页 173 - Xilinx Inc. 产品 - 嵌入式 - FPGA（现场可编程门阵列） | 深圳黑森尔电子
联系我们
SalesDept@heisener.com +86-0755-87210559 ext.802
登入/注册
BOM
购物车 0

Xilinx Inc. 产品 - 嵌入式 - FPGA（现场可编程门阵列）

记录 5,652
页  173/189
图片
零件编号
制造商
描述
封装
库存
数量
Number of Logic Elements/Cells
Total RAM Bits
Number of I/O
Number of Gates
Voltage - Supply
Mounting Type
Operating Temperature
Package / Case
Supplier Device Package
hot XC4044XLA-08HQ240C
Xilinx Inc.

IC FPGA 193 I/O 240HQFP

  • Number of LABs/CLBs: 1600
  • Number of Logic Elements/Cells: 3800
  • Total RAM Bits: 51200
  • Number of I/O: 193
  • Number of Gates: 44000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP Exposed Pad
  • Supplier Device Package: 240-PQFP (32x32)
封装: 240-BFQFP Exposed Pad
库存6,192
3800
51200
193
44000
3 V ~ 3.6 V
Surface Mount
0°C ~ 85°C (TJ)
240-BFQFP Exposed Pad
240-PQFP (32x32)
hot XC4028EX-4HQ208C
Xilinx Inc.

IC FPGA 160 I/O 208HQFP

  • Number of LABs/CLBs: 1024
  • Number of Logic Elements/Cells: 2432
  • Total RAM Bits: 32768
  • Number of I/O: 160
  • Number of Gates: 28000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 208-BFQFP Exposed Pad
  • Supplier Device Package: 208-PQFP (28x28)
封装: 208-BFQFP Exposed Pad
库存6,192
2432
32768
160
28000
4.75 V ~ 5.25 V
Surface Mount
0°C ~ 85°C (TJ)
208-BFQFP Exposed Pad
208-PQFP (28x28)
XC4036XLA-09HQ240C
Xilinx Inc.

IC FPGA 193 I/O 240HQFP

  • Number of LABs/CLBs: 1296
  • Number of Logic Elements/Cells: 3078
  • Total RAM Bits: 41472
  • Number of I/O: 193
  • Number of Gates: 36000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP Exposed Pad
  • Supplier Device Package: 240-PQFP (32x32)
封装: 240-BFQFP Exposed Pad
库存5,952
3078
41472
193
36000
3 V ~ 3.6 V
Surface Mount
0°C ~ 85°C (TJ)
240-BFQFP Exposed Pad
240-PQFP (32x32)
hot XC3090A-7TQ176C
Xilinx Inc.

IC FPGA 144 I/O 176TQFP

  • Number of LABs/CLBs: 320
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 64160
  • Number of I/O: 144
  • Number of Gates: 6000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 176-LQFP
  • Supplier Device Package: 176-TQFP (24x24)
封装: 176-LQFP
库存9,528
-
64160
144
6000
4.75 V ~ 5.25 V
Surface Mount
0°C ~ 85°C (TJ)
176-LQFP
176-TQFP (24x24)
XC4028XLA-09HQ240I
Xilinx Inc.

IC FPGA 193 I/O 240HQFP

  • Number of LABs/CLBs: 1024
  • Number of Logic Elements/Cells: 2432
  • Total RAM Bits: 32768
  • Number of I/O: 193
  • Number of Gates: 28000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 240-BFQFP Exposed Pad
  • Supplier Device Package: 240-PQFP (32x32)
封装: 240-BFQFP Exposed Pad
库存6,480
2432
32768
193
28000
3 V ~ 3.6 V
Surface Mount
-40°C ~ 100°C (TJ)
240-BFQFP Exposed Pad
240-PQFP (32x32)
XCV812E-8FG900C
Xilinx Inc.

IC FPGA 556 I/O 900FBGA

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 1146880
  • Number of I/O: 556
  • Number of Gates: 254016
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 900-BBGA
  • Supplier Device Package: 900-FBGA (31x31)
封装: 900-BBGA
库存4,640
21168
1146880
556
254016
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
900-BBGA
900-FBGA (31x31)
XCV812E-8BG560C
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 1146880
  • Number of I/O: 404
  • Number of Gates: 254016
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
封装: 560-LBGA, Metal
库存2,720
21168
1146880
404
254016
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
560-LBGA, Metal
560-MBGA (42.5x42.5)
XCV812E-7FG900C
Xilinx Inc.

IC FPGA 556 I/O 900FBGA

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 1146880
  • Number of I/O: 556
  • Number of Gates: 254016
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 900-BBGA
  • Supplier Device Package: 900-FBGA (31x31)
封装: 900-BBGA
库存5,408
21168
1146880
556
254016
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
900-BBGA
900-FBGA (31x31)
XCV812E-7BG560C
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 1146880
  • Number of I/O: 404
  • Number of Gates: 254016
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
封装: 560-LBGA, Metal
库存6,992
21168
1146880
404
254016
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
560-LBGA, Metal
560-MBGA (42.5x42.5)
hot XCV812E-6FG900C
Xilinx Inc.

IC FPGA 556 I/O 900FBGA

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 1146880
  • Number of I/O: 556
  • Number of Gates: 254016
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 900-BBGA
  • Supplier Device Package: 900-FBGA (31x31)
封装: 900-BBGA
库存17,424
21168
1146880
556
254016
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
900-BBGA
900-FBGA (31x31)
hot XCV812E-6BG560C
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 1146880
  • Number of I/O: 404
  • Number of Gates: 254016
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
封装: 560-LBGA, Metal
库存5,184
21168
1146880
404
254016
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
560-LBGA, Metal
560-MBGA (42.5x42.5)
XCV800-6HQ240C
Xilinx Inc.

IC FPGA 166 I/O 240HQFP

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 114688
  • Number of I/O: 166
  • Number of Gates: 888439
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP Exposed Pad
  • Supplier Device Package: 240-PQFP (32x32)
封装: 240-BFQFP Exposed Pad
库存5,600
21168
114688
166
888439
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
240-BFQFP Exposed Pad
240-PQFP (32x32)
hot XCV800-6FG680C
Xilinx Inc.

IC FPGA 512 I/O 680FBGA

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 114688
  • Number of I/O: 512
  • Number of Gates: 888439
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 680-LBGA Exposed Pad
  • Supplier Device Package: 680-FTEBGA (40x40)
封装: 680-LBGA Exposed Pad
库存6,464
21168
114688
512
888439
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
680-LBGA Exposed Pad
680-FTEBGA (40x40)
XCV800-6FG676C
Xilinx Inc.

IC FPGA 444 I/O 676FBGA

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 114688
  • Number of I/O: 444
  • Number of Gates: 888439
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
封装: 676-BBGA, FCBGA
库存6,688
21168
114688
444
888439
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
676-BBGA, FCBGA
676-FCBGA (27x27)
hot XCV800-6BG560C
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 114688
  • Number of I/O: 404
  • Number of Gates: 888439
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
封装: 560-LBGA, Metal
库存5,680
21168
114688
404
888439
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
560-LBGA, Metal
560-MBGA (42.5x42.5)
hot XCV800-6BG432C
Xilinx Inc.

IC FPGA 316 I/O 432MBGA

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 114688
  • Number of I/O: 316
  • Number of Gates: 888439
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 432-LBGA, Metal
  • Supplier Device Package: 432-MBGA (40x40)
封装: 432-LBGA, Metal
库存3,984
21168
114688
316
888439
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
432-LBGA, Metal
432-MBGA (40x40)
hot XCV800-5HQ240I
Xilinx Inc.

IC FPGA 166 I/O 240HQFP

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 114688
  • Number of I/O: 166
  • Number of Gates: 888439
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 240-BFQFP Exposed Pad
  • Supplier Device Package: 240-PQFP (32x32)
封装: 240-BFQFP Exposed Pad
库存4,256
21168
114688
166
888439
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
240-BFQFP Exposed Pad
240-PQFP (32x32)
hot XCV800-5HQ240C
Xilinx Inc.

IC FPGA 166 I/O 240HQFP

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 114688
  • Number of I/O: 166
  • Number of Gates: 888439
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP Exposed Pad
  • Supplier Device Package: 240-PQFP (32x32)
封装: 240-BFQFP Exposed Pad
库存22,200
21168
114688
166
888439
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
240-BFQFP Exposed Pad
240-PQFP (32x32)
XCV800-5FG680I
Xilinx Inc.

IC FPGA 512 I/O 680FBGA

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 114688
  • Number of I/O: 512
  • Number of Gates: 888439
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 680-LBGA Exposed Pad
  • Supplier Device Package: 680-FTEBGA (40x40)
封装: 680-LBGA Exposed Pad
库存4,784
21168
114688
512
888439
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
680-LBGA Exposed Pad
680-FTEBGA (40x40)
XCV800-5FG680C
Xilinx Inc.

IC FPGA 512 I/O 680FBGA

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 114688
  • Number of I/O: 512
  • Number of Gates: 888439
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 680-LBGA Exposed Pad
  • Supplier Device Package: 680-FTEBGA (40x40)
封装: 680-LBGA Exposed Pad
库存3,648
21168
114688
512
888439
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
680-LBGA Exposed Pad
680-FTEBGA (40x40)
hot XCV800-5FG676I
Xilinx Inc.

IC FPGA 444 I/O 676FBGA

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 114688
  • Number of I/O: 444
  • Number of Gates: 888439
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
封装: 676-BBGA, FCBGA
库存7,808
21168
114688
444
888439
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
676-BBGA, FCBGA
676-FCBGA (27x27)
XCV800-5FG676C
Xilinx Inc.

IC FPGA 444 I/O 676FBGA

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 114688
  • Number of I/O: 444
  • Number of Gates: 888439
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
封装: 676-BBGA, FCBGA
库存5,600
21168
114688
444
888439
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
676-BBGA, FCBGA
676-FCBGA (27x27)
hot XCV800-5BG560I
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 114688
  • Number of I/O: 404
  • Number of Gates: 888439
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
封装: 560-LBGA, Metal
库存5,056
21168
114688
404
888439
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
560-LBGA, Metal
560-MBGA (42.5x42.5)
hot XCV800-5BG560C
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 114688
  • Number of I/O: 404
  • Number of Gates: 888439
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
封装: 560-LBGA, Metal
库存4,784
21168
114688
404
888439
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
560-LBGA, Metal
560-MBGA (42.5x42.5)
XCV800-5BG432I
Xilinx Inc.

IC FPGA 316 I/O 432MBGA

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 114688
  • Number of I/O: 316
  • Number of Gates: 888439
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 432-LBGA, Metal
  • Supplier Device Package: 432-MBGA (40x40)
封装: 432-LBGA, Metal
库存3,408
21168
114688
316
888439
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
432-LBGA, Metal
432-MBGA (40x40)
hot XCV800-5BG432C
Xilinx Inc.

IC FPGA 316 I/O 432MBGA

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 114688
  • Number of I/O: 316
  • Number of Gates: 888439
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 432-LBGA, Metal
  • Supplier Device Package: 432-MBGA (40x40)
封装: 432-LBGA, Metal
库存8,928
21168
114688
316
888439
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
432-LBGA, Metal
432-MBGA (40x40)
hot XCV800-4HQ240I
Xilinx Inc.

IC FPGA 166 I/O 240HQFP

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 114688
  • Number of I/O: 166
  • Number of Gates: 888439
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 240-BFQFP Exposed Pad
  • Supplier Device Package: 240-PQFP (32x32)
封装: 240-BFQFP Exposed Pad
库存5,664
21168
114688
166
888439
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
240-BFQFP Exposed Pad
240-PQFP (32x32)
hot XCV800-4HQ240C
Xilinx Inc.

IC FPGA 166 I/O 240HQFP

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 114688
  • Number of I/O: 166
  • Number of Gates: 888439
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP Exposed Pad
  • Supplier Device Package: 240-PQFP (32x32)
封装: 240-BFQFP Exposed Pad
库存6,176
21168
114688
166
888439
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
240-BFQFP Exposed Pad
240-PQFP (32x32)
XCV800-4FG680I
Xilinx Inc.

IC FPGA 512 I/O 680FBGA

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 114688
  • Number of I/O: 512
  • Number of Gates: 888439
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 680-LBGA Exposed Pad
  • Supplier Device Package: 680-FTEBGA (40x40)
封装: 680-LBGA Exposed Pad
库存7,584
21168
114688
512
888439
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
680-LBGA Exposed Pad
680-FTEBGA (40x40)
XCV800-4FG680C
Xilinx Inc.

IC FPGA 512 I/O 680FBGA

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 114688
  • Number of I/O: 512
  • Number of Gates: 888439
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 680-LBGA Exposed Pad
  • Supplier Device Package: 680-FTEBGA (40x40)
封装: 680-LBGA Exposed Pad
库存2,080
21168
114688
512
888439
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
680-LBGA Exposed Pad
680-FTEBGA (40x40)