页 22 - TE Connectivity AMP Connectors 产品 - 用于 IC 的插座，晶体管 | 深圳黑森尔电子
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TE Connectivity AMP Connectors 产品 - 用于 IC 的插座，晶体管

记录 941
页  22/32
图片
零件编号
制造商
描述
封装
库存
数量
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
3-1437537-0
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 14POS TINLEAD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 14 (2 x 7)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin-Lead
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Surface Mount
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: -
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: -
  • Housing Material: Polyester
  • Operating Temperature: -55°C ~ 105°C
封装: -
库存7,272
14 (2 x 7)
0.100" (2.54mm)
Tin-Lead
-
Copper Alloy
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
-
-
-
Polyester
-55°C ~ 105°C
3-1437532-4
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 28POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 28 (2 x 14)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: -
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Wire Wrap
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: -
  • Housing Material: -
  • Operating Temperature: -
封装: -
库存3,472
28 (2 x 14)
0.100" (2.54mm)
Gold
-
-
Through Hole
Closed Frame
Wire Wrap
0.100" (2.54mm)
Gold
-
-
-
-
3-1437531-7
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 14POS

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 14 (2 x 7)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: -
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: -
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Copper Alloy
  • Housing Material: -
  • Operating Temperature: -55°C ~ 105°C
封装: -
库存4,338
14 (2 x 7)
0.100" (2.54mm)
-
-
Copper Alloy
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
-
-
Copper Alloy
-
-55°C ~ 105°C
3-1437530-2
TE Connectivity AMP Connectors

CONN SOCKET SIP 15POS

  • Type: SIP
  • Number of Positions or Pins (Grid): 15 (1 x 15)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: -
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: -
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: -
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Thermoplastic
  • Operating Temperature: -
封装: -
库存8,712
15 (1 x 15)
0.100" (2.54mm)
-
-
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
-
-
Beryllium Copper
Thermoplastic
-
3-1437508-9
TE Connectivity AMP Connectors

CONN TRANSIST TO-5 8POS GOLD

  • Type: Transistor, TO-5
  • Number of Positions or Pins (Grid): 8 (Round)
  • Pitch - Mating: -
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: -
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polytetrafluoroethylene (PTFE)
  • Operating Temperature: -55°C ~ 125°C
封装: -
库存3,384
8 (Round)
-
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
-
Gold
-
Brass
Polytetrafluoroethylene (PTFE)
-55°C ~ 125°C
3-1437504-6
TE Connectivity AMP Connectors

CONN TRANSIST TO-3 3POS GOLD

  • Type: Transistor, TO-3
  • Number of Positions or Pins (Grid): 3 (Oval)
  • Pitch - Mating: -
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 50µin (1.27µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Chassis Mount
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: -
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 50µin (1.27µm)
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Polytetrafluoroethylene (PTFE)
  • Operating Temperature: -55°C ~ 125°C
封装: -
库存4,464
3 (Oval)
-
Gold
50µin (1.27µm)
Beryllium Copper
Chassis Mount
Closed Frame
Solder
-
Gold
50µin (1.27µm)
Beryllium Copper
Polytetrafluoroethylene (PTFE)
-55°C ~ 125°C
210748-5
TE Connectivity AMP Connectors

CONN SOCKET PGA 6POS TIN-LEAD

  • Type: PGA
  • Number of Positions or Pins (Grid): 6 (2 x 3)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin-Lead
  • Contact Finish Thickness - Mating: 197µin (5.00µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: -
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Thermoplastic, Polyester, Glass Filled
  • Operating Temperature: -
封装: -
库存8,226
6 (2 x 3)
0.100" (2.54mm)
Tin-Lead
197µin (5.00µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
-
-
Brass
Thermoplastic, Polyester, Glass Filled
-
2-641610-2
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 16POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 16 (2 x 8)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 30µin (0.76µm)
  • Contact Material - Post: Beryllium Copper
  • Housing Material: -
  • Operating Temperature: -
封装: -
库存4,626
16 (2 x 8)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
-
-
2-382467-1
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 28POS TIN

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 28 (2 x 14)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
  • Operating Temperature: -
封装: -
库存7,506
28 (2 x 14)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Beryllium Copper
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-
2-210735-5
TE Connectivity AMP Connectors

CONN SOCKET SIP 25POS TIN-LEAD

  • Type: SIP
  • Number of Positions or Pins (Grid): 25 (1 x 25)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin-Lead
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: -
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: -
  • Housing Material: Thermoplastic
  • Operating Temperature: -
封装: -
库存4,590
25 (1 x 25)
0.100" (2.54mm)
Tin-Lead
-
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Tin-Lead
-
-
Thermoplastic
-
2-1437542-9
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 20POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 20 (2 x 10)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 20µin (0.51µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 20µin (0.51µm)
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Aluminum Alloy
  • Operating Temperature: -55°C ~ 125°C
封装: -
库存2,574
20 (2 x 10)
0.100" (2.54mm)
Gold
20µin (0.51µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
20µin (0.51µm)
Beryllium Copper
Aluminum Alloy
-55°C ~ 125°C
2-1437540-2
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 32POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 32 (2 x 16)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 5µin (0.127µm)
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: -
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: -
  • Housing Material: Polyester
  • Operating Temperature: -55°C ~ 105°C
封装: -
库存5,688
32 (2 x 16)
0.100" (2.54mm)
Gold
5µin (0.127µm)
Copper Alloy
Through Hole
Open Frame
Solder
0.100" (2.54mm)
-
-
-
Polyester
-55°C ~ 105°C
2-1437532-2
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 24POS

  • Type: DIP, 0.4" (10.16mm) Row Spacing
  • Number of Positions or Pins (Grid): 24 (2 x 12)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: -
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: -
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: -
  • Pitch - Post: -
  • Contact Finish - Post: -
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: -
  • Housing Material: -
  • Operating Temperature: -
封装: -
库存5,220
24 (2 x 12)
0.100" (2.54mm)
-
-
-
Through Hole
Closed Frame
-
-
-
-
-
-
-
2-1437530-7
TE Connectivity AMP Connectors

CONN SOCKET SIP 7POS

  • Type: SIP
  • Number of Positions or Pins (Grid): 7 (1 x 7)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: -
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: -
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: -
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Thermoplastic
  • Operating Temperature: -
封装: -
库存3,240
7 (1 x 7)
0.100" (2.54mm)
-
-
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
-
-
Beryllium Copper
Thermoplastic
-
8058-1G57
TE Connectivity AMP Connectors

CONN TRANSIST TO-5 8POS GOLD

  • Type: Transistor, TO-5
  • Number of Positions or Pins (Grid): 8 (Round)
  • Pitch - Mating: -
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: -
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polytetrafluoroethylene (PTFE)
  • Operating Temperature: -55°C ~ 125°C
封装: -
库存5,706
8 (Round)
-
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
-
Gold
-
Brass
Polytetrafluoroethylene (PTFE)
-55°C ~ 125°C
1437542-6
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 6POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 6 (2 x 3)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 20µin (0.51µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 20µin (0.51µm)
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Aluminum Alloy
  • Operating Temperature: -55°C ~ 125°C
封装: -
库存8,262
6 (2 x 3)
0.100" (2.54mm)
Gold
20µin (0.51µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
20µin (0.51µm)
Beryllium Copper
Aluminum Alloy
-55°C ~ 125°C
1437538-2
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 28POS

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 28 (2 x 14)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: -
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: -
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: -
  • Housing Material: Polyester
  • Operating Temperature: -55°C ~ 105°C
封装: -
库存8,244
28 (2 x 14)
0.100" (2.54mm)
-
-
Copper Alloy
Through Hole
Open Frame
Solder
0.100" (2.54mm)
-
-
-
Polyester
-55°C ~ 105°C
1437535-6
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 6POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 6 (2 x 3)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: -
  • Operating Temperature: -55°C ~ 125°C
封装: -
库存7,326
6 (2 x 3)
0.100" (2.54mm)
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
-
Brass
-
-55°C ~ 125°C
1437532-5
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 22POS

  • Type: DIP, 0.4" (10.16mm) Row Spacing
  • Number of Positions or Pins (Grid): 22 (2 x 11)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: -
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: -
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: -
  • Pitch - Post: -
  • Contact Finish - Post: -
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: -
  • Housing Material: -
  • Operating Temperature: -
封装: -
库存8,388
22 (2 x 11)
0.100" (2.54mm)
-
-
-
Through Hole
Closed Frame
-
-
-
-
-
-
-
1437508-6
TE Connectivity AMP Connectors

CONN TRANSIST TO-5 8POS GOLD

  • Type: Transistor, TO-5
  • Number of Positions or Pins (Grid): 8 (Round)
  • Pitch - Mating: -
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: -
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polytetrafluoroethylene (PTFE)
  • Operating Temperature: -55°C ~ 125°C
封装: -
库存5,076
8 (Round)
-
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
-
Gold
-
Brass
Polytetrafluoroethylene (PTFE)
-55°C ~ 125°C
1437504-3
TE Connectivity AMP Connectors

CONN TRANSIST TO-5 4POS GOLD

  • Type: Transistor, TO-5
  • Number of Positions or Pins (Grid): 4 (Round)
  • Pitch - Mating: -
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: -
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Polytetrafluoroethylene (PTFE)
  • Operating Temperature: -55°C ~ 125°C
封装: -
库存3,528
4 (Round)
-
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
-
Gold
-
Beryllium Copper
Polytetrafluoroethylene (PTFE)
-55°C ~ 125°C
1-822473-2
TE Connectivity AMP Connectors

CONN SOCKET PLCC 28POS TIN

  • Type: PLCC
  • Number of Positions or Pins (Grid): 28 (4 x 7)
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: 80µin (2.03µm)
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 80µin (2.03µm)
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Thermoplastic
  • Operating Temperature: -
封装: -
库存5,076
28 (4 x 7)
0.050" (1.27mm)
Tin
80µin (2.03µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Tin
80µin (2.03µm)
Phosphor Bronze
Thermoplastic
-
1-390262-1
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 24POS TIN

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 24 (2 x 12)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: -
  • Operating Temperature: -40°C ~ 105°C
封装: -
库存5,400
24 (2 x 12)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
-
-40°C ~ 105°C
1-390261-1
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 6POS TIN

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 6 (2 x 3)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: 60µin (1.52µm)
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 60µin (1.52µm)
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: -
  • Operating Temperature: -40°C ~ 105°C
封装: -
库存6,318
6 (2 x 3)
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
-
-40°C ~ 105°C
1-345830-1
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 16POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 16 (2 x 8)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: -
  • Mounting Type: Through Hole, Right Angle, Vertical
  • Features: Closed Frame
  • Termination: -
  • Pitch - Post: -
  • Contact Finish - Post: -
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: -
  • Housing Material: -
  • Operating Temperature: -
封装: -
库存7,326
16 (2 x 8)
0.100" (2.54mm)
Gold
10µin (0.25µm)
-
Through Hole, Right Angle, Vertical
Closed Frame
-
-
-
-
-
-
-
1-1437542-9
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 16POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 16 (2 x 8)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 20µin (0.51µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 20µin (0.51µm)
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Aluminum Alloy
  • Operating Temperature: -55°C ~ 125°C
封装: -
库存7,272
16 (2 x 8)
0.100" (2.54mm)
Gold
20µin (0.51µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
20µin (0.51µm)
Beryllium Copper
Aluminum Alloy
-55°C ~ 125°C
1-1437542-1
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 8POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 8 (2 x 4)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 20µin (0.51µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 20µin (0.51µm)
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Aluminum Alloy
  • Operating Temperature: -55°C ~ 125°C
封装: -
库存3,526
8 (2 x 4)
0.100" (2.54mm)
Gold
20µin (0.51µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
20µin (0.51µm)
Beryllium Copper
Aluminum Alloy
-55°C ~ 125°C
1-1437542-0
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 8POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 8 (2 x 4)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 20µin (0.51µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 20µin (0.51µm)
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Aluminum Alloy
  • Operating Temperature: -55°C ~ 125°C
封装: -
库存7,344
8 (2 x 4)
0.100" (2.54mm)
Gold
20µin (0.51µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
20µin (0.51µm)
Beryllium Copper
Aluminum Alloy
-55°C ~ 125°C
1-1437540-2
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 36POS TIN

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 36 (2 x 18)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: -
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: -
  • Housing Material: Polyester
  • Operating Temperature: -55°C ~ 105°C
封装: -
库存4,176
36 (2 x 18)
0.100" (2.54mm)
Tin
-
Copper Alloy
Through Hole
Open Frame
Solder
0.100" (2.54mm)
-
-
-
Polyester
-55°C ~ 105°C
1-1437540-0
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 36POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 36 (2 x 18)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 25µin (0.63µm)
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: -
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: -
  • Housing Material: Polyester
  • Operating Temperature: -55°C ~ 105°C
封装: -
库存7,794
36 (2 x 18)
0.100" (2.54mm)
Gold
25µin (0.63µm)
Copper Alloy
Through Hole
Open Frame
Solder
0.100" (2.54mm)
-
-
-
Polyester
-55°C ~ 105°C