Microchip Technology 产品

DSC8121CM5T

Microchip Technology

OSC PGM 10MHZ - 170MHZ SMD

• Type: MEMS (Silicon)
• Programmable Type: Blank (User Must Program)
• Available Frequency Range: 10MHz ~ 170MHz
• Function: Enable/Disable
• Output: CMOS
• Voltage - Supply: 2.25 V ~ 3.6 V
• Frequency Stability: ±10ppm
• Frequency Stability (Total): -
• Operating Temperature: -55°C ~ 125°C
• Spread Spectrum Bandwidth: -
• Current - Supply (Max): 35mA
• Ratings: -
• Mounting Type: Surface Mount
• Package / Case: 6-SMD, No Lead
• Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
• Height: 0.035" (0.90mm)

封装: 6-SMD, No Lead

DSC8002DI2T

Microchip Technology

OSC MEMS BLANK CMOS

• Type: MEMS (Silicon)
• Programmable Type: Blank (User Must Program)
• Available Frequency Range: 1MHz ~ 150MHz
• Function: Standby
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±25ppm
• Frequency Stability (Total): -
• Operating Temperature: -40°C ~ 85°C
• Spread Spectrum Bandwidth: -
• Current - Supply (Max): 10mA
• Ratings: -
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
• Height: 0.035" (0.90mm)

封装: 4-SMD, No Lead

DSC1018DI2-024.0000T

Microchip Technology

OSC MEMS 24.000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 24MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8V
• Frequency Stability: ±25ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 3mA
• Ratings: -
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

封装: 4-SMD, No Lead

DSC1001BI2-049.0908T

Microchip Technology

OSC MEMS 49.0908MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 49.0908MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±25ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 7.2mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
• Height - Seated (Max): 0.035" (0.90mm)

封装: 4-SMD, No Lead

MIC2214-GLYML-TR

Microchip Technology

IC REG LINEAR 1.8V/2.7V 10MLF

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 2
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 1.8V, 2.7V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.25V @ 150mA, 0.42V @ 300mA
• Current - Output: 150mA, 300mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 80µA
• PSRR: 60dB ~ 40dB (1KHz ~ 20kHz)
• Control Features: Enable, Power On Reset
• Protection Features: Over Current, Over Temperature
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 10-VFDFN Exposed Pad, 10-MLF?
• Supplier Device Package: 10-MLF? (3x3)

封装: 10-VFDFN Exposed Pad, 10-MLF?

MCP1755S-5002E/MC

Microchip Technology

IC REG LINEAR 5V 300MA 8DFN

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 1
• Voltage - Input (Max): 16V
• Voltage - Output (Min/Fixed): 5V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.5V @ 300mA
• Current - Output: 300mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 100µA ~ 400µA
• PSRR: 80dB (1kHz)
• Control Features: -
• Protection Features: Over Current, Over Temperature, Short Circuit
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-VFDFN Exposed Pad
• Supplier Device Package: 8-DFN (2x3)

封装: 8-VFDFN Exposed Pad

TC4426COA

Microchip Technology

IC MOSFET DVR 1.5A DUAL HS 8SOIC

• Driven Configuration: Low-Side
• Channel Type: Independent
• Number of Drivers: 2
• Gate Type: N-Channel, P-Channel MOSFET
• Voltage - Supply: 4.5 V ~ 18 V
• Logic Voltage - VIL, VIH: 0.8V, 2.4V
• Current - Peak Output (Source, Sink): 1.5A, 1.5A
• Input Type: Inverting
• High Side Voltage - Max (Bootstrap): -
• Rise / Fall Time (Typ): 19ns, 19ns
• Operating Temperature: 0°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

封装: 8-SOIC (0.154", 3.90mm Width)

SST39SF040-70-4C-WHE-T

Microchip Technology

IC FLASH 4MBIT 70NS 32TSOP

• Memory Type: Non-Volatile
• Memory Format: FLASH
• Technology: FLASH
• Memory Size: 4Mb (512K x 8)
• Memory Interface: Parallel
• Clock Frequency: -
• Write Cycle Time - Word, Page: 20µs
• Access Time: 70ns
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 32-TFSOP (0.488", 12.40mm Width)
• Supplier Device Package: 32-TSOP

封装: 32-TFSOP (0.488", 12.40mm Width)

24C01CT-I/SN

Microchip Technology

IC EEPROM 1KBIT 400KHZ 8SOIC

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 1Kb (128 x 8)
• Memory Interface: I2C
• Clock Frequency: 400kHz
• Write Cycle Time - Word, Page: 1ms
• Access Time: 900ns
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

封装: 8-SOIC (0.154", 3.90mm Width)

MCP6404T-H/SL

Microchip Technology

IC OPAMP GP 1MHZ RRO 14SOIC

• Amplifier Type: General Purpose
• Number of Circuits: 4
• Output Type: Rail-to-Rail
• Slew Rate: 0.5 V/µs
• Gain Bandwidth Product: 1MHz
• -3db Bandwidth: -
• Current - Input Bias: 1pA
• Voltage - Input Offset: 800µV
• Current - Supply: 45µA
• Current - Output / Channel: 15mA
• Voltage - Supply, Single/Dual (±): 1.8 V ~ 6 V
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SOIC

封装: 14-SOIC (0.154", 3.90mm Width)

MCP2050-500E/MQ

Microchip Technology

IC TXRX LIN 5.0V LDO/WWDT 20-QFN

• Type: Transceiver
• Protocol: LIN
• Number of Drivers/Receivers: 1/1
• Duplex: Half
• Receiver Hysteresis: 175mV
• Data Rate: -
• Voltage - Supply: 6 V ~ 18 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 20-VQFN Exposed Pad
• Supplier Device Package: 20-QFN (5x5)

封装: 20-VQFN Exposed Pad

LAN91C111I-NS

Microchip Technology

IC ETHERNET CTLR MAC PHY 128-QFP

• Protocol: Ethernet
• Function: Controller
• Interface: Parallel
• Standards: 10/100 Base-T/TX PHY
• Voltage - Supply: 3.3V
• Current - Supply: -
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 128-BFQFP
• Supplier Device Package: 128-QFP (14x20)

封装: 128-BFQFP

ATMEGA3290V-8AI

Microchip Technology

IC MCU 8BIT 32KB FLASH 100TQFP

• Core Processor: AVR
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SPI, UART/USART, USI
• Peripherals: Brown-out Detect/Reset, LCD, POR, PWM, WDT
• Number of I/O: 69
• Program Memory Size: 32KB (16K x 16)
• Program Memory Type: FLASH
• EEPROM Size: 1K x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 100-TQFP
• Supplier Device Package: 100-TQFP (14x14)

封装: 100-TQFP

PIC16C72-20I/SS

Microchip Technology

IC MCU 8BIT 3.5KB OTP 28SSOP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, SPI
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 22
• Program Memory Size: 3.5KB (2K x 14)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 4 V ~ 6 V
• Data Converters: A/D 5x8b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 28-SSOP

封装: 28-SSOP (0.209", 5.30mm Width)

DSPIC33FJ32GS606-50I/MR

Microchip Technology

IC MCU 16BIT 32KB FLASH 64QFN

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 50 MIPs
• Connectivity: I2C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, QEI, POR, PWM, WDT
• Number of I/O: 58
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-VFQFN Exposed Pad
• Supplier Device Package: 64-QFN (9x9)

封装: 64-VFQFN Exposed Pad

ATXMEGA192D3-MH

Microchip Technology

IC MCU 8BIT 192KB FLASH 64QFN

• Core Processor: AVR
• Core Size: 8/16-Bit
• Speed: 32MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 50
• Program Memory Size: 192KB (96K x 16)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 1.6 V ~ 3.6 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-VFQFN Exposed Pad
• Supplier Device Package: 64-QFN (9x9)

封装: 64-VFQFN Exposed Pad

PIC32MX210F016C-I/TL

Microchip Technology

IC MCU 32BIT 16KB FLASH 36VTLA

• Core Processor: MIPS32? M4K?
• Core Size: 32-Bit
• Speed: 40MHz
• Connectivity: I2C, IrDA, LIN, PMP, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
• Number of I/O: 25
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2.3 V ~ 3.6 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 36-VFTLA Exposed Pad
• Supplier Device Package: 36-VTLA (5x5)

封装: 36-VFTLA Exposed Pad

PIC16LC71-04/P

Microchip Technology

IC MCU 8BIT 1.75KB OTP 18DIP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Connectivity: -
• Peripherals: POR, WDT
• Number of I/O: 13
• Program Memory Size: 1.75KB (1K x 14)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 36 x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 4x8b
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 18-DIP (0.300", 7.62mm)
• Supplier Device Package: 18-PDIP

封装: 18-DIP (0.300", 7.62mm)

PIC18F2515-I/SO

Microchip Technology

IC MCU 8BIT 48KB FLASH 28SOIC

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number of I/O: 25
• Program Memory Size: 48KB (24K x 16)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 3.8K x 8
• Voltage - Supply (Vcc/Vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC

封装: 28-SOIC (0.295", 7.50mm Width)

DSPIC33EP512GM310-I/PT

Microchip Technology

IC MCU 16BIT 512KB FLASH 100TQFP

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 70 MIPs
• Connectivity: I2C, IrDA, LIN, QEI, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
• Number of I/O: 85
• Program Memory Size: 512KB (170K x 24)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 48K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 49x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 100-TQFP
• Supplier Device Package: 100-TQFP (12x12)

封装: 100-TQFP

AT90CAN32-16AU

Microchip Technology

IC MCU 8BIT 32KB FLASH 64TQFP

• Core Processor: AVR
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: CAN, EBI/EMI, I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 53
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1K x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-TQFP
• Supplier Device Package: 64-TQFP (14x14)

封装: 64-TQFP

PL902Q78USY-T5

Microchip Technology

JITTER BLOCKER

• Type: -
• PLL: -
• Input: -
• Output: -
• Number of Circuits: -
• Ratio - Input:Output: -
• Differential - Input:Output: -
• Frequency - Max: -
• Divider/Multiplier: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

ATSAMV71Q19B-AABT

Microchip Technology

FLASH, 256KB SRAM

• Core Processor: ARM® Cortex®-M7
• Core Size: 32-Bit
• Speed: 300MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number of I/O: 114
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 24x12b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

封装: 144-LQFP

PIC18LF27K42T-I/SO

Microchip Technology

IC MCU 8BIT 128KB FLASH 28SOIC

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 64MHz
• Connectivity: I²C, LINbus, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
• Number of I/O: 25
• Program Memory Size: 128KB (64K x 16)
• Program Memory Type: FLASH
• EEPROM Size: 1K x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 24x12b, D/A 1x5b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC

封装: 28-SOIC (0.295", 7.50mm Width)

USB5816C/KD

Microchip Technology

IC USB HUB CNTRL I2C/SPI 100VQFN

• Protocol: USB
• Function: Hub Controller
• Interface: I²C, SPI
• Standards: USB 3.1
• Voltage - Supply: 1.08V ~ 1.32V, 3V ~ 3.6V
• Current - Supply: -
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 100-VFQFN Exposed Pad
• Supplier Device Package: 100-VQFN (12x12)

封装: 100-VFQFN Exposed Pad

JANS1N943B-1-TR

Microchip Technology

DIODE ZENER TEMP COMPENSATED

• Voltage - Zener (Nom) (Vz): 11.7 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 30 Ohms
• Current - Reverse Leakage @ Vr: 15 µA @ 8 V
• Voltage - Forward (Vf) (Max) @ If: -
• Operating Temperature: -55°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

封装: -

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GMV15006-GM1

Microchip Technology

SI TVAR NON HERMETIC PLASTIC SMT

• Capacitance @ Vr, F: -
• Capacitance Ratio: -
• Capacitance Ratio Condition: -
• Voltage - Peak Reverse (Max): -
• Diode Type: -
• Q @ Vr, F: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

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MCP48FEB08T-20E-ST

Microchip Technology

IC DAC 8BIT V-OUT 20TSSOP

• Number of Bits: 8
• Number of D/A Converters: 8
• Settling Time: 7.8µs (Typ)
• Output Type: Voltage - Unbuffered
• Differential Output: No
• Data Interface: SPI
• Reference Type: External
• Voltage - Supply, Analog: 2.7V ~ 5.5V
• Voltage - Supply, Digital: 2.7V ~ 5.5V
• INL/DNL (LSB): ±0.1, ±0.0125LSB
• Architecture: -
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP
• Mounting Type: Surface Mount

封装: -

JANS1N5415

Microchip Technology

DIODE GEN PURP 50V 3A B AXIAL

• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 50 V
• Current - Average Rectified (Io): 3A
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 9 A
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 150 ns
• Current - Reverse Leakage @ Vr: 1 µA @ 150 V
• Capacitance @ Vr, F: -
• Mounting Type: Through Hole
• Package / Case: B, Axial
• Supplier Device Package: B, Axial
• Operating Temperature - Junction: -65°C ~ 175°C

封装: -

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JANKCA1N967B

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 18 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 21 Ohms
• Current - Reverse Leakage @ Vr: 5 µA @ 13.7 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Die

封装: -

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