页 160 - Xilinx Inc. 产品 - 嵌入式 - FPGA（现场可编程门阵列） | 深圳黑森尔电子
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Xilinx Inc. 产品 - 嵌入式 - FPGA（现场可编程门阵列）

记录 5,652
页  160/189
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零件编号
制造商
描述
封装
库存
数量
Number of Logic Elements/Cells
Total RAM Bits
Number of I/O
Number of Gates
Voltage - Supply
Mounting Type
Operating Temperature
Package / Case
Supplier Device Package
XCV1000E-6FG860I
Xilinx Inc.

IC FPGA 660 I/O 860FGBA

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 393216
  • Number of I/O: 660
  • Number of Gates: 1569178
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 860-BGA
  • Supplier Device Package: 860-FBGA (42.5x42.5)
封装: 860-BGA
库存3,296
27648
393216
660
1569178
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
860-BGA
860-FBGA (42.5x42.5)
hot XCV1000E-6FG860C
Xilinx Inc.

IC FPGA 660 I/O 860FGBA

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 393216
  • Number of I/O: 660
  • Number of Gates: 1569178
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 860-BGA
  • Supplier Device Package: 860-FBGA (42.5x42.5)
封装: 860-BGA
库存4,032
27648
393216
660
1569178
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
860-BGA
860-FBGA (42.5x42.5)
hot XCV1000E-6FG680I
Xilinx Inc.

IC FPGA 512 I/O 680FBGA

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 393216
  • Number of I/O: 512
  • Number of Gates: 1569178
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 680-LBGA Exposed Pad
  • Supplier Device Package: 680-FTEBGA (40x40)
封装: 680-LBGA Exposed Pad
库存4,048
27648
393216
512
1569178
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
680-LBGA Exposed Pad
680-FTEBGA (40x40)
hot XCV1000E-6FG680C
Xilinx Inc.

IC FPGA 512 I/O 680FBGA

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 393216
  • Number of I/O: 512
  • Number of Gates: 1569178
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 680-LBGA Exposed Pad
  • Supplier Device Package: 680-FTEBGA (40x40)
封装: 680-LBGA Exposed Pad
库存9,312
27648
393216
512
1569178
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
680-LBGA Exposed Pad
680-FTEBGA (40x40)
XCV1000E-6FG1156I
Xilinx Inc.

IC FPGA 660 I/O 1156FBGA

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 393216
  • Number of I/O: 660
  • Number of Gates: 1569178
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA
  • Supplier Device Package: 1156-FBGA (35x35)
封装: 1156-BBGA
库存7,008
27648
393216
660
1569178
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
1156-BBGA
1156-FBGA (35x35)
hot XCV1000E-6FG1156C
Xilinx Inc.

IC FPGA 660 I/O 1156FBGA

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 393216
  • Number of I/O: 660
  • Number of Gates: 1569178
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1156-BBGA
  • Supplier Device Package: 1156-FBGA (35x35)
封装: 1156-BBGA
库存5,488
27648
393216
660
1569178
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
1156-BBGA
1156-FBGA (35x35)
XCV1000E-6BG560I
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 393216
  • Number of I/O: 404
  • Number of Gates: 1569178
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
封装: 560-LBGA, Metal
库存2,240
27648
393216
404
1569178
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
560-LBGA, Metal
560-MBGA (42.5x42.5)
hot XCV1000E-6BG560C
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 393216
  • Number of I/O: 404
  • Number of Gates: 1569178
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
封装: 560-LBGA, Metal
库存3,680
27648
393216
404
1569178
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
560-LBGA, Metal
560-MBGA (42.5x42.5)
hot XCV1000-6FG680C
Xilinx Inc.

IC FPGA 512 I/O 680FBGA

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 131072
  • Number of I/O: 512
  • Number of Gates: 1124022
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 680-LBGA Exposed Pad
  • Supplier Device Package: 680-FTEBGA (40x40)
封装: 680-LBGA Exposed Pad
库存4,304
27648
131072
512
1124022
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
680-LBGA Exposed Pad
680-FTEBGA (40x40)
XCV1000-6BG560C
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 131072
  • Number of I/O: 404
  • Number of Gates: 1124022
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
封装: 560-LBGA, Metal
库存6,416
27648
131072
404
1124022
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
560-LBGA, Metal
560-MBGA (42.5x42.5)
XCV1000-5FG680I
Xilinx Inc.

IC FPGA 512 I/O 680FBGA

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 131072
  • Number of I/O: 512
  • Number of Gates: 1124022
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 680-LBGA Exposed Pad
  • Supplier Device Package: 680-FTEBGA (40x40)
封装: 680-LBGA Exposed Pad
库存4,080
27648
131072
512
1124022
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
680-LBGA Exposed Pad
680-FTEBGA (40x40)
hot XCV1000-5FG680C
Xilinx Inc.

IC FPGA 512 I/O 680FBGA

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 131072
  • Number of I/O: 512
  • Number of Gates: 1124022
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 680-LBGA Exposed Pad
  • Supplier Device Package: 680-FTEBGA (40x40)
封装: 680-LBGA Exposed Pad
库存6,396
27648
131072
512
1124022
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
680-LBGA Exposed Pad
680-FTEBGA (40x40)
hot XCV1000-5BG560I
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 131072
  • Number of I/O: 404
  • Number of Gates: 1124022
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
封装: 560-LBGA, Metal
库存4,960
27648
131072
404
1124022
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
560-LBGA, Metal
560-MBGA (42.5x42.5)
hot XCV1000-5BG560C
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 131072
  • Number of I/O: 404
  • Number of Gates: 1124022
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
封装: 560-LBGA, Metal
库存5,216
27648
131072
404
1124022
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
560-LBGA, Metal
560-MBGA (42.5x42.5)
XCV1000-4FG680I
Xilinx Inc.

IC FPGA 512 I/O 680FBGA

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 131072
  • Number of I/O: 512
  • Number of Gates: 1124022
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 680-LBGA Exposed Pad
  • Supplier Device Package: 680-FTEBGA (40x40)
封装: 680-LBGA Exposed Pad
库存5,664
27648
131072
512
1124022
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
680-LBGA Exposed Pad
680-FTEBGA (40x40)
hot XCV1000-4FG680C
Xilinx Inc.

IC FPGA 512 I/O 680FBGA

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 131072
  • Number of I/O: 512
  • Number of Gates: 1124022
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 680-LBGA Exposed Pad
  • Supplier Device Package: 680-FTEBGA (40x40)
封装: 680-LBGA Exposed Pad
库存5,824
27648
131072
512
1124022
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
680-LBGA Exposed Pad
680-FTEBGA (40x40)
hot XCV1000-4BG560I
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 131072
  • Number of I/O: 404
  • Number of Gates: 1124022
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
封装: 560-LBGA, Metal
库存5,120
27648
131072
404
1124022
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
560-LBGA, Metal
560-MBGA (42.5x42.5)
hot XCV1000-4BG560C
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 131072
  • Number of I/O: 404
  • Number of Gates: 1124022
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
封装: 560-LBGA, Metal
库存6,948
27648
131072
404
1124022
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
560-LBGA, Metal
560-MBGA (42.5x42.5)
hot XCV100-6TQ144C
Xilinx Inc.

IC FPGA 98 I/O 144TQFP

  • Number of LABs/CLBs: 600
  • Number of Logic Elements/Cells: 2700
  • Total RAM Bits: 40960
  • Number of I/O: 98
  • Number of Gates: 108904
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
封装: 144-LQFP
库存50,280
2700
40960
98
108904
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
144-LQFP
144-TQFP (20x20)
hot XCV100-6PQ240C
Xilinx Inc.

IC FPGA 166 I/O 240QFP

  • Number of LABs/CLBs: 600
  • Number of Logic Elements/Cells: 2700
  • Total RAM Bits: 40960
  • Number of I/O: 166
  • Number of Gates: 108904
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-PQFP (32x32)
封装: 240-BFQFP
库存3,808
2700
40960
166
108904
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
240-BFQFP
240-PQFP (32x32)
hot XCV100-6FG256C
Xilinx Inc.

IC FPGA 176 I/O 256FBGA

  • Number of LABs/CLBs: 600
  • Number of Logic Elements/Cells: 2700
  • Total RAM Bits: 40960
  • Number of I/O: 176
  • Number of Gates: 108904
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
封装: 256-BGA
库存5,168
2700
40960
176
108904
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
256-BGA
256-FBGA (17x17)
XCV100-6CS144C
Xilinx Inc.

IC FPGA 94 I/O 144CSBGA

  • Number of LABs/CLBs: 600
  • Number of Logic Elements/Cells: 2700
  • Total RAM Bits: 40960
  • Number of I/O: 94
  • Number of Gates: 108904
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 144-TFBGA, CSPBGA
  • Supplier Device Package: 144-LCSBGA (12x12)
封装: 144-TFBGA, CSPBGA
库存4,608
2700
40960
94
108904
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
144-TFBGA, CSPBGA
144-LCSBGA (12x12)
XCV100-6BG256C
Xilinx Inc.

IC FPGA 180 I/O 256BGA

  • Number of LABs/CLBs: 600
  • Number of Logic Elements/Cells: 2700
  • Total RAM Bits: 40960
  • Number of I/O: 180
  • Number of Gates: 108904
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-BBGA
  • Supplier Device Package: 256-PBGA (27x27)
封装: 256-BBGA
库存6,400
2700
40960
180
108904
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
256-BBGA
256-PBGA (27x27)
hot XCV100-5TQ144I
Xilinx Inc.

IC FPGA 98 I/O 144TQFP

  • Number of LABs/CLBs: 600
  • Number of Logic Elements/Cells: 2700
  • Total RAM Bits: 40960
  • Number of I/O: 98
  • Number of Gates: 108904
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
封装: 144-LQFP
库存15,828
2700
40960
98
108904
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
144-LQFP
144-TQFP (20x20)
hot XCV100-5TQ144C
Xilinx Inc.

IC FPGA 98 I/O 144TQFP

  • Number of LABs/CLBs: 600
  • Number of Logic Elements/Cells: 2700
  • Total RAM Bits: 40960
  • Number of I/O: 98
  • Number of Gates: 108904
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
封装: 144-LQFP
库存4,368
2700
40960
98
108904
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
144-LQFP
144-TQFP (20x20)
hot XCV100-5PQ240I
Xilinx Inc.

IC FPGA 166 I/O 240QFP

  • Number of LABs/CLBs: 600
  • Number of Logic Elements/Cells: 2700
  • Total RAM Bits: 40960
  • Number of I/O: 166
  • Number of Gates: 108904
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-PQFP (32x32)
封装: 240-BFQFP
库存5,824
2700
40960
166
108904
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
240-BFQFP
240-PQFP (32x32)
hot XCV100-5PQ240C
Xilinx Inc.

IC FPGA 166 I/O 240QFP

  • Number of LABs/CLBs: 600
  • Number of Logic Elements/Cells: 2700
  • Total RAM Bits: 40960
  • Number of I/O: 166
  • Number of Gates: 108904
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-PQFP (32x32)
封装: 240-BFQFP
库存6,208
2700
40960
166
108904
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
240-BFQFP
240-PQFP (32x32)
hot XCV100-5FG256I
Xilinx Inc.

IC FPGA 176 I/O 256FBGA

  • Number of LABs/CLBs: 600
  • Number of Logic Elements/Cells: 2700
  • Total RAM Bits: 40960
  • Number of I/O: 176
  • Number of Gates: 108904
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
封装: 256-BGA
库存4,896
2700
40960
176
108904
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
256-BGA
256-FBGA (17x17)
XCV100-5FG256C
Xilinx Inc.

IC FPGA 176 I/O 256FBGA

  • Number of LABs/CLBs: 600
  • Number of Logic Elements/Cells: 2700
  • Total RAM Bits: 40960
  • Number of I/O: 176
  • Number of Gates: 108904
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
封装: 256-BGA
库存4,912
2700
40960
176
108904
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
256-BGA
256-FBGA (17x17)
XCV100-5CS144I
Xilinx Inc.

IC FPGA 94 I/O 144CSBGA

  • Number of LABs/CLBs: 600
  • Number of Logic Elements/Cells: 2700
  • Total RAM Bits: 40960
  • Number of I/O: 94
  • Number of Gates: 108904
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 144-TFBGA, CSPBGA
  • Supplier Device Package: 144-LCSBGA (12x12)
封装: 144-TFBGA, CSPBGA
库存3,664
2700
40960
94
108904
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
144-TFBGA, CSPBGA
144-LCSBGA (12x12)