页 11 - TE Connectivity AMP Connectors 产品 - 用于 IC 的插座，晶体管

528-AG11D

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 28POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 25µin (0.63µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: -
Contact Material - Post: Copper Alloy
Housing Material: Polyester
Operating Temperature: -55°C ~ 105°C

封装: -

库存2,088

28 (2 x 14)

0.100" (2.54mm)

Gold

25µin (0.63µm)

Copper Alloy

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin-Lead

-

Copper Alloy

Polyester

-55°C ~ 105°C

828-AG11D

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 28POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 25µin (0.63µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 80µin (2.03µm)
Contact Material - Post: Copper Alloy
Housing Material: Polyester
Operating Temperature: -55°C ~ 105°C

封装: -

库存8,676

28 (2 x 14)

0.100" (2.54mm)

Gold

25µin (0.63µm)

Copper Alloy

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin-Lead

80µin (2.03µm)

Copper Alloy

Polyester

-55°C ~ 105°C

3-1437536-8

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 24POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: -
Operating Temperature: -55°C ~ 125°C

封装: -

库存2,106

24 (2 x 12)

0.100" (2.54mm)

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

-

Brass

-

-55°C ~ 125°C

3-1571586-2

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 40POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 25µin (0.63µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 25µin (0.63µm)
Contact Material - Post: Copper
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature: -55°C ~ 105°C

封装: -

库存6,678

40 (2 x 20)

0.100" (2.54mm)

Gold

25µin (0.63µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

25µin (0.63µm)

Copper

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

-55°C ~ 105°C

5-1571552-5

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 64POS GOLD

Type: DIP, 0.9" (22.86mm) Row Spacing
Number of Positions or Pins (Grid): 64 (2 x 32)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 20µin (0.51µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 20µin (0.51µm)
Contact Material - Post: Copper
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature: -55°C ~ 105°C

封装: -

库存2,088

64 (2 x 32)

0.100" (2.54mm)

Gold

20µin (0.51µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

20µin (0.51µm)

Copper

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

-55°C ~ 105°C

528-AG12D

TE Connectivity AMP Connectors

SOCKET ASSY

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

封装: -

库存4,590

-

528-AG12D-LF

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 28POS TIN

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Beryllium Copper
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature: -55°C ~ 105°C

封装: -

库存5,058

28 (2 x 14)

0.100" (2.54mm)

Tin

-

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Beryllium Copper

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

-55°C ~ 105°C

347843-5

TE Connectivity AMP Connectors

DIP10P OF LED TIN STD/TIN .300

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

封装: -

库存7,146

-

1825415-1

TE Connectivity AMP Connectors

SOCKET ASSY

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

封装: -

库存5,616

-

5-1814640-0

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 28POS TIN

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 196.8µin (5.00µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.8µin (5.00µm)
Contact Material - Post: Brass
Housing Material: Thermoplastic, Polyester
Operating Temperature: -55°C ~ 125°C

封装: -

库存3,240

28 (2 x 14)

0.100" (2.54mm)

Tin

196.8µin (5.00µm)

Beryllium Copper

Surface Mount

Open Frame

Solder

0.100" (2.54mm)

Tin

196.8µin (5.00µm)

Brass

Thermoplastic, Polyester

-55°C ~ 125°C

824-AG32D-LF

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 24POS TIN

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Copper
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature: -55°C ~ 105°C

封装: -

库存7,236

24 (2 x 12)

0.100" (2.54mm)

Tin

-

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

-

Copper

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

-55°C ~ 105°C

824-AG66D

TE Connectivity AMP Connectors

SOCKET ASSY

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

封装: -

库存8,460

-

1825088-3

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 14POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 20µin (0.51µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole, Right Angle, Horizontal
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Thermoplastic
Operating Temperature: -55°C ~ 125°C

封装: -

库存6,678

14 (2 x 7)

0.100" (2.54mm)

Gold

20µin (0.51µm)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

-

Brass

Thermoplastic

-55°C ~ 125°C

824-AG10D

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 24POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 25µin (0.63µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: Polyester
Operating Temperature: -55°C ~ 105°C

封装: -

库存5,400

24 (2 x 12)

0.100" (2.54mm)

Gold

25µin (0.63µm)

Copper Alloy

Through Hole

Open Frame

Solder

0.100" (2.54mm)

-

Polyester

-55°C ~ 105°C

4-1437531-5

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 16POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: -
Contact Material - Mating: Copper Alloy
Mounting Type: Through Hole
Features: Closed Frame
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: -
Contact Material - Post: Copper Alloy
Housing Material: -
Operating Temperature: -55°C ~ 125°C

封装: -

库存4,806

16 (2 x 8)

0.100" (2.54mm)

Gold

-

Copper Alloy

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Gold

-

Copper Alloy

-

-55°C ~ 125°C

514-AG7D

TE Connectivity AMP Connectors

514-AG7D=SOCKET ASSY

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

封装: -

库存6,912

-

2-5916783-5

TE Connectivity AMP Connectors

CONN SOCKET PGA ZIF 370POS GOLD

Type: PGA, ZIF (ZIP)
Number of Positions or Pins (Grid): 370 (19 x 19)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15µin (0.38µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 15µin (0.38µm)
Contact Material - Post: Copper Alloy
Housing Material: Liquid Crystal Polymer (LCP)
Operating Temperature: -

封装: -

库存4,374

370 (19 x 19)

0.100" (2.54mm)

Gold

15µin (0.38µm)

Copper Alloy

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

15µin (0.38µm)

Copper Alloy

Liquid Crystal Polymer (LCP)

-

824-AG11D

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 24POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 25µin (0.63µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: -
Contact Material - Post: Copper Alloy
Housing Material: Polyester
Operating Temperature: -55°C ~ 105°C

封装: -

库存3,114

24 (2 x 12)

0.100" (2.54mm)

Gold

25µin (0.63µm)

Copper Alloy

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin-Lead

-

Copper Alloy

Polyester

-55°C ~ 105°C

6437540-7

TE Connectivity AMP Connectors

SOCKET ASSY

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

封装: -

库存5,598

-

520-AG11D-ESL

TE Connectivity AMP Connectors

SOCKET ASSY

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

封装: -

库存3,528

-

2-1825046-4

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 16POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: -
Operating Temperature: -

封装: -

库存2,394

16 (2 x 8)

0.100" (2.54mm)

Gold

-

Beryllium Copper

Surface Mount

Open Frame

Solder

0.100" (2.54mm)

-

Brass

-

822-AG11D

TE Connectivity AMP Connectors

SOCKET ASSY

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

封装: -

库存4,266

-

820-AG10D-ES

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 20POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 20 (2 x 10)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 25µin (0.63µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: Polyester
Operating Temperature: -55°C ~ 105°C

封装: -

库存4,266

20 (2 x 10)

0.100" (2.54mm)

Gold

25µin (0.63µm)

Copper Alloy

Through Hole

Open Frame

Solder

0.100" (2.54mm)

-

Polyester

-55°C ~ 105°C

832-AG11D

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 32POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 25µin (0.63µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: -
Contact Material - Post: Copper Alloy
Housing Material: Polyester
Operating Temperature: -55°C ~ 105°C

封装: -

库存6,444

32 (2 x 16)

0.100" (2.54mm)

Gold

25µin (0.63µm)

Copper Alloy

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin-Lead

-

Copper Alloy

Polyester

-55°C ~ 105°C

832-AG10D-ES

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 32POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 25µin (0.63µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: Polyester
Operating Temperature: -55°C ~ 105°C

封装: -

库存5,526

32 (2 x 16)

0.100" (2.54mm)

Gold

25µin (0.63µm)

Copper Alloy

Through Hole

Open Frame

Solder

0.100" (2.54mm)

-

Polyester

-55°C ~ 105°C

1571550-8

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 24POS TIN

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Beryllium Copper
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature: -55°C ~ 105°C

封装: -

库存6,264

24 (2 x 12)

0.100" (2.54mm)

Tin

-

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Beryllium Copper

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

-55°C ~ 105°C

524-AG12D

TE Connectivity AMP Connectors

SOCKET ASSY

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

封装: -

库存2,574

-

608-CG1T

TE Connectivity AMP Connectors

ADAPTER PLUG ASSY

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

封装: -

库存5,742

-

5-1437536-2

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 28POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: -
Operating Temperature: -55°C ~ 125°C

封装: -

库存8,640

28 (2 x 14)

0.100" (2.54mm)

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

-

Brass

-

-55°C ~ 125°C

3-1571552-1

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 36POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 36 (2 x 18)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Copper
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature: -55°C ~ 105°C

封装: -

库存2,988

36 (2 x 18)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

Flash

Copper

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

-55°C ~ 105°C

零件编号	制造商	描述	封装	库存	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
528-AG11D	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 28POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 25µin (0.63µm) Contact Material - Mating: Copper Alloy Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: - Contact Material - Post: Copper Alloy Housing Material: Polyester Operating Temperature: -55°C ~ 105°C	封装: -	库存2,088	28 (2 x 14)	0.100" (2.54mm)	Gold	25µin (0.63µm)	Copper Alloy	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	-	Copper Alloy	Polyester	-55°C ~ 105°C
828-AG11D	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 28POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 25µin (0.63µm) Contact Material - Mating: Copper Alloy Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 80µin (2.03µm) Contact Material - Post: Copper Alloy Housing Material: Polyester Operating Temperature: -55°C ~ 105°C	封装: -	库存8,676	28 (2 x 14)	0.100" (2.54mm)	Gold	25µin (0.63µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	80µin (2.03µm)	Copper Alloy	Polyester	-55°C ~ 105°C
3-1437536-8	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 24POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: - Operating Temperature: -55°C ~ 125°C	封装: -	库存2,106	24 (2 x 12)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	-	-	Brass	-	-55°C ~ 125°C
3-1571586-2	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 40POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 25µin (0.63µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 25µin (0.63µm) Contact Material - Post: Copper Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 105°C	封装: -	库存6,678	40 (2 x 20)	0.100" (2.54mm)	Gold	25µin (0.63µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	25µin (0.63µm)	Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 105°C
5-1571552-5	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 64POS GOLD Type: DIP, 0.9" (22.86mm) Row Spacing Number of Positions or Pins (Grid): 64 (2 x 32) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 20µin (0.51µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 20µin (0.51µm) Contact Material - Post: Copper Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 105°C	封装: -	库存2,088	64 (2 x 32)	0.100" (2.54mm)	Gold	20µin (0.51µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	20µin (0.51µm)	Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 105°C
528-AG12D	TE Connectivity AMP Connectors	SOCKET ASSY Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	封装: -	库存4,590	-	-	-	-	-	-	-	-	-	-	-	-	-	-
528-AG12D-LF	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 28POS TIN Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Beryllium Copper Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 105°C	封装: -	库存5,058	28 (2 x 14)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 105°C
347843-5	TE Connectivity AMP Connectors	DIP10P OF LED TIN STD/TIN .300 Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	封装: -	库存7,146	-	-	-	-	-	-	-	-	-	-	-	-	-	-
1825415-1	TE Connectivity AMP Connectors	SOCKET ASSY Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	封装: -	库存5,616	-	-	-	-	-	-	-	-	-	-	-	-	-	-
5-1814640-0	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 28POS TIN Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 196.8µin (5.00µm) Contact Material - Mating: Beryllium Copper Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 196.8µin (5.00µm) Contact Material - Post: Brass Housing Material: Thermoplastic, Polyester Operating Temperature: -55°C ~ 125°C	封装: -	库存3,240	28 (2 x 14)	0.100" (2.54mm)	Tin	196.8µin (5.00µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	196.8µin (5.00µm)	Brass	Thermoplastic, Polyester	-55°C ~ 125°C
824-AG32D-LF	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 24POS TIN Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Copper Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 105°C	封装: -	库存7,236	24 (2 x 12)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 105°C
824-AG66D	TE Connectivity AMP Connectors	SOCKET ASSY Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	封装: -	库存8,460	-	-	-	-	-	-	-	-	-	-	-	-	-	-
1825088-3	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 14POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 14 (2 x 7) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 20µin (0.51µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole, Right Angle, Horizontal Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Thermoplastic Operating Temperature: -55°C ~ 125°C	封装: -	库存6,678	14 (2 x 7)	0.100" (2.54mm)	Gold	20µin (0.51µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	-	-	Brass	Thermoplastic	-55°C ~ 125°C
824-AG10D	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 24POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 25µin (0.63µm) Contact Material - Mating: Copper Alloy Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: Polyester Operating Temperature: -55°C ~ 105°C	封装: -	库存5,400	24 (2 x 12)	0.100" (2.54mm)	Gold	25µin (0.63µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	-	-	-	Polyester	-55°C ~ 105°C
4-1437531-5	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 16POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: - Contact Material - Mating: Copper Alloy Mounting Type: Through Hole Features: Closed Frame Termination: Wire Wrap Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: - Contact Material - Post: Copper Alloy Housing Material: - Operating Temperature: -55°C ~ 125°C	封装: -	库存4,806	16 (2 x 8)	0.100" (2.54mm)	Gold	-	Copper Alloy	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	-	Copper Alloy	-	-55°C ~ 125°C
514-AG7D	TE Connectivity AMP Connectors	514-AG7D=SOCKET ASSY Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	封装: -	库存6,912	-	-	-	-	-	-	-	-	-	-	-	-	-	-
2-5916783-5	TE Connectivity AMP Connectors	CONN SOCKET PGA ZIF 370POS GOLD Type: PGA, ZIF (ZIP) Number of Positions or Pins (Grid): 370 (19 x 19) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15µin (0.38µm) Contact Material - Mating: Copper Alloy Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 15µin (0.38µm) Contact Material - Post: Copper Alloy Housing Material: Liquid Crystal Polymer (LCP) Operating Temperature: -	封装: -	库存4,374	370 (19 x 19)	0.100" (2.54mm)	Gold	15µin (0.38µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	15µin (0.38µm)	Copper Alloy	Liquid Crystal Polymer (LCP)	-
824-AG11D	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 24POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 25µin (0.63µm) Contact Material - Mating: Copper Alloy Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: - Contact Material - Post: Copper Alloy Housing Material: Polyester Operating Temperature: -55°C ~ 105°C	封装: -	库存3,114	24 (2 x 12)	0.100" (2.54mm)	Gold	25µin (0.63µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	-	Copper Alloy	Polyester	-55°C ~ 105°C
6437540-7	TE Connectivity AMP Connectors	SOCKET ASSY Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	封装: -	库存5,598	-	-	-	-	-	-	-	-	-	-	-	-	-	-
520-AG11D-ESL	TE Connectivity AMP Connectors	SOCKET ASSY Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	封装: -	库存3,528	-	-	-	-	-	-	-	-	-	-	-	-	-	-
2-1825046-4	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 16POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: - Operating Temperature: -	封装: -	库存2,394	16 (2 x 8)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	-	-	Brass	-	-
822-AG11D	TE Connectivity AMP Connectors	SOCKET ASSY Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	封装: -	库存4,266	-	-	-	-	-	-	-	-	-	-	-	-	-	-
820-AG10D-ES	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 20POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 20 (2 x 10) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 25µin (0.63µm) Contact Material - Mating: Copper Alloy Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: Polyester Operating Temperature: -55°C ~ 105°C	封装: -	库存4,266	20 (2 x 10)	0.100" (2.54mm)	Gold	25µin (0.63µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	-	-	-	Polyester	-55°C ~ 105°C
832-AG11D	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 32POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 32 (2 x 16) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 25µin (0.63µm) Contact Material - Mating: Copper Alloy Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: - Contact Material - Post: Copper Alloy Housing Material: Polyester Operating Temperature: -55°C ~ 105°C	封装: -	库存6,444	32 (2 x 16)	0.100" (2.54mm)	Gold	25µin (0.63µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	-	Copper Alloy	Polyester	-55°C ~ 105°C
832-AG10D-ES	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 32POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 32 (2 x 16) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 25µin (0.63µm) Contact Material - Mating: Copper Alloy Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: Polyester Operating Temperature: -55°C ~ 105°C	封装: -	库存5,526	32 (2 x 16)	0.100" (2.54mm)	Gold	25µin (0.63µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	-	-	-	Polyester	-55°C ~ 105°C
1571550-8	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 24POS TIN Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Beryllium Copper Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 105°C	封装: -	库存6,264	24 (2 x 12)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 105°C
524-AG12D	TE Connectivity AMP Connectors	SOCKET ASSY Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	封装: -	库存2,574	-	-	-	-	-	-	-	-	-	-	-	-	-	-
608-CG1T	TE Connectivity AMP Connectors	ADAPTER PLUG ASSY Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	封装: -	库存5,742	-	-	-	-	-	-	-	-	-	-	-	-	-	-
5-1437536-2	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 28POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: - Operating Temperature: -55°C ~ 125°C	封装: -	库存8,640	28 (2 x 14)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	-	-	Brass	-	-55°C ~ 125°C
3-1571552-1	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 36POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 36 (2 x 18) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Copper Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 105°C	封装: -	库存2,988	36 (2 x 18)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 105°C