页 77 - NXP 产品 | 深圳黑森尔电子

零件编号	制造商	描述	封装	库存
MRF7S19080HR3	NXP	FET RF 65V 1.99GHZ NI-780 Transistor Type: LDMOS Frequency: 1.99GHz Gain: 18dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 750mA Power - Output: 24W Voltage - Rated: 65V Package / Case: NI-780 Supplier Device Package: NI-780	封装: NI-780	库存5,200
MRF9060LR1	NXP	FET RF 65V 945MHZ NI-360 Transistor Type: LDMOS Frequency: 945MHz Gain: 17dB Voltage - Test: 26V Current Rating: - Noise Figure: - Current - Test: 450mA Power - Output: 60W Voltage - Rated: 65V Package / Case: NI-360 Supplier Device Package: NI-360	封装: NI-360	库存6,944
BZX84-C2V7/LF1R	NXP	DIODE ZENER TO-236AB SOT23 Voltage - Zener (Nom) (Vz): 2.7V Tolerance: ±5% Power - Max: 250mW Impedance (Max) (Zzt): 100 Ohms Current - Reverse Leakage @ Vr: 20µA @ 1V Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: TO-236AB (SOT23)	封装: TO-236-3, SC-59, SOT-23-3	库存3,264
PZM2.7NB,115	NXP	DIODE ZENER 2.7V 300MW SMT3 Voltage - Zener (Nom) (Vz): 2.7V Tolerance: ±5% Power - Max: 300mW Impedance (Max) (Zzt): 100 Ohms Current - Reverse Leakage @ Vr: 20µA @ 1V Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK	封装: TO-236-3, SC-59, SOT-23-3	库存3,312
SAA1064/N2,112	NXP	IC LED DRIVER 4DGT W/I2C 24-DIP Display Type: LED Configuration: 7 Segment + DP Interface: I2C Digits or Characters: 4 Digits Current - Supply: 9.5mA Voltage - Supply: 4.5 V ~ 15 V Operating Temperature: -40°C ~ 85°C Mounting Type: Through Hole Package / Case: 24-DIP (0.600", 15.24mm) Supplier Device Package: 24-DIP	封装: 24-DIP (0.600", 15.24mm)	库存3,808
74HC597D/AUJ	NXP	IC SHIFT REGISTER 8BIT 16SOIC Logic Type: Shift Register Output Type: - Number of Elements: 1 Number of Bits per Element: 8 Function: Parallel or Serial to Serial Voltage - Supply: 2 V ~ 6 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	封装: 16-SOIC (0.154", 3.90mm Width)	库存2,032
74LVT10D,118	NXP	IC GATE NAND 3CH 3-INP 14-SO Logic Type: NAND Gate Number of Circuits: 3 Number of Inputs: 3 Features: - Voltage - Supply: 2.7 V ~ 3.6 V Current - Quiescent (Max): - Current - Output High, Low: 20mA, 32mA Logic Level - Low: 0.8V Logic Level - High: 2V Max Propagation Delay @ V, Max CL: 3.8ns @ 3.3V, 50pF Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Supplier Device Package: 14-SO Package / Case: 14-SOIC (0.154", 3.90mm Width)	封装: 14-SOIC (0.154", 3.90mm Width)	库存3,360
74HC640N,652	NXP	IC TRANSCEIVER 3ST 8BIT 20DIP Logic Type: Transceiver, Inverting Number of Elements: 1 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 7.8mA, 7.8mA Voltage - Supply: 2 V ~ 6 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Through Hole Package / Case: 20-DIP (0.300", 7.62mm) Supplier Device Package: 20-DIP	封装: 20-DIP (0.300", 7.62mm)	库存6,704
74LVTH16244BBQ,518	NXP	IC BUFFER/DVR 16BIT 3ST 60HUQFN Logic Type: Buffer, Non-Inverting Number of Elements: 4 Number of Bits per Element: 4 Input Type: - Output Type: Push-Pull Current - Output High, Low: 32mA, 64mA Voltage - Supply: 2.7 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 60-UFQFN Dual Rows, Exposed Pad Supplier Device Package: 60-HUQFN (4x6)	封装: 60-UFQFN Dual Rows, Exposed Pad	库存4,288
TDA19988BET/C1,157	NXP	IC HDMI TRANSMITTER 64-TFBGA Type: HDMI Transmitter Applications: Mobile Phones, Cellular, Video Displays Mounting Type: Surface Mount Package / Case: 64-TFBGA Supplier Device Package: 64-TFBGA (4.5x4.5)	封装: 64-TFBGA	库存5,792
P1020PSE2HFB	NXP	IC MPU Q OR IQ 800MHZ 689TEBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Security; SEC 3.3 RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 125°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	封装: 689-BBGA Exposed Pad	库存5,648
MC68360ZP25VLR2	NXP	IC MPU M683XX 25MHZ 357BGA Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 357-BGA Supplier Device Package: 357-PBGA (25x25)	封装: 357-BGA	库存5,680
MPC8560VT667LC	NXP	IC MPU MPC85XX 667MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DDR, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: - Voltage - I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 784-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	封装: 784-BBGA, FCBGA	库存4,288
MPC860TVR66D4	NXP	IC MPU MPC8XX 66MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (4), 10/100 Mbps (1) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	封装: 357-BBGA	库存5,840
PXAG49KBA/00,512	NXP	IC MCU 16BIT 64KB FLASH 44PLCC Core Processor: XA Core Size: 16-Bit Speed: 30MHz Connectivity: UART/USART Peripherals: PWM, WDT Number of I/O: 32 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: - Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59)	封装: 44-LCC (J-Lead)	库存3,872
SPC5668EK0VMG	NXP	IC MCU 32BIT 2MB FLASH 208MAPBGA Core Processor: e200z650 Core Size: 32-Bit Speed: 116MHz Connectivity: CAN, I2C, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 155 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 3.3 V ~ 5 V Data Converters: A/D 64x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 208-BGA Supplier Device Package: 208-MAPBGA (17x17)	封装: 208-BGA	库存3,776
MK51DX256CMC7	NXP	IC MCU 32BIT 256KB FLASH 121BGA Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 72MHz Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 78 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 35x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 121-LFBGA Supplier Device Package: 121-MAPBGA (8x8)	封装: 121-LFBGA	库存6,840
SPAKXC309AG100A	NXP	IC DSP 24BIT 100MHZ 144-LQFP Type: Fixed Point Interface: Host Interface, SSI, SCI Clock Rate: 100MHz Non-Volatile Memory: ROM (576 B) On-Chip RAM: 24kB Voltage - I/O: 3.30V Voltage - Core: 3.30V Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	封装: 144-LQFP	库存3,920
MPXM2202D	NXP	SENS PRESSURE 29 PSI MAX MPAK Pressure Type: Differential Operating Pressure: 29.01 PSI (200 kPa) Output Type: Wheatstone Bridge Output: 0 mV ~ 40 mV (10V) Accuracy: - Voltage - Supply: 10 V ~ 16 V Port Size: - Port Style: No Port Features: Temperature Compensated Termination Style: PCB Maximum Pressure: 58.02 PSI (400 kPa) Operating Temperature: -40°C ~ 125°C Package / Case: 5-SMD Module Supplier Device Package: 5-MPAK	封装: 5-SMD Module	库存3,816
MPVZ5004G6U	NXP	PRESSURE SENSOR SS CAP 8-SOP Pressure Type: Vented Gauge Operating Pressure: 0.57 PSI (3.92 kPa) Output Type: Analog Voltage Output: 1 V ~ 4.9 V Accuracy: ±6.25% Voltage - Supply: 4.75 V ~ 5.25 V Port Size: - Port Style: No Port Features: Temperature Compensated Termination Style: PCB Maximum Pressure: 2.32 PSI (16 kPa) Operating Temperature: 0°C ~ 85°C Package / Case: 8-SMD Module Supplier Device Package: -	封装: 8-SMD Module	库存8,676
MMA6900KQR2	NXP	ACCELEROMETER 3.5G PCM/SPI 16QFN Type: Digital Axis: X, Y Acceleration Range: ±3.5g Sensitivity (LSB/g): 291 Sensitivity (mV/g): - Bandwidth: 1.2kHz Output Type: PCM, SPI Voltage - Supply: 3.15 V ~ 5.25 V Features: Temperature Sensor Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 16-QFN Exposed Pad Supplier Device Package: 16-QFN-EP (6x6)	封装: 16-QFN Exposed Pad	库存13,980
MMA2201KEG	NXP	ACCELEROMETER 40G ANALOG 16SOIC Type: Analog Axis: X Acceleration Range: ±40g Sensitivity (LSB/g): - Sensitivity (mV/g): 50 Bandwidth: 400Hz Output Type: Analog Voltage Voltage - Supply: 4.75 V ~ 5.25 V Features: - Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SOIC	封装: 16-SOIC (0.295", 7.50mm Width)	库存3,132
NT2H0301G0DUD,005	NXP	IC SMART TAG NFC TYPE 2 UNCASED Type: RFID Transponder Frequency: 13.56MHz Standards: ISO 14443 Interface: - Voltage - Supply: - Operating Temperature: -25°C ~ 70°C Package / Case: Die Supplier Device Package: Wafer	封装: Die	库存4,554
SA676DK/01,112	NXP	IC MIXER 100MHZ UP CONVRT 20SSOP RF Type: Cordless Phones Frequency: 100MHz Number of Mixers: 2 Gain: 17dB Noise Figure: 7dB Secondary Attributes: Up Converter Current - Supply: 5mA Voltage - Supply: 2.7 V ~ 7 V Package / Case: 20-LSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-SSOP	封装: 20-LSSOP (0.173", 4.40mm Width)	库存4,050
SPC5607BAVLU6	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 149 Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 96K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 29x10b, 5x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 176-LQFP Supplier Device Package: 176-LQFP (24x24)	封装: 176-LQFP	库存7,536
S912ZVC19F0VKH	NXP	MAGNIV 16-BIT MCU S12Z CORE 19 Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, I²C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 192KB (192K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 12K x 8 Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V Data Converters: A/D 16x10b, D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP (10x10)	封装: 64-LQFP Exposed Pad	库存3,520
LPC54S018J4MET180E	NXP	IC MCU CORTEX M4 BGA183 Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Speed: 180MHz Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT Number of I/O: 137 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 360K x 8 Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 180-TFBGA Supplier Device Package: 180-TFBGA (12x12)	封装: 180-TFBGA	库存6,416
FS32K146HAT0MLLR	NXP	IC MCU 32BIT 1MB FLASH 100LQFP Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Speed: 80MHz Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 89 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b SAR; D/A1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	封装: -	Request a Quote
MWCT2014SHVPAR	NXP	MAXQFP100,512KB Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封装: -	Request a Quote
MCXA154VLL	NXP	IC Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封装: -	Request a Quote

MRF7S19080HR3

NXP

FET RF 65V 1.99GHZ NI-780

Transistor Type: LDMOS
Frequency: 1.99GHz
Gain: 18dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 750mA
Power - Output: 24W
Voltage - Rated: 65V
Package / Case: NI-780
Supplier Device Package: NI-780

封装: NI-780

库存5,200

MRF9060LR1

NXP

FET RF 65V 945MHZ NI-360

Transistor Type: LDMOS
Frequency: 945MHz
Gain: 17dB
Voltage - Test: 26V
Current Rating: -
Noise Figure: -
Current - Test: 450mA
Power - Output: 60W
Voltage - Rated: 65V
Package / Case: NI-360
Supplier Device Package: NI-360

封装: NI-360

库存6,944

BZX84-C2V7/LF1R

NXP

DIODE ZENER TO-236AB SOT23

Voltage - Zener (Nom) (Vz): 2.7V
Tolerance: ±5%
Power - Max: 250mW
Impedance (Max) (Zzt): 100 Ohms
Current - Reverse Leakage @ Vr: 20µA @ 1V
Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: TO-236AB (SOT23)

封装: TO-236-3, SC-59, SOT-23-3

库存3,264

PZM2.7NB,115

NXP

DIODE ZENER 2.7V 300MW SMT3

Voltage - Zener (Nom) (Vz): 2.7V
Tolerance: ±5%
Power - Max: 300mW
Impedance (Max) (Zzt): 100 Ohms
Current - Reverse Leakage @ Vr: 20µA @ 1V
Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: SMT3; MPAK

封装: TO-236-3, SC-59, SOT-23-3

库存3,312

SAA1064/N2,112

NXP

IC LED DRIVER 4DGT W/I2C 24-DIP

Display Type: LED
Configuration: 7 Segment + DP
Interface: I2C
Digits or Characters: 4 Digits
Current - Supply: 9.5mA
Voltage - Supply: 4.5 V ~ 15 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Through Hole
Package / Case: 24-DIP (0.600", 15.24mm)
Supplier Device Package: 24-DIP

封装: 24-DIP (0.600", 15.24mm)

库存3,808

74HC597D/AUJ

NXP

IC SHIFT REGISTER 8BIT 16SOIC

Logic Type: Shift Register
Output Type: -
Number of Elements: 1
Number of Bits per Element: 8
Function: Parallel or Serial to Serial
Voltage - Supply: 2 V ~ 6 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO

封装: 16-SOIC (0.154", 3.90mm Width)

库存2,032

74LVT10D,118

NXP

IC GATE NAND 3CH 3-INP 14-SO

Logic Type: NAND Gate
Number of Circuits: 3
Number of Inputs: 3
Features: -
Voltage - Supply: 2.7 V ~ 3.6 V
Current - Quiescent (Max): -
Current - Output High, Low: 20mA, 32mA
Logic Level - Low: 0.8V
Logic Level - High: 2V
Max Propagation Delay @ V, Max CL: 3.8ns @ 3.3V, 50pF
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Supplier Device Package: 14-SO
Package / Case: 14-SOIC (0.154", 3.90mm Width)

封装: 14-SOIC (0.154", 3.90mm Width)

库存3,360

74HC640N,652

NXP

IC TRANSCEIVER 3ST 8BIT 20DIP

Logic Type: Transceiver, Inverting
Number of Elements: 1
Number of Bits per Element: 8
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 7.8mA, 7.8mA
Voltage - Supply: 2 V ~ 6 V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Through Hole
Package / Case: 20-DIP (0.300", 7.62mm)
Supplier Device Package: 20-DIP

封装: 20-DIP (0.300", 7.62mm)

库存6,704

74LVTH16244BBQ,518

NXP

IC BUFFER/DVR 16BIT 3ST 60HUQFN

Logic Type: Buffer, Non-Inverting
Number of Elements: 4
Number of Bits per Element: 4
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 32mA, 64mA
Voltage - Supply: 2.7 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 60-UFQFN Dual Rows, Exposed Pad
Supplier Device Package: 60-HUQFN (4x6)

封装: 60-UFQFN Dual Rows, Exposed Pad

库存4,288

TDA19988BET/C1,157

NXP

IC HDMI TRANSMITTER 64-TFBGA

Type: HDMI Transmitter
Applications: Mobile Phones, Cellular, Video Displays
Mounting Type: Surface Mount
Package / Case: 64-TFBGA
Supplier Device Package: 64-TFBGA (4.5x4.5)

封装: 64-TFBGA

库存5,792

P1020PSE2HFB

NXP

IC MPU Q OR IQ 800MHZ 689TEBGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (3)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 2.5V, 3.3V
Operating Temperature: 0°C ~ 125°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

封装: 689-BBGA Exposed Pad

库存5,648

MC68360ZP25VLR2

NXP

IC MPU M683XX 25MHZ 357BGA

Core Processor: CPU32+
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 25MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: -
Package / Case: 357-BGA
Supplier Device Package: 357-PBGA (25x25)

封装: 357-BGA

库存5,680

MPC8560VT667LC

NXP

IC MPU MPC85XX 667MHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 667MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: -
Voltage - I/O: 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 784-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

封装: 784-BBGA, FCBGA

库存4,288

MPC860TVR66D4

NXP

IC MPU MPC8XX 66MHZ 357BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 66MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (4), 10/100 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 95°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

封装: 357-BBGA

库存5,840

PXAG49KBA/00,512

NXP

IC MCU 16BIT 64KB FLASH 44PLCC

Core Processor: XA
Core Size: 16-Bit
Speed: 30MHz
Connectivity: UART/USART
Peripherals: PWM, WDT
Number of I/O: 32
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: -
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 44-LCC (J-Lead)
Supplier Device Package: 44-PLCC (16.59x16.59)

封装: 44-LCC (J-Lead)

库存3,872

SPC5668EK0VMG

NXP

IC MCU 32BIT 2MB FLASH 208MAPBGA

Core Processor: e200z650
Core Size: 32-Bit
Speed: 116MHz
Connectivity: CAN, I2C, LIN, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 155
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 3.3 V ~ 5 V
Data Converters: A/D 64x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 208-BGA
Supplier Device Package: 208-MAPBGA (17x17)

封装: 208-BGA

库存3,776

MK51DX256CMC7

NXP

IC MCU 32BIT 256KB FLASH 121BGA

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 72MHz
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 78
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 35x16b, D/A 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 121-LFBGA
Supplier Device Package: 121-MAPBGA (8x8)

封装: 121-LFBGA

库存6,840

SPAKXC309AG100A

NXP

IC DSP 24BIT 100MHZ 144-LQFP

Type: Fixed Point
Interface: Host Interface, SSI, SCI
Clock Rate: 100MHz
Non-Volatile Memory: ROM (576 B)
On-Chip RAM: 24kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Operating Temperature: -40°C ~ 105°C (TJ)
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

封装: 144-LQFP

库存3,920

MPXM2202D

NXP

SENS PRESSURE 29 PSI MAX MPAK

Pressure Type: Differential
Operating Pressure: 29.01 PSI (200 kPa)
Output Type: Wheatstone Bridge
Output: 0 mV ~ 40 mV (10V)
Accuracy: -
Voltage - Supply: 10 V ~ 16 V
Port Size: -
Port Style: No Port
Features: Temperature Compensated
Termination Style: PCB
Maximum Pressure: 58.02 PSI (400 kPa)
Operating Temperature: -40°C ~ 125°C
Package / Case: 5-SMD Module
Supplier Device Package: 5-MPAK

封装: 5-SMD Module

库存3,816

MPVZ5004G6U

NXP

PRESSURE SENSOR SS CAP 8-SOP

Pressure Type: Vented Gauge
Operating Pressure: 0.57 PSI (3.92 kPa)
Output Type: Analog Voltage
Output: 1 V ~ 4.9 V
Accuracy: ±6.25%
Voltage - Supply: 4.75 V ~ 5.25 V
Port Size: -
Port Style: No Port
Features: Temperature Compensated
Termination Style: PCB
Maximum Pressure: 2.32 PSI (16 kPa)
Operating Temperature: 0°C ~ 85°C
Package / Case: 8-SMD Module
Supplier Device Package: -

封装: 8-SMD Module

库存8,676

MMA6900KQR2

NXP

ACCELEROMETER 3.5G PCM/SPI 16QFN

Type: Digital
Axis: X, Y
Acceleration Range: ±3.5g
Sensitivity (LSB/g): 291
Sensitivity (mV/g): -
Bandwidth: 1.2kHz
Output Type: PCM, SPI
Voltage - Supply: 3.15 V ~ 5.25 V
Features: Temperature Sensor
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 16-QFN Exposed Pad
Supplier Device Package: 16-QFN-EP (6x6)

封装: 16-QFN Exposed Pad

库存13,980

MMA2201KEG

NXP

ACCELEROMETER 40G ANALOG 16SOIC

Type: Analog
Axis: X
Acceleration Range: ±40g
Sensitivity (LSB/g): -
Sensitivity (mV/g): 50
Bandwidth: 400Hz
Output Type: Analog Voltage
Voltage - Supply: 4.75 V ~ 5.25 V
Features: -
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 16-SOIC

封装: 16-SOIC (0.295", 7.50mm Width)

库存3,132

NT2H0301G0DUD,005

NXP

IC SMART TAG NFC TYPE 2 UNCASED

Type: RFID Transponder
Frequency: 13.56MHz
Standards: ISO 14443
Interface: -
Voltage - Supply: -
Operating Temperature: -25°C ~ 70°C
Package / Case: Die
Supplier Device Package: Wafer

封装: Die

库存4,554

SA676DK/01,112

NXP

IC MIXER 100MHZ UP CONVRT 20SSOP

RF Type: Cordless Phones
Frequency: 100MHz
Number of Mixers: 2
Gain: 17dB
Noise Figure: 7dB
Secondary Attributes: Up Converter
Current - Supply: 5mA
Voltage - Supply: 2.7 V ~ 7 V
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-SSOP

封装: 20-LSSOP (0.173", 4.40mm Width)

库存4,050

SPC5607BAVLU6

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 64MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 149
Program Memory Size: 1.5MB (1.5M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 96K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 29x10b, 5x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 176-LQFP
Supplier Device Package: 176-LQFP (24x24)

封装: 176-LQFP

库存7,536

S912ZVC19F0VKH

NXP

MAGNIV 16-BIT MCU S12Z CORE 19

Core Processor: S12Z
Core Size: 16-Bit
Speed: 32MHz
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 42
Program Memory Size: 192KB (192K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 12K x 8
Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V
Data Converters: A/D 16x10b, D/A 1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LQFP Exposed Pad
Supplier Device Package: 64-LQFP (10x10)

封装: 64-LQFP Exposed Pad

库存3,520

LPC54S018J4MET180E

NXP

IC MCU CORTEX M4 BGA183

Core Processor: ARM® Cortex®-M4
Core Size: 32-Bit
Speed: 180MHz
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Number of I/O: 137
Program Memory Size: 4MB (4M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 360K x 8
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Data Converters: A/D 12x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 180-TFBGA
Supplier Device Package: 180-TFBGA (12x12)

封装: 180-TFBGA

库存6,416

FS32K146HAT0MLLR

NXP

IC MCU 32BIT 1MB FLASH 100LQFP

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit Single-Core
Speed: 80MHz
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 89
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 24x12b SAR; D/A1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

封装: -

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MWCT2014SHVPAR

NXP

MAXQFP100,512KB

Applications: -
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封装: -

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MCXA154VLL

NXP

IC

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封装: -

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