页 184 - NXP 产品 | 深圳黑森尔电子

零件编号	制造商	描述	封装	库存
BUK9515-60E,127	NXP	MOSFET N-CH 60V 54A TO220AB FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 60V Current - Continuous Drain (Id) @ 25°C: 54A (Tc) Drive Voltage (Max Rds On, Min Rds On): 5V, 10V Vgs(th) (Max) @ Id: 2.1V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 20.5nC @ 5V Input Capacitance (Ciss) (Max) @ Vds: 2651pF @ 25V Vgs (Max): ±10V FET Feature: - Power Dissipation (Max): 96W (Tc) Rds On (Max) @ Id, Vgs: 13 mOhm @ 15A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Through Hole Supplier Device Package: TO-220AB Package / Case: TO-220-3	封装: TO-220-3	库存6,512
BUK7506-75B,127	NXP	MOSFET N-CH 75V 75A TO220AB FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 75V Current - Continuous Drain (Id) @ 25°C: 75A (Tc) Drive Voltage (Max Rds On, Min Rds On): 10V Vgs(th) (Max) @ Id: 4V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 91nC @ 10V Input Capacitance (Ciss) (Max) @ Vds: 7446pF @ 25V Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 300W (Tc) Rds On (Max) @ Id, Vgs: 5.6 mOhm @ 25A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Through Hole Supplier Device Package: TO-220AB Package / Case: TO-220-3	封装: TO-220-3	库存3,408
MRF7S19210HR5	NXP	FET RF 65V 1.99GHZ NI780 Transistor Type: LDMOS Frequency: 1.99GHz Gain: 20dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 1.4A Power - Output: 63W Voltage - Rated: 65V Package / Case: NI-780 Supplier Device Package: NI-780	封装: NI-780	库存3,808
BAP50-05,215	NXP	DIODE PIN GP 50V 50MA SOT-23 Diode Type: PIN - 1 Pair Common Cathode Voltage - Peak Reverse (Max): 50V Current - Max: 50mA Capacitance @ Vr, F: 0.5pF @ 5V, 1MHz Resistance @ If, F: 5 Ohm @ 10mA, 100MHz Power Dissipation (Max): 250mW Operating Temperature: -65°C ~ 150°C (TJ) Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: TO-236AB (SOT23)	封装: TO-236-3, SC-59, SOT-23-3	库存29,328
PCF1252-3T/F4,112	NXP	IC VOLT DETECT W/RESET 8SO Type: Simple Reset/Power-On Reset Number of Voltages Monitored: 1 Output: Push-Pull, Totem Pole Reset: Active High Reset Timeout: 400 µs Minimum Voltage - Threshold: 4.05V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	封装: 8-SOIC (0.154", 3.90mm Width)	库存5,520
NTS0101GF,132	NXP	TXRX TRANSLATING OPEN DRN 6-XSON Translator Type: Voltage Level Channel Type: Bidirectional Number of Circuits: 1 Channels per Circuit: 1 Voltage - VCCA: 1.65V ~ 3.6V Voltage - VCCB: 2.3V ~ 5.5V Input Signal: - Output Signal: - Output Type: Open Drain, Tri-State Data Rate: 50Mbps Operating Temperature: -40°C ~ 125°C (TA) Features: Auto-Direction Sensing Mounting Type: Surface Mount Package / Case: 6-XFDFN Supplier Device Package: 6-XSON, SOT891 (1x1)	封装: 6-XFDFN	库存48,024
NVT2006BS,118	NXP	IC TRANSLATOR BIDIR 16HVQFN Translator Type: Voltage Level Channel Type: Bidirectional Number of Circuits: 1 Channels per Circuit: 6 Voltage - VCCA: 1V ~ 3.6V Voltage - VCCB: 1.8V ~ 5.5V Input Signal: - Output Signal: - Output Type: Open Drain, Push-Pull Data Rate: - Operating Temperature: -40°C ~ 85°C (TA) Features: Auto-Direction Sensing Mounting Type: Surface Mount Package / Case: 16-VFQFN Exposed Pad Supplier Device Package: 16-HXQFN (3x3)	封装: 16-VFQFN Exposed Pad	库存43,008
SC16C554DIB64,151	NXP	IC UART QUAD 64LQFP Features: - Number of Channels: 4, QUART FIFO's: 16 Byte Protocol: - Data Rate (Max): 5Mbps Voltage - Supply: 2.5V, 3.3V, 5V With Auto Flow Control: Yes With IrDA Encoder/Decoder: Yes With False Start Bit Detection: Yes With Modem Control: Yes Mounting Type: Surface Mount Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	封装: 64-LQFP	库存3,232
M86297G12	NXP	IC C2K 900MHZ 16CH VOIP 625BGA Function: - Interface: - Number of Circuits: - Voltage - Supply: - Current - Supply: - Power (Watts): - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封装: -	库存4,992
UJA1075ATW/3V3,112	NXP	IC SBC CAN/LIN 3.3V HS 32HTSSOP Applications: Automotive Interface: CAN, LIN Voltage - Supply: 4.5 V ~ 28 V Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Supplier Device Package: 32-HTSSOP Mounting Type: Surface Mount	封装: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad	库存3,696
TJA1041T/N,112	NXP	IC TXRX CAN 14BIT 27V 14-SOIC Type: Transceiver Protocol: CAN Number of Drivers/Receivers: 1/1 Duplex: Half Receiver Hysteresis: 70mV Data Rate: - Voltage - Supply: 4.75 V ~ 5.25 V Operating Temperature: -40°C ~ 150°C Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Supplier Device Package: 14-SO	封装: 14-SOIC (0.154", 3.90mm Width)	库存2,688
TJA1145T/FDJ	NXP	IC TRANSCEIVER CAN HS 14SOIC Type: Transceiver Protocol: CAN Number of Drivers/Receivers: 1/1 Duplex: Full Receiver Hysteresis: 200mV Data Rate: - Voltage - Supply: 3.3 V ~ 5 V Operating Temperature: -40°C ~ 150°C Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Supplier Device Package: 14-SO	封装: 14-SOIC (0.154", 3.90mm Width)	库存6,480
MC7448HX1000LD	NXP	IC MPU MPC74XX 1.0GHZ 360FCCBGA Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; SIMD RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 360-BCBGA, FCCBGA Supplier Device Package: 360-FCCBGA (25x25)	封装: 360-BCBGA, FCCBGA	库存5,808
MPC8540PX667LC	NXP	IC MPU MPC85XX 667MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: - RAM Controllers: DDR, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (1), 10/100/1000 Mbps (2) SATA: - USB: - Voltage - I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 784-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	封装: 784-BBGA, FCBGA	库存6,420
MC68EN360CRC25L	NXP	IC MPU M683XX 25MHZ 241PGA Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1) SATA: - USB: - Voltage - I/O: 5.0V Operating Temperature: -40°C ~ 85°C (TA) Security Features: - Package / Case: 241-BEPGA Supplier Device Package: 241-PGA (47.24x47.24)	封装: 241-BEPGA	库存3,824
XPC8240LVV200E	NXP	IC MPU MPC82XX 200MHZ 352TBGA Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 200MHz Co-Processors/DSP: - RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 352-LBGA Supplier Device Package: 352-TBGA (35x35)	封装: 352-LBGA	库存5,664
MC908AP64ACBE	NXP	IC MCU 8BIT 64KB FLASH 42PSDIP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: I2C, IRSCI, SCI, SPI Peripherals: LED, LVD, POR, PWM Number of I/O: 30 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 42-SDIP (0.600", 15.24mm) Supplier Device Package: 42-PSDIP	封装: 42-SDIP (0.600", 15.24mm)	库存2,608
SPC5604BK0VLQ6	NXP	IC MCU 32BIT 512KB FLASH 144LQFP Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CAN, I2C, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 123 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 16 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 36x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	封装: 144-LQFP	库存4,800
MC908AP64CFAER	NXP	IC MCU 8BIT 64KB FLASH 48LQFP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: I2C, IRSCI, SCI, SPI Peripherals: LED, LVD, POR, PWM Number of I/O: 32 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	封装: 48-LQFP	库存5,072
MC56F8365VFGE	NXP	IC MCU 16BIT 512KB FLASH 128LQFP Core Processor: 56800E Core Size: 16-Bit Speed: 60MHz Connectivity: CAN, EBI/EMI, SCI, SPI Peripherals: POR, PWM, Temp Sensor, WDT Number of I/O: 49 Program Memory Size: 512KB (256K x 16) Program Memory Type: FLASH EEPROM Size: - RAM Size: 18K x 16 Voltage - Supply (Vcc/Vdd): 2.25 V ~ 3.6 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 128-LQFP Supplier Device Package: 128-LQFP (14x20)	封装: 128-LQFP	库存5,824
MPVZ7025DP	NXP	IC PRESSURE SENSOR 8-SOP Pressure Type: Differential Operating Pressure: ±3.63 PSI (±25 kPa) Output Type: Analog Voltage Output: 0.2 V ~ 4.7 V Accuracy: ±5% Voltage - Supply: 4.75 V ~ 5.25 V Port Size: Male - 0.13" (3.3mm) Tube, Dual Port Style: Barbed Features: Temperature Compensated Termination Style: PCB Maximum Pressure: ±29.01 PSI (±200 kPa) Operating Temperature: -40°C ~ 125°C Package / Case: 8-SMD Module Supplier Device Package: -	封装: 8-SMD Module	库存4,158
MC32PF3001A3EPR2	NXP	POWER MANAGEMENT IC I.MX7 PRE- Applications: Processor Current - Supply: - Voltage - Supply: 2.8 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN (7x7)	封装: 48-VFQFN Exposed Pad	库存7,504
MC33FS6520CAE	NXP	SYSTEM BASIS CHIP DCDC 2.2A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: -1.0 V ~ 40 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP (7x7)	封装: 48-LQFP Exposed Pad	库存7,952
S9S12DG12W2CPVER	NXP	16-BIT MCU S12 CORE 128KB FLAS Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, I²C, SCI, SPI Peripherals: PWM, WDT Number of I/O: 91 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	封装: 112-LQFP	库存5,856
S912XD128F2VAAR	NXP	16-BIT MCU S12X CORE 128KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 80MHz Connectivity: CANbus, I²C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 59 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 12K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V Data Converters: A/D 8x10b, 16x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	封装: 80-QFP	库存5,872
S9S12G128AVLL	NXP	16BIT 128K FLASH Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 86 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	封装: 100-LQFP	库存5,168
NTS0304EPWJ	NXP	4-BIT VOLTAGE TRANSLATOR 14TSSOP Logic Type: Translating Transceiver Supply Voltage: 0.95V ~ 3.6V, 1.65V ~ 5.5V Number of Bits: 4 Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 14-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 14-TSSOP	封装: 14-TSSOP (0.173", 4.40mm Width)	库存6,816
ASL5108SHV-0Y	NXP	IC LED DRVR CTRLR PWM 48HLQFP Type: DC DC Controller Topology: Switched Capacitor (Charge Pump) Internal Switch(s): Yes Number of Outputs: 12 Voltage - Supply (Min): 4.5V Voltage - Supply (Max): 5.5V Voltage - Output: - Current - Output / Channel: 800mA Frequency: 200MHz Dimming: PWM Applications: - Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	封装: -	Request a Quote
MC33FS6600M2KS	NXP	SAFETY POWER MANAGEMENT IC, QFN5 Applications: - Current - Supply: - Voltage - Supply: 2.7V ~ 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	封装: -	Request a Quote
MIMX9321CVXXMAB	NXP	IC Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	封装: -	Request a Quote

BUK9515-60E,127

NXP

MOSFET N-CH 60V 54A TO220AB

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 60V
Current - Continuous Drain (Id) @ 25°C: 54A (Tc)
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Vgs(th) (Max) @ Id: 2.1V @ 1mA
Gate Charge (Qg) (Max) @ Vgs: 20.5nC @ 5V
Input Capacitance (Ciss) (Max) @ Vds: 2651pF @ 25V
Vgs (Max): ±10V
FET Feature: -
Power Dissipation (Max): 96W (Tc)
Rds On (Max) @ Id, Vgs: 13 mOhm @ 15A, 10V
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Supplier Device Package: TO-220AB
Package / Case: TO-220-3

封装: TO-220-3

库存6,512

BUK7506-75B,127

NXP

MOSFET N-CH 75V 75A TO220AB

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 75V
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs(th) (Max) @ Id: 4V @ 1mA
Gate Charge (Qg) (Max) @ Vgs: 91nC @ 10V
Input Capacitance (Ciss) (Max) @ Vds: 7446pF @ 25V
Vgs (Max): ±20V
FET Feature: -
Power Dissipation (Max): 300W (Tc)
Rds On (Max) @ Id, Vgs: 5.6 mOhm @ 25A, 10V
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Supplier Device Package: TO-220AB
Package / Case: TO-220-3

封装: TO-220-3

库存3,408

MRF7S19210HR5

NXP

FET RF 65V 1.99GHZ NI780

Transistor Type: LDMOS
Frequency: 1.99GHz
Gain: 20dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 1.4A
Power - Output: 63W
Voltage - Rated: 65V
Package / Case: NI-780
Supplier Device Package: NI-780

封装: NI-780

库存3,808

BAP50-05,215

NXP

DIODE PIN GP 50V 50MA SOT-23

Diode Type: PIN - 1 Pair Common Cathode
Voltage - Peak Reverse (Max): 50V
Current - Max: 50mA
Capacitance @ Vr, F: 0.5pF @ 5V, 1MHz
Resistance @ If, F: 5 Ohm @ 10mA, 100MHz
Power Dissipation (Max): 250mW
Operating Temperature: -65°C ~ 150°C (TJ)
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: TO-236AB (SOT23)

封装: TO-236-3, SC-59, SOT-23-3

库存29,328

PCF1252-3T/F4,112

NXP

IC VOLT DETECT W/RESET 8SO

Type: Simple Reset/Power-On Reset
Number of Voltages Monitored: 1
Output: Push-Pull, Totem Pole
Reset: Active High
Reset Timeout: 400 µs Minimum
Voltage - Threshold: 4.05V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO

封装: 8-SOIC (0.154", 3.90mm Width)

库存5,520

NTS0101GF,132

NXP

TXRX TRANSLATING OPEN DRN 6-XSON

Translator Type: Voltage Level
Channel Type: Bidirectional
Number of Circuits: 1
Channels per Circuit: 1
Voltage - VCCA: 1.65V ~ 3.6V
Voltage - VCCB: 2.3V ~ 5.5V
Input Signal: -
Output Signal: -
Output Type: Open Drain, Tri-State
Data Rate: 50Mbps
Operating Temperature: -40°C ~ 125°C (TA)
Features: Auto-Direction Sensing
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Supplier Device Package: 6-XSON, SOT891 (1x1)

封装: 6-XFDFN

库存48,024

NVT2006BS,118

NXP

IC TRANSLATOR BIDIR 16HVQFN

Translator Type: Voltage Level
Channel Type: Bidirectional
Number of Circuits: 1
Channels per Circuit: 6
Voltage - VCCA: 1V ~ 3.6V
Voltage - VCCB: 1.8V ~ 5.5V
Input Signal: -
Output Signal: -
Output Type: Open Drain, Push-Pull
Data Rate: -
Operating Temperature: -40°C ~ 85°C (TA)
Features: Auto-Direction Sensing
Mounting Type: Surface Mount
Package / Case: 16-VFQFN Exposed Pad
Supplier Device Package: 16-HXQFN (3x3)

封装: 16-VFQFN Exposed Pad

库存43,008

SC16C554DIB64,151

NXP

IC UART QUAD 64LQFP

Features: -
Number of Channels: 4, QUART
FIFO's: 16 Byte
Protocol: -
Data Rate (Max): 5Mbps
Voltage - Supply: 2.5V, 3.3V, 5V
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

封装: 64-LQFP

库存3,232

M86297G12

NXP

IC C2K 900MHZ 16CH VOIP 625BGA

Function: -
Interface: -
Number of Circuits: -
Voltage - Supply: -
Current - Supply: -
Power (Watts): -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封装: -

库存4,992

UJA1075ATW/3V3,112

NXP

IC SBC CAN/LIN 3.3V HS 32HTSSOP

Applications: Automotive
Interface: CAN, LIN
Voltage - Supply: 4.5 V ~ 28 V
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Supplier Device Package: 32-HTSSOP
Mounting Type: Surface Mount

封装: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad

库存3,696

TJA1041T/N,112

NXP

IC TXRX CAN 14BIT 27V 14-SOIC

Type: Transceiver
Protocol: CAN
Number of Drivers/Receivers: 1/1
Duplex: Half
Receiver Hysteresis: 70mV
Data Rate: -
Voltage - Supply: 4.75 V ~ 5.25 V
Operating Temperature: -40°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 14-SO

封装: 14-SOIC (0.154", 3.90mm Width)

库存2,688

TJA1145T/FDJ

NXP

IC TRANSCEIVER CAN HS 14SOIC

Type: Transceiver
Protocol: CAN
Number of Drivers/Receivers: 1/1
Duplex: Full
Receiver Hysteresis: 200mV
Data Rate: -
Voltage - Supply: 3.3 V ~ 5 V
Operating Temperature: -40°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 14-SO

封装: 14-SOIC (0.154", 3.90mm Width)

库存6,480

MC7448HX1000LD

NXP

IC MPU MPC74XX 1.0GHZ 360FCCBGA

Core Processor: PowerPC G4
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: Multimedia; SIMD
RAM Controllers: -
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 1.5V, 1.8V, 2.5V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 360-BCBGA, FCCBGA
Supplier Device Package: 360-FCCBGA (25x25)

封装: 360-BCBGA, FCCBGA

库存5,808

MPC8540PX667LC

NXP

IC MPU MPC85XX 667MHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 667MHz
Co-Processors/DSP: -
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (1), 10/100/1000 Mbps (2)
SATA: -
USB: -
Voltage - I/O: 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 784-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

封装: 784-BBGA, FCBGA

库存6,420

MC68EN360CRC25L

NXP

IC MPU M683XX 25MHZ 241PGA

Core Processor: CPU32+
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 25MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 5.0V
Operating Temperature: -40°C ~ 85°C (TA)
Security Features: -
Package / Case: 241-BEPGA
Supplier Device Package: 241-PGA (47.24x47.24)

封装: 241-BEPGA

库存3,824

XPC8240LVV200E

NXP

IC MPU MPC82XX 200MHZ 352TBGA

Core Processor: PowerPC 603e
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 200MHz
Co-Processors/DSP: -
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 352-LBGA
Supplier Device Package: 352-TBGA (35x35)

封装: 352-LBGA

库存5,664

MC908AP64ACBE

NXP

IC MCU 8BIT 64KB FLASH 42PSDIP

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Number of I/O: 30
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 42-SDIP (0.600", 15.24mm)
Supplier Device Package: 42-PSDIP

封装: 42-SDIP (0.600", 15.24mm)

库存2,608

SPC5604BK0VLQ6

NXP

IC MCU 32BIT 512KB FLASH 144LQFP

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 64MHz
Connectivity: CAN, I2C, LIN, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 123
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 16
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 36x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

封装: 144-LQFP

库存4,800

MC908AP64CFAER

NXP

IC MCU 8BIT 64KB FLASH 48LQFP

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Number of I/O: 32
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

封装: 48-LQFP

库存5,072

MC56F8365VFGE

NXP

IC MCU 16BIT 512KB FLASH 128LQFP

Core Processor: 56800E
Core Size: 16-Bit
Speed: 60MHz
Connectivity: CAN, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, Temp Sensor, WDT
Number of I/O: 49
Program Memory Size: 512KB (256K x 16)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 18K x 16
Voltage - Supply (Vcc/Vdd): 2.25 V ~ 3.6 V
Data Converters: A/D 16x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 128-LQFP
Supplier Device Package: 128-LQFP (14x20)

封装: 128-LQFP

库存5,824

MPVZ7025DP

NXP

IC PRESSURE SENSOR 8-SOP

Pressure Type: Differential
Operating Pressure: ±3.63 PSI (±25 kPa)
Output Type: Analog Voltage
Output: 0.2 V ~ 4.7 V
Accuracy: ±5%
Voltage - Supply: 4.75 V ~ 5.25 V
Port Size: Male - 0.13" (3.3mm) Tube, Dual
Port Style: Barbed
Features: Temperature Compensated
Termination Style: PCB
Maximum Pressure: ±29.01 PSI (±200 kPa)
Operating Temperature: -40°C ~ 125°C
Package / Case: 8-SMD Module
Supplier Device Package: -

封装: 8-SMD Module

库存4,158

MC32PF3001A3EPR2

NXP

POWER MANAGEMENT IC I.MX7 PRE-

Applications: Processor
Current - Supply: -
Voltage - Supply: 2.8 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-QFN (7x7)

封装: 48-VFQFN Exposed Pad

库存7,504

MC33FS6520CAE

NXP

SYSTEM BASIS CHIP DCDC 2.2A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: -1.0 V ~ 40 V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP (7x7)

封装: 48-LQFP Exposed Pad

库存7,952

S9S12DG12W2CPVER

NXP

16-BIT MCU S12 CORE 128KB FLAS

Core Processor: HCS12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: PWM, WDT
Number of I/O: 91
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
Data Converters: A/D 16x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 112-LQFP
Supplier Device Package: 112-LQFP (20x20)

封装: 112-LQFP

库存5,856

S912XD128F2VAAR

NXP

16-BIT MCU S12X CORE 128KB FLA

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 80MHz
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 59
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 12K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
Data Converters: A/D 8x10b, 16x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 80-QFP
Supplier Device Package: 80-QFP (14x14)

封装: 80-QFP

库存5,872

S9S12G128AVLL

NXP

16BIT 128K FLASH

Core Processor: 12V1
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 86
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

封装: 100-LQFP

库存5,168

NTS0304EPWJ

NXP

4-BIT VOLTAGE TRANSLATOR 14TSSOP

Logic Type: Translating Transceiver
Supply Voltage: 0.95V ~ 3.6V, 1.65V ~ 5.5V
Number of Bits: 4
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 14-TSSOP

封装: 14-TSSOP (0.173", 4.40mm Width)

库存6,816

ASL5108SHV-0Y

NXP

IC LED DRVR CTRLR PWM 48HLQFP

Type: DC DC Controller
Topology: Switched Capacitor (Charge Pump)
Internal Switch(s): Yes
Number of Outputs: 12
Voltage - Supply (Min): 4.5V
Voltage - Supply (Max): 5.5V
Voltage - Output: -
Current - Output / Channel: 800mA
Frequency: 200MHz
Dimming: PWM
Applications: -
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

封装: -

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MC33FS6600M2KS

NXP

SAFETY POWER MANAGEMENT IC, QFN5

Applications: -
Current - Supply: -
Voltage - Supply: 2.7V ~ 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

封装: -

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MIMX9321CVXXMAB

NXP

IC

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

封装: -

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