页 371 - NXP 产品 | 深圳黑森尔电子

零件编号	制造商	描述	封装	库存
PHB176NQ04T,118	NXP	MOSFET N-CH 40V 75A D2PAK FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 40V Current - Continuous Drain (Id) @ 25°C: 75A (Tc) Drive Voltage (Max Rds On, Min Rds On): 10V Vgs(th) (Max) @ Id: 4V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 68.9nC @ 10V Input Capacitance (Ciss) (Max) @ Vds: 3620pF @ 25V Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 250W (Tc) Rds On (Max) @ Id, Vgs: 4.3 mOhm @ 25A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Surface Mount Supplier Device Package: D2PAK Package / Case: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB	封装: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB	库存3,200
BSS83,215	NXP	MOSFET N-CH 10V 50MA SOT-143B Transistor Type: N-Channel Frequency: - Gain: - Voltage - Test: - Current Rating: 50mA Noise Figure: - Current - Test: - Power - Output: - Voltage - Rated: 10V Package / Case: TO-253-4, TO-253AA Supplier Device Package: SOT-143B	封装: TO-253-4, TO-253AA	库存6,496
BZX84-C6V8/LF1R	NXP	DIODE ZENER TO-236AB SOT23 Voltage - Zener (Nom) (Vz): 6.8V Tolerance: ±5% Power - Max: 250mW Impedance (Max) (Zzt): 15 Ohms Current - Reverse Leakage @ Vr: 2µA @ 4V Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: TO-236AB (SOT23)	封装: TO-236-3, SC-59, SOT-23-3	库存5,776
BA277,135	NXP	DIODE BAND-SWITCHING 35V SOD523 Diode Type: Standard - Single Voltage - Peak Reverse (Max): 35V Current - Max: 100mA Capacitance @ Vr, F: 1.2pF @ 6V, 1MHz Resistance @ If, F: - Power Dissipation (Max): 715mW Operating Temperature: -65°C ~ 150°C (TJ) Package / Case: SC-79, SOD-523 Supplier Device Package: SOD-523	封装: SC-79, SOD-523	库存6,816
HSTL16918DGG,118	NXP	IC MEMORY ADDRESS LATCH 48TSSOP Logic Type: D-Type Latch Circuit: 9:18 Output Type: Tri-State Voltage - Supply: 3.15 V ~ 3.45 V Independent Circuits: 1 Delay Time - Propagation: 3.4ns Current - Output High, Low: 24mA, 24mA Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 48-TFSOP (0.240", 6.10mm Width) Supplier Device Package: 48-TSSOP	封装: 48-TFSOP (0.240", 6.10mm Width)	库存3,744
74HCT125N,652	NXP	IC BUFFER DVR TRI-ST QD 14DIP Logic Type: Buffer, Non-Inverting Number of Elements: 4 Number of Bits per Element: 1 Input Type: - Output Type: Push-Pull Current - Output High, Low: 6mA, 6mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Through Hole Package / Case: 14-DIP (0.300", 7.62mm) Supplier Device Package: 14-DIP	封装: 14-DIP (0.300", 7.62mm)	库存6,720
CGD982LCU	NXP	IC AMP CATV PWR DOUBLER 8SIL Applications: CATV Output Type: - Number of Circuits: 1 -3db Bandwidth: - Slew Rate: - Current - Supply: 365mA Current - Output / Channel: - Voltage - Supply, Single/Dual (±): 24V Mounting Type: Chassis Mount Package / Case: SOT-115AE Supplier Device Package: 8-SIL	封装: SOT-115AE	库存6,000
UJA1076ATW/3V3,112	NXP	IC SBC CAN/LIN 3.3V HS 32HTSSOP Applications: Automotive Interface: SPI Serial Voltage - Supply: 4.5 V ~ 28 V Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Supplier Device Package: 32-HTSSOP Mounting Type: Surface Mount	封装: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad	库存7,968
PCA9554N,112	NXP	IC I/O EXPANDER I2C 8B 16DIP Number of I/O: 8 Interface: I2C, SMBus Interrupt Output: Yes Features: POR Output Type: Push-Pull Current - Output Source/Sink: 10mA, 25mA Clock Frequency: 400kHz Voltage - Supply: 2.3 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Through Hole Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP	封装: 16-DIP (0.300", 7.62mm)	库存5,360
TJA1055T/3/1J	NXP	IC TXRX CAN ENH FAULT-TOL 14SOIC Type: Transceiver Protocol: CAN Number of Drivers/Receivers: 1/1 Duplex: Half Receiver Hysteresis: - Data Rate: - Voltage - Supply: 4.75 V ~ 5.25 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Supplier Device Package: 14-SO	封装: 14-SOIC (0.154", 3.90mm Width)	库存3,760
MPC8533VTARJA	NXP	IC MPU MPC85XX 1.067GHZ 783BGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.067GHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 90°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	封装: 783-BBGA, FCBGA	库存3,696
P3041NXE7PNC	NXP	IC MPU Q OR IQ 1.5GHZ 1295FCBGA Core Processor: PowerPC e500mc Number of Cores/Bus Width: 4 Core, 32-Bit Speed: 1.5GHz Co-Processors/DSP: Security; SEC 4.2 RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (5), 10 Gbps (1) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox Package / Case: 1295-BBGA, FCBGA Supplier Device Package: 1295-FCPBGA (37.5x37.5)	封装: 1295-BBGA, FCBGA	库存4,608
MPC885VR66	NXP	IC MPU MPC8XX 66MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (3), 10/100 Mbps (2) SATA: - USB: USB 2.0 (1) Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: Cryptography Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	封装: 357-BBGA	库存3,488
P1020NSE2DFB	NXP	IC MPU Q OR IQ 800MHZ 689TEBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Security; SEC 3.3 RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 125°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	封装: 689-BBGA Exposed Pad	库存6,960
MCHC908QY2MDWE	NXP	IC MCU 8BIT 1.5KB FLASH 16SOIC Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: - Peripherals: LVD, POR, PWM Number of I/O: 13 Program Memory Size: 1.5KB (1.5K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 4x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SOIC	封装: 16-SOIC (0.295", 7.50mm Width)	库存3,760
LPC1837FET256,551	NXP	IC MCU 32BIT 1MB FLASH 256LBGA Core Processor: ARM? Cortex?-M3 Core Size: 32-Bit Speed: 150MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, Microwire, SD, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 80 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 136K x 8 Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V Data Converters: A/D 16x10b; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 256-LBGA Supplier Device Package: 256-LBGA (17x17)	封装: 256-LBGA	库存7,200
MK22DX256VLK5	NXP	IC MCU 32BIT 256KB FLASH 80LQFP Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 56 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 20x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (12x12)	封装: 80-LQFP	库存20,508
JN5161/001,518	NXP	IC RF TXRX+MCU 802.15.4 40-VFQFN Type: TxRx + MCU RF Family/Standard: 802.15.4 Protocol: ZigbeePRO? Modulation: O-QPSK Frequency: 2.4GHz Data Rate (Max): 1Mbps Power - Output: 2.5dBm Sensitivity: -96dBm Memory Size: 64kB Flash, 4kB EEPROM, 8kB RAM Serial Interfaces: I2C, JTAG, SPI, UART GPIO: 20 Voltage - Supply: 2 V ~ 3.6 V Current - Receiving: 17mA Current - Transmitting: 15.3mA Operating Temperature: -40°C ~ 125°C Package / Case: 40-VFQFN Exposed Pad	封装: 40-VFQFN Exposed Pad	库存2,898
MCZ33903DP3EK	NXP	SYSTEM BASIS CHIP 2X 3.3 V/400M Applications: System Basis Chip Interface: CAN, LIN Voltage - Supply: 5.5 V ~ 28 V Package / Case: - Supplier Device Package: - Mounting Type: -	封装: -	库存6,320
T2081NSE8MQB	NXP	QORIQ 64B POWER ARCH 8X 1.2GHZ Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	封装: -	库存6,320
SPC5744PK1AMLQ8R	NXP	2.5MB NVM 2 X E200Z4 CORES 180 Core Processor: e200z4 Core Size: 32-Bit Dual-Core Speed: 180MHz Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Number of I/O: 79 Program Memory Size: 2.5MB (2.5M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 384K x 8 Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V Data Converters: A/D 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	封装: 144-LQFP	库存7,632
SPC5602BK0VLL6	NXP	32BIT 256KF 100LD 64MHZ Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 79 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 24K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 28x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	封装: 100-LQFP	库存6,864
S9S12G64F0VLF	NXP	16-BIT MCU S12 CORE 64KB FLASH Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	封装: 48-LQFP	库存7,184
MCIMX280DVM4CR	NXP	IC MPU I.MX28 454MHZ 289MAPBGA Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 454MHz Co-Processors/DSP: Data; DCP RAM Controllers: DDR2, LVDDR, LVDDR2 Graphics Acceleration: No Display & Interface Controllers: Keypad, Touchscreen Ethernet: 10/100Mbps (1) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 1.8V, 3.3V Operating Temperature: -20°C ~ 70°C (TA) Security Features: Boot Security, Cryptography, Hardware ID Package / Case: 289-LFBGA Supplier Device Package: 289-MAPBGA (14x14)	封装: -	Request a Quote
BT234-600D-127	NXP	TRIAC 600V 4A TO220AB Triac Type: Standard Voltage - Off State: 600 V Current - On State (It (RMS)) (Max): 4 A Voltage - Gate Trigger (Vgt) (Max): 1 V Current - Non Rep. Surge 50, 60Hz (Itsm): 35A @ 50Hz Current - Gate Trigger (Igt) (Max): 10 mA Current - Hold (Ih) (Max): 6 mA Configuration: Single Operating Temperature: 125°C (TJ) Mounting Type: Through Hole Package / Case: TO-220-3 Supplier Device Package: TO-220AB	封装: -	Request a Quote
FS32K146HRT0MMHT	NXP	IC MCU 32BIT 1MB FLASH 100MAPBGA Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Speed: 80MHz Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 89 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b SAR; D/A1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 100-LFBGA Supplier Device Package: 100-MAPBGA (11x11)	封装: -	Request a Quote
BC847C-AU-215	NXP	SMALL SIGNAL BIPOLAR TRANSISTOR Transistor Type: NPN Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 45 V Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA Current - Collector Cutoff (Max): 15nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V Power - Max: 250 mW Frequency - Transition: 100MHz Operating Temperature: 150°C (TJ) Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SOT23-3 (TO-236)	封装: -	Request a Quote
XC511363CFUE8	NXP	NO DESCRIPTION Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封装: -	Request a Quote
LPC5526JBD100E	NXP	IC MCU 32BIT 256KB FLSH 100LQFP Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Speed: 150MHz Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 64 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 144K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Supplier Device Package: 100-HLQFP (14x14)	封装: -	Request a Quote
MPF5020CMMACESR2	NXP	POWER MANAGEMENT IC, PRE-PROG, 3 Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封装: -	Request a Quote

PHB176NQ04T,118

NXP

MOSFET N-CH 40V 75A D2PAK

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 40V
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs(th) (Max) @ Id: 4V @ 1mA
Gate Charge (Qg) (Max) @ Vgs: 68.9nC @ 10V
Input Capacitance (Ciss) (Max) @ Vds: 3620pF @ 25V
Vgs (Max): ±20V
FET Feature: -
Power Dissipation (Max): 250W (Tc)
Rds On (Max) @ Id, Vgs: 4.3 mOhm @ 25A, 10V
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Supplier Device Package: D2PAK
Package / Case: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB

封装: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB

库存3,200

BSS83,215

NXP

MOSFET N-CH 10V 50MA SOT-143B

Transistor Type: N-Channel
Frequency: -
Gain: -
Voltage - Test: -
Current Rating: 50mA
Noise Figure: -
Current - Test: -
Power - Output: -
Voltage - Rated: 10V
Package / Case: TO-253-4, TO-253AA
Supplier Device Package: SOT-143B

封装: TO-253-4, TO-253AA

库存6,496

BZX84-C6V8/LF1R

NXP

DIODE ZENER TO-236AB SOT23

Voltage - Zener (Nom) (Vz): 6.8V
Tolerance: ±5%
Power - Max: 250mW
Impedance (Max) (Zzt): 15 Ohms
Current - Reverse Leakage @ Vr: 2µA @ 4V
Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: TO-236AB (SOT23)

封装: TO-236-3, SC-59, SOT-23-3

库存5,776

BA277,135

NXP

DIODE BAND-SWITCHING 35V SOD523

Diode Type: Standard - Single
Voltage - Peak Reverse (Max): 35V
Current - Max: 100mA
Capacitance @ Vr, F: 1.2pF @ 6V, 1MHz
Resistance @ If, F: -
Power Dissipation (Max): 715mW
Operating Temperature: -65°C ~ 150°C (TJ)
Package / Case: SC-79, SOD-523
Supplier Device Package: SOD-523

封装: SC-79, SOD-523

库存6,816

HSTL16918DGG,118

NXP

IC MEMORY ADDRESS LATCH 48TSSOP

Logic Type: D-Type Latch
Circuit: 9:18
Output Type: Tri-State
Voltage - Supply: 3.15 V ~ 3.45 V
Independent Circuits: 1
Delay Time - Propagation: 3.4ns
Current - Output High, Low: 24mA, 24mA
Operating Temperature: 0°C ~ 70°C
Mounting Type: Surface Mount
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Supplier Device Package: 48-TSSOP

封装: 48-TFSOP (0.240", 6.10mm Width)

库存3,744

74HCT125N,652

NXP

IC BUFFER DVR TRI-ST QD 14DIP

Logic Type: Buffer, Non-Inverting
Number of Elements: 4
Number of Bits per Element: 1
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 6mA, 6mA
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Through Hole
Package / Case: 14-DIP (0.300", 7.62mm)
Supplier Device Package: 14-DIP

封装: 14-DIP (0.300", 7.62mm)

库存6,720

CGD982LCU

NXP

IC AMP CATV PWR DOUBLER 8SIL

Applications: CATV
Output Type: -
Number of Circuits: 1
-3db Bandwidth: -
Slew Rate: -
Current - Supply: 365mA
Current - Output / Channel: -
Voltage - Supply, Single/Dual (±): 24V
Mounting Type: Chassis Mount
Package / Case: SOT-115AE
Supplier Device Package: 8-SIL

封装: SOT-115AE

库存6,000

UJA1076ATW/3V3,112

NXP

IC SBC CAN/LIN 3.3V HS 32HTSSOP

Applications: Automotive
Interface: SPI Serial
Voltage - Supply: 4.5 V ~ 28 V
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Supplier Device Package: 32-HTSSOP
Mounting Type: Surface Mount

封装: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad

库存7,968

PCA9554N,112

NXP

IC I/O EXPANDER I2C 8B 16DIP

Number of I/O: 8
Interface: I2C, SMBus
Interrupt Output: Yes
Features: POR
Output Type: Push-Pull
Current - Output Source/Sink: 10mA, 25mA
Clock Frequency: 400kHz
Voltage - Supply: 2.3 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Through Hole
Package / Case: 16-DIP (0.300", 7.62mm)
Supplier Device Package: 16-DIP

封装: 16-DIP (0.300", 7.62mm)

库存5,360

TJA1055T/3/1J

NXP

IC TXRX CAN ENH FAULT-TOL 14SOIC

Type: Transceiver
Protocol: CAN
Number of Drivers/Receivers: 1/1
Duplex: Half
Receiver Hysteresis: -
Data Rate: -
Voltage - Supply: 4.75 V ~ 5.25 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 14-SO

封装: 14-SOIC (0.154", 3.90mm Width)

库存3,760

MPC8533VTARJA

NXP

IC MPU MPC85XX 1.067GHZ 783BGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.067GHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 90°C (TA)
Security Features: -
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

封装: 783-BBGA, FCBGA

库存3,696

P3041NXE7PNC

NXP

IC MPU Q OR IQ 1.5GHZ 1295FCBGA

Core Processor: PowerPC e500mc
Number of Cores/Bus Width: 4 Core, 32-Bit
Speed: 1.5GHz
Co-Processors/DSP: Security; SEC 4.2
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (5), 10 Gbps (1)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (2)
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
Package / Case: 1295-BBGA, FCBGA
Supplier Device Package: 1295-FCPBGA (37.5x37.5)

封装: 1295-BBGA, FCBGA

库存4,608

MPC885VR66

NXP

IC MPU MPC8XX 66MHZ 357BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 66MHz
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (3), 10/100 Mbps (2)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 95°C (TA)
Security Features: Cryptography
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

封装: 357-BBGA

库存3,488

P1020NSE2DFB

NXP

IC MPU Q OR IQ 800MHZ 689TEBGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (3)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 2.5V, 3.3V
Operating Temperature: 0°C ~ 125°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

封装: 689-BBGA Exposed Pad

库存6,960

MCHC908QY2MDWE

NXP

IC MCU 8BIT 1.5KB FLASH 16SOIC

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: -
Peripherals: LVD, POR, PWM
Number of I/O: 13
Program Memory Size: 1.5KB (1.5K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 4x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 16-SOIC

封装: 16-SOIC (0.295", 7.50mm Width)

库存3,760

LPC1837FET256,551

NXP

IC MCU 32BIT 1MB FLASH 256LBGA

Core Processor: ARM? Cortex?-M3
Core Size: 32-Bit
Speed: 150MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, Microwire, SD, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O: 80
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 136K x 8
Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V
Data Converters: A/D 16x10b; D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 256-LBGA
Supplier Device Package: 256-LBGA (17x17)

封装: 256-LBGA

库存7,200

MK22DX256VLK5

NXP

IC MCU 32BIT 256KB FLASH 80LQFP

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 50MHz
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 56
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 20x16b, D/A 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 80-LQFP
Supplier Device Package: 80-LQFP (12x12)

封装: 80-LQFP

库存20,508

JN5161/001,518

NXP

IC RF TXRX+MCU 802.15.4 40-VFQFN

Type: TxRx + MCU
RF Family/Standard: 802.15.4
Protocol: ZigbeePRO?
Modulation: O-QPSK
Frequency: 2.4GHz
Data Rate (Max): 1Mbps
Power - Output: 2.5dBm
Sensitivity: -96dBm
Memory Size: 64kB Flash, 4kB EEPROM, 8kB RAM
Serial Interfaces: I2C, JTAG, SPI, UART
GPIO: 20
Voltage - Supply: 2 V ~ 3.6 V
Current - Receiving: 17mA
Current - Transmitting: 15.3mA
Operating Temperature: -40°C ~ 125°C
Package / Case: 40-VFQFN Exposed Pad

封装: 40-VFQFN Exposed Pad

库存2,898

MCZ33903DP3EK

NXP

SYSTEM BASIS CHIP 2X 3.3 V/400M

Applications: System Basis Chip
Interface: CAN, LIN
Voltage - Supply: 5.5 V ~ 28 V
Package / Case: -
Supplier Device Package: -
Mounting Type: -

封装: -

库存6,320

T2081NSE8MQB

NXP

QORIQ 64B POWER ARCH 8X 1.2GHZ

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

封装: -

库存6,320

SPC5744PK1AMLQ8R

NXP

2.5MB NVM 2 X E200Z4 CORES 180

Core Processor: e200z4
Core Size: 32-Bit Dual-Core
Speed: 180MHz
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 79
Program Memory Size: 2.5MB (2.5M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 384K x 8
Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
Data Converters: A/D 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

封装: 144-LQFP

库存7,632

SPC5602BK0VLL6

NXP

32BIT 256KF 100LD 64MHZ

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 64MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 79
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 24K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 28x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

封装: 100-LQFP

库存6,864

S9S12G64F0VLF

NXP

16-BIT MCU S12 CORE 64KB FLASH

Core Processor: 12V1
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 40
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

封装: 48-LQFP

库存7,184

MCIMX280DVM4CR

NXP

IC MPU I.MX28 454MHZ 289MAPBGA

Core Processor: ARM926EJ-S
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 454MHz
Co-Processors/DSP: Data; DCP
RAM Controllers: DDR2, LVDDR, LVDDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, Touchscreen
Ethernet: 10/100Mbps (1)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 1.8V, 3.3V
Operating Temperature: -20°C ~ 70°C (TA)
Security Features: Boot Security, Cryptography, Hardware ID
Package / Case: 289-LFBGA
Supplier Device Package: 289-MAPBGA (14x14)

封装: -

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BT234-600D-127

NXP

TRIAC 600V 4A TO220AB

Triac Type: Standard
Voltage - Off State: 600 V
Current - On State (It (RMS)) (Max): 4 A
Voltage - Gate Trigger (Vgt) (Max): 1 V
Current - Non Rep. Surge 50, 60Hz (Itsm): 35A @ 50Hz
Current - Gate Trigger (Igt) (Max): 10 mA
Current - Hold (Ih) (Max): 6 mA
Configuration: Single
Operating Temperature: 125°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3
Supplier Device Package: TO-220AB

封装: -

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FS32K146HRT0MMHT

NXP

IC MCU 32BIT 1MB FLASH 100MAPBGA

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit Single-Core
Speed: 80MHz
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 89
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 24x12b SAR; D/A1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Supplier Device Package: 100-MAPBGA (11x11)

封装: -

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BC847C-AU-215

NXP

SMALL SIGNAL BIPOLAR TRANSISTOR

Transistor Type: NPN
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V
Power - Max: 250 mW
Frequency - Transition: 100MHz
Operating Temperature: 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: SOT23-3 (TO-236)

封装: -

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XC511363CFUE8

NXP

NO DESCRIPTION

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封装: -

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LPC5526JBD100E

NXP

IC MCU 32BIT 256KB FLSH 100LQFP

Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit Single-Core
Speed: 150MHz
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O: 64
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 144K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 10x16b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Supplier Device Package: 100-HLQFP (14x14)

封装: -

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MPF5020CMMACESR2

NXP

POWER MANAGEMENT IC, PRE-PROG, 3

Applications: -
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封装: -

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