页 412 - NXP 产品 | 深圳黑森尔电子
联系我们
SalesDept@heisener.com +86-0755-87210559 ext.802

NXP 产品

记录 26,590
页  412/887
图片
零件编号
制造商
描述
封装
库存
数量
BF1212,215
NXP

MOSFET N-CH DUAL GATE 6V SOT143B

  • Transistor Type: N-Channel Dual Gate
  • Frequency: 400MHz
  • Gain: 30dB
  • Voltage - Test: 5V
  • Current Rating: 30mA
  • Noise Figure: 0.9dB
  • Current - Test: 12mA
  • Power - Output: -
  • Voltage - Rated: 6V
  • Package / Case: TO-253-4, TO-253AA
  • Supplier Device Package: SOT-143B
封装: TO-253-4, TO-253AA
库存3,456
MMRF1015GNR1
NXP

FET RF 68V 960MHZ

  • Transistor Type: LDMOS
  • Frequency: 960MHz
  • Gain: 18dB
  • Voltage - Test: 28V
  • Current Rating: -
  • Noise Figure: -
  • Current - Test: 125mA
  • Power - Output: 10W
  • Voltage - Rated: 68V
  • Package / Case: TO-270-2 Gull Wing
  • Supplier Device Package: TO-270-2 GULL
封装: TO-270-2 Gull Wing
库存5,424
NX1117C120Z,115
NXP

IC REG LINEAR 1A SOT223

  • Output Configuration: -
  • Output Type: -
  • Number of Regulators: 1
  • Voltage - Input (Max): -
  • Voltage - Output (Min/Fixed): -
  • Voltage - Output (Max): -
  • Voltage Dropout (Max): -
  • Current - Output: 1A
  • Current - Quiescent (Iq): -
  • Current - Supply (Max): -
  • PSRR: -
  • Control Features: -
  • Protection Features: -
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Surface Mount
  • Package / Case: TO-261-4, TO-261AA
  • Supplier Device Package: SOT-223
封装: TO-261-4, TO-261AA
库存7,440
CBTD16213DGG,112
NXP

IC FET BUS EXCH SWCH 56-TSSOP

  • Type: Bus FET Exchange Switch
  • Circuit: 12 x 2:2
  • Independent Circuits: 1
  • Current - Output High, Low: -
  • Voltage Supply Source: Single Supply
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 56-TFSOP (0.240", 6.10mm Width)
  • Supplier Device Package: 56-TSSOP
封装: 56-TFSOP (0.240", 6.10mm Width)
库存6,672
HEC4069UBT,112
NXP

IC HEX INVERTER 14SOIC

  • Logic Type: Inverter
  • Number of Circuits: 6
  • Number of Inputs: 6
  • Features: -
  • Voltage - Supply: 3 V ~ 15 V
  • Current - Quiescent (Max): 1µA
  • Current - Output High, Low: 3.4mA, 3.4mA
  • Logic Level - Low: 1 V ~ 2.5 V
  • Logic Level - High: 4 V ~ 12.5 V
  • Max Propagation Delay @ V, Max CL: 25ns @ 15V, 50pF
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Surface Mount
  • Supplier Device Package: 14-SO
  • Package / Case: 14-SOIC (0.154", 3.90mm Width)
封装: 14-SOIC (0.154", 3.90mm Width)
库存3,136
74LVC74APW/AUJ
NXP

IC FLIP FLOP OCT D POS 14TSSOP

  • Function: Set(Preset) and Reset
  • Type: D-Type
  • Output Type: Differential
  • Number of Elements: 2
  • Number of Bits per Element: 1
  • Clock Frequency: 250MHz
  • Max Propagation Delay @ V, Max CL: 5.2ns @ 3.3V, 50pF
  • Trigger Type: Positive Edge
  • Current - Output High, Low: 24mA, 24mA
  • Voltage - Supply: 1.65 V ~ 3.6 V
  • Current - Quiescent (Iq): 10µA
  • Input Capacitance: 4pF
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 14-TSSOP (0.173", 4.40mm Width)
封装: 14-TSSOP (0.173", 4.40mm Width)
库存3,008
MPC8377CVRALG
NXP

IC MPU MPC83XX 667MHZ 689TEBGA

  • Core Processor: PowerPC e300c4s
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 667MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: SATA 3Gbps (2)
  • USB: USB 2.0 + PHY (1)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Security Features: -
  • Package / Case: 689-BBGA Exposed Pad
  • Supplier Device Package: 689-TEPBGA II (31x31)
封装: 689-BBGA Exposed Pad
库存6,208
MPC8358CVVADDE
NXP

IC MPU MPC83XX 266MHZ 740TBGA

  • Core Processor: PowerPC e300
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 266MHz
  • Co-Processors/DSP: Communications; QUICC Engine
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (1)
  • SATA: -
  • USB: USB 1.x (1)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 740-LBGA
  • Supplier Device Package: 740-TBGA (37.5x37.5)
封装: 740-LBGA
库存4,688
hot MPC8540CPX667JB
NXP

IC MPU MPC85XX 667MHZ 783FCBGA

  • Core Processor: PowerPC e500
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 667MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100 Mbps (1), 10/100/1000 Mbps (2)
  • SATA: -
  • USB: -
  • Voltage - I/O: 2.5V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 783-FCPBGA (29x29)
封装: 784-BBGA, FCBGA
库存5,904
KMPC8560PX833LB
NXP

IC MPU MPC85XX 833MHZ 783FCBGA

  • Core Processor: PowerPC e500
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 833MHz
  • Co-Processors/DSP: Communications; CPM
  • RAM Controllers: DDR, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: -
  • USB: -
  • Voltage - I/O: 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 783-FCPBGA (29x29)
封装: 784-BBGA, FCBGA
库存3,760
B4860NXE7QUMD
NXP

BASEBAND PROC PILOT REV 1.0

  • Core Processor: PowerPC e6500
  • Number of Cores/Bus Width: 4 Core, 64-Bit
  • Speed: 1.8GHz
  • Co-Processors/DSP: Signal Processing; SC3900FP FVP - 6 Core
  • RAM Controllers: DDR3, DDR3L
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 1/2.5 Gbps (4), 1/2.5/10 Gbps (2)
  • SATA: -
  • USB: USB 2.0 (1)
  • Voltage - I/O: 1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
  • Package / Case: 1020-BBGA, FCBGA
  • Supplier Device Package: 1020-FCPBGA (33x33)
封装: 1020-BBGA, FCBGA
库存4,848
PK20X256VLK100
NXP

IC MCU 32BIT 256KB FLASH 80LQFP

  • Core Processor: ARM? Cortex?-M4
  • Core Size: 32-Bit
  • Speed: 100MHz
  • Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
  • Peripherals: DMA, I2S, LVD, POR, PWM, WDT
  • Number of I/O: 52
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 64K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 33x16b, D/A 2x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 80-LQFP
  • Supplier Device Package: 80-LQFP (12x12)
封装: 80-LQFP
库存7,616
LPC2134FBD64,151
NXP

IC MCU 32BIT 128KB FLASH 64LQFP

  • Core Processor: ARM7?
  • Core Size: 16/32-Bit
  • Speed: 60MHz
  • Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
  • Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
  • Number of I/O: 47
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 16K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
  • Data Converters: A/D 16x10b; D/A 1x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
封装: 64-LQFP
库存2,192
hot MC9S08GT60CFB
NXP

IC MCU 8BIT 60KB FLASH 44QFP

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 40MHz
  • Connectivity: I2C, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 36
  • Program Memory Size: 60KB (60K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 4K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
  • Data Converters: A/D 8x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 44-QFP
  • Supplier Device Package: 44-QFP (10x10)
封装: 44-QFP
库存89,580
MC68332GMEH20
NXP

IC MCU 32BIT ROMLESS 132QFP

  • Core Processor: CPU32
  • Core Size: 32-Bit
  • Speed: 20MHz
  • Connectivity: EBI/EMI, SCI, SPI, UART/USART
  • Peripherals: POR, PWM, WDT
  • Number of I/O: 15
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 132-BQFP Bumpered
  • Supplier Device Package: 132-PQFP (24.13x24.13)
封装: 132-BQFP Bumpered
库存5,184
MC9S12GC96CFUE
NXP

IC MCU 16BIT 96KB FLASH 80QFP

  • Core Processor: HCS12
  • Core Size: 16-Bit
  • Speed: 25MHz
  • Connectivity: EBI/EMI, SCI, SPI
  • Peripherals: POR, PWM, WDT
  • Number of I/O: 60
  • Program Memory Size: 96KB (96K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 4K x 8
  • Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
  • Data Converters: A/D 8x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 80-QFP
  • Supplier Device Package: 80-QFP (14x14)
封装: 80-QFP
库存7,136
SPC5602BK0CLQ4
NXP

IC MCU 32BIT 256KB FLASH 144LQFP

  • Core Processor: e200z0h
  • Core Size: 32-Bit
  • Speed: 48MHz
  • Connectivity: CAN, I2C, LIN, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 123
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 16
  • RAM Size: 24K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 36x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-LQFP (15x15)
封装: 144-LQFP
库存4,224
hot MC68HC908QY4CDTE
NXP

IC MCU 8BIT 4KB FLASH 16TSSOP

  • Core Processor: HC08
  • Core Size: 8-Bit
  • Speed: 8MHz
  • Connectivity: -
  • Peripherals: LVD, POR, PWM
  • Number of I/O: 13
  • Program Memory Size: 4KB (4K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 128 x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 4x8b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 16-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 16-TSSOP
封装: 16-TSSOP (0.173", 4.40mm Width)
库存65,940
JN516X-EK005-230VZ
NXP

DEMO BOARD WIRELESS MCU

  • Type: -
  • Frequency: -
  • For Use With/Related Products: -
  • Supplied Contents: -
封装: -
库存4,284
MC33PF3000A7ESR2
NXP

POWER MANAGEMENT IC I.MX7 PRE-

  • Applications: i.MX Processors
  • Current - Supply: -
  • Voltage - Supply: 2.8 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 105°C
  • Mounting Type: Surface Mount
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-QFN (7x7)
封装: 48-VFQFN Exposed Pad
库存7,120
MCIMX6DP4AVT8AB
NXP

IC MPU I.MX6DP ENHAN 624FCBGA

  • Core Processor: ARM® Cortex®-A9
  • Number of Cores/Bus Width: 2 Core, 32-Bit
  • Speed: 852MHZ
  • Co-Processors/DSP: Multimedia; NEON™ SIMD
  • RAM Controllers: LPDDR2, DDR3L, DDR3
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
  • Ethernet: 10/100/1000 Mbps (1)
  • SATA: SATA 3Gbps (1)
  • USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
  • Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
  • Package / Case: 624-FBGA, FCBGA
  • Supplier Device Package: 624-FCBGA (21x21)
封装: 624-FBGA, FCBGA
库存6,080
MCIMX6DP5EYM1AB
NXP

IC MPU I.MX6DP ENHAN 624FCBGA

  • Core Processor: ARM® Cortex®-A9
  • Number of Cores/Bus Width: 2 Core, 32-Bit
  • Speed: 1.0GHz
  • Co-Processors/DSP: Multimedia; NEON™ SIMD
  • RAM Controllers: LPDDR2, DDR3L, DDR3
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
  • Ethernet: 10/100/1000 Mbps (1)
  • SATA: SATA 3Gbps (1)
  • USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
  • Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
  • Operating Temperature: -20°C ~ 105°C (TJ)
  • Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
  • Package / Case: 624-LFBGA, FCBGA
  • Supplier Device Package: 624-FCBGA (21x21)
封装: 624-LFBGA, FCBGA
库存6,564
S9S12VRP64F0VLF
NXP

64K FLASH, 6K RAM

  • Core Processor: 12V1
  • Core Size: 16-Bit
  • Speed: 25MHz
  • Connectivity: IrDA, LINbus, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 28
  • Program Memory Size: 64KB (64K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 512 x 8
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
  • Data Converters: A/D 6x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 48-LQFP
  • Supplier Device Package: 48-LQFP (7x7)
封装: 48-LQFP
库存21,180
SP5744BBK1AMMH2R
NXP

SINGLE CORE 1.5M FLASH 192K RA

  • Core Processor: e200z4
  • Core Size: 32-Bit
  • Speed: 120MHz
  • Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI
  • Peripherals: DMA, I²S, POR, WDT
  • Number of I/O: -
  • Program Memory Size: 1.5MB (1.5M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 192K x 8
  • Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
  • Data Converters: A/D 36x10b, 16x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 100-LBGA
  • Supplier Device Package: 100-MAPBGA (11x11)
封装: 100-LBGA
库存2,544
TDA8024T/C1,518
NXP

HIGH INTEGRATED AND LOW POWER SM

  • Applications: -
  • Interface: Analog
  • Voltage - Supply: 2.7V ~ 6.5V
  • Package / Case: 28-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 28-SO
  • Mounting Type: Surface Mount
封装: 28-SOIC (0.295", 7.50mm Width)
库存2,272
S9S08RNA16W2MTGR
NXP

IC MCU 8BIT 16KB FLASH 16TSSOP

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 20MHz
  • Connectivity: I2C, LINbus, SPI, UART/USART
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 12
  • Program Memory Size: 16KB (16K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 256 x 8
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
  • Data Converters: A/D 8x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 16-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 16-TSSOP
封装: -
Request a Quote
MM912I637AV1EP-NXP
NXP

BATTERY SENSOR, LIN, 96KB FLASH,

  • Applications: -
  • Core Processor: HCS12
  • Program Memory Type: FLASH (48kB)
  • Controller Series: HCS12
  • RAM Size: 6K x 8
  • Interface: LIN, PWM, SCI, SPI
  • Number of I/O: 14
  • Voltage - Supply: 2.25V ~ 5.25V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-QFN-EP (7x7)
封装: -
Request a Quote
TJA1044BT-0Z
NXP

IC TRANSCEIVER HI SPEED 8SO

  • Type: Transceiver
  • Protocol: CANbus
  • Number of Drivers/Receivers: 1/1
  • Duplex: Half
  • Receiver Hysteresis: 300 mV
  • Data Rate: 5Mbps
  • Voltage - Supply: 4.5V ~ 5.5V
  • Operating Temperature: -40°C ~ 150°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-SO
封装: -
库存11,556
K32L2B21VFT0AR
NXP

K32 L2B, 48QFN

  • Core Processor: ARM® Cortex®-M0+
  • Core Size: 32-Bit
  • Speed: 48MHz
  • Connectivity: I2C, SPI, UART/USART, USB
  • Peripherals: DMA, LVD, POR, PWM, WDT
  • Number of I/O: 36
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 32K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
  • Data Converters: A/D 14x16b SAR; D/A 1x12b
  • Oscillator Type: External, Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-UFQFN Exposed Pad
  • Supplier Device Package: 48-QFN (7x7)
封装: -
Request a Quote
FB32K116LFT0MLFT
NXP

S32K116 32-BIT MCU, ARM CORTEX-M

  • Core Processor: -
  • Core Size: -
  • Speed: -
  • Connectivity: -
  • Peripherals: -
  • Number of I/O: -
  • Program Memory Size: -
  • Program Memory Type: -
  • EEPROM Size: -
  • RAM Size: -
  • Voltage - Supply (Vcc/Vdd): -
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封装: -
Request a Quote