NXP 产品

PMF63UN,115

NXP

MOSFET N-CH 20V 1.8A SOT323

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 20V
• Current - Continuous Drain (Id) @ 25°C: 1.8A (Ta)
• Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
• Vgs(th) (Max) @ Id: 1V @ 250µA
• Gate Charge (Qg) (Max) @ Vgs: 3.3nC @ 4.5V
• Input Capacitance (Ciss) (Max) @ Vds: 185pF @ 10V
• Vgs (Max): ±8V
• FET Feature: -
• Power Dissipation (Max): 275mW (Ta), 1.785W (Tc)
• Rds On (Max) @ Id, Vgs: 74 mOhm @ 1.8A, 4.5V
• Operating Temperature: -55°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Supplier Device Package: SOT-323-3
• Package / Case: SC-70, SOT-323

封装: SC-70, SOT-323

MRF8P20160HSR5

NXP

FET RF 2CH 65V 1.92GHZ

• Transistor Type: LDMOS (Dual)
• Frequency: 1.92GHz
• Gain: 16.5dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 550mA
• Power - Output: 37W
• Voltage - Rated: 65V
• Package / Case: NI-780S-4
• Supplier Device Package: NI-780S-4

封装: NI-780S-4

AFV141KHR5

NXP

IC TRANS RF LDMOS

• Transistor Type: LDMOS (Dual)
• Frequency: 1.4GHz
• Gain: 17.7dB
• Voltage - Test: 50V
• Current Rating: -
• Noise Figure: -
• Current - Test: 100mA
• Power - Output: 1000W
• Voltage - Rated: 105V
• Package / Case: SOT-979A
• Supplier Device Package: NI-1230-4H

封装: SOT-979A

MRF8P20165WHSR5

NXP

FET RF 2CH 65V 2.01GHZ NI780S4

• Transistor Type: LDMOS (Dual)
• Frequency: 1.98GHz ~ 2.01GHz
• Gain: 14.8dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 550mA
• Power - Output: 37W
• Voltage - Rated: 65V
• Package / Case: NI-780S-4
• Supplier Device Package: NI-780S-4

封装: NI-780S-4

PDTA144TE,115

NXP

TRANS PREBIAS PNP 150MW SC75

• Transistor Type: PNP - Pre-Biased
• Current - Collector (Ic) (Max): 100mA
• Voltage - Collector Emitter Breakdown (Max): 50V
• Resistor - Base (R1) (Ohms): 47k
• Resistor - Emitter Base (R2) (Ohms): -
• DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V
• Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
• Current - Collector Cutoff (Max): 1µA
• Frequency - Transition: -
• Power - Max: 150mW
• Mounting Type: Surface Mount
• Package / Case: SC-75, SOT-416
• Supplier Device Package: SC-75

封装: SC-75, SOT-416

PZM3.6NB1,115

NXP

DIODE ZENER 3.6V 300MW SMT3

• Voltage - Zener (Nom) (Vz): 3.6V
• Tolerance: ±2%
• Power - Max: 300mW
• Impedance (Max) (Zzt): 90 Ohms
• Current - Reverse Leakage @ Vr: 5µA @ 1V
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: SMT3; MPAK

封装: TO-236-3, SC-59, SOT-23-3

LD6806CX4/18H,315

NXP

IC REG LINEAR 1.8V 200MA 4WLCSP

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 1
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 1.8V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.1V @ 200mA
• Current - Output: 200mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 100µA ~ 250µA
• PSRR: 55dB (1kHz)
• Control Features: Enable
• Protection Features: Over Current, Over Temperature
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 4-XFBGA, WLCSP
• Supplier Device Package: 4-WLCSP (0.76x0.76)

封装: 4-XFBGA, WLCSP

PCE85133AUG/DAZ

NXP

IC LCD DRIVER UNIV 80X4 UNCASED

• Display Type: LCD
• Configuration: 320 Segment
• Interface: I2C
• Digits or Characters: 20 Characters, 40 Characters, 320 Elements
• Current - Supply: 22µA
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Die

封装: Die

74LVU04D,118

NXP

IC HEX INVERTER 14SOIC

• Logic Type: Inverter
• Number of Circuits: 6
• Number of Inputs: 6
• Features: -
• Voltage - Supply: 1 V ~ 5.5 V
• Current - Quiescent (Max): 40µA
• Current - Output High, Low: 12mA, 12mA
• Logic Level - Low: 0.2 V ~ 0.5 V
• Logic Level - High: 1 V ~ 2.4 V
• Max Propagation Delay @ V, Max CL: 7ns @ 3.3V, 50pF
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Supplier Device Package: 14-SO
• Package / Case: 14-SOIC (0.154", 3.90mm Width)

封装: 14-SOIC (0.154", 3.90mm Width)

MC145026D

NXP

IC ENCODER 9 LINE SMPLX 16-SOIC

• Type: Encoder, Decoder
• Applications: Remote Control
• Voltage - Supply, Analog: 2.5 V ~ 18 V
• Voltage - Supply, Digital: 2.5 V ~ 18 V
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 16-SOG

封装: 16-SOIC (0.295", 7.50mm Width)

NX3L4051PW-Q100J

NXP

IC SWITCH ANLG 8CH 16TSSOP

• Switch Circuit: -
• Multiplexer/Demultiplexer Circuit: 8:1
• Number of Circuits: 1
• On-State Resistance (Max): 750 mOhm
• Channel-to-Channel Matching (ΔRon): 70 mOhm
• Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V
• Voltage - Supply, Dual (V±): -
• Switch Time (Ton, Toff) (Max): 45ns, 25ns
• -3db Bandwidth: 15MHz
• Charge Injection: 15pC
• Channel Capacitance (CS(off), CD(off)): 35pF
• Current - Leakage (IS(off)) (Max): 10nA
• Crosstalk: -90dB @ 100kHz
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

封装: 16-TSSOP (0.173", 4.40mm Width)

MPC8572VTATLD

NXP

IC MPU MPC85XX 1.2GHZ 1023FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.2GHz
• Co-Processors/DSP: Signal Processing; SPE
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 1023-BFBGA, FCBGA
• Supplier Device Package: 1023-FCPBGA (33x33)

封装: 1023-BFBGA, FCBGA

MC68EC060ZU66

NXP

IC MPU M680X0 66MHZ 304TBGA

• Core Processor: 68060
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 66MHz
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 5.0V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 304-LBGA
• Supplier Device Package: 304-TBGA (31x31)

封装: 304-LBGA

MC68360EM25L

NXP

IC MPU M683XX 25MHZ 240FQFP

• Core Processor: CPU32+
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 25MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 5.0V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 240-BFQFP
• Supplier Device Package: 240-FQFP (32x32)

封装: 240-BFQFP

P1010NSE5KHB

NXP

IC MPU Q OR IQ 1.0GHZ 425TEBGA

• Core Processor: PowerPC e500v2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Security; SEC 4.4
• RAM Controllers: DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (3)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (1)
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
• Package / Case: 425-FBGA
• Supplier Device Package: 425-TEPBGA I (19x19)

封装: 425-FBGA

P89LPC9402FBD,557

NXP

IC MCU 8BIT 8KB FLASH 64LQFP

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 18MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LCD, LED, POR, PWM, WDT
• Number of I/O: 23
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (14x14)

封装: 64-LQFP

LPC11A13FHI33/201,

NXP

IC MCU 32BIT 24KB FLASH 33HVQFN

• Core Processor: ARM? Cortex?-M0
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number of I/O: 28
• Program Memory Size: 24KB (24K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 6K x 8
• Voltage - Supply (Vcc/Vdd): 2.6 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (5x5)

封装: 32-VFQFN Exposed Pad

MC9S08PA4VWJ

NXP

IC MCU 8BIT 4KB FLASH 20SOIC

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: LIN, SPI, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 18
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 128 x 8
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SOIC

封装: 20-SOIC (0.295", 7.50mm Width)

MPVZ5004GC6U

NXP

SENSOR PRESSURE SS CAP SO8 SMD

• Pressure Type: Vented Gauge
• Operating Pressure: 0.57 PSI (3.92 kPa)
• Output Type: Analog Voltage
• Output: 1 V ~ 4.9 V
• Accuracy: ±6.25%
• Voltage - Supply: 4.75 V ~ 5.25 V
• Port Size: Male - 0.13" (3.17mm) Tube
• Port Style: Barbless
• Features: Temperature Compensated
• Termination Style: PCB
• Maximum Pressure: 2.32 PSI (16 kPa)
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 8-SMD, Gull Wing, Top Port
• Supplier Device Package: -

封装: 8-SMD, Gull Wing, Top Port

MPX2200D

NXP

SENSOR DIFF PRESSURE 29 PSI MAX

• Pressure Type: Differential
• Operating Pressure: 29.01 PSI (200 kPa)
• Output Type: Wheatstone Bridge
• Output: 0 mV ~ 40 mV (10V)
• Accuracy: ±0.25%
• Voltage - Supply: 10 V ~ 16 V
• Port Size: -
• Port Style: No Port
• Features: Temperature Compensated
• Termination Style: PCB
• Maximum Pressure: 116.03 PSI (800 kPa)
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 4-SIP Module
• Supplier Device Package: -

封装: 4-SIP Module

PCF7939VA/CABC0600

NXP

IC TRANSPONDER IMMOBILIZER PLLMC

• Style: -
• Technology: -
• Frequency: -
• Memory Type: -
• Writable Memory: -
• Standards: -
• Operating Temperature: -
• Size / Dimension: -

封装: -

MC35FS6503NAER2

NXP

FS6500

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: -1.0 V ~ 40 V
• Operating Temperature: -40°C ~ 150°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP (7x7)

封装: 48-LQFP Exposed Pad

S912XEQ512J2MAA

NXP

16-BIT MCU S12X CORE 512KB FLA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 59
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 8x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 80-QFP
• Supplier Device Package: 80-QFP (14x14)

封装: 80-QFP

SPC5604CF2MLH6

NXP

NXP 32-BIT MCU POWER ARCH CORE

• Core Processor: e200z0h
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: CANbus, I²C, LINbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 79
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 48K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 28x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

封装: 100-LQFP

S912ZVML12F3MKHR

NXP

MAGNIV 16-BIT MCU S12Z CORE 12

• Core Processor: S12Z
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: LINbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 31
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V
• Data Converters: A/D 9x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP Exposed Pad
• Supplier Device Package: 64-LQFP-EP (10x10)

封装: 64-LQFP Exposed Pad

A3G35H100-04SR3

NXP

RF MOSFET

• Transistor Type: -
• Frequency: -
• Gain: -
• Voltage - Test: -
• Current Rating: -
• Noise Figure: -
• Current - Test: -
• Power - Output: -
• Voltage - Rated: -
• Package / Case: -
• Supplier Device Package: -

封装: -

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MVR5510AMMAHESR2

NXP

IC PMIC VR5510 QM

• Applications: -
• Current - Supply: 15mA
• Voltage - Supply: 2.7V ~ 60V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-HVQFN (8x8)

封装: -

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S32K322EHT0VPBST

NXP

IC MCU 32BIT 2MB FLASH 172QFP

• Core Processor: ARM® Cortex®-M7
• Core Size: 32-Bit Dual-Core
• Speed: 160MHz
• Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
• Peripherals: DMA, I2S, WDT
• Number of I/O: 143
• Program Memory Size: 2MB (2M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 128K x 8
• RAM Size: 256K x 8
• Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
• Data Converters: A/D 24x12b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 172-QFP
• Supplier Device Package: 172-QFP (16x16)

封装: -

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MPF5300AMMA0ES

NXP

IC REG BUCK ADJ 12A 24HWQFN

• Function: Step-Down
• Output Configuration: Positive
• Topology: Buck
• Output Type: Adjustable
• Number of Outputs: 1
• Voltage - Input (Min): 2.7V
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 0.5V
• Voltage - Output (Max): 1.2V
• Current - Output: 12A
• Frequency - Switching: 2MHz ~ 3MHz
• Synchronous Rectifier: No
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 24-PowerWFQFN
• Supplier Device Package: 24-HWQFN (4.5x3.5)

封装: -

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MC33FS8530A4KSR2

NXP

SAFETY POWER MANAGEMENT IC, QFN5

• Applications: System Basis Chip
• Current - Supply: 15mA
• Voltage - Supply: 60V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-HVQFN (8x8)

封装: -

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