NXP 产品

PSMN004-55W,127

NXP

MOSFET N-CH 55V 100A SOT429

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 55V
• Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
• Vgs(th) (Max) @ Id: 2V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 226nC @ 5V
• Input Capacitance (Ciss) (Max) @ Vds: 13000pF @ 25V
• Vgs (Max): ±15V
• FET Feature: -
• Power Dissipation (Max): 300W (Tc)
• Rds On (Max) @ Id, Vgs: 4.2 mOhm @ 25A, 10V
• Operating Temperature: -55°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Supplier Device Package: TO-247-3
• Package / Case: TO-247-3

封装: TO-247-3

MRF6V12250HSR3

NXP

FET RF 100V 1.03GHZ NI-780S

• Transistor Type: LDMOS
• Frequency: 1.03GHz
• Gain: 20.3dB
• Voltage - Test: 50V
• Current Rating: -
• Noise Figure: -
• Current - Test: 100mA
• Power - Output: 275W
• Voltage - Rated: 100V
• Package / Case: NI-780S
• Supplier Device Package: NI-780S

封装: NI-780S

MRF8P20165WHR3

NXP

FET RF 2CH 65V 2.01GHZ NI780-4

• Transistor Type: LDMOS (Dual)
• Frequency: 1.98GHz ~ 2.01GHz
• Gain: 14.8dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 550mA
• Power - Output: 37W
• Voltage - Rated: 65V
• Package / Case: NI-780-4
• Supplier Device Package: NI-780-4

封装: NI-780-4

MC68882RC25A

NXP

IC COPROCESSOR FLOAT PT 68-PGA

• Type: Floating-Point Co-Processor
• Applications: -
• Mounting Type: Through Hole
• Package / Case: 68-BCPGA
• Supplier Device Package: 68-PGA (27x27)

封装: 68-BCPGA

MC33909Q5ADR2

NXP

SBC 5V 1CAN 4LIN 6SG HLQFP48

• Applications: System Basis Chip
• Current - Supply: 7mA
• Voltage - Supply: 3.5 V ~ 28 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

MC20XS4200BFK

NXP

IC SWITCH HIGH SIDE 23PQFN

• Switch Type: General Purpose
• Number of Outputs: 2
• Ratio - Input:Output: 1:1
• Output Configuration: High Side
• Output Type: N-Channel
• Interface: SPI
• Voltage - Load: 8 V ~ 36 V
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Current - Output (Max): 3A
• Rds On (Typ): 20 mOhm (Max)
• Input Type: -
• Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
• Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 23-PowerQFN
• Supplier Device Package: 23-PQFN (12x12)

封装: 23-PowerQFN

UBA2021T/N2,518

NXP

IC CFL DRIVER 630V 14-SOIC

• Type: CFL/TL Controller
• Frequency: 41.21kHz ~ 44.59kHz
• Voltage - Supply: 10.15 V ~ 11.95 V
• Current - Supply: 1mA
• Current - Output Source/Sink: -
• Dimming: No
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SO

封装: 14-SOIC (0.154", 3.90mm Width)

BUK218-50DY,118

NXP

TOPFET DUAL SWITCH D2PAK

• Driven Configuration: High-Side
• Channel Type: Independent
• Number of Drivers: 2
• Gate Type: N-Channel MOSFET
• Voltage - Supply: 5.5 V ~ 35 V
• Logic Voltage - VIL, VIH: 1.2V, 3V
• Current - Peak Output (Source, Sink): 8A, 8A
• Input Type: -
• High Side Voltage - Max (Bootstrap): -
• Rise / Fall Time (Typ): -
• Operating Temperature: -40°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: TO-263-7, D2Pak (6 Leads + Tab), TO-263CB
• Supplier Device Package: D2PAK

封装: TO-263-7, D2Pak (6 Leads + Tab), TO-263CB

MC33742PEP

NXP

IC SYSTEM BASE W/CAN 48QFN

• Applications: Automotive
• Interface: SPI Serial
• Voltage - Supply: 5.5 V ~ 18 V
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-QFN-EP (7x7)
• Mounting Type: Surface Mount

封装: 48-VFQFN Exposed Pad

NX3L2T384GD,125

NXP

IC ANALOG SWITCH SPDT XSON8U

• Switch Circuit: SPST - NC
• Multiplexer/Demultiplexer Circuit: 1:1
• Number of Circuits: 2
• On-State Resistance (Max): 750 mOhm
• Channel-to-Channel Matching (ΔRon): 20 mOhm
• Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V
• Voltage - Supply, Dual (V±): -
• Switch Time (Ton, Toff) (Max): 40ns, 15ns
• -3db Bandwidth: 60MHz
• Charge Injection: 6pC
• Channel Capacitance (CS(off), CD(off)): 35pF
• Current - Leakage (IS(off)) (Max): 10nA
• Crosstalk: -90dB @ 100kHz
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 8-XFDFN
• Supplier Device Package: 8-XSON, SOT996-2 (2x3)

封装: 8-XFDFN

HEF4052BP,652

NXP

IC MUX/DEMUX DUAL 4X1 16DIP

• Switch Circuit: SP4T
• Multiplexer/Demultiplexer Circuit: 4:1
• Number of Circuits: 2
• On-State Resistance (Max): 155 Ohm
• Channel-to-Channel Matching (ΔRon): 5 Ohm
• Voltage - Supply, Single (V+): 3 V ~ 15 V
• Voltage - Supply, Dual (V±): -
• Switch Time (Ton, Toff) (Max): -
• -3db Bandwidth: 70MHz
• Charge Injection: -
• Channel Capacitance (CS(off), CD(off)): 7.5pF
• Current - Leakage (IS(off)) (Max): 200nA
• Crosstalk: -50dB @ 1MHz
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 16-DIP (0.300", 7.62mm)
• Supplier Device Package: 16-DIP

封装: 16-DIP (0.300", 7.62mm)

MCIMX251AVM4

NXP

IC MPU I.MX25 400MHZ 400MAPBGA

• Core Processor: ARM926EJ-S
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: -
• RAM Controllers: LPDDR, DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: Keypad
• Ethernet: 10/100 Mbps (1)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
• Operating Temperature: -40°C ~ 85°C (TA)
• Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection
• Package / Case: 400-LFBGA
• Supplier Device Package: 400-MAPBGA (17x17)

封装: 400-LFBGA

MC7448HX1267NC

NXP

IC MPU MPC74XX 1.267GHZ 360BGA

• Core Processor: PowerPC G4
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.267GHz
• Co-Processors/DSP: Multimedia; SIMD
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 1.5V, 1.8V, 2.5V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 360-BCBGA, FCCBGA
• Supplier Device Package: 360-FCCBGA (25x25)

封装: 360-BCBGA, FCCBGA

MC908JB16JDWE

NXP

IC MCU 8BIT 16KB FLASH 20SOIC

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 6MHz
• Connectivity: SCI, USB
• Peripherals: LED, LVD, POR, PWM
• Number of I/O: 13
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 384 x 8
• Voltage - Supply (Vcc/Vdd): 4 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SOIC

封装: 20-SOIC (0.295", 7.50mm Width)

S9S08AW60E5MFDE

NXP

IC MCU 8BIT 60KB FLASH 48QFN

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 38
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-QFN-EP (7x7)

封装: 48-VFQFN Exposed Pad

MC9S08QG8CDNE

NXP

IC MCU 8BIT 8KB FLASH 8SOIC

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 4
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

封装: 8-SOIC (0.154", 3.90mm Width)

MSC8254SAG1000B

NXP

IC DSP 4X 1GHZ SC3850 783FCBGA

• Type: SC3850 Quad Core
• Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
• Clock Rate: 1GHz
• Non-Volatile Memory: ROM (96 kB)
• On-Chip RAM: 576kB
• Voltage - I/O: 2.50V
• Voltage - Core: 1.00V
• Operating Temperature: 0°C ~ 105°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

封装: 783-BBGA, FCBGA

PCF2003DUS/DAAZ

NXP

IC CLOCK 32KHZ 1CIR 8WLCSP

• PLL: No
• Main Purpose: Battery operated wrist watches
• Input: Crystal
• Output: -
• Number of Circuits: 1
• Ratio - Input:Output: 1:2
• Differential - Input:Output: No/No
• Frequency - Max: 32kHz
• Voltage - Supply: 1.1 V ~ 3.6 V
• Operating Temperature: -10°C ~ 60°C
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: 8-WLCSP (1.16x0.86)

封装: Die

MMA6821AKGCWR2

NXP

ACCELEROMETER 10BIT SPI 16QFN

• Type: -
• Axis: -
• Acceleration Range: -
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): -
• Bandwidth: -
• Output Type: -
• Voltage - Supply: -
• Features: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

MC33596FCAER2

NXP

IC UHF RECEIVER PLL TUNED 32-QFN

• Frequency: 304, 315, 426, 434, 868, 915MHz
• Sensitivity: -104dBm
• Data Rate (Max): 22.4 kBaud
• Modulation or Protocol: FSK, OOK
• Applications: General Data Transfer
• Current - Receiving: 10.3mA
• Data Interface: PCB, Surface Mount
• Memory Size: -
• Antenna Connector: PCB, Surface Mount
• Features: -
• Voltage - Supply: 2.7 V ~ 3.6 V, 4.5 V ~ 5.5 V
• Operating Temperature: -20°C ~ 85°C
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-QFN Exposed Pad (5x5)

封装: 32-VFQFN Exposed Pad

MCIMX6Y1CVK05AB

NXP

I.MX6ULL ROM PERF ENHAN

• Core Processor: ARM® Cortex®-A7
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 528MHz
• Co-Processors/DSP: Multimedia; NEON™ MPE
• RAM Controllers: LPDDR2, DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: Electrophoretic, LCD
• Ethernet: 10/100 Mbps (1)
• SATA: -
• USB: USB 2.0 OTG + PHY (2)
• Voltage - I/O: 1.8V, 2.8V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TJ)
• Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
• Package / Case: 272-LFBGA
• Supplier Device Package: 272-MAPBGA (9x9)

封装: 272-LFBGA

SPC5566MZP144R

NXP

NXP 32-BIT MCU POWER ARCH CORE

• Core Processor: e200z6
• Core Size: 32-Bit
• Speed: 144MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 256
• Program Memory Size: 3MB (3M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V
• Data Converters: A/D 40x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 416-BBGA
• Supplier Device Package: 416-PBGA (27x27)

封装: 416-BBGA

S912XEQ512AVALR

NXP

16-BIT MCU S12X CORE 512KB FLA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 91
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

封装: 112-LQFP

S9S12GN16J1MTJ

NXP

16-BIT16K FLASH2K RAM

• Core Processor: 12V1
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: IrDA, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 14
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP

封装: 20-TSSOP (0.173", 4.40mm Width)

MC33FS8520A0ESR2

NXP

SAFETY POWER MANAGEMENT IC, QFN5

• Applications: System Basis Chip
• Current - Supply: 15mA
• Voltage - Supply: 60V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-HVQFN (8x8)

封装: -

Request a Quote

SAF4000EL-101S130Y

NXP

SOFTWARE DEFINED RADIO

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

Request a Quote

PMST2369-ZLF

NXP

TRANS NPN SWITCHING SOT323

• Transistor Type: -
• Current - Collector (Ic) (Max): -
• Voltage - Collector Emitter Breakdown (Max): -
• Vce Saturation (Max) @ Ib, Ic: -
• Current - Collector Cutoff (Max): -
• DC Current Gain (hFE) (Min) @ Ic, Vce: -
• Power - Max: -
• Frequency - Transition: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

Request a Quote

LPC55S26JBD100E

NXP

IC MCU 32BIT 256KB FLSH 100LQFP

• Core Processor: ARM® Cortex®-M33
• Core Size: 32-Bit Single-Core
• Speed: 150MHz
• Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
• Number of I/O: 64
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 144K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
• Data Converters: A/D 10x16b
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP Exposed Pad
• Supplier Device Package: 100-HLQFP (14x14)

封装: -

Request a Quote

LPC55S36JBD100MP

NXP

IC MCU 32BIT 256KB FLSH 100HLQFP

• Core Processor: ARM® Cortex®-M33
• Core Size: 32-Bit Single-Core
• Speed: 150MHz
• Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
• Number of I/O: 66
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
• Data Converters: A/D 23x16b; D/A 3x12b
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP
• Supplier Device Package: 100-HLQFP (14x14)

封装: -

Request a Quote

MIMX8UX6FVOFZAC

NXP

I.MX 8DUALX 17X17

• Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
• Number of Cores/Bus Width: 3 Core, 64-Bit
• Speed: 1.2GHz, 264MHz
• Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
• RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
• Graphics Acceleration: Yes
• Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
• Ethernet: 10/100/1000Mbps (2)
• SATA: -
• USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -
• Security Features: -
• Package / Case: 609-BFBGA
• Supplier Device Package: 609-FBGA (21x21)

封装: -

Request a Quote