页 440 - NXP 产品 | 深圳黑森尔电子
联系我们
SalesDept@heisener.com +86-0755-87210559 ext.802
登入/注册
BOM
购物车 0

NXP 产品

记录 26,590
页  440/887
图片
零件编号
制造商
描述
封装
库存
数量
BZX84-C22/LF1VL
NXP

DIODE ZENER TO-236AB SOT23

  • Voltage - Zener (Nom) (Vz): 22V
  • Tolerance: ±5%
  • Power - Max: 250mW
  • Impedance (Max) (Zzt): 55 Ohms
  • Current - Reverse Leakage @ Vr: 50nA @ 15.4V
  • Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
  • Operating Temperature: -65°C ~ 150°C
  • Mounting Type: Surface Mount
  • Package / Case: TO-236-3, SC-59, SOT-23-3
  • Supplier Device Package: TO-236AB (SOT23)
封装: TO-236-3, SC-59, SOT-23-3
库存7,376
74ABT540D,602
NXP

IC BUFF INVERT 5.5V 20SOIC

  • Logic Type: Buffer, Inverting
  • Number of Elements: 1
  • Number of Bits per Element: 8
  • Input Type: -
  • Output Type: Push-Pull
  • Current - Output High, Low: 32mA, 64mA
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 20-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 20-SO
封装: 20-SOIC (0.295", 7.50mm Width)
库存5,808
hot PCA9546ABS,118
NXP

IC I2C SWITCH 4CH 16-HVQFN

  • Applications: Translating Switch
  • Interface: I2C, SMBus
  • Voltage - Supply: 2.3 V ~ 5.5 V
  • Package / Case: 16-VQFN Exposed Pad
  • Supplier Device Package: 16-HVQFN (4x4)
  • Mounting Type: Surface Mount
封装: 16-VQFN Exposed Pad
库存42,000
PCA9672D,512
NXP

IC I/O EXPANDER I2C 8B 16SOIC

  • Number of I/O: 8
  • Interface: I2C
  • Interrupt Output: Yes
  • Features: POR
  • Output Type: Push-Pull
  • Current - Output Source/Sink: 100µA, 25mA
  • Clock Frequency: 1MHz
  • Voltage - Supply: 2.3 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 16-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 16-SO
封装: 16-SOIC (0.295", 7.50mm Width)
库存6,688
MPC8536AVTAQGA
NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

  • Core Processor: PowerPC e500
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.0GHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR2, DDR3
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: SATA 3Gbps (2)
  • USB: USB 2.0 (3)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 90°C (TA)
  • Security Features: -
  • Package / Case: 783-BBGA, FCBGA
  • Supplier Device Package: 783-FCPBGA (29x29)
封装: 783-BBGA, FCBGA
库存7,312
MPC564CVR66
NXP

IC MCU 32BIT 512KB FLASH 388BGA

  • Core Processor: PowerPC
  • Core Size: 32-Bit
  • Speed: 66MHz
  • Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
  • Peripherals: POR, PWM, WDT
  • Number of I/O: 56
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 32K x 8
  • Voltage - Supply (Vcc/Vdd): 2.5 V ~ 2.7 V
  • Data Converters: A/D 32x10b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 388-BBGA
  • Supplier Device Package: 388-PBGA (27x27)
封装: 388-BBGA
库存3,536
hot MCHC705B16NCFNE
NXP

IC MCU 8BIT 15KB OTP 52PLCC

  • Core Processor: HC05
  • Core Size: 8-Bit
  • Speed: 2.1MHz
  • Connectivity: SCI
  • Peripherals: POR, WDT
  • Number of I/O: 32
  • Program Memory Size: 15KB (15K x 8)
  • Program Memory Type: OTP
  • EEPROM Size: 256 x 8
  • RAM Size: 352 x 8
  • Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
  • Data Converters: A/D 8x8b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 52-LCC (J-Lead)
  • Supplier Device Package: 52-PLCC (19.1x19.1)
封装: 52-LCC (J-Lead)
库存16,200
hot MC68HC705C8ACP
NXP

IC MCU 8BIT 8KB OTP 40DIP

  • Core Processor: HC05
  • Core Size: 8-Bit
  • Speed: 2.1MHz
  • Connectivity: SCI, SPI
  • Peripherals: POR, WDT
  • Number of I/O: 24
  • Program Memory Size: 8KB (8K x 8)
  • Program Memory Type: OTP
  • EEPROM Size: -
  • RAM Size: 304 x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 40-DIP (0.600", 15.24mm)
  • Supplier Device Package: 40-PDIP
封装: 40-DIP (0.600", 15.24mm)
库存107,292
hot MC9S12H128VFVE
NXP

IC MCU 16BIT 128KB FLASH 144LQFP

  • Core Processor: HCS12
  • Core Size: 16-Bit
  • Speed: 16MHz
  • Connectivity: CAN, I2C, SCI, SPI
  • Peripherals: LCD, POR, PWM, WDT
  • Number of I/O: 99
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 6K x 8
  • Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
  • Data Converters: A/D 8x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-LQFP (20x20)
封装: 144-LQFP
库存17,172
LPC1813JET100E
NXP

IC MCU 32BIT 512KB FLSH 100TFBGA

  • Core Processor: ARM? Cortex?-M3
  • Core Size: 32-Bit
  • Speed: 180MHz
  • Connectivity: CAN, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
  • Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
  • Number of I/O: 49
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 16K x 8
  • RAM Size: 104K x 8
  • Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
  • Data Converters: A/D 4x10b; D/A 1x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 100-TFBGA
  • Supplier Device Package: -
封装: 100-TFBGA
库存4,784
hot MCF51AC256BCPUE
NXP

IC MCU 32BIT 256KB FLASH 64LQFP

  • Core Processor: Coldfire V1
  • Core Size: 32-Bit
  • Speed: 50MHz
  • Connectivity: I2C, SCI, SPI
  • Peripherals: LVD, PWM, WDT
  • Number of I/O: 54
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 32K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 20x12b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
封装: 64-LQFP
库存6,912
hot MK40DN512ZVLQ10
NXP

IC MCU 32BIT 512KB FLASH 144LQFP

  • Core Processor: ARM? Cortex?-M4
  • Core Size: 32-Bit
  • Speed: 100MHz
  • Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
  • Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
  • Number of I/O: 98
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 128K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 42x16b, D/A 2x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-LQFP (20x20)
封装: 144-LQFP
库存7,040
LPC4320FET100,551
NXP

IC MCU 32BIT ROMLESS 100TFBGA

  • Core Processor: ARM? Cortex?-M4/M0
  • Core Size: 32-Bit Dual-Core
  • Speed: 204MHz
  • Connectivity: CAN, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
  • Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
  • Number of I/O: 49
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 200K x 8
  • Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
  • Data Converters: A/D 4x10b; D/A 1x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 100-TFBGA
  • Supplier Device Package: 100-TFBGA (9x9)
封装: 100-TFBGA
库存6,228
SX1534PKWT1
NXP

ACCELEROMETER

  • Type: -
  • Axis: -
  • Acceleration Range: -
  • Sensitivity (LSB/g): -
  • Sensitivity (mV/g): -
  • Bandwidth: -
  • Output Type: -
  • Voltage - Supply: -
  • Features: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封装: -
库存2,214
NCF29A3MHN/0500IJ
NXP

IC REMOTE KEYLESS ENTRY 32HVQFN

  • Type: -
  • Frequency: -
  • Standards: -
  • Interface: -
  • Voltage - Supply: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
封装: -
库存6,948
MF3DH2200DA4/00J
NXP

MIFARE DESFIRE EV2 PLLMC

  • Type: RFID Reader
  • Frequency: 13.56MHz
  • Standards: ISO 14443
  • Interface: -
  • Voltage - Supply: -
  • Operating Temperature: -25°C ~ 70°C
  • Package / Case: MOA4, Smart Card Module
  • Supplier Device Package: PLLMC
封装: MOA4, Smart Card Module
库存6,138
HTCICC6402FUG/AM,0
NXP

TRANSPONDER RFIC HITAG RO64 DIE

  • Type: RFID Transponder
  • Frequency: 100kHz ~ 150kHz
  • Standards: -
  • Interface: -
  • Voltage - Supply: 5V
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: Die
  • Supplier Device Package: Die
封装: Die
库存8,910
SA605D/01,112
NXP

IC MIXER FM IF SYSTEM LP 20-SOIC

  • Frequency: 0Hz ~ 500MHz
  • Sensitivity: -
  • Data Rate (Max): -
  • Modulation or Protocol: ASK, FSK
  • Applications: FM Remote Receiver
  • Current - Receiving: 5.7mA
  • Data Interface: PCB, Surface Mount
  • Memory Size: -
  • Antenna Connector: PCB, Surface Mount
  • Features: RSSI Equipped
  • Voltage - Supply: 4.5 V ~ 8 V
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 20-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 20-SO
封装: 20-SOIC (0.295", 7.50mm Width)
库存8,520
SA636BS,115
NXP

IC MIXER 500MHZ UP CONV 20HVQFN

  • RF Type: Cellular, ASK, DECT, FSK, UHF, VHF
  • Frequency: 500MHz
  • Number of Mixers: 1
  • Gain: 11dB
  • Noise Figure: 12dB
  • Secondary Attributes: Up Converter
  • Current - Supply: 6.5mA
  • Voltage - Supply: 2.7 V ~ 5.5 V
  • Package / Case: 20-VFQFN Exposed Pad
  • Supplier Device Package: 20-HVQFN (4x4)
封装: 20-VFQFN Exposed Pad
库存17,760
MC33FS6501CAE
NXP

SYSTEM BASIS CHIP DCDC 0.8A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: -1.0 V ~ 40 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP (7x7)
封装: 48-LQFP Exposed Pad
库存6,352
MC34PF3000A8EPR2
NXP

POWER MANAGEMENT IC I.MX7 PRE-

  • Applications: i.MX Processors
  • Current - Supply: -
  • Voltage - Supply: 2.8 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 105°C
  • Mounting Type: Surface Mount
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-QFN (7x7)
封装: 48-VFQFN Exposed Pad
库存4,224
S9S12VR32F0MLCR
NXP

MAGNIV 16-BIT MCU S12 CORE 32K

  • Core Processor: 12V1
  • Core Size: 16-Bit
  • Speed: 25MHz
  • Connectivity: IrDA, LINbus, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 16
  • Program Memory Size: 32KB (32K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 128 x 8
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
  • Data Converters: A/D 2x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 32-LQFP
  • Supplier Device Package: 32-LQFP (7x7)
封装: 32-LQFP
库存17,376
SPC5748GBK0AVKU6
NXP

TRIPLE CORE, 6M FLASH

  • Core Processor: e200z2, e200z4, e200z4
  • Core Size: 32-Bit Tri-Core
  • Speed: 80MHz/160MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: 129
  • Program Memory Size: 6MB (6M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 768K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 80x10b, 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP Exposed Pad
  • Supplier Device Package: 176-LQFP (24x24)
封装: 176-LQFP Exposed Pad
库存5,424
S9S08EL32F1CTLR
NXP

8-BIT MCU S08 CORE 32KB FLASH

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 40MHz
  • Connectivity: I²C, LINbus, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 22
  • Program Memory Size: 32KB (32K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 512 x 8
  • RAM Size: 1K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 16x10b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 28-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 28-TSSOP
封装: 28-TSSOP (0.173", 4.40mm Width)
库存7,520
S912ZVMBA4F0WLF
NXP

IC MCU 16BIT 48KB FLASH 48LQFP

  • Core Processor: S12Z
  • Core Size: 16-Bit
  • Speed: 32MHz
  • Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
  • Peripherals: DMA, LVD, POR, PWM, WDT
  • Number of I/O: 15
  • Program Memory Size: 48KB (48K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 512 x 8
  • RAM Size: 4K x 8
  • Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
  • Data Converters: A/D 5x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 150°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP
  • Supplier Device Package: 48-LQFP (7x7)
封装: -
Request a Quote
SAF4000EL-103Q23CY
NXP

IC

  • Type: -
  • Interface: -
  • Clock Rate: -
  • Non-Volatile Memory: -
  • On-Chip RAM: -
  • Voltage - I/O: -
  • Voltage - Core: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封装: -
Request a Quote
K32L2B11VFM0A
NXP

IC MCU 32BIT 64KB FLASH 32QFN

  • Core Processor: ARM® Cortex®-M0+
  • Core Size: 32-Bit Single-Core
  • Speed: 48MHz
  • Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
  • Peripherals: DMA, LCD, PWM, WDT
  • Number of I/O: -
  • Program Memory Size: 64KB (64K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 32K x 8
  • Voltage - Supply (Vcc/Vdd): 1.2V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: -
  • Mounting Type: Surface Mount
  • Package / Case: 32-UFQFN Exposed Pad
  • Supplier Device Package: 32-QFN (5x5)
封装: -
Request a Quote
SPC5775KK2MMY3A
NXP

IC MCU 4MB FLASH 356MAPBGA

  • Core Processor: -
  • Core Size: -
  • Speed: -
  • Connectivity: -
  • Peripherals: -
  • Number of I/O: -
  • Program Memory Size: -
  • Program Memory Type: -
  • EEPROM Size: -
  • RAM Size: -
  • Voltage - Supply (Vcc/Vdd): -
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封装: -
Request a Quote
S912ZVC64AMKH
NXP

IC MCU 16BIT 64KB FLASH 64LQFP

  • Core Processor: S12Z
  • Core Size: 16-Bit
  • Speed: 32MHz
  • Connectivity: CANbus, I2C, SCI, SPI
  • Peripherals: DMA, LVD, POR, PWM, WDT
  • Number of I/O: 42
  • Program Memory Size: 64KB (64K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 1K x 8
  • RAM Size: 4K x 8
  • Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
  • Data Converters: A/D 16x10b SAR
  • Oscillator Type: External, Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 64-LQFP Exposed Pad
  • Supplier Device Package: 64-LQFP (10x10)
封装: -
Request a Quote
S9S12GN48J0MLH
NXP

S12 CORE,48K FLASH

  • Core Processor: S12
  • Core Size: 16-Bit
  • Speed: 25MHz
  • Connectivity: IrDA, LINbus, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 54
  • Program Memory Size: 48KB (48K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 1.5K x 8
  • RAM Size: 4K x 8
  • Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
  • Data Converters: A/D 12x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
封装: -
Request a Quote