA (47.25x47.25)

封装: 191-BCPGA

库存7,552

XC4003E-4VQ100C

Xilinx Inc.

IC FPGA 77 I/O 100VQFP

Number of LABs/CLBs: 100
Number of Logic Elements/Cells: 238
Total RAM Bits: 3200
Number of I/O: 77
Number of Gates: 3000
Voltage - Supply: 4.75 V ~ 5.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 100-TQFP
Supplier Device Package: 100-VQFP (14x14)

封装: 100-TQFP

库存7,776

XCVU125-2FLVB2104E

Xilinx Inc.

IC FPGA 702 I/O 2104FCBGA

Number of LABs/CLBs: 89520
Number of Logic Elements/Cells: 1566600
Total RAM Bits: 90726400
Number of I/O: 702
Number of Gates: -
Voltage - Supply: 0.922 V ~ 0.979 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 2104-BBGA, FCBGA
Supplier Device Package: 2104-FCBGA (47.5x47.5)

封装: 2104-BBGA, FCBGA

库存6,640

XCVU080-3FFVD1517E

Xilinx Inc.

IC FPGA 338 I/O 1517FCBGA

Number of LABs/CLBs: 55714
Number of Logic Elements/Cells: 975000
Total RAM Bits: 51200000
Number of I/O: 338
Number of Gates: -
Voltage - Supply: 0.970 V ~ 1.030 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCBGA (40x40)

封装: 1517-BBGA, FCBGA

库存6,720

XC6VHX255T-1FFG1155C

Xilinx Inc.

IC FPGA 440 I/O 1156FCBGA

Number of LABs/CLBs: 19800
Number of Logic Elements/Cells: 253440
Total RAM Bits: 19021824
Number of I/O: 440
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)

封装: 1156-BBGA, FCBGA

库存6,656

XC6VLX240T-L1FFG784I

Xilinx Inc.

IC FPGA 400 I/O 784FCBGA

Number of LABs/CLBs: 18840
Number of Logic Elements/Cells: 241152
Total RAM Bits: 15335424
Number of I/O: 400
Number of Gates: -
Voltage - Supply: 0.91 V ~ 0.97 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 784-BBGA, FCBGA
Supplier Device Package: 784-FCBGA (29x29)

封装: 784-BBGA, FCBGA

库存6,352

XC5VLX85-3FFG1153C

Xilinx Inc.

IC FPGA 560 I/O 1153FCBGA

Number of LABs/CLBs: 6480
Number of Logic Elements/Cells: 82944
Total RAM Bits: 3538944
Number of I/O: 560
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1153-BBGA, FCBGA
Supplier Device Package: 1153-FCBGA (35x35)

封装: 1153-BBGA, FCBGA

库存2,256

XQ4VFX100-DIE4058

Xilinx Inc.

IC FPGA VIRTEX-4FX DIE

Number of LABs/CLBs: 10544
Number of Logic Elements/Cells: 94896
Total RAM Bits: 6930432
Number of I/O: 576
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -
Package / Case: Die
Supplier Device Package: Die

封装: Die

库存4,752

XQ6SLX150T-3CSG484I

Xilinx Inc.

IC FPGA SPARTAN-6Q 484-CSBGA

Number of LABs/CLBs: 11519
Number of Logic Elements/Cells: 147443
Total RAM Bits: 4939776
Number of I/O: 296
Number of Gates: -
Voltage - Supply: 1.2 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-FBGA, CSPBGA
Supplier Device Package: 484-CSPBGA (19x19)

封装: 484-FBGA, CSPBGA

库存7,776

XC6SLX150T-3FG676I

Xilinx Inc.

IC FPGA 396 I/O 676FCBGA

Number of LABs/CLBs: 11519
Number of Logic Elements/Cells: 147443
Total RAM Bits: 4939776
Number of I/O: 396
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封装: 676-BBGA, FCBGA

库存7,808

XC6SLX150-3FG900I

Xilinx Inc.

IC FPGA 576 I/O 900FBGA

Number of LABs/CLBs: 11519
Number of Logic Elements/Cells: 147443
Total RAM Bits: 4939776
Number of I/O: 576
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 900-BBGA
Supplier Device Package: 900-FBGA (31x31)

封装: 900-BBGA

库存7,824

XC7A50T-1CSG324C

Xilinx Inc.

IC FPGA ARTIX7 210 I/O 324CSBGA

Number of LABs/CLBs: 4075
Number of Logic Elements/Cells: 52160
Total RAM Bits: 2764800
Number of I/O: 210
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 324-LFBGA, CSPBGA
Supplier Device Package: 324-CSPBGA (15x15)

封装: 324-LFBGA, CSPBGA

库存4,992

XA3S500E-4CPG132Q

Xilinx Inc.

IC FPGA 92 I/O 132CSBGA

Number of LABs/CLBs: 1164
Number of Logic Elements/Cells: 10476
Total RAM Bits: 368640
Number of I/O: 92
Number of Gates: 500000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Package / Case: 132-TFBGA, CSPBGA
Supplier Device Package: 132-CSPBGA (8x8)

封装: 132-TFBGA, CSPBGA

库存5,808

XC3S200A-4VQ100C

Xilinx Inc.

IC FPGA 68 I/O 100VQFP

Number of LABs/CLBs: 448
Number of Logic Elements/Cells: 4032
Total RAM Bits: 294912
Number of I/O: 68
Number of Gates: 200000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 100-TQFP
Supplier Device Package: 100-VQFP (14x14)

封装: 100-TQFP

库存3,936

XC7A200T-1FBG484C

Xilinx Inc.

IC FPGA ARTIX7 285 I/O 484FCBGA

Number of LABs/CLBs: 16825
Number of Logic Elements/Cells: 215360
Total RAM Bits: 13455360
Number of I/O: 285
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BBGA, FCBGA
Supplier Device Package: 484-FCBGA (23x23)

封装: 484-BBGA, FCBGA

库存8,028

XC3S1000-4FTG256C

Xilinx Inc.

IC FPGA 173 I/O 256FTBGA

Number of LABs/CLBs: 1920
Number of Logic Elements/Cells: 17280
Total RAM Bits: 442368
Number of I/O: 173
Number of Gates: 1000000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FTBGA (17x17)

封装: 256-LBGA

库存6,336

XC95288XL-10CSG280C

Xilinx Inc.

IC CPLD 288MC 10NS 280CSBGA

Programmable Type: In System Programmable (min 10K program/erase cycles)
Delay Time tpd(1) Max: 10.0ns
Voltage Supply - Internal: 3 V ~ 3.6 V
Number of Logic Elements/Blocks: 16
Number of Macrocells: 288
Number of Gates: 6400
Number of I/O: 192
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 280-TFBGA, CSPBGA
Supplier Device Package: 280-CSBGA (16x16)

封装: 280-TFBGA, CSPBGA

库存38,880

XC9572XL-7VQ64C

Xilinx Inc.

IC CPLD 72MC 7.5NS 64VQFP

Programmable Type: In System Programmable (min 10K program/erase cycles)
Delay Time tpd(1) Max: 7.5ns
Voltage Supply - Internal: 3 V ~ 3.6 V
Number of Logic Elements/Blocks: 4
Number of Macrocells: 72
Number of Gates: 1600
Number of I/O: 52
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-TQFP
Supplier Device Package: 64-VQFP (10x10)

封装: 64-TQFP

库存22,728

XC7Z030-2FF676I

Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 676FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: -
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封装: 676-BBGA, FCBGA

库存3,360

XC7S50-2FTGB196I

Xilinx Inc.

XC7S50-2FTGB196I

Number of LABs/CLBs: 4075
Number of Logic Elements/Cells: 52160
Total RAM Bits: 2764800
Number of I/O: 100
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 196-LBGA, CSPBGA
Supplier Device Package: 196-CSBGA (15x15)

封装: 196-LBGA, CSPBGA

库存6,048

XCKU3P-L1FFVB676I

Xilinx Inc.

XCKU3P-L1FFVB676I

Number of LABs/CLBs: 20340
Number of Logic Elements/Cells: 355950
Total RAM Bits: 31641600
Number of I/O: 280
Number of Gates: -
Voltage - Supply: 0.698 V ~ 0.876 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封装: 676-BBGA, FCBGA

库存2,336