页 29 - NXP 产品 | 深圳黑森尔电子
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NXP 产品

记录 26,590
页  29/887
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PSMN035-100LS,115
NXP

MOSFET N-CH QFN3333

  • FET Type: N-Channel
  • Technology: MOSFET (Metal Oxide)
  • Drain to Source Voltage (Vdss): 100V
  • Current - Continuous Drain (Id) @ 25°C: 27A (Tc)
  • Drive Voltage (Max Rds On, Min Rds On): 10V
  • Vgs(th) (Max) @ Id: 4V @ 1mA
  • Gate Charge (Qg) (Max) @ Vgs: 23nC @ 10V
  • Input Capacitance (Ciss) (Max) @ Vds: 1350pF @ 50V
  • Vgs (Max): ±20V
  • FET Feature: -
  • Power Dissipation (Max): 65W (Tc)
  • Rds On (Max) @ Id, Vgs: 32 mOhm @ 10A, 10V
  • Operating Temperature: -55°C ~ 150°C (TJ)
  • Mounting Type: Surface Mount
  • Supplier Device Package: 8-DFN3333 (3.3x3.3)
  • Package / Case: 8-VDFN Exposed Pad
封装: 8-VDFN Exposed Pad
库存2,992
2N7002PM,315
NXP

MOSFET N-CH 60V 0.3A SOT-883

  • FET Type: N-Channel
  • Technology: MOSFET (Metal Oxide)
  • Drain to Source Voltage (Vdss): 60V
  • Current - Continuous Drain (Id) @ 25°C: 300mA (Ta)
  • Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
  • Vgs(th) (Max) @ Id: -
  • Gate Charge (Qg) (Max) @ Vgs: -
  • Input Capacitance (Ciss) (Max) @ Vds: -
  • Vgs (Max): ±20V
  • FET Feature: -
  • Power Dissipation (Max): 250mW (Ta)
  • Rds On (Max) @ Id, Vgs: -
  • Operating Temperature: -55°C ~ 150°C (TJ)
  • Mounting Type: Surface Mount
  • Supplier Device Package: DFN1006-3
  • Package / Case: SC-101, SOT-883
封装: SC-101, SOT-883
库存7,616
BFG310/XR,215
NXP

TRANS NPN 4.5V 18GHZ SOT143R

  • Transistor Type: NPN
  • Voltage - Collector Emitter Breakdown (Max): 6V
  • Frequency - Transition: 14GHz
  • Noise Figure (dB Typ @ f): 1dB @ 2GHz
  • Gain: 18dB
  • Power - Max: 60mW
  • DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 3V
  • Current - Collector (Ic) (Max): 10mA
  • Operating Temperature: 175°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: SOT-143R
  • Supplier Device Package: SOT-143R
封装: SOT-143R
库存7,760
LD6816CX4/22P,315
NXP

IC REG LINEAR 2.2V 150MA 4WLCSP

  • Output Configuration: Positive
  • Output Type: Fixed
  • Number of Regulators: 1
  • Voltage - Input (Max): 5.5V
  • Voltage - Output (Min/Fixed): 2.2V
  • Voltage - Output (Max): -
  • Voltage Dropout (Max): 0.075V @ 150mA
  • Current - Output: 150mA
  • Current - Quiescent (Iq): -
  • Current - Supply (Max): 100µA ~ 250µA
  • PSRR: 55dB (1kHz)
  • Control Features: Enable
  • Protection Features: Over Current, Over Temperature, Transient Voltage
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 4-XFBGA, WLCSP
  • Supplier Device Package: 4-WLCSP (0.76x0.76)
封装: 4-XFBGA, WLCSP
库存5,616
SE97TP/S900,547
NXP

IC TEMP SENSOR DIMM 3.3V 8-HWSON

  • Function: Temp Monitoring System (Sensor), DIMM DDR Memory
  • Sensor Type: Internal
  • Sensing Temperature: -40°C ~ 125°C
  • Accuracy: ±3°C
  • Topology: ADC (Sigma Delta), Comparator, Register Bank
  • Output Type: 2-Wire Serial, I2C/SMBUS
  • Output Alarm: Yes
  • Output Fan: Yes
  • Voltage - Supply: 3 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Surface Mount
  • Package / Case: 8-WFDFN Exposed Pad
  • Supplier Device Package: 8-HWSON (2x3)
封装: 8-WFDFN Exposed Pad
库存7,712
74HCT540N-Q100U
NXP

IC INVERTER 8-INPUT 20DIP

  • Logic Type: Buffer, Inverting
  • Number of Elements: 1
  • Number of Bits per Element: 8
  • Input Type: -
  • Output Type: Push-Pull
  • Current - Output High, Low: 6mA, 6mA
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Through Hole
  • Package / Case: 20-DIP (0.300", 7.62mm)
  • Supplier Device Package: 20-DIP
封装: 20-DIP (0.300", 7.62mm)
库存2,688
74ALVT162241DGG,11
NXP

IC BUFF DVR TRI-ST 16BIT 48TSSOP

  • Logic Type: Buffer, Non-Inverting
  • Number of Elements: 4
  • Number of Bits per Element: 4
  • Input Type: -
  • Output Type: Push-Pull
  • Current - Output High, Low: 12mA, 12mA
  • Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-TFSOP (0.240", 6.10mm Width)
  • Supplier Device Package: 48-TSSOP
封装: 48-TFSOP (0.240", 6.10mm Width)
库存2,928
74ABT544PW,118
NXP

IC TRANSCVR 3ST 8BIT INV 24TSSOP

  • Logic Type: Transceiver, Inverting
  • Number of Elements: 1
  • Number of Bits per Element: 8
  • Input Type: -
  • Output Type: Push-Pull
  • Current - Output High, Low: 32mA, 64mA
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 24-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 24-TSSOP
封装: 24-TSSOP (0.173", 4.40mm Width)
库存3,328
UJA1079ATW/5V0WD,1
NXP

IC SBC LIN 5.0V 32HTSSOP

  • Applications: Automotive
  • Interface: SPI Serial
  • Voltage - Supply: 4.5 V ~ 28 V
  • Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
  • Supplier Device Package: 32-HTSSOP
  • Mounting Type: Surface Mount
封装: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
库存5,904
hot MC145011P
NXP

IC SMOKE DETECT PHOTOELEC 16-DIP

  • Type: Smoke Detector
  • Input Type: Photoelectric
  • Output Type: Voltage
  • Interface: -
  • Current - Supply: 12µA
  • Operating Temperature: -10°C ~ 60°C
  • Mounting Type: Through Hole
  • Package / Case: 16-DIP (0.300", 7.62mm)
  • Supplier Device Package: 16-PDIP
封装: 16-DIP (0.300", 7.62mm)
库存4,640
PCF8574TS/3,112
NXP

IC I/O EXPANDER I2C 8B 20SSOP

  • Number of I/O: 8
  • Interface: I2C
  • Interrupt Output: Yes
  • Features: POR
  • Output Type: Push-Pull
  • Current - Output Source/Sink: 300µA, 25mA
  • Clock Frequency: 100kHz
  • Voltage - Supply: 2.5 V ~ 6 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 20-LSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 20-SSOP
封装: 20-LSSOP (0.173", 4.40mm Width)
库存28,464
NX3L1T5157GM,115
NXP

IC ANALOG SWITCH XSON6

  • Switch Circuit: SPDT
  • Multiplexer/Demultiplexer Circuit: 2:1
  • Number of Circuits: 1
  • On-State Resistance (Max): 750 mOhm
  • Channel-to-Channel Matching (ΔRon): 20 mOhm
  • Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V
  • Voltage - Supply, Dual (V±): -
  • Switch Time (Ton, Toff) (Max): 40ns, 20ns
  • -3db Bandwidth: 60MHz
  • Charge Injection: 15pC
  • Channel Capacitance (CS(off), CD(off)): 35pF
  • Current - Leakage (IS(off)) (Max): 10nA
  • Crosstalk: -
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Package / Case: 6-XFDFN
  • Supplier Device Package: 6-XSON, SOT886 (1.45x1)
封装: 6-XFDFN
库存7,632
MPC8544EAVTARJ
NXP

IC MPU MPC85XX 1.067GHZ 783BGA

  • Core Processor: PowerPC e500
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.067GHz
  • Co-Processors/DSP: Signal Processing; SPE, Security; SEC
  • RAM Controllers: DDR, DDR2, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: Cryptography, Random Number Generator
  • Package / Case: 783-BBGA, FCBGA
  • Supplier Device Package: 783-FCPBGA (29x29)
封装: 783-BBGA, FCBGA
库存6,464
MPC8349VVAJD
NXP

IC MPU MPC83XX 533MHZ 672TBGA

  • Core Processor: PowerPC e300
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 533MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: -
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 672-LBGA
  • Supplier Device Package: 672-TBGA (35x35)
封装: 672-LBGA
库存3,056
hot MCIMX31LCVMN4C
NXP

IC MPU I.MX31 400MHZ 473MAPBGA

  • Core Processor: ARM1136JF-S
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 400MHz
  • Co-Processors/DSP: Multimedia; GPU, IPU, MPEG-4, VFP
  • RAM Controllers: DDR
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: Keyboard, Keypad, LCD
  • Ethernet: -
  • SATA: -
  • USB: USB 2.0 (3)
  • Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Security Features: Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory
  • Package / Case: 473-LFBGA
  • Supplier Device Package: -
封装: 473-LFBGA
库存4,192
MCS12GC64MFUE
NXP

IC MCU 16BIT 64KB FLASH 80QFP

  • Core Processor: HCS12
  • Core Size: 16-Bit
  • Speed: 25MHz
  • Connectivity: EBI/EMI, SCI, SPI
  • Peripherals: POR, PWM, WDT
  • Number of I/O: 60
  • Program Memory Size: 64KB (64K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 4K x 8
  • Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
  • Data Converters: A/D 8x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 80-QFP
  • Supplier Device Package: 80-QFP (14x14)
封装: 80-QFP
库存6,656
hot MCF5474VR200
NXP

IC MCU 32BIT ROMLESS 388PBGA

  • Core Processor: Coldfire V4E
  • Core Size: 32-Bit
  • Speed: 200MHz
  • Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
  • Peripherals: DMA, PWM, WDT
  • Number of I/O: 99
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 32K x 8
  • Voltage - Supply (Vcc/Vdd): 1.43 V ~ 1.58 V
  • Data Converters: -
  • Oscillator Type: External
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: -
  • Package / Case: 388-BBGA
  • Supplier Device Package: 388-PBGA (27x27)
封装: 388-BBGA
库存3,536
SPC5746CHK0AMMH6
NXP

IC MCU 32BIT 3MB FLASH 256MAPBGA

  • Core Processor: e200z2, e200z4
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz/160MHz
  • Connectivity: CAN, Ethernet, I2C, LIN, SAI, SPI, USB, USB OTG
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: -
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 80x10b, 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-MAPPBGA (17x17)
封装: 256-LBGA
库存2,896
SPC5602BK0MLL6
NXP

IC MCU 32BIT 256KB FLASH 100LQFP

  • Core Processor: e200z0h
  • Core Size: 32-Bit
  • Speed: 64MHz
  • Connectivity: CAN, I2C, LIN, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 79
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 16
  • RAM Size: 24K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 28x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-LQFP (14x14)
封装: 100-LQFP
库存6,528
hot MSC8101VT1375F
NXP

IC DSP 16BIT 250MHZ 332FCBGA

  • Type: SC140 Core
  • Interface: Communications Processor Module (CPM)
  • Clock Rate: 275MHz
  • Non-Volatile Memory: External
  • On-Chip RAM: 512kB
  • Voltage - I/O: 3.30V
  • Voltage - Core: 1.60V
  • Operating Temperature: -40°C ~ 105°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 332-BFBGA, FCPBGA
  • Supplier Device Package: 332-FCBGA (17x17)
封装: 332-BFBGA, FCPBGA
库存5,072
NT3H1201W0FHKH
NXP

IC SMART TAG

  • Type: RFID Transponder
  • Frequency: 13.56MHz
  • Standards: ISO 14443
  • Interface: I2C
  • Voltage - Supply: 1.7 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 95°C
  • Package / Case: 8-XFQFN Exposed Pad
  • Supplier Device Package: 8-XQFN (1.6x1.6)
封装: 8-XFQFN Exposed Pad
库存29,964
A7102CHUK/T0BC2VAZ
NXP

SECURITY IC EXT TEMP WLCSP

  • Applications: Authentication
  • Core Processor: MX51
  • Program Memory Type: -
  • Controller Series: -
  • RAM Size: -
  • Interface: I²C
  • Number of I/O: -
  • Voltage - Supply: 2.5 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 90°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 12-UFBGA, WLCSP
  • Supplier Device Package: 12-WLCSP (2.06x2.02)
封装: 12-UFBGA, WLCSP
库存3,728
MIMXRT1064CVL5A
NXP

I.MXRT1064 MPU 196MAPBGA

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: 196-LFBGA
  • Supplier Device Package: 196-MAPBGA (10x10)
封装: 196-LFBGA
库存2,224
SPC5646CK0MMJ1
NXP

3M FLASH256K RAM120MHZ

  • Core Processor: e200z4d, e200z0h
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz/120MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 199
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 256K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 33x10b, 10x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-MAPBGA
封装: 256-LBGA
库存4,096
S32G398ASCK1VUCT
NXP

8XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1

  • Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
  • Number of Cores/Bus Width: 3 Core, 64-Bit/8 Core, 32-Bit
  • Speed: 400MHz, 1.3GHz
  • Co-Processors/DSP: Multimedia; NEON
  • RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 2.5Gbps (3)
  • SATA: -
  • USB: USB 2.0 OTG (1)
  • Voltage - I/O: 1.8V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
  • Package / Case: 525-FBGA, FCBGA
  • Supplier Device Package: 525-FCPBGA (19x19)
封装: -
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MC33FS4505NAER2
NXP

SYSTEM BASIS CHIP, LINEAR 0.5A V

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 1V ~ 5V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-HLQFP (7x7)
封装: -
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MVR5510AMDA0ES
NXP

IC PMIC VR5510 ASIL-D

  • Applications: -
  • Current - Supply: 15mA
  • Voltage - Supply: 2.7V ~ 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
封装: -
库存2,340
S9S12G64J0MLHR
NXP

S12 CORE 64K FLASH

  • Core Processor: S12
  • Core Size: 16-Bit
  • Speed: 25MHz
  • Connectivity: CANbus, IrDA, LINbus, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 54
  • Program Memory Size: 64KB (64K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 2K x 8
  • RAM Size: 4K x 8
  • Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
  • Data Converters: A/D 12x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
封装: -
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TEA2209T-1J
NXP

IC ACTIVE BRIDGE CTRL SO16

  • Applications: Desktop, Notebook PCs
  • Current - Supply: 2mA
  • Voltage - Supply: 440V
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 16-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 16-SO
封装: -
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K32L2B21VFT0A
NXP

IC MCU 32BIT 128KB FLASH 48QFN

  • Core Processor: ARM® Cortex®-M0+
  • Core Size: 32-Bit Single-Core
  • Speed: 48MHz
  • Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
  • Peripherals: DMA, LCD, PWM, WDT
  • Number of I/O: -
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 32K x 8
  • Voltage - Supply (Vcc/Vdd): 1.2V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: -
  • Mounting Type: Surface Mount
  • Package / Case: 48-UFQFN Exposed Pad
  • Supplier Device Package: 48-QFN (7x7)
封装: -
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